10AS032H3F34I2SG - Arria 10 SX 320K LE SoC FPGA | Intel
MPN: 10AS032H3F34I2SG ✓ فعال10AS032H3F34I2SG نمای کلی
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device built from an array of programmable logic blocks, interconnect, and I/O elements, allowing engineers to implement custom digital circuits in silicon. A SoC FPGA goes further by integrating a hard processor core alongside the programmable fabric, eliminating the need for a discrete companion MCU/MPU. The Arria 10 SX family sits in the mid-to-high-performance tier of Intel's FPGA portfolio, bridging the Cyclone low-end and Stratix high-end families, and is widely deployed in wireless, broadcast, and compute acceleration.
Key features include 320K logic elements, 1.5 GHz ARM Cortex-A9 MPCore with CoreSight debug, embedded transceivers up to 14.1 Gbps, dedicated DSP blocks, and on-chip memory. The 1152-ball FC-FBGA package exposes the full I/O count of the silicon die and supports high-density board designs. The H3 speed grade indicates the device is one of the higher-performance speed bins within the family, with industrial temperature qualification for harsh-environment deployments.
The Arria 10 SX architecture pairs a hardened ARM Cortex-A9 subsystem with the FPGA fabric using a coherent multi-port memory controller, allowing low-latency data sharing between software tasks running on the HPS and hardware accelerators in the fabric. This is essential for applications like software-defined radio where baseband DSP runs on the fabric and protocol stacks run on the Cortex-A9.
Typical applications include software-defined radio baseband processing, video broadcast and transcoding, test and measurement equipment, military/aerospace signal processing, medical imaging, and high-performance industrial control. The HPS enables Linux/RTOS workloads to coexist with hardware-accelerated DSP pipelines.
When designing with this part, plan PCB layout for the 35x35 mm BGA footprint carefully - signal-integrity simulation for high-speed transceivers and a multi-layer PCB stack-up with continuous ground planes are mandatory. Thermal management should account for industrial-grade ambient operation and sustained switching activity in the fabric.
This page synthesizes distributor pricing, industrial-grade drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
جایگزین‌های drop-in برای 10AS032H3F34I2SG — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای 10AS032H3F34I2SG (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Package Code, Mounting Type, RoHS Status, Speed Grade.
10AS032H3F34I2LG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS032H3F34E2SG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS032H3F34E2LG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS032H2F34I2SG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS032H2F34I2LG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS032H3F34I2SG حداکثر مقادیر مجاز و مشخصات الکتریکی
| Family | Arria 10 SX |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Maximum Processor Frequency | 1.5 GHz |
| بسته‌بندی | 1152-ball FC-FBGA (F34) 35x35 mm |
| Temperature Grade | Industrial |
| Speed Grade | H3 |
| نوع نصب | Surface Mount (BGA) |
| وضعیت RoHS | Compliant |
| دمای کاری | -40C to +100C (industrial) |
| Lead-Free | Yes |
| سطح MSL | 3 |
| تعداد پین‌ها | 1152 |
| Transceiver Data Rate | Up to 14.1 Gbps |
راهنمای پیکربندی پین 10AS032H3F34I2SG 1152-ball fc-fbga (f34) 35x35 mm
پیکربندی پین برای 10AS032H3F34I2SG (پکیج 1152-ball fc-fbga (f34) 35x35 mm). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای 10AS032H3F34I2SG.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
10AS032H3F34I2SG مناسب است برای 6 کاربردs: Software-Defined Radio Baseband, Video Broadcast and Transcoding, Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Medical Imaging Systems, Industrial Motor Control and Automation.
Software-Defined Radio Baseband
The Intel 10AS032H3F34I2SG is purpose-built for software-defined radio (SDR) baseband processing. Its 320K logic elements deliver sufficient fabric capacity for FFT, channelization, and demodulation datapaths at channel bandwidths up to 40 MHz, while the dual ARM Cortex-A9 HPS runs the protocol stack, MAC scheduler, and RF control loops. The 14.1 Gbps transceivers interface directly to wideband ADC/DAC front-ends such as the AD9371, eliminating external SERDES chips. Industrial temperature grade enables outdoor and vehicle-mounted SDR deployments.
پیشنهادی
Video Broadcast and Transcoding
The 10AS032H3F34I2SG enables real-time video broadcast transcoding and format conversion in head-end equipment and contribution encoders. The fabric's parallel DSP blocks accelerate H.264/HEVC motion estimation and motion compensation pipelines, while the Cortex-A9 HPS handles transport stream multiplexing, PSI/SI table generation, and Ethernet control. The 14.1 Gbps transceivers drive SMPTE 2022-6/2110 IP-based video at 12G-SDI rates. Industrial temperature grade supports 24/7 broadcast rack environments.
پیشنهادی
Test and Measurement Instrumentation
Precision test and measurement instruments - oscilloscopes, protocol analyzers, bit-error-rate testers, and arbitrary waveform generators - leverage the 10AS032H3F34I2SG for hardware-timed signal capture and stimulus. The fabric implements real-time trigger logic, pattern matching, and DSP averaging, while the HPS runs the user interface, USB/LAN connectivity, and remote SCPI command parser. The 1152-FBGA package fits mid-density PCIe digitizer card form factors. Industrial temperature grade supports laboratory and field-test deployment scenarios.
پیشنهادی
Military and Aerospace Signal Processing
Defense and aerospace platforms use the 10AS032H3F34I2SG for radar signal processing, electronic warfare (EW) subsystems, and secure communications. The hardened ARM Cortex-A9 HPS runs cryptographic libraries and mission software on a trusted compute base, while the FPGA fabric implements fast Fourier transforms, pulse compression, and direction-finding algorithms. Industrial temperature grade suits ground and airborne platforms. The 20 nm process delivers low power dissipation critical for SWaP-constrained defense applications.
پیشنهادی
Medical Imaging Systems
Medical imaging modalities such as ultrasound, endoscopy, and intra-operative imaging platforms integrate the 10AS032H3F34I2SG for real-time beamforming, image reconstruction, and high-speed sensor aggregation. The fabric processes multi-channel transducer data at line rates exceeding 5 Gbps, while the Cortex-A9 HPS manages the user touchscreen, DICOM networking stack, and device safety monitoring. Industrial temperature supports continuous clinical-use operation. The SoC architecture reduces board space versus separate processor + FPGA designs.
پیشنهادی
Industrial Motor Control and Automation
High-end industrial servo drives, robotics controllers, and CNC machines use the 10AS032H3F34I2SG to implement field-oriented control (FOC) loops for multi-axis motor systems at sub-microsecond update rates. The fabric's parallel DSP blocks execute Park/Clarke transforms and PID loops in hardware, while the HPS runs the EtherCAT or PROFINET master stack and HMI logic. The 14.1 Gbps transceivers support multi-axis EtherCAT distributed I/O. Industrial temperature grade is essential for factory floor and outdoor installations.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای 10AS032H3F34I2SG — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | 10AS032H3F34I2LG | 10AS032H3F34E2SG | 10AS032H3F34E2LG | 10AS032H2F34I2SG | 10AS032H2F34I2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (F34) 35x35 mm | 1152-ball FC-FBGA (F34) 35x35 mm - same | 1152-ball FC-FBGA (F34) 35x35 mm - same | 1152-ball FC-FBGA (F34) 35x35 mm - same | 1152-ball FC-FBGA (F34) 35x35 mm - same | 1152-ball FC-FBGA (F34) 35x35 mm - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed Grade | H3 | H3 | H3 | H3 | H2 (slower bin) | H2 (slower bin) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Packaging Lead-Free | SG (standard) | LG (lead-free) | SG (standard) | LG (lead-free) | SG (standard) | LG (lead-free) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
تفاوت‌های کلیدی
- Highest speed bin in same F34 package (در مقابل10AS032H2F34I2SG)
- Industrial temperature qualification (در مقابل10AS032H3F34E2SG)
- Same silicon die with lead-free packaging option (در مقابل10AS032H3F34I2LG)
یادداشت‌های طراحی
The 1152-ball FC-FBGA F34 package requires a high-density PCB stack-up of at least 10 layers with microvia or via-in-pad technology to fan out the 1.0 mm pitch BGA. Continuous ground planes adjacent to high-speed signal layers are mandatory to maintain 14.1 Gbps transceiver signal integrity. Use the Intel Arria 10 PCB design guidelines to determine escape routing topology, length-matching, and via stitching requirements before schematic capture.
The Arria 10 SX industrial-grade device can dissipate up to 15-20 W under sustained high fabric utilization and HPS workload. Attach a heat spreader or finned heatsink with thermal interface material (TIM) to the package top; design the enclosure airflow to keep ambient at least 20C below the 100C junction limit. Measure the actual Theta_JB using a thermal test die before finalizing the mechanical design, since BGA-only convection is rarely sufficient.
Do not confuse the F34 1152-BGA package with the F35 1517-BGA package used by higher-density Arria 10 SX variants. The F35 has a different footprint and pinout - PCB designs are not interchangeable between F34 and F35. Also avoid mixing speed grades (H2/H3) across PCB revisions without re-running Quartus timing analysis. The HPS boot mode straps (BSEL) must match the selected boot flash interface (QSPI, NAND, SD) or the device will fail to boot.
Place transceiver reference clock sources (e.g., the Si5338 or equivalent jitter cleaner) within 5 cm of the FPGA clock input pins and use differential routing with 100 ohm controlled impedance. Decouple each transceiver power rail (VCCR_GXB, VCCT_GXB) with 0.1 uF MLCC + 10 uF bulk capacitors placed within 3 mm of the BGA balls. Reference Intel AN 742 for recommended power decoupling network values.
اطلاعات انطباق
Industrial temperature grade per Arria 10 SX datasheet. RoHS/REACH compliance confirmed via Intel product page. AEC-Q100 not applicable - automotive-grade is offered under separate 'I' variants and is part-number-dependent. Halogen-free status not explicitly stated in retrieved data.
