10AS032H3F34I2SG - Arria 10 SX 320K LE SoC FPGA | Intel
MPN: 10AS032H3F34I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4080 | $40,800.00 |
| 100 | $3820 | $382,000.00 |
| 500 | $3650 | $1,825,000.00 |
| 1,000 | $3450 | $3,450,000.00 |
Drop-in alternatives for 10AS032H3F34I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H3F34I2LG
✅ Drop-In✓ In Stock
$1620.19 / Unit
View Datasheet →10AS032H3F34E2SG
✅ Drop-In✓ In Stock
$2120 / Unit
View Datasheet →10AS032H3F34E2LG
✅ Drop-In✓ In Stock
$1650 / Unit
View Datasheet →10AS032H2F34I2SG
✅ Drop-In✓ In Stock
$3760 / Unit
View Datasheet →10AS032H2F34I2LG
✅ Drop-In✓ In Stock
$1390 / Unit
View Datasheet →10AS032H3F34I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Maximum Processor Frequency | 1.5 GHz |
| Package | 1152-ball FC-FBGA (F34) 35x35 mm |
| Temperature Grade | Industrial |
| Speed Grade | H3 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Operating Temperature | -40C to +100C (industrial) |
| Lead-Free | Yes |
| MSL Level | 3 |
| Number of Pins | 1152 |
| Transceiver Data Rate | Up to 14.1 Gbps |
10AS032H3F34I2SG 1152-ball fc-fbga (f34) 35x35 mm Pin Configuration Guide
Complete pinout information for 10AS032H3F34I2SG (1152-ball fc-fbga (f34) 35x35 mm package) with 1152 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H3F34I2SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1152 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H3F34I2SG is suitable for 6 applications: Software-Defined Radio Baseband, Video Broadcast and Transcoding, Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Medical Imaging Systems, Industrial Motor Control and Automation.
Software-Defined Radio Baseband
The Intel 10AS032H3F34I2SG is purpose-built for software-defined radio (SDR) baseband processing. Its 320K logic elements deliver sufficient fabric capacity for FFT, channelization, and demodulation datapaths at channel bandwidths up to 40 MHz, while the dual ARM Cortex-A9 HPS runs the protocol stack, MAC scheduler, and RF control loops. The 14.1 Gbps transceivers interface directly to wideband ADC/DAC front-ends such as the AD9371, eliminating external SERDES chips. Industrial temperature grade enables outdoor and vehicle-mounted SDR deployments.
Recommended
Video Broadcast and Transcoding
The 10AS032H3F34I2SG enables real-time video broadcast transcoding and format conversion in head-end equipment and contribution encoders. The fabric's parallel DSP blocks accelerate H.264/HEVC motion estimation and motion compensation pipelines, while the Cortex-A9 HPS handles transport stream multiplexing, PSI/SI table generation, and Ethernet control. The 14.1 Gbps transceivers drive SMPTE 2022-6/2110 IP-based video at 12G-SDI rates. Industrial temperature grade supports 24/7 broadcast rack environments.
Recommended
Test and Measurement Instrumentation
Precision test and measurement instruments - oscilloscopes, protocol analyzers, bit-error-rate testers, and arbitrary waveform generators - leverage the 10AS032H3F34I2SG for hardware-timed signal capture and stimulus. The fabric implements real-time trigger logic, pattern matching, and DSP averaging, while the HPS runs the user interface, USB/LAN connectivity, and remote SCPI command parser. The 1152-FBGA package fits mid-density PCIe digitizer card form factors. Industrial temperature grade supports laboratory and field-test deployment scenarios.
Recommended
Military and Aerospace Signal Processing
Defense and aerospace platforms use the 10AS032H3F34I2SG for radar signal processing, electronic warfare (EW) subsystems, and secure communications. The hardened ARM Cortex-A9 HPS runs cryptographic libraries and mission software on a trusted compute base, while the FPGA fabric implements fast Fourier transforms, pulse compression, and direction-finding algorithms. Industrial temperature grade suits ground and airborne platforms. The 20 nm process delivers low power dissipation critical for SWaP-constrained defense applications.
Recommended
Medical Imaging Systems
Medical imaging modalities such as ultrasound, endoscopy, and intra-operative imaging platforms integrate the 10AS032H3F34I2SG for real-time beamforming, image reconstruction, and high-speed sensor aggregation. The fabric processes multi-channel transducer data at line rates exceeding 5 Gbps, while the Cortex-A9 HPS manages the user touchscreen, DICOM networking stack, and device safety monitoring. Industrial temperature supports continuous clinical-use operation. The SoC architecture reduces board space versus separate processor + FPGA designs.
Recommended
Industrial Motor Control and Automation
High-end industrial servo drives, robotics controllers, and CNC machines use the 10AS032H3F34I2SG to implement field-oriented control (FOC) loops for multi-axis motor systems at sub-microsecond update rates. The fabric's parallel DSP blocks execute Park/Clarke transforms and PID loops in hardware, while the HPS runs the EtherCAT or PROFINET master stack and HMI logic. The 14.1 Gbps transceivers support multi-axis EtherCAT distributed I/O. Industrial temperature grade is essential for factory floor and outdoor installations.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H3F34I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H3F34I2LG | 10AS032H3F34E2SG | 10AS032H3F34E2LG | 10AS032H2F34I2SG | 10AS032H2F34I2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (F34) 35x35 mm | 1152-ball FC-FBGA (F34) 35x35 mm - same | 1152-ball FC-FBGA (F34) 35x35 mm - same | 1152-ball FC-FBGA (F34) 35x35 mm - same | 1152-ball FC-FBGA (F34) 35x35 mm - same | 1152-ball FC-FBGA (F34) 35x35 mm - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed Grade | H3 | H3 | H3 | H3 | H2 (slower bin) | H2 (slower bin) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Packaging Lead-Free | SG (standard) | LG (lead-free) | SG (standard) | LG (lead-free) | SG (standard) | LG (lead-free) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Highest speed bin in same F34 package (vs 10AS032H2F34I2SG)
- Industrial temperature qualification (vs 10AS032H3F34E2SG)
- Same silicon die with lead-free packaging option (vs 10AS032H3F34I2LG)
Design Notes
The 1152-ball FC-FBGA F34 package requires a high-density PCB stack-up of at least 10 layers with microvia or via-in-pad technology to fan out the 1.0 mm pitch BGA. Continuous ground planes adjacent to high-speed signal layers are mandatory to maintain 14.1 Gbps transceiver signal integrity. Use the Intel Arria 10 PCB design guidelines to determine escape routing topology, length-matching, and via stitching requirements before schematic capture.
The Arria 10 SX industrial-grade device can dissipate up to 15-20 W under sustained high fabric utilization and HPS workload. Attach a heat spreader or finned heatsink with thermal interface material (TIM) to the package top; design the enclosure airflow to keep ambient at least 20C below the 100C junction limit. Measure the actual Theta_JB using a thermal test die before finalizing the mechanical design, since BGA-only convection is rarely sufficient.
Do not confuse the F34 1152-BGA package with the F35 1517-BGA package used by higher-density Arria 10 SX variants. The F35 has a different footprint and pinout - PCB designs are not interchangeable between F34 and F35. Also avoid mixing speed grades (H2/H3) across PCB revisions without re-running Quartus timing analysis. The HPS boot mode straps (BSEL) must match the selected boot flash interface (QSPI, NAND, SD) or the device will fail to boot.
Place transceiver reference clock sources (e.g., the Si5338 or equivalent jitter cleaner) within 5 cm of the FPGA clock input pins and use differential routing with 100 ohm controlled impedance. Decouple each transceiver power rail (VCCR_GXB, VCCT_GXB) with 0.1 uF MLCC + 10 uF bulk capacitors placed within 3 mm of the BGA balls. Reference Intel AN 742 for recommended power decoupling network values.
Compliance Information
Industrial temperature grade per Arria 10 SX datasheet. RoHS/REACH compliance confirmed via Intel product page. AEC-Q100 not applicable - automotive-grade is offered under separate 'I' variants and is part-number-dependent. Halogen-free status not explicitly stated in retrieved data.
