10AS032H3F34E2LG - Arria 10 SX SoC FPGA 320K LE | Intel
MPN: 10AS032H3F34E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2049.57 | $2,049.57 |
| 10 | $1950 | $19,500.00 |
| 50 | $1820 | $91,000.00 |
| 100 | $1750 | $175,000.00 |
| 500 | $1650 | $825,000.00 |
Drop-in alternatives for 10AS032H3F34E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H2F34E2LG
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View Datasheet →10AS032H2F34I2LG
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View Datasheet →10AS032H2F34E2SG
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View Datasheet →10AS032H2F34I2SG
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View Datasheet →10AS032H3F34E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock | Up to 1.5 GHz |
| Speed Grade | H3 |
| Package Code | F34 (FCBGA) |
| Pin/Ball Count | 1152 |
| Package Size | 35 x 35 mm |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Temperature Grade | E2 (Industrial) |
| Process Node | 20 nm |
| Memory Interface | DDR3 / DDR4 with hard controllers |
| RoHS Status | Compliant (lead-free) |
| Lifecycle Status | Active |
10AS032H3F34E2LG 35 x 35 mm Pin Configuration Guide
Complete pinout information for 10AS032H3F34E2LG (35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H3F34E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H3F34E2LG is suitable for 6 applications: Military Radar Signal Processing, Software Defined Radio (SDR) Baseband, Wireless Baseband Processing, Video Transcoding and Broadcast, Industrial Machine Vision, 200G/400G Bridge and Aggregation.
Military Radar Signal Processing
The 10AS032H3F34E2LG fits military radar because its 320K logic elements plus hard DSP blocks deliver deterministic low-latency FFT and pulse-Doppler pipelines, while the dual ARM Cortex-A9 HPS runs radar control, scheduling, and Ethernet management at up to 1.5 GHz. The F34 1152-ball FCBGA exposes enough transceivers to drive multiple phased-array antennas. Industrial E2 temperature and RoHS-compliant construction satisfy defense program requirements without compromising timing margin in field deployments.
Recommended
Software Defined Radio (SDR) Baseband
The 10AS032H3F34E2LG serves as a strong SDR baseband engine: the FPGA fabric accelerates wideband channelization, modulation/demodulation, and FEC decoding, while the Cortex-A9 HPS runs Linux for waveform management and networking stacks. The Arria 10 SX transceivers handle multi-Gsps ADC/DAC interfaces and CPRI/OBSAI links. The 1.5 GHz HPS clock plus variable-precision DSP blocks enable baseband throughputs measured in tens of Gbps, supporting modern multi-radio platforms.
Recommended
Wireless Baseband Processing
The 10AS032H3F34E2LG supports LTE and 5G baseband processing where the FPGA fabric accelerates turbo/LDPC decoding, FFT/IFFT, and crest-factor reduction, while the integrated ARM HPS handles the L2/L3 protocol stack and OAM. The 35x35 mm F34 package provides enough I/O to drive multiple CPRI links toward radio units and enough transceivers for backhaul. Industrial temperature grade suits outdoor base-station deployments subject to wide thermal swings.
Recommended
Video Transcoding and Broadcast
The 10AS032H3F34E2LG accelerates H.264/HEVC transcoding in broadcast workflows by dedicating FPGA logic to motion estimation and entropy coding, while the dual-core ARM Cortex-A9 HPS at 1.5 GHz manages stream routing, control plane, and IP multicast. The Arria 10 SX's DDR3/DDR4 hard controllers sustain the bandwidth between external frame buffers and on-chip video pipelines, and the F34 BGA exposes enough SERDES lanes for SDI and 10GbE I/O.
Recommended
Industrial Machine Vision
The 10AS032H3F34E2LG powers multi-camera machine vision systems where the FPGA fabric executes pixel pipelines, feature extraction, and CNN inference at line rate, and the Cortex-A9 HPS runs the inspection controller and PLC interface. The 1152-ball F34 FCBGA supports multiple MIPI CSI-2 or LVDS camera inputs and gigabit Ethernet outputs. The E2 industrial temperature and RoHS-compliance suit factory-floor deployments with vibration, dust, and thermal stress.
Recommended
200G/400G Bridge and Aggregation
The 10AS032H3F34E2LG fits 200G/400G aggregation switches and bridge line cards because the Arria 10 SX fabric handles header processing, traffic management, and MACsec at line rate, while the ARM HPS manages routing protocols and telemetry. The F34 1152-ball BGA provides sufficient transceiver counts and PCB area for 28 Gbps lanes driving QSFP28 modules. Industrial E2 temperature and lead-free assembly make it deployable in carrier-grade central offices and edge aggregation points.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H3F34E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H2F34E2LG | 10AS032H2F34I2LG | 10AS032H2F34E2SG | 10AS032H2F34I2SG | 10AS032H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FCBGA-1152 (F34 35x35 mm) | FCBGA-1152 (F34 35x35 mm) - same | FCBGA-1152 (F34 35x35 mm) - same | FCBGA-1152 (F34 35x35 mm) - same | FCBGA-1152 (F34 35x35 mm) - same | FCBGA-1152 (F34 35x35 mm) - same |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| Speed Grade | H3 | H2 (one bin slower) | H2 (one bin slower) | H2 (one bin slower) | H2 (one bin slower) | H1 (two bins slower) |
| Temperature Grade | E2 (Industrial) | E2 (Industrial) | I2 (Industrial) | E2 (Industrial) | I2 (Industrial) | E1 (Industrial, narrower spec) |
| Security Option | LG (no security) | LG (no security) | LG (no security) | SG (with security) | SG (with security) | HG (with security) |
| HPS Clock | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 |
| Pin/Ball Count | 1152 | 1152 | 1152 | 1152 | 1152 | 1152 |
| Param Match (Drop-In %) | 100 | 90 | 90 | 90 | 90 | 80 |
Key Differentiators
- H3 mid-range speed grade balances Fmax, cost, and power (vs 10AS032H2F34E2LG (H2))
- LG suffix avoids security-enabled cost premium (vs 10AS032H2F34E2SG (SG))
- E2 industrial temperature grade suits outdoor deployments (vs 10AS032H2F34I2LG (I2))
Design Notes
Estimated: The F34 35x35 mm FCBGA with 1152 balls at 1.0 mm pitch requires a high-density PCB stack-up, typically an 8-12 layer board with laser-drilled microvias, mixed dielectric (low-Dk for transceiver layers), and length-matched routing for SERDES lanes. A continuous ground reference plane beneath the BGA is mandatory to control impedance and reduce crosstalk. Land-pattern design must follow Intel's published F34 footprint exactly, including NSMD (non-solder mask defined) pads with a 0.4-0.45 mm solder-mask opening.
Estimated: At maximum FPGA utilization with HPS active and transceivers running at 28 Gbps, the 10AS032H3F34E2LG can dissipate 15-20 W. With a typical theta_JA of approximately 8-10 C/W for a 1152-ball FCBGA on a 12-layer PCB, the junction-to-ambient rise is 120-200 C above ambient without airflow. A heatsink with 1-2 m/s forced airflow is strongly recommended. Use the Quartus Prime PowerPlay thermal estimator to validate the design before committing to PCB.
The 10AS032H3F34E2LG requires multiple supply rails: VCC, VCCP (HPS), VCCPT (transceiver PLL), VCCBAT (battery-backed), and per-bank VCCIO. According to Intel's Arria 10 family datasheet, all rails must ramp in a specified sequence to avoid permanent damage. Use a dedicated PMIC or power sequencer IC and decouple each rail with bulk, mid-frequency, and high-frequency ceramic capacitors placed directly beneath the BGA. DDR VTT termination must be a split-rail topology to meet JEDEC DDR3/DDR4 signal-integrity requirements.
Estimated: For 28 Gbps SERDES channels, route over continuous ground planes, maintain differential pair length matching within 0.1 mm, keep skew across 4 lanes below 0.4 ps, and avoid stubs. Reference the Arria 10 SX transceiver design kit for PCB stack-up guidelines. AC-coupling capacitors must be placed within 100 mil of the transmitter ball, and the receiver CTLE / DFE adaptation should be calibrated per channel using the Arria 10 dynamic reconfiguration interface.
Estimated: Do not assume the H3 speed grade automatically grants Quartus Prime timing closure without setting the proper fitter seed and TimeQuest constraints. Do not skip SEU-mitigation for outdoor/aerospace deployments - the Arria 10 SX CRAM scrubbing IP is mandatory when bit-flips can cause functional failures. Do not overlook the FPGA configuration scheme: a JTAG plus EPCQ flash configuration with watchdog is recommended for production hardware.
Compliance Information
RoHS-compliant per Intel Altera product page (lead-free FCBGA construction). Industrial E2 temperature grade. AEC-Q100 not applicable for FPGA SoC. Halogen-free and conflict-minerals compliance not explicitly stated in the provided verified data.
