10AS032H2F34I2SG - Arria 10 SX 320K SoC FPGA, 1.5GHz, 1152-FBGA | Intel
MPN: 10AS032H2F34I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4185 | $41,850.00 |
| 100 | $4030 | $403,000.00 |
| 500 | $3895 | $1,947,500.00 |
| 1,000 | $3760 | $3,760,000.00 |
Drop-in alternatives for 10AS032H2F34I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AS032H2F34I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed (max) | 1.5 GHz |
| On-chip RAM (HPS) | 256 KB |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1152-FBGA, FC (35x35 mm) |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Operating Temperature Grade | Industrial |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Configuration | System-on-Chip (SoC) FPGA |
| Number of Terminals | 1152 (BGA) |
| Package Code | BGA (Square, Flip-Chip) |
10AS032H2F34I2SG bga (square, flip-chip) Pin Configuration Guide
Complete pinout information for 10AS032H2F34I2SG (bga (square, flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H2F34I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H2F34I2SG is suitable for 7 applications: Industrial Machine Vision Systems, Software-Defined Radio Baseband, Military and Aerospace Signal Processing, Medical Imaging Equipment, High-Performance Motor Control, Embedded Compute and Edge Servers, Test and Measurement Instrumentation.
Industrial Machine Vision Systems
The 10AS032H2F34I2SG's 320K logic elements and dual-core ARM Cortex-A9 HPS running at 1.5 GHz make it well-suited for high-throughput machine vision pipelines. In a typical configuration, the FPGA fabric handles image sensor interface, color conversion, and edge-detection kernels at line-rate, while the HPS runs Linux with OpenCV-based classification or quality control algorithms. The 1152-FBGA package provides sufficient I/O for multi-channel MIPI CSI-2 or GigE Vision cameras. Industrial temperature grade allows deployment on factory floors without additional ruggedization.
Recommended
Software-Defined Radio Baseband
The Arria 10 SX 320 is widely deployed in software-defined radio baseband processing where its FPGA fabric performs DDC/DUC, channelization, and digital predistortion while the HPS runs protocol stacks and management software. The industrial temperature grade enables outdoor base-station deployment. With its 20nm process, the part delivers favorable performance-per-watt compared to older 28nm FPGAs, critical for thermally constrained radio units. The 1.5 GHz HPS handles network timing, encryption, and control-plane signaling alongside the data-plane FPGA fabric.
Recommended
Military and Aerospace Signal Processing
The industrial-grade 10AS032H2F34I2SG combined with extended screening makes the part attractive for military/aerospace electronic warfare, radar, and signals-intelligence subsystems. The hard ARM Cortex-A9 cores handle command and control, while the FPGA fabric implements FFTs, pulse compression, and beamforming at high sample rates. Its wide operating temperature range supports avionics and outdoor defense deployments. The SoC integration eliminates the need for a separate processor card, reducing SWaP-C in size-constrained platforms.
Recommended
Medical Imaging Equipment
The 10AS032H2F34I2SG is suitable for medical imaging modalities such as ultrasound beamforming, endoscopy processing, and CT reconstruction front-ends. The FPGA fabric executes parallel beamforming or tomographic reconstruction at real-time rates, while the ARM cores run embedded Linux for user interface, network connectivity (DICOM), and patient data handling. Industrial temperature grade supports operating-room and bedside use without active cooling in many configurations. The SoC architecture reduces total component count and improves reliability for regulated medical device certification.
Recommended
High-Performance Motor Control
Industrial motor drives benefit from the 10AS032H2F34I2SG's ability to combine deterministic FPGA-based PWM generation and field-oriented control loops with a Linux-capable HPS for higher-level motion orchestration. Designers can implement multi-axis servo control at microsecond rates in the fabric while the HPS runs EtherCAT, PROFINET, or Ethernet/IP master stacks and application-level logic. The 1152-BGA package exposes sufficient pins for multiple encoder interfaces, current-sensing ADCs, and gate-driver PWMs across several axes.
Recommended
Embedded Compute and Edge Servers
The dual-core ARM Cortex-A9 subsystem at 1.5 GHz combined with 320K logic elements allows the 10AS032H2F34I2SG to serve as a low-power edge compute node. The FPGA fabric accelerates specific workloads such as cryptography, packet processing, or inference pre-processing, while the HPS handles container orchestration or lightweight virtualization for edge applications. Industrial temperature operation and the BGA package support compact fanless enclosures. This combination is attractive for distributed IoT gateways and on-premise edge analytics where cloud connectivity is intermittent or latency-sensitive.
Recommended
Test and Measurement Instrumentation
The 10AS032H2F34I2SG integrates well into automated test equipment where the FPGA fabric implements high-speed signal acquisition, pattern generation, and protocol-aware triggering while the HPS runs the test executive, user interface, and remote API. The 1.5 GHz Cortex-A9 cores drive touchscreen interfaces and network connectivity without an external processor module. Industrial-grade reliability supports use in production-line test stations running 24/7. The SoC integration reduces BOM count and simplifies thermal design in rack-mounted instruments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H2F34I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H2F34I2LG | 10AS032H2F34E2SG | 10AS032H1F34I1HG | 10AS032H2F34E2LG | 10AS032H2F34E1HG | 10AS032H1F35I1HG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35 mm) F34 | 1152-FBGA, FC (35x35 mm) F34 - same | 1152-FBGA, FC (35x35 mm) F34 - same | 1152-FBGA, FC (34x34 mm) F34 - same family | 1152-FBGA, FC (35x35 mm) F34 - same | 1152-FBGA, FC (35x35 mm) F34 - same | 1152-FBGA, FC (35x35 mm) F35 - same body, different routing |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| HPS Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Speed Grade | -2 | -2 | -2 | -1 | -2 | -1 | -1 |
| Temperature Grade | Industrial (-40C to +100C Tj) | Industrial | Commercial (0-85C) | Industrial | Commercial | Commercial | Industrial |
| Lead-Free Finish | Yes | Yes | Standard (SnPb) | Yes | Yes | Yes | Yes |
| Approx. Unit Price (USD, qty 100) | $4,030 | $4,020 | $3,650 | $3,800 | $3,640 | $3,420 | $3,820 |
Key Differentiators
- Highest speed grade in this footprint (vs 10AS032H2F34E2SG)
- Industrial temperature grade with lead-free finish (vs 10AS032H2F34E2SG)
- Hard dual-core ARM Cortex-A9 SoC integration (vs Cyclone V SoC (5CSEBA2U19C8N))
Design Notes
Estimated: at 1.5 GHz HPS and 320K LE utilization around 70%, the 10AS032H2F34I2SG dissipates approximately 12-15 W typical, with peaks to 20 W during HPS+FPGA concurrent load. The 35x35 mm FCBGA package requires a heatsink or thermal interface material plus adequate airflow to keep junction temperature below 100 C industrial limit. Place thermal vias directly under the central BGA thermal balls and use a minimum 6-layer PCB stack-up with solid inner ground/power planes for heat spreading. Always validate with the Intel Arria 10 thermal model and junction-to-ambient calculator.
The 1152-ball flip-chip BGA F34 package has 1.0 mm ball pitch. Use laser-drilled micro-via PCB technology (any layer HDI recommended) to fan out the inner balls; conventional through-via PCBs cannot reliably escape the inner rows without via-in-pad. The DDR3/DDR4 HPS memory interface requires matched-length routing with length-matching tolerance within +/-25 mil across the byte lanes. Place the HPS memory as close as possible to the HPS-specific BGA balls to minimize reflections. Provide at least 4 PCB layers dedicated to GND/PWR for return-path integrity at 1.5 GHz.
According to the Intel Arria 10 board design guidelines, isolate the HPS subsystem power rails (VCC_HPS, DDR PLL, HPS I/O) from the FPGA fabric power rails with separate ferrite beads or filters. This prevents FPGA fabric switching noise from coupling into the HPS DDR interface. Reserve 4-wire JTAG access to both the FPGA AS config device and the HPS debug TAP for production testing. Place the configuration EPCQ flash within 2 inches of the dedicated configuration pins to avoid signal-integrity issues during boot.
Common pitfalls with 10AS032H2F34I2SG include (1) using EPCQ flash not on the Arria 10 supported-device list, causing configuration failure; (2) exceeding 0.9 V VCCINT tolerance by more than 30 mV, leading to timing failures or hard faults; (3) ignoring the HPS cold-boot flow - the HPS bitstream must be loaded before boot code can execute; (4) selecting commercial-temperature grade parts (-E) for industrial deployments and observing field failures at temperature extremes. Always order with the correct -I2 industrial suffix and verify using the Intel Arria 10 Silicon Revision Errata document before tape-out.
Compliance Information
RoHS 3 (2015/863) and REACH SVHC compliant per Intel material composition datasheet. Halogen-free per JEDEC JS709B. AEC-Q100 not applicable (FPGA, not automotive-grade IC). For aerospace/defense applications, MIL-PRF-38535 and Extended Temperature screening may be available via Intel's military/aerospace program - consult Intel FPGA sales.
