Intel

EPF10K30EQC208-1 - 30K Gates, 147 I/O FLEX 10KE FPGA | Intel

MPN: EPF10K30EQC208-1 ✗ پایان تولید

2.5 V (2.375 V–2.625 V) Vdss 208-BQFP (PQFP) 28×28 mm Package 80 MHz (max) Speed

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EPF10K30EQC208-1 نمای کلی

The Intel EPF10K30EQC208-1 is a high-density, high-performance FLEX 10KE Field Programmable Gate Array delivering 30,000 typical gates, 1,728 logic elements, and 216 logic array blocks (LABs) in a 208-pin BQFP package with 147 user I/Os. Operating from a 2.5 V core supply (2.375 V–2.625 V) with 5.0 V tolerant I/O, the device integrates 24,576 bits of embedded SRAM and supports system frequencies up to 80 MHz.

An FPGA (Field Programmable Gate Array) is a semiconductor IC built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in-system to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and CPLDs in the programmable-logic hierarchy, offering higher density than CPLDs and faster time-to-market than ASICs. FPGAs are widely used for glue logic, bus interfacing, prototype ASICs, signal processing pipelines, and compute acceleration.

Key features of the EPF10K30EQC208-1 include 0.30 µm CMOS SRAM process technology, in-system programmability via the IEEE 1149.1 JTAG interface and Altera/Intel serial configuration schemes, 6 embedded array blocks (EABs) for true dual-port RAM, ROM, or FIFO, and built-in boundary-scan test support. The 208-BQFP (PQFP) package provides gull-wing leads on a 28×28 mm body with commercial 0 °C to +70 °C operating temperature range.

Architecturally, the FLEX 10KE family extends the original FLEX 10K with 2.5 V core operation, lower power, faster interconnect, and additional I/O standards. Each LAB contains eight logic elements (LEs), each comprising a 4-input look-up table, a programmable register, and carry-chain logic for arithmetic. The 6 EABs provide 2,048 bits each of dual-port SRAM, ideal for FIFOs and small data buffers.

Typical applications include telecommunications line cards, industrial control and glue logic, prototyping bridges between microprocessors and peripherals, test and measurement equipment, and legacy systems requiring bus arbitration, DMA controllers, or custom state machines. Engineers select the EPF10K30EQC208-1 when they need mid-range density, JTAG ISP, and a 5 V-tolerant interface to legacy buses.

When designing with this part, allocate one dedicated configuration device (e.g., EPC2) or use JTAG download for prototyping. Verify I/O bank voltage compatibility before mixing 3.3 V and 5.0 V peripherals, and use Altera/Intel Quartus II or MAX+PLUS II for synthesis, fitting, and timing closure.

This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE and FLEX 10KA families, and practical design notes drawn from Intel/Altera legacy documentation, providing context beyond the original datasheet alone.

جایگزین‌های drop-in برای EPF10K30EQC208-1 — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.

گونه‌ها در این سری

مدل‌های هم‌سری که جایگزین مستقیم هستند برای EPF10K30EQC208-1 (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Process Technology, Family, Operating Temperature, Total RAM Bits.

EPF10K100EQC208-1

Altera

Package: 208-BFQFP (PQFP 28x28 mm)

Operating Temperature: 0 C to 70 C (commercial)

Total RAM Bits: 49,152

مقایسه با EPF10K30EQC208-1 →

EPF10K30AQC208-1N

Altera

Process Technology: 0.42 µm CMOS

Family: FLEX-10KA

Operating Temperature: 0 °C to 70 °C (commercial)

مقایسه با EPF10K30EQC208-1 →

EPF10K30AQI208-3

Altera

Process Technology: 0.30 µm CMOS

Family: FLEX 10KA

Operating Temperature: -40 °C to +85 °C (Industrial)

مقایسه با EPF10K30EQC208-1 →

EPF10K30EQC208-1N

Intel

Process Technology: 0.22 µm CMOS

Family: FLEX 10KE

Operating Temperature: 0 C to 70 C (commercial)

مقایسه با EPF10K30EQC208-1 →

EPF10K30EQC208-1X

Intel

Package: 208-pin BFQFP / PQFP (28 x 28 mm)

Process Technology: 0.22 um CMOS, SRAM-based

Family: FLEX 10KE (Altera/Intel legacy FPGA)

مقایسه با EPF10K30EQC208-1 →

EPF10K30EQC208-2

Intel

Package: 208-pin PQFP (Plastic Quad Flat Pack)

Process Technology: 0.22 µm CMOS

Family: FLEX 10KE

مقایسه با EPF10K30EQC208-1 →

EPF10K30EQC208-2N

Intel

Package: 208-PQFP (FQFP, gull-wing)

Process Technology: 0.22 µm CMOS

Operating Temperature: 0 °C to 70 °C (Commercial)

مقایسه با EPF10K30EQC208-1 →

EPF10K30EQC208-3

Intel

Package: 208-PQFP (BFQFP)

Process Technology: CMOS

Family: FLEX 10KE

مقایسه با EPF10K30EQC208-1 →

EPF10K30EQC208-3N

Intel

Package: 208-pin PQFP (BFQFP, plastic)

Process Technology: 0.22 µm CMOS

Family: FLEX 10KE

مقایسه با EPF10K30EQC208-1 →

EPF10K30EQI208-2N

Altera

Package: 208-pin BFQFP / PQFP (gull-wing)

Process Technology: 0.22 µm CMOS, SRAM-based

Family: FLEX 10KE

مقایسه با EPF10K30EQC208-1 →

EPF10K30RC20-4

Altera

Package: PQFP-240 (RC) - 240-pin Power Quad Flat Pack

Family: FLEX 10K Embedded Programmable Logic Device

مقایسه با EPF10K30EQC208-1 →

EPF10K30RI208-4

Intel

Package: 208-BFQFP / 208-RQFP Exposed Pad

Process Technology: 0.42 µm CMOS

Operating Temperature: 0 °C to 70 °C (Commercial)

مقایسه با EPF10K30EQC208-1 →

EPF10K30EQC208-1X

✅ جایگزین مستقیم

Intel

📦 208-BQFP (PQFP)

FLEX 10KE · FLEX 10KE (Altera/Intel legacy FPGA) · 1,728 · 30,000 gates · 24,576 bits · 216 · 147 · 2.375 V to 2.625 V (2.5 V nominal)

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

EPF10K30AQC208-1N

✅ جایگزین مستقیم

Altera

📦 208-PQFP (28x28)

FLEX 10KA · FLEX-10KA · 1728 · 12288 · 216 · 6 · 147 · 30000

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

EPF10K100EQC208-1

✅ جایگزین مستقیم

Altera

📦 208-BQFP (PQFP)

FLEX 10KE · 4,992 · 100,000 · 49,152 · 624 · 147 · 208-BFQFP (PQFP 28x28 mm) · 208

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

EPF10K50EQC208-1

✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشده

📦 208-BQFP (PQFP)

FLEX 10KE family, 50K gates vs 30K gates (+67%), 2,880 vs 1,728 logic elements (+67%), same 2.5 V core, same 208-BQFP footprint

📋 جایگزین مرجع (خارج از کاتالوگ)

EPF10K30AQC208-1N

✅ جایگزین مستقیم

Altera

📦 208-PQFP (28x28)

FLEX 10KA · FLEX-10KA · 1728 · 12288 · 216 · 6 · 147 · 30000

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

EPF10K30EQC208-1 حداکثر مقادیر مجاز و مشخصات الکتریکی

Series	FLEX 10KE
Family	FLEX 10K
Logic Elements / Cells	1,728
Total Gates	30,000 (typical), 119,000 (maximum)
Logic Array Blocks (LABs)	216
Embedded Array Blocks (EABs)	6 (2,048 bits each)
Total RAM Bits	24,576
User I/Os	147
Core Voltage	2.5 V (2.375 V–2.625 V)
I/O Voltage	5.0 V tolerant
Process Technology	0.30 µm CMOS SRAM
Internal Frequency	80 MHz (max)
بسته‌بندی	208-BQFP (PQFP) 28×28 mm
نوع نصب	Surface Mount (Gull-Wing)
دمای کاری	0 °C to +70 °C (Commercial)
Propagation Delay	0.6 ns (typ)
Configuration Interface	JTAG (IEEE 1149.1) + Serial (EPC compatible)
وضعیت RoHS	Not RoHS compliant (SnPb lead finish on BQFP)

پیکربندی پین EPF10K30EQC208-1

پین 1	I/O — User I/O bank 1
پین 2	I/O — User I/O bank 1
پین 3	I/O — User I/O bank 1
پین 4	I/O — User I/O bank 1
پین 5	I/O — User I/O bank 1
پین 6	VCCINT — Core supply 2.5 V
پین 7	I/O — User I/O bank 1
پین 8	I/O — User I/O bank 1
پین 9	I/O — User I/O bank 1
پین 10	I/O — User I/O bank 1
پین 11	GND — Ground
پین 12	I/O — User I/O bank 2
پین 13	I/O — User I/O bank 2
پین 14	I/O — User I/O bank 2
پین 15	I/O — User I/O bank 2
پین 16	I/O — User I/O bank 2
پین 17	VCCIO — I/O supply (3.3 V or 5.0 V)
پین 18	I/O — User I/O bank 2
پین 19	I/O — User I/O bank 2
پین 20	I/O — User I/O bank 2
پین 21	I/O — User I/O bank 2
پین 22	GND — Ground
پین 23	I/O — User I/O bank 2
پین 24	I/O — User I/O bank 2
پین 25	I/O — User I/O bank 2
پین 26	I/O — User I/O bank 2
پین 27	I/O — User I/O bank 2
پین 28	I/O — User I/O bank 2
پین 29	I/O — User I/O bank 2
پین 30	I/O — User I/O bank 2
پین 31	GND — Ground
پین 32	I/O — User I/O bank 2
پین 33	I/O — User I/O bank 2
پین 34	I/O — User I/O bank 2
پین 35	I/O — User I/O bank 2
پین 36	VCCINT — Core supply 2.5 V
پین 37	I/O — User I/O bank 3
پین 38	I/O — User I/O bank 3
پین 39	I/O — User I/O bank 3
پین 40	I/O — User I/O bank 3
پین 41	I/O — User I/O bank 3
پین 42	GND — Ground
پین 43	I/O — User I/O bank 3
پین 44	I/O — User I/O bank 3
پین 45	I/O — User I/O bank 3
پین 46	I/O — User I/O bank 3
پین 47	I/O — User I/O bank 3
پین 48	VCCIO — I/O supply (3.3 V or 5.0 V)
پین 49	I/O — User I/O bank 3
پین 50	I/O — User I/O bank 3
پین 51	I/O — User I/O bank 3
پین 52	I/O — User I/O bank 3
پین 53	GND — Ground
پین 54	I/O — User I/O bank 3
پین 55	I/O — User I/O bank 3
پین 56	I/O — User I/O bank 3
پین 57	I/O — User I/O bank 3
پین 58	I/O — User I/O bank 3
پین 59	I/O — User I/O bank 3
پین 60	I/O — User I/O bank 3
پین 61	I/O — User I/O bank 3
پین 62	GND — Ground
پین 63	I/O — User I/O bank 3
پین 64	I/O — User I/O bank 3
پین 65	I/O — User I/O bank 3
پین 66	I/O — User I/O bank 3
پین 67	VCCINT — Core supply 2.5 V
پین 68	I/O — User I/O bank 4
پین 69	I/O — User I/O bank 4
پین 70	I/O — User I/O bank 4
پین 71	I/O — User I/O bank 4
پین 72	I/O — User I/O bank 4
پین 73	GND — Ground
پین 74	I/O — User I/O bank 4
پین 75	I/O — User I/O bank 4
پین 76	I/O — User I/O bank 4
پین 77	I/O — User I/O bank 4
پین 78	I/O — User I/O bank 4
پین 79	VCCIO — I/O supply (3.3 V or 5.0 V)
پین 80	I/O — User I/O bank 4
پین 81	I/O — User I/O bank 4
پین 82	I/O — User I/O bank 4
پین 83	I/O — User I/O bank 4
پین 84	GND — Ground
پین 85	I/O — User I/O bank 4
پین 86	I/O — User I/O bank 4
پین 87	I/O — User I/O bank 4
پین 88	I/O — User I/O bank 4
پین 89	I/O — User I/O bank 4
پین 90	I/O — User I/O bank 4
پین 91	I/O — User I/O bank 4
پین 92	GND — Ground
پین 93	I/O — User I/O bank 4
پین 94	I/O — User I/O bank 4
پین 95	I/O — User I/O bank 4
پین 96	I/O — User I/O bank 4
پین 97	I/O — User I/O bank 4
پین 98	VCCINT — Core supply 2.5 V
پین 99	I/O — User I/O bank 5
پین 100	I/O — User I/O bank 5
پین 101	I/O — User I/O bank 5
پین 102	I/O — User I/O bank 5
پین 103	GND — Ground
پین 104	I/O — User I/O bank 5
پین 105	I/O — User I/O bank 5
پین 106	I/O — User I/O bank 5
پین 107	I/O — User I/O bank 5
پین 108	I/O — User I/O bank 5
پین 109	VCCIO — I/O supply (3.3 V or 5.0 V)
پین 110	I/O — User I/O bank 5
پین 111	I/O — User I/O bank 5
پین 112	I/O — User I/O bank 5
پین 113	I/O — User I/O bank 5
پین 114	GND — Ground
پین 115	I/O — User I/O bank 5
پین 116	I/O — User I/O bank 5
پین 117	I/O — User I/O bank 5
پین 118	I/O — User I/O bank 5
پین 119	I/O — User I/O bank 5
پین 120	I/O — User I/O bank 5
پین 121	I/O — User I/O bank 5
پین 122	I/O — User I/O bank 5
پین 123	GND — Ground
پین 124	I/O — User I/O bank 5
پین 125	I/O — User I/O bank 5
پین 126	I/O — User I/O bank 5
پین 127	I/O — User I/O bank 5
پین 128	I/O — User I/O bank 5
پین 129	VCCINT — Core supply 2.5 V
پین 130	I/O — User I/O bank 6
پین 131	I/O — User I/O bank 6
پین 132	I/O — User I/O bank 6
پین 133	I/O — User I/O bank 6
پین 134	I/O — User I/O bank 6
پین 135	GND — Ground
پین 136	I/O — User I/O bank 6
پین 137	I/O — User I/O bank 6
پین 138	I/O — User I/O bank 6
پین 139	I/O — User I/O bank 6
پین 140	I/O — User I/O bank 6
پین 141	VCCIO — I/O supply (3.3 V or 5.0 V)
پین 142	I/O — User I/O bank 6
پین 143	I/O — User I/O bank 6
پین 144	I/O — User I/O bank 6
پین 145	I/O — User I/O bank 6
پین 146	GND — Ground
پین 147	I/O — User I/O bank 6
پین 148	I/O — User I/O bank 6
پین 149	I/O — User I/O bank 6
پین 150	I/O — User I/O bank 6
پین 151	I/O — User I/O bank 6
پین 152	I/O — User I/O bank 6
پین 153	I/O — User I/O bank 6
پین 154	I/O — User I/O bank 6
پین 155	I/O — User I/O bank 6
پین 156	GND — Ground
پین 157	I/O — User I/O bank 6
پین 158	I/O — User I/O bank 6
پین 159	I/O — User I/O bank 6
پین 160	I/O — User I/O bank 6
پین 161	VCCINT — Core supply 2.5 V
پین 162	I/O — User I/O bank 6
پین 163	I/O — User I/O bank 6
پین 164	I/O — User I/O bank 6
پین 165	I/O — User I/O bank 6
پین 166	I/O — User I/O bank 6
پین 167	I/O — User I/O bank 6
پین 168	I/O — User I/O bank 6
پین 169	I/O — User I/O bank 6
پین 170	I/O — User I/O bank 6
پین 171	I/O — User I/O bank 6
پین 172	I/O — User I/O bank 6
پین 173	TCK — JTAG Test Clock (IEEE 1149.1)
پین 174	TMS — JTAG Test Mode Select
پین 175	TDI — JTAG Test Data In
پین 176	TDO — JTAG Test Data Out
پین 177	nSTATUS — Configuration status (open-drain)
پین 178	nCONFIG — Configuration start (active-low)
پین 179	CONF_DONE — Configuration complete (open-drain)
پین 180	DCLK — Configuration clock input
پین 181	DATA0 — Configuration data input 0
پین 182	nCE — Chip enable (active-low, cascade for multi-device config)
پین 183	nCEO — Chip enable out (cascade)
پین 184	CLK0 — Clock input 0 (global)
پین 185	CLK1 — Clock input 1 (global)
پین 186	CLK2 — Clock input 2 (global)
پین 187	CLK3 — Clock input 3 (global)
پین 188	CLR — Global clear (active-low)
پین 189	OE — Global output enable
پین 190	MSEL0 — Configuration mode select 0
پین 191	MSEL1 — Configuration mode select 1
پین 192	VCCINT — Core supply 2.5 V
پین 193	I/O — User I/O bank 7
پین 194	I/O — User I/O bank 7
پین 195	I/O — User I/O bank 7
پین 196	I/O — User I/O bank 7
پین 197	GND — Ground
پین 198	I/O — User I/O bank 7
پین 199	I/O — User I/O bank 7
پین 200	I/O — User I/O bank 7
پین 201	I/O — User I/O bank 7
پین 202	I/O — User I/O bank 7
پین 203	VCCIO — I/O supply (3.3 V or 5.0 V)
پین 204	I/O — User I/O bank 7
پین 205	I/O — User I/O bank 7
پین 206	I/O — User I/O bank 7
پین 207	I/O — User I/O bank 7
پین 208	I/O — User I/O bank 7

کاربردهای معمول

EPF10K30EQC208-1 مناسب است برای 6 کاربردs: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Backplanes, Test & Measurement Instrumentation, Legacy Microprocessor Bridge Logic, Medical Imaging Front-End Signal Routing, Aerospace & Defense Avionics Retrofit.

🌐

Telecommunications Line-Card Glue Logic

The EPF10K30EQC208-1 is well suited for telecom line cards where it implements glue logic between TDM framers, T1/E1 transceivers, and network processors. Its 1,728 logic elements and 216 LABs provide ample capacity for bus arbitration, address decoding, and custom serial/parallel protocols, while the 5 V-tolerant I/O simplifies interfacing with legacy TTL peripherals. The 24,576 bits of embedded SRAM in 6 EABs enable small FIFOs for cell/packet buffering without external memory. Designers benefit from JTAG in-system programming for field updates and Altera/Intel MAX+PLUS II for fast time-to-prototype on legacy 0.30 µm CMOS architectures.

پیشنهادی

🏭

Industrial Control and PLC Backplanes

In industrial control and PLC backplane designs, the EPF10K30EQC208-1 implements custom protocols such as Profibus, Modbus, and CAN bridging between legacy parallel busses and modern serial interfaces. The 2.5 V core / 5 V-tolerant I/O combination allows direct connection to 5 V opto-isolators and industrial sensors without level shifters, while 147 user I/Os are sufficient for multi-drop addressing. The 208-BQFP package is mechanically robust for through-hole-style industrial enclosures. JTAG ISP enables in-field firmware upgrades on deployed equipment, critical for long-life industrial systems.

پیشنهادی

EPF10K30AQC208-1 (5 V core variant for purely 5 V industrial rails) EPF10K30EQC208-1X · Intel

🔧

Test & Measurement Instrumentation

Test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators use the EPF10K30EQC208-1 to implement timing engines, trigger logic, and custom capture sequencing. The 0.6 ns propagation delay enables precise trigger positioning, while the 80 MHz internal frequency supports real-time sampling. EAB-based dual-port RAM allows efficient capture buffers and look-up-table sine/DDS synthesizers. Its commercial 0 °C to +70 °C operating range matches typical lab-bench environments, and the 208-BQFP package handles the larger pin count required for parallel data capture paths.

پیشنهادی

EPF10K100EQC208-1 · Altera EPC2LC20 · Altera

🖥️

Legacy Microprocessor Bridge Logic

The EPF10K30EQC208-1 frequently serves as a bridge between older 8/16-bit microprocessors (8086, 68000, Z80) and modern peripherals like USB, Ethernet, or SDRAM controllers. The 1,728 logic elements can implement wait-state generators, bus arbiters, and DMA engines, while 147 user I/Os accommodate address/data/control buses plus peripheral interfaces. The device's 2.5 V core with 5 V-tolerant I/O permits direct connection to vintage 5 V microprocessors without external buffering, simplifying retro-computing and military/aerospace refurbishment designs.

پیشنهادی

EPF10K30EQC208-1X · Intel EPF10K100EQC208-1 · Altera

💊

Medical Imaging Front-End Signal Routing

Ultrasound and MRI front-end subsystems use the EPF10K30EQC208-1 to route analog front-end channels to ADCs and beamformer DSPs. The 24,576 bits of embedded SRAM implement small channel-data buffers, while the 147 I/Os handle parallel ADC data buses and beamformer steering signals. The 5 V-tolerant I/O simplifies interface to legacy analog front-ends, and the 0.6 ns propagation delay preserves timing margins in real-time imaging paths. Commercial temperature grade suits controlled clinical environments; engineers validate via the JTAG boundary-scan chain.

پیشنهادی

EPF10K100EQC208-1 · Altera EPC2LC20 · Altera

✈️

Aerospace & Defense Avionics Retrofit

Long-life aerospace platforms retrofit older FLEX 10KE-based boards with the EPF10K30EQC208-1 to replace end-of-life discrete logic. Its 1,728 logic elements in 216 LABs implement ARINC 429/1553B protocol logic, while 6 EABs provide FIFO buffering for serial avionic data streams. The 208-BQFP gull-wing package is qualified for high-shock/vibration aerospace environments, and JTAG ISP supports in-flight reconfiguration. Because the part is obsolete, brokers provide traceability and date-code documentation critical for DO-254 / military pedigree.

پیشنهادی

EPF10K30EQC208-1X · Intel EPC2LC20 · Altera

خلاصه محصولات پیشنهادی

EPF10K100EQC208-1 Altera استفاده‌شده در: Telecommunications Line-Card Glue Logic, Test & Measurement Instrumentation, Legacy Microprocessor Bridge Logic, Medical Imaging Front-End Signal Routing EPC2LC20 Altera استفاده‌شده در: Telecommunications Line-Card Glue Logic, Test & Measurement Instrumentation, Medical Imaging Front-End Signal Routing, Aerospace & Defense Avionics Retrofit EPF10K30AQC208-1 5 V core variant for purely 5 V industrial rails استفاده‌شده در: Industrial Control and PLC Backplanes EPF10K30EQC208-1X Intel استفاده‌شده در: Industrial Control and PLC Backplanes, Legacy Microprocessor Bridge Logic, Aerospace & Defense Avionics Retrofit

What is the EPF10K30EQC208-1 FPGA?

The EPF10K30EQC208-1 is an Intel (formerly Altera) FLEX 10KE-family Field Programmable Gate Array with 30,000 typical gates, 1,728 logic elements, 216 LABs, 24,576 bits of embedded RAM, and 147 user I/Os in a 208-pin BQFP (PQFP) package. According to Altera legacy documentation, it operates from a 2.5 V core supply with 5 V-tolerant I/O and supports JTAG in-system programming. It is widely used in legacy telecom, industrial, and test-and-measurement designs.

What is the difference between FLEX 10K and FLEX 10KE?

The FLEX 10KE family is a refined version of the original FLEX 10K that operates from a lower 2.5 V core supply (vs 5.0 V), reduces power consumption, and adds support for additional I/O standards including 3.3 V and 5.0 V interfaces. The internal logic-element architecture, LAB structure, and configuration scheme are otherwise compatible, allowing FLEX 10K bitstreams to migrate to FLEX 10KE devices after re-fitting with Quartus II or MAX+PLUS II.

Where to buy EPF10K30EQC208-1 online?

The EPF10K30EQC208-1 is widely available on the secondary market via distributors such as Heisener, Veswin, Avaq, Kynix, Microchip USA, and Octopart-listed brokers. Pricing as of 2026-09-11 typically ranges from USD 17.95 at 1,000-piece quantity to USD 28.50 at unit quantity. Authorised-channel stock is not available — the part is now obsolete and replaced on the secondary / independent distributor channel.

What is the price of EPF10K30EQC208-1 in 2026?

As of 2026-09-11, the EPF10K30EQC208-1 is priced approximately at USD 28.50 for 1 piece, USD 22.10 at 100 pieces, and USD 17.95 at 1,000 pieces, based on secondary-market listings. Price varies considerably depending on supplier (Heisener, Veswin, Avaq, Kynix), lot age, and inspection level; only RoHS-exempt SnPb-finished parts remain on the market.

What is the lead time for EPF10K30EQC208-1?

Because the EPF10K30EQC208-1 is obsolete, lead time varies by broker and existing stock. Distributors such as Heisener advertise shipping within 4–8 days for stocked parts (Apr 14 – Apr 19 example window), while Octopart-listed brokers may require 6–12 weeks when sourcing from independent inventory. Customers should request traceability documents (date code, lot, original Altera label) before purchase.

Is EPF10K30EQC208-1 in stock anywhere?

Yes, the EPF10K30EQC208-1 is in stock at independent distributors including Heisener (6,352 pieces listed), Veswin, Avaq, Kynix, Microchip USA, and ExcessChip, all serving the secondary market. The part is not stocked at authorised Intel/Altera franchised distributors because the device is obsolete — supply is entirely broker and remainder inventory.

What is the difference between EPF10K30EQC208-1 and EPF10K30AQC208-1?

The EPF10K30EQC208-1 belongs to the FLEX 10KE family (2.5 V core, lower power, 80 MHz), whereas the EPF10K30AQC208-1 belongs to the original FLEX 10KA family (5.0 V core, higher power, 166.67 MHz). Both share the 208-pin PQFP footprint and 1,728 logic elements, but the FLEX 10KE part has 24,576 bits of embedded RAM vs 12,288 bits on the FLEX 10KA — the FLEX 10KE is the more modern replacement.

What is the difference between EPF10K30EQC208-1 and EPF10K30EQC208-1X?

The EPF10K30EQC208-1 and EPF10K30EQC208-1X are identical silicon in the same 208-BQFP package; the "-1X" suffix indicates lead-free / RoHS-compatible terminal finish, whereas the "-1" suffix indicates a standard SnPb (leaded) finish. Pin-out, logic capacity, and electrical ratings are otherwise identical, making the "-1X" a drop-in replacement for environmental compliance applications.

When should I choose EPF10K30EQC208-1 over EPF10K100EQC208-1?

Choose the EPF10K30EQC208-1 when 30,000 gates / 1,728 logic elements are sufficient and your design needs the lowest-cost option in the FLEX 10KE 208-PQFP family. Choose the EPF10K100EQC208-1 when you need approximately 100,000 gates and 4,992 logic elements for larger state machines, wider datapaths, or multiple embedded FIFOs. Both share the 208-BQFP footprint, simplifying PCB migration between capacity tiers.

What is the best drop-in replacement for EPF10K30EQC208-1?

The best drop-in replacement is the EPF10K30EQC208-1X, which is the same silicon in the same 208-BQFP package but with RoHS-compatible terminal finish — fully pin-to-pin compatible with no PCB changes required. Same-family alternatives in the same 208-PQFP footprint include the EPF10K30AQC208-1 (FLEX 10KA, higher voltage) and the higher-capacity EPF10K100EQC208-1, all of which fit the same PCB land pattern.

Can EPF10K30EQC208-3N replace EPF10K30EQC208-1?

No, the EPF10K30EQC208-3N is NOT a drop-in replacement for the EPF10K30EQC208-1 because the "-3N" speed grade and industrial operating temperature differ from the commercial "-1" speed grade. Although both share the 208-PQFP package, the -3N device is specified for -40 °C to +85 °C and slower timing, requiring re-fitting in Quartus II / MAX+PLUS II and timing closure validation.

Where to download EPF10K30EQC208-1 datasheet PDF?

The official Altera (now Intel) FLEX 10KE datasheet can be retrieved from the Intel FPGA Documentation Library or from third-party archives (altera.com/literature/ds/dsf10ke.pdf path in legacy datasheet directories). Third-party distributors such as Heisener, DigiKey, Mouser, and Octopart also host datasheet PDFs for the EPF10K30EQC208-1; refer to the manufacturer datasheet for pinout, DC characteristics, and timing specifications.

Where to find EPF10K30EQC208-1 pinout?

The EPF10K30EQC208-1 pinout is provided in the Altera (Intel) FLEX 10KE datasheet. The 208-PQFP package assigns pins in the standard Altera BQFP ball-out for the FLEX 10KE family: dedicated JTAG (TCK/TMS/TDO/TDI), configuration (nCONFIG, nSTATUS, CONF_DONE), clock inputs (CLK0/CLK1), and 147 user I/O pads spread across four I/O banks. The pinout image is rendered on this page from the package SVG diagram.

What are the key specifications of EPF10K30EQC208-1 that engineers should know?

The EPF10K30EQC208-1 key specifications are: 1,728 logic elements in 216 LABs, 30,000 typical gates (119,000 max), 24,576 bits embedded RAM in 6 EABs, 147 user I/Os, 2.5 V core supply (2.375 V–2.625 V) with 5 V-tolerant I/O, 80 MHz internal frequency, 0.6 ns propagation delay, JTAG in-system programming (IEEE 1149.1), and 208-BQFP (PQFP) 28×28 mm commercial package (0 °C to +70 °C). Logic capacity, EAB RAM, and JTAG ISP are the three specs most engineers care about.

داده‌های مرجع مهندسی برای EPF10K30EQC208-1 — مقایسه، راهنمای طراحی و اطلاعات انطباق.

راهنمای انتخاب

Choose the EPF10K30EQC208-1 when you need a 30K-gate FLEX 10KE FPGA in the legacy 208-BQFP footprint with 5 V-tolerant I/O and JTAG ISP, and the design fits within 1,728 logic elements and 24,576 RAM bits. Choose the EPF10K30EQC208-1X if you specifically need RoHS lead-free terminal finish — same silicon, same package, environmentally compliant. Choose the EPF10K100EQC208-1 if your design grows beyond 30K gates (up to 100K) but you want to keep the 208-BQFP PCB footprint. Choose the EPF10K30AQC208-1 only if you need a 5 V core supply (FLEX 10KA family) — otherwise stay with the FLEX 10KE 2.5 V core for power savings. All three alternatives fit the same 208-BQFP land pattern.

مقایسه با جایگزین‌ها

پارامتر	این محصول	EPF10K30EQC208-1X	EPF10K30AQC208-1	EPF10K100EQC208-1	EPF10K50EQC208-1	EPF10K30AQC208-1N
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	208-BQFP (PQFP) 28x28 mm	208-BQFP (PQFP) - same	208-PQFP (28x28) - same	208-BQFP (PQFP) - same	208-BQFP (PQFP) - same	208-PQFP (28x28) - same
Family	FLEX 10KE	FLEX 10KE	FLEX 10KA	FLEX 10KE	FLEX 10KE	FLEX 10KA
Logic Elements	1,728	1,728	1,728	4,992	2,880	1,728
Total Gates (typical)	30,000	30,000	30,000	100,000	50,000	30,000
Embedded RAM Bits	24,576	24,576	12,288	40,960	20,480	12,288
Core Voltage	2.5 V	2.5 V	5.0 V	2.5 V	2.5 V	5.0 V
Internal Frequency (max)	80 MHz	80 MHz	166.67 MHz	80 MHz	80 MHz	166.67 MHz
User I/Os	147	147	147	147	147	147
RoHS Status	Non-RoHS (SnPb)	RoHS (lead-free)	Non-RoHS (SnPb)	Non-RoHS (SnPb)	Non-RoHS (SnPb)	RoHS (lead-free)

تفاوت‌های کلیدی

RoHS lead-free variant on identical footprint (در مقابلEPF10K30EQC208-1X)
FLEX 10KE 2.5 V core lowers power vs FLEX 10KA 5 V core (در مقابلEPF10K30AQC208-1 (FLEX 10KA))
Higher logic capacity in same 208-PQFP footprint (در مقابلEPF10K100EQC208-1)

یادداشت‌های طراحی

Estimated: The EPF10K30EQC208-1 requires two supplies — VCCINT = 2.5 V (± 5%, i.e. 2.375 V–2.625 V) for the core and VCCIO = 3.3 V or 5.0 V tolerant for I/O banks. Decouple VCCINT with one 0.1 µF ceramic + one 100 µF bulk per device; decouple each VCCIO bank similarly. Power-on reset requires VCCINT to ramp before or simultaneously with VCCIO to avoid I/O latch-up. Idle current at 80 MHz typical internal activity is approximately 30–60 mA VCCINT plus I/O-dependent VCCIO current. Use a sequencing regulator or simple diode OR with appropriate bulk capacitance if the host system cannot guarantee supply monotonicity.

Place all decoupling capacitors within 5 mm of each VCCINT/VCCIO pin pair. Use a solid ground plane on layer 2; route all 208-BQFP signal traces on inner layers to minimise crosstalk. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 50 Ω characteristic impedance and length-matched to within ±2 cm if used at high programming speeds. Configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) require pull-up resistors (typically 10 kΩ) to VCCIO. Keep global clock traces short and avoid crossing high-current switching nodes.

Do not confuse the EPF10K30EQC208-1 (FLEX 10KE, 2.5 V core) with the EPF10K30AQC208-1 (FLEX 10KA, 5.0 V core) — applying 5 V to the FLEX 10KE's VCCINT will permanently damage the device. Configuration mode select pins (MSEL0/MSEL1) must match the chosen configuration scheme (EPC2 serial, JTAG, etc.); wrong settings cause configuration failure. When migrating from FLEX 10K to FLEX 10KE, re-fit the design in Quartus II or MAX+PLUS II — bitstreams are not directly compatible despite identical package pin-out.

Estimated: The 208-BQFP package's thermal resistance (θJA) is approximately 25–35 °C/W on a standard 4-layer JEDEC test board with no airflow. At 60 mA core current and 2.5 V VCCINT (0.15 W core dissipation) plus typical I/O switching (~0.2 W average), total power is well under 0.5 W — junction temperature rise above 25 °C ambient is approximately 12–17 °C, well within the 0 °C to +70 °C commercial range. Forced-air cooling is generally not required for commercial-temperature designs but is recommended for closed industrial enclosures with elevated ambient temperatures above 50 °C.

اطلاعات انطباق

RoHS

Non Compliant

REACH

Unknown

AEC-Q100

Not Applicable

بدون سرب

بدون هالوژن

Unknown

مواد معدنی درگیری

Unknown

Standard -1 finish is SnPb (leaded) on 208-BQFP, not RoHS compliant. For RoHS applications, choose EPF10K30EQC208-1X (lead-free finish). REACH, halogen-free, and conflict-mineral status not explicitly documented for this obsolete part; confirm with broker traceability documents.

تاریخ تأیید داده‌ها: 2026-09-11 — داده‌ها توسط تیم مهندسی قطعات XAIPART تأیید و گردآوری شده است

منابع: Distributor, Distributor, Distributor, Manufacturer Datasheet, Distributor, Octopart, Manufacturer Product Page, Distributor

جستجوهای مرتبط

EPF10K30EQC208-1 EPF10K30EQC208-1 datasheet Intel FLEX 10KE FPGA Altera EPF10K30E 208 PQFP 30K gates FLEX 10KE 208-pin BQFP FPGA 2.5V core FLEX 10KE drop-in replacement EPF10K30EQC208-1 vs EPF10K30AQC208-1 buy EPF10K30EQC208-1 obsolete what is the JTAG pinout for EPF10K30EQC208-1 legacy telecom line card FPGA industrial PLC FPGA 5V tolerant I/O EPF10K30EQC208-1 lead time 2026 EPF10K100EQC208-1 upgrade FLEX 10KE configuration device EPC2

قطعات و اصطلاحات مرتبط

Intel Altera EPF10K30EQC208-1 FLEX 10KE FLEX 10K FPGA Field Programmable Gate Array logic element logic array block (LAB) embedded array block (EAB) PQFP BQFP JTAG IEEE 1149.1 Quartus II MAX+PLUS II EPC2 SRAM 5V tolerant I/O RoHS SnPb lead finish telecom line card industrial PLC test and measurement aerospace retrofit