EPF10K30EQC208-1 - 30K Gates, 147 I/O FLEX 10KE FPGA | Intel
MPN: EPF10K30EQC208-1 ✗ Cuối đờiEPF10K30EQC208-1 Tóm tắt
An FPGA (Field Programmable Gate Array) is a semiconductor IC built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in-system to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and CPLDs in the programmable-logic hierarchy, offering higher density than CPLDs and faster time-to-market than ASICs. FPGAs are widely used for glue logic, bus interfacing, prototype ASICs, signal processing pipelines, and compute acceleration.
Key features of the EPF10K30EQC208-1 include 0.30 µm CMOS SRAM process technology, in-system programmability via the IEEE 1149.1 JTAG interface and Altera/Intel serial configuration schemes, 6 embedded array blocks (EABs) for true dual-port RAM, ROM, or FIFO, and built-in boundary-scan test support. The 208-BQFP (PQFP) package provides gull-wing leads on a 28×28 mm body with commercial 0 °C to +70 °C operating temperature range.
Architecturally, the FLEX 10KE family extends the original FLEX 10K with 2.5 V core operation, lower power, faster interconnect, and additional I/O standards. Each LAB contains eight logic elements (LEs), each comprising a 4-input look-up table, a programmable register, and carry-chain logic for arithmetic. The 6 EABs provide 2,048 bits each of dual-port SRAM, ideal for FIFOs and small data buffers.
Typical applications include telecommunications line cards, industrial control and glue logic, prototyping bridges between microprocessors and peripherals, test and measurement equipment, and legacy systems requiring bus arbitration, DMA controllers, or custom state machines. Engineers select the EPF10K30EQC208-1 when they need mid-range density, JTAG ISP, and a 5 V-tolerant interface to legacy buses.
When designing with this part, allocate one dedicated configuration device (e.g., EPC2) or use JTAG download for prototyping. Verify I/O bank voltage compatibility before mixing 3.3 V and 5.0 V peripherals, and use Altera/Intel Quartus II or MAX+PLUS II for synthesis, fitting, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE and FLEX 10KA families, and practical design notes drawn from Intel/Altera legacy documentation, providing context beyond the original datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EPF10K30EQC208-1 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K30EQC208-1 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Family, Operating Temperature, Total RAM Bits.
EPF10K30EQC208-1X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30AQC208-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K100EQC208-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K50EQC208-1
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K30AQC208-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30EQC208-1 Tỷ lệ tối đa & tính chất điện
| Series | FLEX 10KE |
| Family | FLEX 10K |
| Logic Elements / Cells | 1,728 |
| Total Gates | 30,000 (typical), 119,000 (maximum) |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (2,048 bits each) |
| Total RAM Bits | 24,576 |
| User I/Os | 147 |
| Core Voltage | 2.5 V (2.375 V–2.625 V) |
| I/O Voltage | 5.0 V tolerant |
| Process Technology | 0.30 µm CMOS SRAM |
| Internal Frequency | 80 MHz (max) |
| Hộp | 208-BQFP (PQFP) 28×28 mm |
| Kiểu lắp đặt | Surface Mount (Gull-Wing) |
| Nhiệt độ hoạt động | 0 °C to +70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typ) |
| Configuration Interface | JTAG (IEEE 1149.1) + Serial (EPC compatible) |
| Trạng thái RoHS | Not RoHS compliant (SnPb lead finish on BQFP) |
Cấu hình chân EPF10K30EQC208-1
| Chân 1 | I/O — User I/O bank 1 |
| Chân 2 | I/O — User I/O bank 1 |
| Chân 3 | I/O — User I/O bank 1 |
| Chân 4 | I/O — User I/O bank 1 |
| Chân 5 | I/O — User I/O bank 1 |
| Chân 6 | VCCINT — Core supply 2.5 V |
| Chân 7 | I/O — User I/O bank 1 |
| Chân 8 | I/O — User I/O bank 1 |
| Chân 9 | I/O — User I/O bank 1 |
| Chân 10 | I/O — User I/O bank 1 |
| Chân 11 | GND — Ground |
| Chân 12 | I/O — User I/O bank 2 |
| Chân 13 | I/O — User I/O bank 2 |
| Chân 14 | I/O — User I/O bank 2 |
| Chân 15 | I/O — User I/O bank 2 |
| Chân 16 | I/O — User I/O bank 2 |
| Chân 17 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Chân 18 | I/O — User I/O bank 2 |
| Chân 19 | I/O — User I/O bank 2 |
| Chân 20 | I/O — User I/O bank 2 |
| Chân 21 | I/O — User I/O bank 2 |
| Chân 22 | GND — Ground |
| Chân 23 | I/O — User I/O bank 2 |
| Chân 24 | I/O — User I/O bank 2 |
| Chân 25 | I/O — User I/O bank 2 |
| Chân 26 | I/O — User I/O bank 2 |
| Chân 27 | I/O — User I/O bank 2 |
| Chân 28 | I/O — User I/O bank 2 |
| Chân 29 | I/O — User I/O bank 2 |
| Chân 30 | I/O — User I/O bank 2 |
| Chân 31 | GND — Ground |
| Chân 32 | I/O — User I/O bank 2 |
| Chân 33 | I/O — User I/O bank 2 |
| Chân 34 | I/O — User I/O bank 2 |
| Chân 35 | I/O — User I/O bank 2 |
| Chân 36 | VCCINT — Core supply 2.5 V |
| Chân 37 | I/O — User I/O bank 3 |
| Chân 38 | I/O — User I/O bank 3 |
| Chân 39 | I/O — User I/O bank 3 |
| Chân 40 | I/O — User I/O bank 3 |
| Chân 41 | I/O — User I/O bank 3 |
| Chân 42 | GND — Ground |
| Chân 43 | I/O — User I/O bank 3 |
| Chân 44 | I/O — User I/O bank 3 |
| Chân 45 | I/O — User I/O bank 3 |
| Chân 46 | I/O — User I/O bank 3 |
| Chân 47 | I/O — User I/O bank 3 |
| Chân 48 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Chân 49 | I/O — User I/O bank 3 |
| Chân 50 | I/O — User I/O bank 3 |
| Chân 51 | I/O — User I/O bank 3 |
| Chân 52 | I/O — User I/O bank 3 |
| Chân 53 | GND — Ground |
| Chân 54 | I/O — User I/O bank 3 |
| Chân 55 | I/O — User I/O bank 3 |
| Chân 56 | I/O — User I/O bank 3 |
| Chân 57 | I/O — User I/O bank 3 |
| Chân 58 | I/O — User I/O bank 3 |
| Chân 59 | I/O — User I/O bank 3 |
| Chân 60 | I/O — User I/O bank 3 |
| Chân 61 | I/O — User I/O bank 3 |
| Chân 62 | GND — Ground |
| Chân 63 | I/O — User I/O bank 3 |
| Chân 64 | I/O — User I/O bank 3 |
| Chân 65 | I/O — User I/O bank 3 |
| Chân 66 | I/O — User I/O bank 3 |
| Chân 67 | VCCINT — Core supply 2.5 V |
| Chân 68 | I/O — User I/O bank 4 |
| Chân 69 | I/O — User I/O bank 4 |
| Chân 70 | I/O — User I/O bank 4 |
| Chân 71 | I/O — User I/O bank 4 |
| Chân 72 | I/O — User I/O bank 4 |
| Chân 73 | GND — Ground |
| Chân 74 | I/O — User I/O bank 4 |
| Chân 75 | I/O — User I/O bank 4 |
| Chân 76 | I/O — User I/O bank 4 |
| Chân 77 | I/O — User I/O bank 4 |
| Chân 78 | I/O — User I/O bank 4 |
| Chân 79 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Chân 80 | I/O — User I/O bank 4 |
| Chân 81 | I/O — User I/O bank 4 |
| Chân 82 | I/O — User I/O bank 4 |
| Chân 83 | I/O — User I/O bank 4 |
| Chân 84 | GND — Ground |
| Chân 85 | I/O — User I/O bank 4 |
| Chân 86 | I/O — User I/O bank 4 |
| Chân 87 | I/O — User I/O bank 4 |
| Chân 88 | I/O — User I/O bank 4 |
| Chân 89 | I/O — User I/O bank 4 |
| Chân 90 | I/O — User I/O bank 4 |
| Chân 91 | I/O — User I/O bank 4 |
| Chân 92 | GND — Ground |
| Chân 93 | I/O — User I/O bank 4 |
| Chân 94 | I/O — User I/O bank 4 |
| Chân 95 | I/O — User I/O bank 4 |
| Chân 96 | I/O — User I/O bank 4 |
| Chân 97 | I/O — User I/O bank 4 |
| Chân 98 | VCCINT — Core supply 2.5 V |
| Chân 99 | I/O — User I/O bank 5 |
| Chân 100 | I/O — User I/O bank 5 |
| Chân 101 | I/O — User I/O bank 5 |
| Chân 102 | I/O — User I/O bank 5 |
| Chân 103 | GND — Ground |
| Chân 104 | I/O — User I/O bank 5 |
| Chân 105 | I/O — User I/O bank 5 |
| Chân 106 | I/O — User I/O bank 5 |
| Chân 107 | I/O — User I/O bank 5 |
| Chân 108 | I/O — User I/O bank 5 |
| Chân 109 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Chân 110 | I/O — User I/O bank 5 |
| Chân 111 | I/O — User I/O bank 5 |
| Chân 112 | I/O — User I/O bank 5 |
| Chân 113 | I/O — User I/O bank 5 |
| Chân 114 | GND — Ground |
| Chân 115 | I/O — User I/O bank 5 |
| Chân 116 | I/O — User I/O bank 5 |
| Chân 117 | I/O — User I/O bank 5 |
| Chân 118 | I/O — User I/O bank 5 |
| Chân 119 | I/O — User I/O bank 5 |
| Chân 120 | I/O — User I/O bank 5 |
| Chân 121 | I/O — User I/O bank 5 |
| Chân 122 | I/O — User I/O bank 5 |
| Chân 123 | GND — Ground |
| Chân 124 | I/O — User I/O bank 5 |
| Chân 125 | I/O — User I/O bank 5 |
| Chân 126 | I/O — User I/O bank 5 |
| Chân 127 | I/O — User I/O bank 5 |
| Chân 128 | I/O — User I/O bank 5 |
| Chân 129 | VCCINT — Core supply 2.5 V |
| Chân 130 | I/O — User I/O bank 6 |
| Chân 131 | I/O — User I/O bank 6 |
| Chân 132 | I/O — User I/O bank 6 |
| Chân 133 | I/O — User I/O bank 6 |
| Chân 134 | I/O — User I/O bank 6 |
| Chân 135 | GND — Ground |
| Chân 136 | I/O — User I/O bank 6 |
| Chân 137 | I/O — User I/O bank 6 |
| Chân 138 | I/O — User I/O bank 6 |
| Chân 139 | I/O — User I/O bank 6 |
| Chân 140 | I/O — User I/O bank 6 |
| Chân 141 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Chân 142 | I/O — User I/O bank 6 |
| Chân 143 | I/O — User I/O bank 6 |
| Chân 144 | I/O — User I/O bank 6 |
| Chân 145 | I/O — User I/O bank 6 |
| Chân 146 | GND — Ground |
| Chân 147 | I/O — User I/O bank 6 |
| Chân 148 | I/O — User I/O bank 6 |
| Chân 149 | I/O — User I/O bank 6 |
| Chân 150 | I/O — User I/O bank 6 |
| Chân 151 | I/O — User I/O bank 6 |
| Chân 152 | I/O — User I/O bank 6 |
| Chân 153 | I/O — User I/O bank 6 |
| Chân 154 | I/O — User I/O bank 6 |
| Chân 155 | I/O — User I/O bank 6 |
| Chân 156 | GND — Ground |
| Chân 157 | I/O — User I/O bank 6 |
| Chân 158 | I/O — User I/O bank 6 |
| Chân 159 | I/O — User I/O bank 6 |
| Chân 160 | I/O — User I/O bank 6 |
| Chân 161 | VCCINT — Core supply 2.5 V |
| Chân 162 | I/O — User I/O bank 6 |
| Chân 163 | I/O — User I/O bank 6 |
| Chân 164 | I/O — User I/O bank 6 |
| Chân 165 | I/O — User I/O bank 6 |
| Chân 166 | I/O — User I/O bank 6 |
| Chân 167 | I/O — User I/O bank 6 |
| Chân 168 | I/O — User I/O bank 6 |
| Chân 169 | I/O — User I/O bank 6 |
| Chân 170 | I/O — User I/O bank 6 |
| Chân 171 | I/O — User I/O bank 6 |
| Chân 172 | I/O — User I/O bank 6 |
| Chân 173 | TCK — JTAG Test Clock (IEEE 1149.1) |
| Chân 174 | TMS — JTAG Test Mode Select |
| Chân 175 | TDI — JTAG Test Data In |
| Chân 176 | TDO — JTAG Test Data Out |
| Chân 177 | nSTATUS — Configuration status (open-drain) |
| Chân 178 | nCONFIG — Configuration start (active-low) |
| Chân 179 | CONF_DONE — Configuration complete (open-drain) |
| Chân 180 | DCLK — Configuration clock input |
| Chân 181 | DATA0 — Configuration data input 0 |
| Chân 182 | nCE — Chip enable (active-low, cascade for multi-device config) |
| Chân 183 | nCEO — Chip enable out (cascade) |
| Chân 184 | CLK0 — Clock input 0 (global) |
| Chân 185 | CLK1 — Clock input 1 (global) |
| Chân 186 | CLK2 — Clock input 2 (global) |
| Chân 187 | CLK3 — Clock input 3 (global) |
| Chân 188 | CLR — Global clear (active-low) |
| Chân 189 | OE — Global output enable |
| Chân 190 | MSEL0 — Configuration mode select 0 |
| Chân 191 | MSEL1 — Configuration mode select 1 |
| Chân 192 | VCCINT — Core supply 2.5 V |
| Chân 193 | I/O — User I/O bank 7 |
| Chân 194 | I/O — User I/O bank 7 |
| Chân 195 | I/O — User I/O bank 7 |
| Chân 196 | I/O — User I/O bank 7 |
| Chân 197 | GND — Ground |
| Chân 198 | I/O — User I/O bank 7 |
| Chân 199 | I/O — User I/O bank 7 |
| Chân 200 | I/O — User I/O bank 7 |
| Chân 201 | I/O — User I/O bank 7 |
| Chân 202 | I/O — User I/O bank 7 |
| Chân 203 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Chân 204 | I/O — User I/O bank 7 |
| Chân 205 | I/O — User I/O bank 7 |
| Chân 206 | I/O — User I/O bank 7 |
| Chân 207 | I/O — User I/O bank 7 |
| Chân 208 | I/O — User I/O bank 7 |
Ứng dụng tiêu biểu
EPF10K30EQC208-1 phù hợp cho 6 Áp dụngs: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Backplanes, Test & Measurement Instrumentation, Legacy Microprocessor Bridge Logic, Medical Imaging Front-End Signal Routing, Aerospace & Defense Avionics Retrofit.
Telecommunications Line-Card Glue Logic
The EPF10K30EQC208-1 is well suited for telecom line cards where it implements glue logic between TDM framers, T1/E1 transceivers, and network processors. Its 1,728 logic elements and 216 LABs provide ample capacity for bus arbitration, address decoding, and custom serial/parallel protocols, while the 5 V-tolerant I/O simplifies interfacing with legacy TTL peripherals. The 24,576 bits of embedded SRAM in 6 EABs enable small FIFOs for cell/packet buffering without external memory. Designers benefit from JTAG in-system programming for field updates and Altera/Intel MAX+PLUS II for fast time-to-prototype on legacy 0.30 µm CMOS architectures.
Được đề xuất
Industrial Control and PLC Backplanes
In industrial control and PLC backplane designs, the EPF10K30EQC208-1 implements custom protocols such as Profibus, Modbus, and CAN bridging between legacy parallel busses and modern serial interfaces. The 2.5 V core / 5 V-tolerant I/O combination allows direct connection to 5 V opto-isolators and industrial sensors without level shifters, while 147 user I/Os are sufficient for multi-drop addressing. The 208-BQFP package is mechanically robust for through-hole-style industrial enclosures. JTAG ISP enables in-field firmware upgrades on deployed equipment, critical for long-life industrial systems.
Được đề xuất
Test & Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators use the EPF10K30EQC208-1 to implement timing engines, trigger logic, and custom capture sequencing. The 0.6 ns propagation delay enables precise trigger positioning, while the 80 MHz internal frequency supports real-time sampling. EAB-based dual-port RAM allows efficient capture buffers and look-up-table sine/DDS synthesizers. Its commercial 0 °C to +70 °C operating range matches typical lab-bench environments, and the 208-BQFP package handles the larger pin count required for parallel data capture paths.
Được đề xuất
Legacy Microprocessor Bridge Logic
The EPF10K30EQC208-1 frequently serves as a bridge between older 8/16-bit microprocessors (8086, 68000, Z80) and modern peripherals like USB, Ethernet, or SDRAM controllers. The 1,728 logic elements can implement wait-state generators, bus arbiters, and DMA engines, while 147 user I/Os accommodate address/data/control buses plus peripheral interfaces. The device's 2.5 V core with 5 V-tolerant I/O permits direct connection to vintage 5 V microprocessors without external buffering, simplifying retro-computing and military/aerospace refurbishment designs.
Được đề xuất
Medical Imaging Front-End Signal Routing
Ultrasound and MRI front-end subsystems use the EPF10K30EQC208-1 to route analog front-end channels to ADCs and beamformer DSPs. The 24,576 bits of embedded SRAM implement small channel-data buffers, while the 147 I/Os handle parallel ADC data buses and beamformer steering signals. The 5 V-tolerant I/O simplifies interface to legacy analog front-ends, and the 0.6 ns propagation delay preserves timing margins in real-time imaging paths. Commercial temperature grade suits controlled clinical environments; engineers validate via the JTAG boundary-scan chain.
Được đề xuất
Aerospace & Defense Avionics Retrofit
Long-life aerospace platforms retrofit older FLEX 10KE-based boards with the EPF10K30EQC208-1 to replace end-of-life discrete logic. Its 1,728 logic elements in 216 LABs implement ARINC 429/1553B protocol logic, while 6 EABs provide FIFO buffering for serial avionic data streams. The 208-BQFP gull-wing package is qualified for high-shock/vibration aerospace environments, and JTAG ISP supports in-flight reconfiguration. Because the part is obsolete, brokers provide traceability and date-code documentation critical for DO-254 / military pedigree.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF10K30EQC208-1 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF10K30EQC208-1X | EPF10K30AQC208-1 | EPF10K100EQC208-1 | EPF10K50EQC208-1 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-BQFP (PQFP) 28x28 mm | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same | 208-BQFP (PQFP) - same | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KE | FLEX 10KE | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 4,992 | 2,880 | 1,728 |
| Total Gates (typical) | 30,000 | 30,000 | 30,000 | 100,000 | 50,000 | 30,000 |
| Embedded RAM Bits | 24,576 | 24,576 | 12,288 | 40,960 | 20,480 | 12,288 |
| Core Voltage | 2.5 V | 2.5 V | 5.0 V | 2.5 V | 2.5 V | 5.0 V |
| Internal Frequency (max) | 80 MHz | 80 MHz | 166.67 MHz | 80 MHz | 80 MHz | 166.67 MHz |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| RoHS Status | Non-RoHS (SnPb) | RoHS (lead-free) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | RoHS (lead-free) |
Bảo phân biệt quan trọng
- RoHS lead-free variant on identical footprint (vsEPF10K30EQC208-1X)
- FLEX 10KE 2.5 V core lowers power vs FLEX 10KA 5 V core (vsEPF10K30AQC208-1 (FLEX 10KA))
- Higher logic capacity in same 208-PQFP footprint (vsEPF10K100EQC208-1)
Ghi chú thiết kế
Estimated: The EPF10K30EQC208-1 requires two supplies — VCCINT = 2.5 V (± 5%, i.e. 2.375 V–2.625 V) for the core and VCCIO = 3.3 V or 5.0 V tolerant for I/O banks. Decouple VCCINT with one 0.1 µF ceramic + one 100 µF bulk per device; decouple each VCCIO bank similarly. Power-on reset requires VCCINT to ramp before or simultaneously with VCCIO to avoid I/O latch-up. Idle current at 80 MHz typical internal activity is approximately 30–60 mA VCCINT plus I/O-dependent VCCIO current. Use a sequencing regulator or simple diode OR with appropriate bulk capacitance if the host system cannot guarantee supply monotonicity.
Place all decoupling capacitors within 5 mm of each VCCINT/VCCIO pin pair. Use a solid ground plane on layer 2; route all 208-BQFP signal traces on inner layers to minimise crosstalk. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 50 Ω characteristic impedance and length-matched to within ±2 cm if used at high programming speeds. Configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) require pull-up resistors (typically 10 kΩ) to VCCIO. Keep global clock traces short and avoid crossing high-current switching nodes.
Do not confuse the EPF10K30EQC208-1 (FLEX 10KE, 2.5 V core) with the EPF10K30AQC208-1 (FLEX 10KA, 5.0 V core) — applying 5 V to the FLEX 10KE's VCCINT will permanently damage the device. Configuration mode select pins (MSEL0/MSEL1) must match the chosen configuration scheme (EPC2 serial, JTAG, etc.); wrong settings cause configuration failure. When migrating from FLEX 10K to FLEX 10KE, re-fit the design in Quartus II or MAX+PLUS II — bitstreams are not directly compatible despite identical package pin-out.
Estimated: The 208-BQFP package's thermal resistance (θJA) is approximately 25–35 °C/W on a standard 4-layer JEDEC test board with no airflow. At 60 mA core current and 2.5 V VCCINT (0.15 W core dissipation) plus typical I/O switching (~0.2 W average), total power is well under 0.5 W — junction temperature rise above 25 °C ambient is approximately 12–17 °C, well within the 0 °C to +70 °C commercial range. Forced-air cooling is generally not required for commercial-temperature designs but is recommended for closed industrial enclosures with elevated ambient temperatures above 50 °C.
Thông tin tuân thủ
Standard -1 finish is SnPb (leaded) on 208-BQFP, not RoHS compliant. For RoHS applications, choose EPF10K30EQC208-1X (lead-free finish). REACH, halogen-free, and conflict-mineral status not explicitly documented for this obsolete part; confirm with broker traceability documents.