FPGA & CPLD
Produits (6666)
EP1S25F1020I6 - Stratix 25K LE FPGA, 706 I/O, FC-FBGA-1020 | Altera
The Altera EP1S25F1020I6 is a member of the Stratix® family of high-performance Field Programmable Gate Arrays (FPGAs), built on a 1.5V, 130 nm CMOS process and packaged in a 1020-ball FineLine BGA (FC-FBGA) measuring 33 x 33 mm with 1 mm pitch. The device integrates 25,660 logic elements distributed across 2,566 Logic Array Blocks (LABs), 1,944,576 bits of embedded RAM (1,944 Kbits ≈ 1.85 Mbits), and supports up to 706 user I/O pins. Its industrial-grade -40 °C to +85 °C operating range and Stratix DSP blocks make it a long-standing workhorse for high-throughput signal processing and bus-interface designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric is composed of programmable Look-Up Tables (LUTs), flip-flops, embedded memory, and routing channels that can be electrically rewired to implement arbitrary digital circuits. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, distinguished by their higher logic density, embedded DSP blocks, high-speed transceivers, and on-chip memory. The Stratix family in particular targets ASIC-replacement applications where deterministic throughput, parallel processing, and rich I/O bandwidth outweigh the lower unit cost of a hard ASIC. Key features of the EP1S25F1020I6 include 25,660 logic elements (LEs), 1,944,576 RAM bits (≈ 1.85 Mbits), 2,566 LABs, and up to 706 user I/Os. The device is built on Altera's 130 nm process and is supplied by a 1.5 V core rail. Per Altera's Stratix Family Data Sheet, the part supports configuration via passive serial, fast passive parallel, JTAG, and Altera's enhanced configuration devices, plus on-chip PLL-based clock management for high-speed timing closure. The architecture combines LUT-based logic, embedded TriMatrix memory blocks, and dedicated DSP blocks optimized for multiply-accumulate operations. The 1.85 Mbit embedded memory is organised into M512, M4K, and MegaRAM blocks for flexible buffering of wide datapaths. Distributed routing and ALM-style adaptive logic ensure predictable timing closure at moderate clock frequencies reported by distributors in the 420 MHz to 450 MHz range. Typical applications include telecommunications backplane bridging, high-speed serial protocol bridging (PCI Express, RapidIO), video and imaging pipelines, ASIC prototyping, and industrial control DSP blocks. The 706 user I/O pins comfortably interface to wide parallel buses, DDR memory controllers, and high-pin-count companion chips. Design tip: Use Altera's Quartus II design software (the supported toolchain for this Stratix generation) for synthesis, place-and-route, and timing closure; modern Quartus Prime releases maintain legacy support for older Stratix silicon. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that are not consolidated in the original Altera datasheet, giving engineers a single reference for sourcing the EP1S25F1020I6 today.
EP1S25F1020I6N - Stratix 25,660-Cell FPGA 1020-BGA | Intel / Altera
The Intel / Altera EP1S25F1020I6N is a high-density Field Programmable Gate Array from the original Altera Stratix family, fabricated on a 130 nm CMOS process with 25,660 logic cells, 2,566 logic array blocks (LABs), and 706 user I/Os housed in a 1020-ball FineLine BGA (FC-FBGA, 33 × 33 mm, 1 mm pitch). The device operates from a 1.5 V core supply and supports enhanced-block DSP, embedded TriMatrix memory, and high-speed transceivers in selected family members. A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture sits between fixed-function ASICs and software-programmed processors: it consists of an array of configurable logic blocks (here organized into LABs), programmable routing, dedicated hard IP such as memory blocks and DSP slices, and a perimeter of user I/O buffers. Within the broader taxonomy, an FPGA belongs to the programmable logic sub-category of digital semiconductors, alongside CPLDs and structured ASICs. Key features of the EP1S25F1020I6N include 1,944,576 bits of embedded memory, multi-gigabit transceiver support on related Stratix variants, an industrial operating temperature range of 0 °C to +85 °C per the device suffix, and a 1.5 V core supply with separate VCCIO banks for mixed-voltage I/O. The FC-FBGA-1020 package uses fine-pitch flip-chip BGA construction to meet the high I/O count and signal-integrity requirements of the Stratix architecture. The 130 nm process node, combined with Stratix's DirectDrive and MultiTrack interconnect, gives the EP1S25 a balance of density, performance, and predictability that made the family a mainstream choice for early-2000s communications, video-processing, and high-speed prototyping designs. Its 1020-pin BGA supports 706 user I/Os and dedicated clock, configuration, and transceiver pins. Typical applications include wireline communications line cards, video broadcast and image processing, military and aerospace signal processing, high-performance ASIC prototyping, and test and measurement instrumentation. Industrial-grade temperature screening (the I6 suffix indicates an industrial operating range) makes the part suitable for non-automotive but thermally demanding environments. When designing with this part, plan PCB layout for a 33 × 33 mm 1 mm-pitch BGA; allocate at least six PCB layers with dedicated power and ground planes, and follow Altera's Stratix pin connection guidelines for unused pins, configuration mode pins, and JTAG signals. This page synthesizes distributor pricing, drop-in alternatives within the Stratix family, and practical design notes not found in the original datasheet.
EP1S25F672C5N - Stratix FPGA 25,660 Cells, 672-FBGA | Intel
The Intel EP1S25F672C5N is a member of the Stratix FPGA family built on a 130 nm CMOS process, delivering 25,660 logic cells with up to 500 MHz internal operation in a 672-pin FineLine BGA package. It is positioned in the mid-density Stratix tier, providing a balance of logic, embedded memory, and DSP resources for high-performance programmable logic designs. The device operates from a nominal 1.5 V core supply and supports the Stratix family architecture of LABs, TriMatrix memory blocks, and DSP blocks. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells that can be re-programmed after manufacturing to implement custom digital circuits. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The Stratix family from Altera (now Intel) targeted high-performance applications including communications, signal processing, and ASIC prototyping. Key features of the EP1S25F672C5N include 25,660 logic elements organized into LABs, embedded TriMatrix memory blocks for distributed and block RAM, dedicated DSP blocks for high-speed multiply-accumulate operations, and high-speed LVDS I/O support. The FineLine BGA-672 package provides ample I/O count and short interconnect lengths for signal-integrity-critical designs. The "C5" speed grade and "N" lead-free designation indicate commercial temperature range (0 °C to 85 °C) with Pb-free terminal finish. Architecturally, the Stratix family uses a row-and-column-based interconnect fabric with R4/R8/R24 routing resources, dedicated clock networks with PLLs, and configuration via SRAM cells. The 130 nm process node supports the embedded memory and DSP multipliers needed for applications like baseband processing, video pipeline, and high-speed serial interfaces (when paired with external transceiver devices). Typical applications include telecom baseband processing, ASIC prototyping, high-speed data acquisition, video and image processing, and industrial control systems requiring deterministic parallel logic. The combination of logic density and DSP blocks makes the EP1S25F672C5N well suited to multi-channel DSP and protocol bridging implementations. When designing with this device, plan the power distribution network carefully: the 1.5 V core plus I/O banks at 1.5/1.8/2.5/3.3 V require multiple regulated rails. Use the Quartus II design toolchain for synthesis, place-and-route, and timing closure. Decoupling must follow Stratix device guidelines, with high-frequency capacitors placed adjacent to the BGA balls. This page synthesizes distributor pricing, drop-in alternatives from the Stratix family and cross-brand Cyclone/Stratix II families, and practical design notes not found in the manufacturer datasheet.
EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672
The Intel EP1S25F672C6 is a member of the Stratix FPGA family implemented in 1.5V CMOS process technology with 25,660 logic elements, 1,944,576 bits of embedded memory, and a 672-ball FineLine BGA package. It is part of the first-generation Stratix series targeting high-performance digital signal processing, communications, and parallel processing applications with up to 6.4 Gbps transceiver capability in selected variants. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, allowing hardware designers to implement custom digital logic after fabrication. The Stratix family sits within Intel's (formerly Altera's) programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. FPGAs differ from ASICs in that they can be re-programmed in-system, providing rapid prototyping and field upgradability. Key features of the EP1S25F672C6 include 2,852 Configurable Logic Blocks (CLBs) organized as 25,660 logic elements, 14 embedded DSP blocks, up to 473 user I/O pins, and MultiVolt I/O support for 1.5V, 1.8V, 2.5V, and 3.3V interfaces. The device supports up to 256 Kbytes of TriMatrix embedded memory using 4 Kbit M512, 32 Kbit M4K, and 512 Kbit M-RAM blocks, providing flexible on-chip storage for buffers, FIFOs, and look-up tables. The architecture combines a high-bandwidth TriMatrix memory subsystem with dedicated DSP blocks optimized for FIR filters and FFT computations. Internal clock management uses up to 12 PLLs (including enhanced PLLs), supporting multiple clock domains and zero-delay buffer configurations. The 130nm CMOS process and 1.5V core power deliver low static power relative to competing 0.13um FPGAs of the era. Typical applications include high-speed data acquisition cards, baseband processing for wireless base stations, software-defined radio (SDR), medical imaging pipelines, and industrial machine vision. Designers frequently choose the EP1S25F672C6 for new designs and migration paths because its combination of logic density, DSP throughput, and abundant I/O fits mid-range DSP and protocol-bridging tasks. When designing with this device, allocate sufficient PCB layers for the 672-ball BGA escape routing and follow Altera's Stratix Hardware Reference Manual guidelines for power plane stitching, decoupling capacitor selection, and JTAG chain topology. Plan JTAG configuration source (EPCS serial configuration device, Fast Passive Parallel, or JTAG) at project start to avoid late-stage board rework. This page synthesizes distributor pricing, drop-in same-package alternatives sourced from the Stratix family cross-reference, and practical design notes not found in the manufacturer datasheet.
EP1S25F672C6N - Stratix 25K LEs 672-FBGA FPGA | Intel (Altera)
The Intel (formerly Altera) EP1S25F672C6N is a Stratix family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements and 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package. It provides 473 user I/O pins and is built on a 1.5 V CMOS process, making it suitable for high-density logic, on-chip memory, and high-throughput DSP designs. The part is rated for commercial operating temperature (0C to +85C) and is supplied in a 35 mm x 35 mm body with 1.27 mm ball pitch for standard SMT assembly. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital circuits after PCB fabrication. FPGAs sit in the broader taxonomy of digital ICs -> programmable logic -> gate array, and they occupy the highest flexibility tier below full-custom ASICs, offering hundreds of thousands of logic gates plus dedicated blocks such as block RAM, DSP multipliers, PLLs, and high-speed transceivers. The Stratix family specifically targets high-performance applications including communications infrastructure, image processing, and ASIC prototyping where logic density and on-chip memory bandwidth dominate the design trade-off. Key features of the EP1S25F672C6N include 2566 Logic Array Blocks (LABs), embedded TriMatrix memory supporting true dual-port and FIFO modes, DSP blocks for high-speed multiplication, dedicated clock management PLLs, and support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS. The 672-FBGA package exposes the full I/O count required for memory-rich and parallel-interface designs. Architecturally, Stratix devices combine a sea-of-LABs fabric with column-based embedded memory, embedded multipliers, and high-speed I/O elements. The 672-FBGA package provides controlled-impedance routing to support DDR SDRAM interfaces and external memory buses typical in networking and signal-processing designs. Typical applications include networking line cards, DSP co-processing, telecommunications equipment, video and image processing pipelines, and ASIC prototyping. The device is also used in industrial control systems that require parallel DSP throughput and deterministic real-time performance. When designing with the EP1S25F672C6N, designers should use the Quartus II development tool (or Quartus Prime for newer designs where legacy device support exists) and observe the I/O standard termination guidelines for high-speed memory interfaces. The 672-BGA requires careful PCB stackup planning with matched impedance for DDR traces. This page synthesizes distributor pricing, package diagrams, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing an integrated reference for engineers sourcing the EP1S25F672C6N.
EP1S25F672C7 - 25K LE Stratix FPGA, 672-BGA, 420 MHz | Intel
The Intel EP1S25F672C7 is a member of the Stratix FPGA family, delivering 25,660 logic elements (LEs), 1,944,576 RAM bits, and 473 user I/O pins in a 672-ball FineLine BGA (FBGA) package. Built on a 130 nm CMOS process with a 1.5 V core supply, the device operates at up to 420 MHz core frequency and supports embedded multipliers, TriMatrix memory blocks, and up to 6 DLLs plus 2 PLLs for high-speed clock management. The 'C7' speed grade and commercial operating temperature range (0 °C to +85 °C) make this part a mainstream mid-density Stratix for wired telecom line cards, industrial imaging, and DSP co-processing cards. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that lets engineers implement arbitrary digital logic, memory, and DSP functions in silicon. FPGAs sit in the broader category of programmable logic devices (PLDs) within the integrated circuit hierarchy: transistor -> CMOS gate -> logic cell -> logic array block -> FPGA -> ASIC-class programmable silicon. Unlike fixed-function ASICs, FPGAs are configured post-manufacture via an SRAM bitstream, allowing iterative design changes without respinning masks. The Stratix family in particular is the first-generation Intel/Altera high-density FPGA architecture, emphasizing embedded memory, DSP blocks, and high-speed serial interfaces for communications infrastructure. Key features of the EP1S25F672C7 include 2,852 Configurable Logic Blocks (CLBs), 224 embedded 18x18 multipliers, 2,103,744 total memory bits organized as TriMatrix blocks (MRAM, M512, M4K), and 12 dedicated clock networks. It supports LVDS, LVTTL, LVPECL, and 3.3 V PCI I/O standards on the same die, and provides up to 40 channels of high-speed LVDS pairs. The JTAG-compliant IEEE 1149.1 boundary-scan interface plus on-chip configuration circuitry enable in-system programming from a single configuration EPROM. Architecture-wise, the Stratix LAB contains 10 LEs with local and direct-link routing, and embedded memory is split into three block sizes for efficient buffering of small and large payloads. The 130 nm process and 1.5 V core keep dynamic power roughly proportional to toggle rate, while the commercial speed grade (-7) targets clock frequencies up to 420 MHz. Designers migrating from older APEX families get an immediate jump in on-chip memory density and DSP throughput per square millimeter. Typical applications include wired telecom line cards and DSLAM backplanes, broadcast video processing, military radar front-end preprocessing, medical imaging pipelines, and DSP co-processing accelerator cards. The 672-FBGA package provides 473 user I/O, sufficient for wide bus interfaces to external DDR SDRAM, ZBT SRAM, or QDR SRAM companion memories. Designers needing more logic density can step up to EP1S40 or EP1S60 in the same family. When designing with this device, plan the power budget carefully: a fully utilized EP1S25F672C7 can exceed 4-5 W, so a thermal pad, 6-layer PCB with internal power planes, and synchronous decoupling are mandatory. Quartus II (or its modern Quartus Prime successor) is the primary design entry, synthesis, place-and-route, and bitstream generation toolchain. This page consolidates distributor pricing, drop-in pin-compatible alternatives in the same 672-FBGA footprint, and Stratix design notes not all collected on the official datasheet.
EP1S25F672C7N - Stratix FPGA 25K LEs 672-BBGA | Intel / Altera
The Intel / Altera EP1S25F672C7N is a member of the original Stratix FPGA family, integrating approximately 25,660 logic elements (2566 LABs) and 1,944,576 bits of embedded RAM in a 672-ball FineLine BGA package. Built on a 0.13 µm CMOS process with 1.5 V core supply and 473 user I/O pins, this device targets high-performance DSP, communications, and signal-processing applications where the TriMatrix memory architecture and dedicated DSP blocks deliver deterministic performance. The 35 × 35 mm, 1.27 mm-pitch BGA-672 package enables high-density board designs while supporting high-speed LVDS, HSTL, SSTL, and LVPECL I/O standards. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacture by a user-supplied configuration bitstream. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, occupying the same general role as ASICs but offering in-system re-programmability, faster prototyping cycles, and lower non-recurring engineering cost. Within a digital system, an FPGA typically implements glue logic, custom datapaths, parallel DSP, packet processing, or even soft-core CPUs, making it a foundational component in the broader category of programmable logic devices (PLDs) and digital logic ICs. Key features of the EP1S25F672C7N include up to 6 full-duplex high-speed transceiver channels (model-dependent), dedicated DSP blocks for 18 × 18 multipliers at full speed, distributed and TriMatrix embedded memory, up to 12 PLLs for clock management, and 473 user I/Os. The Stratix architecture uses look-up tables (LUTs), embedded memory blocks (M512, M4K, M-RAM), and high-speed I/O elements supporting DDR SDRAM interfaces. Configuration is via JTAG or passive/active serial schemes, and the device supports in-system programming for field updates. Typical applications for the EP1S25F672C7N include high-end DSP designs (radar, baseband, video processing), communications infrastructure (line cards, protocol bridges, packet classification), test and measurement equipment, medical imaging accelerators, and military/aerospace signal processing. The combination of 25K logic elements and approximately 2 Mbit of block RAM in this BGA-672 footprint makes it well suited to mid-density datapath designs. The 0 to 85 °C commercial operating temperature grade further confirms its use in standard commercial and industrial environments rather than extended-temperature deployments. When designing with this device, plan power-rail sequencing for VCCINT (1.5 V core), VCCIO (per bank, 1.2–3.3 V), VCC_PLL, and VCC_GXB if transceivers are used. Decoupling must follow Altera's recommended guidelines with multiple low-ESL ceramics close to each supply pin. Designers should also reference the Stratix Device Handbook and AN-224 for I/O termination and signal-integrity best practices. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet.
EP1S25F672C8 - 25,660 LEs Stratix FPGA 672-BGA | Intel / Altera
The Intel / Altera EP1S25F672C8 is a Stratix-family Field Programmable Gate Array (FPGA) offering 25,660 logic elements, 2,566 LABs, and 473 user I/Os in a 672-ball FineLine BGA package. It is built on a 130 nm CMOS process, supports an internal core voltage of 1.5 V, and is rated for the commercial 0 C to +85 C operating range. The "C8" speed grade denotes a -8 device timing bin in the Stratix family. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the integration density of an Application-Specific Integrated Circuit (ASIC) with the design flexibility of software-configurable hardware. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > programmable logic > digital semiconductor) and are widely used for parallel data-path processing, high-speed serial interfaces, and ASIC prototyping where time-to-market and field reconfigurability outweigh raw unit cost. Key features of the EP1S25F672C8 include 25,660 logic elements organized into 2,566 Logic Array Blocks (LABs), dedicated on-chip memory blocks (TriMatrix memory), DSP blocks for high-throughput arithmetic, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 40 high-speed transceiver channels in the Stratix family, providing multi-gigabit serial connectivity for communications and storage applications. From an architecture standpoint, the Stratix family employs an LUT-based fabric with embedded RAM and multiplier blocks. The 130 nm process and 1.5 V core deliver a balance of performance and power efficiency suitable for ASIC prototyping, communications infrastructure, and high-performance digital signal processing where deterministic latency and parallel execution are required. Typical applications include ASIC prototyping, telecom line-card design, video and image processing pipelines, military/aerospace signal processing, and high-speed serial interface bridging. The 672-pin BGA package supports the high I/O count needed for memory and bus interfaces in these demanding systems. When designing with the EP1S25F672C8, ensure the PCB layout follows BGA escape routing best practices and that decoupling capacitors are placed close to each power pin per the Stratix pin connection guidelines. Configuration via JTAG or an Altera configuration device must be planned at the board level. This page synthesizes distributor pricing from 19 active sources, drop-in alternatives from the same Stratix family and competitor equivalents, and practical design considerations not aggregated on a single datasheet page.
EP1S25F672C8N - Stratix 25K LE FPGA, 672-FBGA, 1.5V | Intel
The Intel EP1S25F672C8N is a member of the original Stratix FPGA family, integrating 25,660 logic elements, 1,944 Kbit of embedded memory, and dedicated DSP blocks within a 672-ball FineLine BGA package. Manufactured on a 130 nm CMOS process and supplied from a 1.5 V core rail, the device delivers up to 357 MHz internal operation and is offered in a commercial 0 °C to 85 °C temperature grade. The 'C8' speed grade denotes a -8 speed bin, and the 'N' suffix indicates a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital logic through SRAM-based configuration cells. Within the broader taxonomy, an FPGA belongs to programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix family was Intel's (formerly Altera's) first high-end FPGA family built on a 1.5 V core, introducing embedded TriMatrix memory, DSP blocks, and high-speed transceivers in a single fabric. These architectural elements positioned Stratix as the predecessor to Stratix II, III, and the modern Stratix 10 families. Key features of the EP1S25F672C8N include 25,660 logic elements (LEs), 1,944 Kbit of embedded RAM (in three memory block sizes), twelve embedded DSP blocks optimized for multiplication and multiply-accumulate operations, six phase-locked loops (PLLs), and up to 426 user I/O pins depending on the package's I/O bank count. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with eight I/O banks that allow flexible voltage reference selection. Architecturally, the Stratix core combines a multi-level routing hierarchy (LAB, MegaLAB) with embedded memory, multipliers, and PLL resources distributed throughout the fabric. The 1.5 V core is paired with selectable I/O voltages per bank via VREF pins, allowing the same die to interface with 1.5 V, 1.8 V, 2.5 V, or 3.3 V peripherals without level shifters. The configuration scheme supports passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), JTAG, and Altera's EPC configuration devices. Typical applications include high-throughput digital signal processing (software-defined radio, video processing), custom protocol bridging and packet processing in telecom line cards, ASIC prototyping and emulation, high-speed data acquisition front-ends, and industrial imaging pipelines. The DSP-rich fabric makes it particularly attractive for digital filters, FFT engines, and baseband processing in mid-2000s-generation designs. When designing with this part, verify Quartus II version support for the EP1S25 family before starting firmware work. Modern toolchains (Quartus II v13.x) still support Stratix but may not include the latest security patches; users targeting new designs should evaluate Stratix II or Cyclone IV for active tool support, while existing EP1S25 boards may rely on legacy Quartus flows for long-term maintenance. This page synthesizes distributor stock, parametric comparisons against other Stratix density points, and practical design notes (decoupling, JTAG, configuration) not consolidated on any single manufacturer or distributor page.
EP1S25F672I7 - Stratix FPGA 25660 LE, 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP1S25F672I7 is a member of the Stratix FPGA family delivering 25,660 logic elements, 1,944,576 bits of embedded RAM, and 473 user I/O pins in a 672-ball FineLine BGA package. Built on a 0.13 µm CMOS process, this device integrates 2,566 LABs/CLBs, up to 6 embedded DSP blocks, and high-speed serial interfaces suited for data-path intensive designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O cells can be configured after manufacture to implement arbitrary digital functions ranging from glue logic to full system-on-chip prototypes. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy, offering hardware-timed parallelism for DSP, communications, and protocol bridging. The Stratix family specifically targets high-performance applications with embedded multipliers, memory blocks, and dedicated clock management circuitry, positioning it within the broader class of programmable logic devices (PLDs) under the semiconductor category. Key features include 473 maximum user I/O pins, a 1.5 V core supply voltage, 1.27 mm ball pitch, and industrial-grade operating temperature range of -40 °C to +100 °C (industrial) per datasheet, with 0 °C to +85 °C noted in some distribution listings. The device supports in-system programmability via JTAG, dedicated configuration circuitry, and multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through dedicated I/O banks. Typical applications include telecom baseband processing, high-speed serial protocol bridging, software-defined radio, video processing pipelines, and ASIC prototyping. Its combination of dense logic, embedded RAM, and high I/O count makes it well suited for designs requiring parallel datapath implementation alongside flexible I/O configuration. When designing with this device, ensure PCB layout accommodates the 672-ball FBGA with controlled-impedance routing for high-speed LVDS pairs and adequate decoupling per Altera's Stratix hardware reference design. The device's obsolete lifecycle status means new designs should consider Cyclone IV/V or Stratix IV/V successors; existing designs should source from authorized distributors carrying traceable stock. This page synthesizes distributor pricing, drop-in alternatives, and engineering notes not consolidated elsewhere.
EP1S25F672I7N - 25,660 LE Stratix FPGA, 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP1S25F672I7N is a member of the original Stratix FPGA family, integrating 25,660 logic elements, 1.9 Mbits of embedded TriMatrix memory, and DSP blocks in a 672-ball FineLine BGA package. Fabricated on a 1.5 V, 0.13 µm CMOS process, the device supports embedded multipliers, high-speed I/O, and up to 473 user I/O pins at user-defined I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The industrial speed grade -7 variant operates across 0 °C to 85 °C junction range. An FPGA (Field Programmable Gate Array) is a reconfigurable digital logic device that allows hardware designers to implement arbitrary digital functions after PCB assembly. Stratix devices occupy the high-density, feature-rich tier of the Altera/Intel programmable logic hierarchy, sitting above Cyclone (cost-optimized) and below Stratix GX (transceiver-equipped) and Stratix II/GX (next-generation). Within a power management or embedded system, FPGAs serve as hardware accelerators, protocol bridges, glue logic, and signal-processing engines. FPGAs differ from MCUs in that logic and interconnect are user-defined rather than fetched from firmware, enabling deterministic parallel throughput. Key features of the EP1S25F672I7N include up to 25,660 logic elements, 1.9 Mbit embedded TriMatrix memory, dedicated 18×18 multipliers for DSP, support for high-speed external memory interfaces such as DDR SDRAM, QDR SRAM, and ZBT SRAM, and dedicated serial configuration support via passive serial, fast passive parallel, and JTAG. The 672-pin FineLine BGA package measures 35 × 35 mm with 1.27 mm pitch and is optimized for high pin-count, multi-layer PCB layouts. Architecturally, the Stratix family introduced the TriMatrix memory architecture with three block sizes (M512, M4K, M-RAM) to optimize silicon area across distributed and buffer-style memory requirements. The 1.5 V core supply is supported by on-chip voltage regulation requiring only a single external supply input, simplifying power tree design compared to earlier 2.5 V / 3.3 V core architectures. Typical applications include telecom line-card packet processing, military/aerospace signal processing, medical imaging accelerators, industrial machine vision, and ASIC prototyping. The wide DSP block density also suits software-defined radio baseband and digital video broadcasting infrastructure. When designing with this device, allocate 1.5 V core and dedicated PLL/IO supply rails with decoupling placed close to each BGA quadrant. Use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis, place-and-route, and timing closure. Note that this part is mature legacy silicon; new designs should consider Stratix IV/V or Cyclone families for active long-term supply. This page synthesizes distributor availability, same-family Stratix drop-in alternatives, and practical configuration guidance not collected in the original manufacturer datasheet alone.
EP1S25F780C5 - Stratix I FPGA, 25,660 LEs, 597 I/O, 780-FBGA | Altera / Intel
The Altera (now Intel) EP1S25F780C5 is a member of the Stratix I family of SRAM-based Field-Programmable Gate Arrays, integrating 25,660 Logic Elements, 2,566 Logic Array Blocks (LABs), and 1,944,576 bits of embedded RAM in a 780-ball FineLine BGA (FBGA) package with 597 user I/O pins. Built on a 0.13 µm process, the device is organized around Altera's MultiTrack interconnect and embedded TriMatrix memory architecture, delivering up to 7.6 Gbps LVDS performance and dedicated DSP blocks for high-throughput arithmetic. An FPGA (Field-Programmable Gate Array) is a programmable logic device in the semiconductor hierarchy: FPGA -> programmable logic -> ASIC-class device -> integrated circuit. FPGAs are used to implement custom digital logic, glue logic, signal processing pipelines, and high-speed interfaces after the PCB has been fabricated, enabling late-stage design changes and accelerating time to market versus a full ASIC. Stratix I FPGAs were Altera's first generation to combine embedded multipliers, large TriMatrix memory blocks, and high-speed LVDS transceivers on a single die. Key differentiating features include 80 (typical) embedded DSP blocks for 9x9-bit to 36x36-bit multiplication, 14 clock networks with up to 8 PLLs per device, support for external memory interfaces such as DDR SDRAM, QDR SRAM, and ZBT SRAM, and 1.5 V core operation. The 780-FBGA package exposes 597 user I/O across 8 banks, providing abundant LVDS pairs and routing flexibility for memory-rich and I/O-intensive designs. The architecture is well suited to telecom line cards, digital video broadcasting equipment, and high-speed serial interfaces where a large logic budget plus embedded multipliers reduce external component count. The 'C5' speed grade trades absolute Fmax for lower static power, making the C5 variant a typical choice for industrial-grade designs that prioritize thermal margin over raw clock rate. Typical applications include telecom baseband processing, software-defined radio (SDR), high-end image processing, and ASIC prototyping platforms. Designers should pay particular attention to power estimation with the Quartus II PowerPlay tool because the static current scales strongly with VCCINT and junction temperature.
EP1S25F780C5N - 25K LE Stratix FPGA 780-FBGA | Intel
The Intel EP1S25F780C5N is a high-density Stratix-family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process and packaged in a 780-ball FineLine BGA (FBGA) measuring 29 x 29 mm with a 1.0 mm ball pitch. It integrates 25,660 logic elements across 2,566 Logic Array Blocks (LABs) and provides up to 597 user I/O pins, making it one of the largest members of the first-generation Stratix family. The device operates from a 1.5 V core supply and supports commercial-extended temperature grades (0 to 85 C). An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected by programmable interconnect. The bitstream stored in on-chip SRAM configures both the logic function of each block and the routing between them. FPGAs are widely used for high-performance parallel processing, glue logic, prototyping, and ASIC replacement where time-to-market matters more than per-unit cost. The Stratix family in particular was the first Intel/Altera platform to embed dedicated DSP blocks, TriMatrix memory, and high-speed transceivers on-chip. Key features of the EP1S25F780C5N include up to 1.92 Mbits of embedded TriMatrix memory, dedicated DSP blocks for fixed- and floating-point arithmetic, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL), and 4 phase-locked loops (PLLs) for clock management. The 597 user I/O pins are organized into 12 I/O banks, supporting a wide range of single-ended and differential interfaces including PCI, PCI-X, DDR, and RapidIO. The 780-pin FBGA package enables high signal density for complex board designs. The device supports configuration via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes. Configuration bitstreams are stored in external EEPROM or flash and loaded into on-chip SRAM at power-up. The 130 nm process provides a mature, well-characterized fabric with proven reliability for telecom, industrial, and military applications. Typical applications include high-throughput digital signal processing (radar, software-defined radio, video processing), telecom line cards, ASIC prototyping, industrial control systems, and high-speed serial interface bridging. The combination of large logic capacity and dedicated DSP blocks makes the EP1S25 well suited for data-path intensive designs where parallel arithmetic performance is critical. When designing with this device, pay close attention to power sequencing and decoupling. The 780-FBGA package requires a multi-layer PCB with continuous power and ground planes. Use the Quartus II design software (version 5.x or later, as required for the Stratix family) for synthesis, place-and-route, and timing closure. Note that the EP1S25 series is end-of-life as newer Stratix/Cyclone generations have superseded it; consult the Intel/Altera Product Discontinuance notices before committing to long-lifecycle designs. This page synthesizes current distributor pricing, lifecycle status, drop-in same-package alternatives, and Quartus II design considerations not found in the original manufacturer datasheet alone. Engineers evaluating the EP1S25F780C5N should cross-reference part numbers EP1S25F672I7N, EP1S20F780C5N, and EP1S10F780C5N as same-package and same-family drop-in alternatives already catalogued on this site.
EP1S25F780C6 - Stratix FPGA 25K LE, 597 I/O, 780-FBGA | Altera
The Altera EP1S25F780C6 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, integrating 25,660 logic elements, 1,944,576 bits of embedded RAM, and 597 user I/O in a 780-ball FineLine BGA package. Operating from a 1.5 V core supply (with multi-volt I/O support), the device delivers up to 450 MHz internal performance and is rated for the commercial 0C to 85C temperature range (the "C6" speed grade). What is a Stratix FPGA? The Stratix family is Altera's first-generation high-performance FPGA architecture (introduced 2002), combining programmable logic, embedded memory blocks (TriMatrix), embedded multipliers (DSP blocks), and high-speed transceivers in a single device. FPGAs sit at the top of the programmable-logic hierarchy - above CPLDs - and below ASICs - giving engineers a reconfigurable alternative to custom silicon. Stratix devices were widely adopted in telecom line cards, military signal processing, and high-speed serial-link prototypes during the mid-2000s. Key features include dedicated DSP blocks for high-throughput multiply-accumulate operations, support for external memory interfaces including DDR SDRAM and QDR SRAM via dedicated DQS circuitry, embedded PLLs for clock management, and configuration via passive serial, fast passive parallel, or JTAG modes. The 780-pin FBGA package exposes the full I/O count and supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL) on a per-pin basis, enabling direct interfacing to parallel buses, memory chips, and differential signaling links. Technical depth: the EP1S25 is fabricated in 1.5 V 130 nm CMOS with copper interconnect, contains 2,566 LABs (logic array blocks), and offers TriMatrix memory architecture (MRAM, M4K, M512 blocks). The 1.5 V core combined with selectable I/O voltages (1.5/1.8/2.5/3.3 V) allows bridging between legacy 5 V-TTL peripherals and modern low-voltage memory. Typical applications include telecom line-card interface logic, military/aerospace signal processing, custom DSP pipelines, bus-bridging glue logic between processors and peripherals, and prototype ASIC verification using the Stratix logic density. When designing with this legacy device, note that new designs should generally target Cyclone or Arria families; the EP1S25F780C6 is best reserved for sustaining production of existing Stratix-based boards where proven firmware and proven PCB layouts must be preserved.
EP1S25F780C6N - Stratix 25K LE FPGA, 597 I/O, 780-BGA | Altera
The Altera (now Intel) EP1S25F780C6N is a Stratix family Field Programmable Gate Array (FPGA) built on a 130nm process, offering 25,660 logic elements and 1,944,576 bits of embedded memory in a 780-ball FineLine BGA (FC-FBGA) package. It provides 597 user I/O pins and is rated for commercial temperature operation (0C to +85C). The device includes 80 DSP blocks and 12 PLLs, making it suitable for high-performance digital signal processing and high-speed serial interfacing. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that allow engineers to implement arbitrary digital logic. FPGAs occupy the high-performance tier above microcontrollers and CPLDs in the programmable logic hierarchy, delivering parallel processing, deterministic timing, and the ability to be re-programmed in-system. The Stratix family, introduced by Altera in 2002, was the company's first FPGA family built on a 0.13 micron process and was positioned for high-end DSP, communications infrastructure, and ASIC prototyping applications. Key features include support for up to 12 channels of high-speed transceivers depending on die variant, embedded TriMatrix memory blocks distributed throughout the fabric, and up to 80 DSP blocks optimized for high-throughput multiplication-accumulation operations. The 780-FBGA package exposes 597 user I/O pins and supports vertical migration within the Stratix family, allowing engineers to design PCBs that accommodate EP1S10, EP1S20, and EP1S25 density points on a single footprint. Architecture-wise, the EP1S25F780C6N integrates a network of LUT-based logic elements, embedded array blocks (EABs), and a hierarchical interconnect fabric routed by Altera's Quartus II design software. The on-chip PLLs provide clock multiplication, division, and phase shifting for high-speed synchronous designs. Configuration is supported via JTAG, passive serial, or passive parallel modes through dedicated configuration pins. Typical applications include high-speed data acquisition cards, telecommunications switching fabric, ASIC prototyping, video broadcast equipment, and military/aerospace signal processing. The wide I/O count and high logic density make it well suited for multi-channel DSP systems and complex state machines. When designing with this part, ensure that your PCB layout respects the FBGA ball pitch requirements and that thermal management accounts for the higher power dissipation typical of Stratix devices at full utilization. Use Altera Quartus II design software (version 13.0 or earlier for legacy support) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP1S25F780C7 - Stratix 25K LEs, 780-BGA FPGA | Intel / Altera
The Intel / Altera EP1S25F780C7 is a Stratix family Field Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, delivering 25,660 logic elements, 597 user I/Os, and 1,944,576 bits of embedded memory. It is housed in a 780-ball FineLine BGA (FC-FBGA) package measuring 29 x 29 mm with 1 mm ball pitch, and operates from a 1.5 V core supply at up to 420.17 MHz internal performance. A Stratix FPGA is a SRAM-based, look-up-table-driven programmable logic device that integrates configurable logic blocks (CLBs / LEs), embedded memory arrays, DSP blocks, high-speed transceiver circuitry, and a programmable interconnect fabric on a single die. Stratix sits in the FPGA hierarchy as: FPGA > programmable logic device > SRAM-based FPGA > high-performance FPGA. The architecture targets high-bandwidth, compute-intensive digital systems where deterministic timing and parallel processing are required. The EP1S25F780C7 includes 2,566 LABs (Logic Array Blocks) each containing ten logic elements, embedded DSP blocks for fixed- and floating-point arithmetic, TriMatrix on-chip memory (MRAM blocks), and up to 12 channels of high-speed 840 Mbps LVDS signaling per device. The 'F' suffix indicates the FineLine BGA package, '780' denotes the 780-ball pinout, 'C7' indicates the commercial temperature grade (0C to +85C) and speed grade 7. The device supports configuration via passive serial, fast passive parallel, JTAG, or Altera EPC configuration devices. Typical applications for the EP1S25F780C7 include telecom line cards, high-performance DSP pipelines, baseband signal processing in wireless infrastructure, network switches and routers, broadcast video processing, and ASIC prototyping. The high LE count combined with embedded DSP blocks and multi-gigabit transceivers makes the device particularly suited to data-plane applications requiring deterministic parallel throughput. When designing with the EP1S25F780C7, ensure proper decoupling on each power rail (VCCINT, VCCIO, VCC_PLL, VCCA) using 0.1 uF and 10 uF ceramic capacitors placed close to the BGA balls. Plan PCB escape routing carefully: 1 mm pitch BGA requires microvia or via-in-pad technology on 6+ layer stack-ups. The device is now mature and was last produced in the original Stratix generation - for new designs, evaluate Cyclone 10, Arria 10, or Agilex families for active lifecycle support. This page synthesizes distributor pricing, drop-in speed-grade alternatives, package data, and practical design notes that complement the official datasheet.
EP1S25F780C7N - 25K LE Stratix FPGA, 597 I/O, 780-BGA | Intel
The Intel (Altera) EP1S25F780C7N is a member of the original Stratix FPGA family, delivering 25,660 logic elements, 1,944,576 bits of embedded memory, and 597 user I/O in a 780-ball FineLine BGA (FBGA) package. Built on a 1.5 V, 130 nm CMOS process, it integrates up to 420 MHz DSP blocks, embedded TriMatrix memory, and high-speed transceivers for digital signal processing and datapath-intensive designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory, and I/O protocols in a single device. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> FPGAs -> high-density FPGAs -> SoC FPGAs, occupying the high-end segment where ASIC-class performance and flexibility are required. Key features of the EP1S25F780C7N include 2,566 LABs (Logic Array Blocks), dedicated DSP blocks delivering up to 4.29 GMACS performance, 12 embedded PLLs for clock management, and configurable I/O standards including LVDS, SSTL, and HSTL. The device supports both passive serial and fast passive parallel configuration schemes through dedicated JTAG and configuration pins. The Stratix architecture combines a hierarchical interconnect with embedded SRAM, distributed logic, and DSP multipliers, enabling high-throughput pipelined datapaths for DSP, communications, and image processing. The 780-ball FBGA package provides ample signal integrity for high-speed differential interfaces and offers a robust thermal path via the substrate. Typical applications include telecom baseband processing, software defined radio, high-speed image and video processing, ASIC prototyping, and PCI Express endpoint designs. The combination of high logic density, embedded multipliers, and high pin count makes it well suited to multi-channel DSP pipelines and protocol bridging subsystems. When designing with this device, plan configuration scheme (AS, PS, FPP, JTAG) up front, allocate enough decoupling (10 uF bulk + 0.1 uF per VCC/GND pair), and reserve clock and PLL pins early in the pin planner to avoid costly re-routes. Refer to the Stratix Device Handbook for board layout and signal-integrity guidelines. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and PCB-level integration decisions.
EP1S25F780I6 - Stratix 25K LE FPGA, 780-BGA, Industrial | Altera
The Altera (Intel) EP1S25F780I6 is a member of the original Stratix FPGA family, built on a 1.5 V, 0.13 µm all-layer copper SRAM process and packaged in a 780-ball FineLine BGA (29 x 29 mm, 1 mm pitch). The device integrates 25,660 logic elements organized as 2,566 Logic Array Blocks (LABs) and backed by approximately 1,944,576 bits of embedded SRAM, giving designers a balanced fabric for parallel datapaths, FIFOs and on-chip buffering. A total of 597 user I/O pins are brought out, supported by up to 28 DSP blocks containing dedicated 9-bit x 9-bit multipliers for high-throughput fixed-point arithmetic. An FPGA (Field Programmable Gate Array) is a programmable logic device whose configurable logic blocks, interconnect and I/O cells are defined by an SRAM configuration bitstream loaded at power-up. FPGAs sit at the top of the programmable logic hierarchy - above CPLDs in density and below ASICs in per-unit cost - and dominate applications requiring hardware-level parallelism such as DSP, baseband processing, high-speed serial protocol bridging, and ASIC prototyping. The Stratix family in particular introduced embedded memory blocks, DSP blocks and high-speed transceivers as hard IP inside the fabric, accelerating arithmetic-heavy designs that previously had to be built from soft multipliers. Key features of the EP1S25F780I6 include 25,660 logic elements, 1,944,576 RAM bits, 597 user I/Os and 28 DSP blocks. The -I6 speed/temperature grade targets the industrial 0 °C to +85 °C window and operates at the core VCCINT of 1.5 V typical, with separate VCCIO banks supporting common single-ended I/O standards. Configuration is handled via the dedicated JTAG (IEEE 1149.1) interface plus the Altera Passive Serial or Fast Passive Parallel configuration schemes supported by the Stratix configuration controller. Typical applications for the EP1S25F780I6 are telecom line-card datapaths, ASIC and SoC prototyping, custom DSP co-processors, high-speed serial protocol bridging, and industrial control / test-and-measurement backplanes. The combination of 28 DSP blocks and 597 I/Os makes the part particularly suited to designs that need both significant glue-logic capacity and arithmetic density on a single device. When designing with this device, ensure the PCB has at least 6 controlled-impedance layers, decoupling on every VCC/VCCINT/VCCIO ball cluster, and thermal vias under the BGA thermal slug; full configuration and JTAG chains must be planned at board level before layout. The Stratix configuration controller requires a valid configuration bitstream at power-up - do not leave configuration pins floating. This page synthesizes distributor availability, cross-reference alternatives and design notes that supplement the official Stratix device family datasheet, with values verified against live distributor data as of 2026-09-07.
EP1S25F780I6N - Stratix 25,660-LE FPGA, 780-BBGA, Industrial | Altera/Intel
The Intel (formerly Altera) EP1S25F780I6N is a high-density Stratix FPGA from the original Stratix family, integrating 25,660 logic elements across 2,566 logic array blocks (LABs) in a 780-ball FineLine BGA package (29 x 29 mm, 1.0 mm pitch). The device is built on a 1.5 V, 130 nm CMOS process and exposes 597 user I/O pins for high-bandwidth parallel interfaces. What is a Stratix FPGA? A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device organized as a grid of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells. The Stratix family was Altera's first high-end family built on a 1.5 V core with embedded TriMatrix memory blocks and DSP blocks, sitting in the hierarchy: programmable logic -> FPGA -> programmable logic device (PLD) -> digital semiconductor. Key features of the EP1S25F780I6N include 1,944,576 total RAM bits of distributed and block memory, dedicated hardware multipliers for DSP, support for LVDS I/O at up to 840 Mbps, and embedded PLL clock management. The 'I6' speed grade with industrial temperature range (0C to 85C) makes it suitable for commercial and industrial designs, while the 780-BBGA FineLine BGA package supports dense, high-pin-count routing. Architecturally, the Stratix device family introduced the TriMatrix memory architecture with three sizes of embedded RAM blocks (M512, M4K, M-RAM), enabling efficient on-chip data buffering. The DSP blocks support 9-bit, 18-bit, and 36-bit signed arithmetic, allowing efficient implementation of FIR filters, FFTs, and other DSP functions without consuming general-purpose logic. Typical applications include high-speed networking line cards, telecom baseband processing, military and aerospace signal processing, ASIC prototyping, and high-performance DSP coprocessing. The 597 user I/Os and abundant memory make it suitable for protocol bridging, packet processing, and image/video preprocessing. When designing with this part, pay close attention to decoupling strategy (the Stratix family datasheet recommends multiple bulk and high-frequency capacitors across each supply pin), and use the Quartus II design software (version 13.0 or older) since later Quartus releases dropped Stratix support. This page synthesizes real-time distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers validate second-source options and lifecycle risk for a long-lived design.
EP1S30B956C6 - Stratix 32K LE FPGA, 956-BGA, 130nm | Altera
The Altera EP1S30B956C6 is a member of the original Stratix FPGA family, fabricated on a 130 nm CMOS process and housed in a 956-ball FineLine BGA (FCBGA, 40 x 40 mm, 1.27 mm pitch) package. It integrates 32,470 logic elements (LEs), 3,317,184 bits of embedded RAM, and 683 user I/O pins, and is specified for the 0 to 85 C commercial operating range. The suffix C6 indicates the device speed grade and the C designator places the part in the commercial temperature class. An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs / LEs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by SRAM-based configuration memory. Within the broader taxonomy, FPGA belongs to programmable logic, which sits alongside ASICs and CPLDs in the digital semiconductor hierarchy. The Stratix family introduced dedicated TriMatrix embedded memory, DSP blocks, and high-speed I/O to FPGAs, making them suitable for DSP, communications, and high-throughput data-path applications that previously required custom ASICs. Key features of the EP1S30B956C6 include 32,470 LEs organized into 3,247 LABs, 3.4 Mbits of TriMatrix memory distributed across MRAM/M4K/M512 blocks, dedicated DSP blocks for fixed-point multiplication and accumulation, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 12 PLLs for clock management and supports the Altera Passive Parallel (PP), Passive Serial (PS), and JTAG configuration modes via dedicated configuration pins. At the architecture level, the Stratix die combines a row/column interconnect fabric with embedded memory columns and DSP columns, allowing designers to trade off logic, memory, and DSP resources per design. The 130 nm process node at 1.5 V core (VCCINT) provides a balance of static and dynamic power, while the C6 speed grade targets an internal operating frequency up to 450.05 MHz as published in the Stratix family datasheet. Configuration data is stored in an external configuration device (EPCS/EPC) or downloaded through JTAG, after which the device operates standalone with optional in-system reconfiguration. Typical applications include high-speed digital signal processing (filtering, FFT engines), telecommunications backplane protocol bridging, video and image processing pipelines, industrial control and test instrumentation, and ASIC prototyping for high-density logic designs. Designers often pair the EP1S30B956C6 with EPCS64 configuration memories and Altera Quartus II design software for synthesis, place-and-route, and timing closure. When designing with this device, carefully plan the 956-ball FCBGA escape routing, allocate sufficient PCB layers (typically 8+ layers with microvia or via-in-pad capability), and verify thermal management - the 130 nm Stratix family can dissipate several watts under typical workloads. Designers migrating to newer device families should treat the EP1S30B956C6 as NRND/EOL and evaluate Stratix II/III/IV or Cyclone IV/E families for new designs. This page synthesizes distributor pricing, drop-in alternatives from the Stratix family, and practical design notes not found in the manufacturer datasheet, helping engineers verify pinout, package, and life-cycle status in a single document.
EP1S30F1020C5 - Stratix 32K LE FPGA 1020-BGA | Intel
The Intel (formerly Altera) EP1S30F1020C5 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, delivering 32,470 logic elements, 726 user I/O pins, and 3,317,184 bits of embedded memory in a 1020-ball FC-FBGA package. Operating from a 1.5 V core supply with commercial extended temperature grading, the device targets high-performance DSP, telecommunications, and parallel processing designs where Stratix' TriMatrix memory and DSP block architecture provide deterministic throughput. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM and DSP multipliers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) and parallel-programmable ICs, and are positioned between fixed-function ASICs and software-programmable DSPs/microprocessors. The Stratix family, the first generation of high-end Altera FPGAs, replaced the APEX II family and was later superseded by Stratix II/III/IV/V families, but the EP1S30 retains a long-tail installed base in industrial, defense, and test-and-measurement equipment. Key features of the EP1S30F1020C5 include up to 500 MHz internal operation, dedicated DSP blocks for fixed- and floating-point math, embedded TriMatrix memory blocks totaling approximately 3.3 Mbits, and a high-speed I/O ring capable of interfacing to external DDR/DDR2/QDR SRAM. The 'C5' speed grade positions the part at a moderate performance bin suitable for cost-sensitive designs, and the 'F1020' suffix denotes the 1020-ball flip-chip BGA package with full I/O count. Architecturally, the device uses an SRAM-based configuration cell so the bitstream must be loaded from an external PROM or flash on every power-up. The logic element combines a 4-input look-up table (LUT), dedicated carry chain, and register; these LEs are clustered into Logic Array Blocks (LABs) with shared control signals. Hard multipliers, MRAM/M4K memory blocks, and a global/local interconnect fabric provide the structural backbone of Stratix. Typical applications include high-speed DSP pipelines (radar, software-defined radio), protocol bridging (telecom backhaul, SONET/SDH framers), ASIC prototyping, and industrial vision/imaging systems. The wide 1020-pin BGA provides ample LVDS pairs for parallel data acquisition, while the rich DSP/memory ratio enables high-bandwidth signal-processing pipelines. When designing with this part, plan for active thermal management: at 500 MHz the Stratix core can dissipate significant power, and the FC-FBGA demands a multi-layer PCB with via-in-pad and a heatsink path. Confirm Quartus II version support - Intel ended Quartus II subscription updates years ago, so legacy toolchains remain the only stable code path. This page synthesizes distributor inventory, drop-in alternative listings, and design notes not found in the standalone Altera datasheet, providing engineer-ready decision context for new designs, long-life-cycle maintenance, and obsolescence management.
EP1S30F1020C5N - 32K LE Stratix FPGA, 1020-BGA, 500MHz | Intel
The Intel (formerly Altera) EP1S30F1020C5N is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 726 user I/O pins, and 3,317,184 bits of embedded memory in a 1020-ball fine-pitch BGA package. Built on a 130 nm CMOS process with a 1.5 V core supply, it provides up to 500 MHz internal operation and integrates DSP blocks, TriMatrix memory, and high-speed serial interfaces (LVDS). The 'C5' speed grade and 'N' suffix denote the commercial temperature range (0 C to 85 C). A Field Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to configure digital logic at the design bench rather than at the semiconductor fab. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Within that hierarchy, the Stratix family targets high-end, logic-, memory-, and DSP-intensive applications where ASIC NRE costs or time-to-market pressures make custom silicon unattractive. The EP1S30 is positioned as a mid-density member of the family, balancing logic capacity, block RAM, and I/O bandwidth for telecom, networking, and DSP prototyping systems. Key features include 32,470 logic elements arranged in 3,247 LABs, 3,317,184 bits of embedded TriMatrix memory (the largest density at launch for this family tier), up to 726 user I/O pins, dedicated DSP blocks for high-throughput multiplier-accumulators, support for multiple I/O standards including LVDS, and on-chip phase-locked loops for clock management. Per-pin slew-rate and drive-strength control are configurable through the Quartus development tool. Architecturally, the EP1S30 uses a sea-of-LABs layout with routing channels between rows and columns, dedicated multiplier blocks, and embedded RAM blocks of multiple depths. The 1020-ball FC-FBGA package exposes the full logic/memory/DSP fabric and is suitable for high-density boards with controlled-impedance routing. Configuration is typically via JTAG or a passive serial/parallel EPROM. Typical applications include high-performance DSP prototyping, telecom line-card processing, military/aerospace signal processing (commercial temp grade limits to benign environments), and test & measurement backplanes. It is also used in legacy industrial controller upgrades where Stratix I designs cannot be re-targeted. When designing, ensure the 1.5 V core and I/O bank supplies meet the sequencing requirement (VCCINT before VCCIO), use a configuration controller or EPC device for boot, and follow Altera's PCB layout guidelines for FC-FBGA escape routing and thermal pad connection. This page synthesizes distributor pricing for the EP1S30F1020C5N, drop-in Stratix I siblings in the 1020-BGA footprint, and practical design notes not found in the original datasheet.
EP1S30F1020C6 - Stratix FPGA 33K LE, 726 I/O, 1020-BBGA | Altera
The Altera (now Intel) EP1S30F1020C6 is a member of the Stratix family of FPGAs built on a 1.5 V, 0.13 micrometer, all-layer copper SRAM process. The device integrates 32470 logic elements (LEs), 3317184 bits of embedded RAM, 726 user I/O pins, and up to 28 DSP blocks with embedded multipliers. It is housed in a 1020-ball flip-chip BGA (FBGA) package suited for high-density logic and DSP designs. An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic functionality is defined after manufacturing by loading a user-supplied configuration bitstream into on-chip SRAM cells. FPGAs sit in the wider hierarchy programmable logic device (PLD) -> programmable logic -> logic IC -> integrated circuit, and they are commonly chosen over ASICs for low-volume designs, fast time-to-market, and field-upgradable hardware. The Stratix family is positioned for high-performance DSP, communications, and signal-processing applications. Key features of the EP1S30F1020C6 include support for multiple I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X), up to 12 clock management PLLs (depending on variant), True-LVDS with data rates up to several hundred Mbps, dedicated hardware multipliers for DSP, and TriMatrix memory architecture with three block RAM sizes (M512, M4K, M-RAM). The device also offers embedded hard IP for PCI, PCI-X, and external memory interfaces such as DDR SDRAM and QDR SRAM. The architecture combines a multi-level routing fabric, embedded DSP blocks for high-throughput arithmetic, and rich clocking with phase-locked loops and dedicated clock pins. This combination enables the device to sustain high DSP throughput on FIR filters and FFT pipelines, while the embedded transceivers (not present on EP1S30; transceiver support is on Stratix GX variants) are not applicable here, so designers rely on LVDS pairs for high-speed serial-style I/O. Typical applications include high-speed digital signal processing (FFT, FIR, encryption engines), telecom baseband processing, test and measurement instrumentation, video and imaging pipelines, and high-density glue logic in ASIC-prototype designs. The wide I/O count makes it well suited to systems that aggregate many parallel data buses. When designing with the EP1S30F1020C6, plan power distribution carefully: the 1.5 V core with multiple I/O banks requires multiple decoupling capacitors near the BGA balls. The 1020-ball FCBGA footprint demands PCB layers with microvia technology and matched-impedance routing for LVDS pairs. This page combines distributor pricing, drop-in Stratix same-die alternatives, and practical design notes that go beyond the original Altera datasheet. Compared with a bare parametric listing, it provides a clearer view of pin-compatible replacements and trade-offs.
EP1S30F1020C6N - 32,470 Logic Elements Stratix FPGA, 1020-BGA | Intel
The Intel EP1S30F1020C6N is a member of the Stratix Field Programmable Gate Array (FPGA) family, delivering 32,470 logic elements, 3,317,184 RAM bits, and 726 user I/O pins in a 1020-ball FC-FBGA package measuring 33x33 mm. Fabricated on a 130 nm CMOS process, the device supports a 1.5 V core supply and operates at up to 450 MHz system frequency, providing high-density programmable logic for ASIC prototyping, telecommunications, and high-performance digital signal processing. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected through programmable interconnect, allowing designers to implement custom digital logic functions after manufacturing. The Stratix family sits within the programmable logic device (PLD) hierarchy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Compared with ASICs, FPGAs offer rapid time-to-market, in-field re-programmability, and the ability to update functionality over the product lifecycle without respinning silicon. Key features of the EP1S30F1020C6N include dedicated embedded multiplier blocks, embedded TriMatrix memory blocks for distributed and block RAM, four enhanced phase-locked loops (PLLs), and high-speed LVDS and DDR memory interfaces. The 1020-ball FC-FBGA package with 1.0 mm ball pitch allows the 30,740 typical gates to be placed in a single chip, with 726 user I/O enabling high-bandwidth parallel connectivity. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, PCI-X, LVDS, LVPECL, and HSTL for protocol-flexible board design. The Stratix architecture combines a fine-grained logic fabric with hardened memory and DSP blocks, allowing high-throughput pipelines without consuming general-purpose logic. The on-chip TriMatrix memory subsystem supports true dual-port RAM, FIFO buffers, and shift registers at hundreds of MHz. Four enhanced PLLs provide clock multiplication, division, phase shifting, and zero-delay buffering for high-speed synchronous designs. Typical applications include ASIC prototyping and emulation, high-speed telecom line cards, software defined radio, military radar signal processing, and high-end image processing. The combination of high logic density, embedded memory, and dedicated multipliers makes the EP1S30F1020C6N well-suited to designs that require both control logic and parallel DSP arithmetic on a single device. When designing with this part, pay close attention to the 1020-BGA layout: 1.0 mm pitch balls require multi-layer PCB with laser-drilled or micro-via stackups. Thermal management must consider the 33x33 mm body, and the configuration scheme (EPC16 or EPC4 configuration device) must be selected to match the design density. This page synthesizes distributor stock, current pricing, and practical FPGA migration guidance not found in the manufacturer datasheet alone.