EP1S25F780C6N - Stratix 25K LE FPGA, 597 I/O, 780-BGA | Altera
Référence : EP1S25F780C6N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1053.51 | $1 053,51 |
| 10 | $980 | $9 800,00 |
| 50 | $905 | $45 250,00 |
| 100 | $850 | $85 000,00 |
| 500 | $780 | $390 000,00 |
EP1S25F780C6N Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that allow engineers to implement arbitrary digital logic. FPGAs occupy the high-performance tier above microcontrollers and CPLDs in the programmable logic hierarchy, delivering parallel processing, deterministic timing, and the ability to be re-programmed in-system. The Stratix family, introduced by Altera in 2002, was the company's first FPGA family built on a 0.13 micron process and was positioned for high-end DSP, communications infrastructure, and ASIC prototyping applications.
Key features include support for up to 12 channels of high-speed transceivers depending on die variant, embedded TriMatrix memory blocks distributed throughout the fabric, and up to 80 DSP blocks optimized for high-throughput multiplication-accumulation operations. The 780-FBGA package exposes 597 user I/O pins and supports vertical migration within the Stratix family, allowing engineers to design PCBs that accommodate EP1S10, EP1S20, and EP1S25 density points on a single footprint.
Architecture-wise, the EP1S25F780C6N integrates a network of LUT-based logic elements, embedded array blocks (EABs), and a hierarchical interconnect fabric routed by Altera's Quartus II design software. The on-chip PLLs provide clock multiplication, division, and phase shifting for high-speed synchronous designs. Configuration is supported via JTAG, passive serial, or passive parallel modes through dedicated configuration pins.
Typical applications include high-speed data acquisition cards, telecommunications switching fabric, ASIC prototyping, video broadcast equipment, and military/aerospace signal processing. The wide I/O count and high logic density make it well suited for multi-channel DSP systems and complex state machines.
When designing with this part, ensure that your PCB layout respects the FBGA ball pitch requirements and that thermal management accounts for the higher power dissipation typical of Stratix devices at full utilization. Use Altera Quartus II design software (version 13.0 or earlier for legacy support) for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1S25F780C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S25F780C6N (même facteur de forme et même empreinte) — différant par Package, DSP Blocks, Operating Temperature, Speed Grade, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S25F780C5N
✅ Remplacement direct✓ En stock
$595 / unité
Voir la fiche technique →EP1S25F780C6
✅ Remplacement direct✓ En stock
$791.02 / unité
Voir la fiche technique →EP1S25F780I6N
✅ Remplacement direct✓ En stock
$1250 / unité
Voir la fiche technique →EP1S20F780C6N
✅ Remplacement direct✓ En stock
$188.75 / unité
Voir la fiche technique →EP1S10F780C6N
✅ Remplacement direct✓ En stock
$205 / unité
Voir la fiche technique →EP1S25F780C6N Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 597 |
| Number of LABs | 2,566 |
| DSP Blocks | 80 |
| PLLs | 12 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Boîtier | 780-BGA (FC-FBGA, FineLine) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Configuration Method | JTAG, Passive Serial, Passive Parallel |
| Statut RoHS | Compliant |
| Speed Grade | C6 |
Guide de configuration des broches du EP1S25F780C6N 780-bga (fc-fbga, fineline)
Configuration des broches du EP1S25F780C6N (boîtier 780-bga (fc-fbga, fineline)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S25F780C6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S25F780C6N convient pour 6 applications: ASIC Prototyping and Emulation, High-Speed Telecommunications Infrastructure, Video Broadcast and Image Processing, Industrial Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Medical Imaging Accelerator.
ASIC Prototyping and Emulation
The EP1S25F780C6N's 25,660 logic elements and 1,944,576 bits of TriMatrix memory make it a proven platform for ASIC emulation and rapid prototyping of multi-million-gate designs. Its 80 DSP blocks and 12 PLLs allow prototyping of complex DSP subsystems alongside custom logic, while the 597 user I/O pins map cleanly to high-pin-count ASICs. Compared to ASIC fabrication cycles of 6-12 months, a single Stratix FPGA can validate RTL in days, dramatically reducing time-to-silicon. Use Quartus II with the Design Partitioning flow to map large ASIC partitions across multiple FPGAs.
Recommandé
High-Speed Telecommunications Infrastructure
Telecom line cards and switching fabrics benefit from the EP1S25F780C6N's high logic density, 597 I/O count, and support for multiple high-speed I/O standards including LVDS and HSTL. The 12 on-chip PLLs provide the multi-frequency clock synthesis required for SONET/SDH, Ethernet MACs, and ATM fabric interfacing. Per the Stratix datasheet, the embedded memory supports per-port buffering at wire rates, while 80 DSP blocks accelerate forward error correction and channel equalization. This combination is well-matched to mid-2000s telecom equipment still in field service.
Recommandé
Video Broadcast and Image Processing
Broadcast video processing cards leverage the EP1S25F780C6N's parallel processing capability, with 80 DSP blocks delivering the throughput needed for real-time HD-SDI processing, color space conversion, and motion-adaptive deinterlacing. The 1,944,576 bits of embedded memory provide line-buffer and frame-buffer storage without external SRAM in many designs, while 597 I/O pins support multi-channel SDI/HDMI input and output expansion. Quartus II MegaWizard IP cores for SDI, AES, and MPEG provide a fast development starting point for broadcast OEMs maintaining legacy equipment.
Recommandé
Industrial Test and Measurement Instrumentation
ATE (Automatic Test Equipment) and high-end oscilloscopes employ the EP1S25F780C6N for waveform synthesis, pattern generation, and real-time DSP-based signal analysis. The 12 PLLs and 597 I/O pins enable precise timing alignment across multiple measurement channels, while 80 DSP blocks accelerate FFT, FIR filtering, and modulation analysis required for vector signal analysis. Per the Stratix datasheet, the device's deterministic routing architecture supports fine-grained timing closure for sub-nanosecond jitter requirements in T&M applications.
Recommandé
Military and Aerospace Signal Processing
Legacy defense programs continue to use the EP1S25F780C6N for radar signal processing, electronic warfare subsystems, and secure communications. The 25,660 logic elements, 597 user I/O, and 80 DSP blocks support multi-channel digital beamforming, pulse compression, and cryptographic acceleration. While the C6 speed grade is commercial-temperature, the EP1S25F780I6N industrial variant is often used in aerospace enclosures with controlled thermal environments. Per Altera's military/aerospace legacy documentation, Stratix devices meet the long-lifecycle support requirements typical of defense programs.
Recommandé
Medical Imaging Accelerator
Medical imaging systems such as ultrasound scanners, CT reconstruction boards, and MRI pre-processors use the EP1S25F780C6N for parallel DSP-based beamforming and image reconstruction. The 80 DSP blocks deliver the multiply-accumulate throughput needed for real-time tomographic reconstruction, while 1,944,576 bits of TriMatrix memory provide on-chip buffering of intermediate results to reduce external memory bandwidth pressure. The 597 I/O count supports multi-channel analog front-end interfacing typical of premium ultrasound carts, and the C6 speed grade meets timing closure for high-frame-rate imaging.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S25F780C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S25F780C5N | EP1S25F780C6 | EP1S25F780I6N | EP1S20F780C6N | EP1S10F780C6N |
|---|---|---|---|---|---|---|
| Package | 780-BGA (FC-FBGA) | 780-BGA (FC-FBGA) - same | 780-BGA (FC-FBGA) - same | 780-BGA (FC-FBGA) - same | 780-BGA (FC-FBGA) - same | 780-BGA (FC-FBGA) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 18,460 | 10,570 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,669,248 | 920,448 |
| User I/O Count | 597 | 597 | 597 | 597 | 586 | 426 |
| Speed Grade | C6 | C5 (slower) | C6 | I6 (industrial temp) | C6 | C6 |
| DSP Blocks | 80 | 80 | 80 | 80 | 64 | 40 |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- 25,660 logic elements - the highest in the Stratix 780-BGA family tier (vs EP1S20F780C6N)
- 80 DSP blocks for parallel multiply-accumulate throughput (vs EP1S10F780C6N)
- Commercial C6 speed grade with widest distributor availability (vs EP1S25F780I6N)
Notes de conception
Estimated: Stratix FPGAs at full utilization (25,660 LE, 80 DSP blocks at high toggle rates) can dissipate 5-10 W. The 780-FBGA package requires substantial PCB thermal management; per the Stratix Device Family Data Sheet, designers should implement at least a 4-layer PCB with dedicated ground/power planes and provide thermal vias beneath the BGA array. Junction temperature must remain below 125C for commercial grade; use the Altera PowerPlay Early Power Estimator before layout commitment to plan thermal dissipation. For enclosed chassis without airflow, attach a heatsink directly to the package top via thermal interface material.
The 780-FBGA FineLine BGA package uses a 1.0 mm ball pitch, requiring PCB fabrication capabilities of 4/4 mil line/space and microvia or stacked-via technology. Per Altera's package guidelines, route all signals on inner layers to escape the BGA, and dedicate outer microvia layers for power and ground fan-out. Use the manufacturer's recommended decoupling scheme: 0.1 uF and 0.01 uF ceramic capacitors placed as close as possible to every power pin pair, plus bulk capacitors on each supply rail.
Configuration pin handling is a frequent source of design errors. The MSEL pins must be tied to the correct logic levels to select the desired configuration scheme (AS, AP, PS, PP, or JTAG). Per the Stratix datasheet, the nCE and nCONFIG pins require external 10 kohm pull-up resistors to VCC, and the configuration clock (DCLK) line must be length-matched for reliable data transfer. Forgetting to connect CONF_DONE to a status LED or processor GPIO is a common debugging pitfall - this is the primary indicator that configuration has completed successfully.
I/O bank voltage compatibility must be planned at the schematic stage. The 597 user I/O pins are divided into multiple I/O banks, each supporting a configurable VCCIO voltage (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) and VREF supply. Mixing incompatible I/O standards across banks without proper VREF planning causes level-shifter errors. Quartus II's Pin Planner tool validates I/O assignments against bank constraints before board fabrication, which should be run as a mandatory pre-layout check.
Informations de conformité
RoHS compliant per Altera/Intel legacy product page. Lead-free 780-FBGA package. Not AEC-Q100 qualified (FPGA is not an automotive-grade part). NRND status; verify supply continuity with authorized distributors for new programs.
