MPX2200DP vs MPX2100D Comparaison

Comparaison détaillée côte à côte de MPX2200DP par NXP Semiconductors et MPX2100D par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MPX2100D MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D ✓ Actif

Comparaison des spécifications

Paramètre MPX2200DP MPX2100D
Marque NXP Semiconductors NXP Semiconductors
Catégorie Pressure Sensors Pressure Sensors
Statut du cycle de vie Actif Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $10,52 $17,80
Manufacturer NXP Semiconductors (formerly Motorola) —
Series MPX2200 —
Type de capteur Differential Pressure Sensor (Piezoresistive) —
Operating Pressure Range 0 kPa to 200 kPa (0 PSI to 29.01 PSI) 0 kPa to 100 kPa (0 to 14.5 psi)
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] —
Type de sortie Analog Wheatstone Bridge (ratiometric) Analog ratiometric Wheatstone bridge (millivolts)
Output Span 0 mV to 40 mV at 10 V excitation —
Sensitivity (nominal) 0.2 mV/kPa —
Pressure Port Dual Male Tube, 0.19 in (4.93 mm) —
Port Configuration DP - Dual Port (differential) —
Supply Voltage (recommended) 10 V DC —
Supply Voltage (max input) 16 V DC —
Température de fonctionnement -40C to +125C —
Boîtier / Format 4-SIP Module (Through-Hole) —
Type de montage Through Hole Through-hole SIP module
Statut RoHS Compliant Compliant [DATA_NEEDED: confirm from NXP product page]
Minimum Order Quantity 100 (tray pack) —
Min. Package Quantity 20 (tray) —
Pressure Type — Differential
Full-Scale Span (Typical) — 40 mV at 10 V excitation
Sensitivity (Nominal) — 0.4 mV/kPa
Supply Voltage (Recommended) — 10 V DC
Supply Voltage (Maximum) — 16 V DC
Pressure Port Configuration — Dual axial ports (differential)
Boîtier — 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch
Package Body Dimensions — 15.56 mm x 15.56 mm x 5.33 mm
Plage de température de fonctionnement — -40C to +125C [DATA_NEEDED: confirm exact range from datasheet]
On-Chip Temperature Compensation — Yes (factory laser-trimmed)
Technology — Silicon piezoresistive MEMS strain-gauge bridge
Diaphragm Material — Silicon [DATA_NEEDED: confirm]
Linearity — 0.1% to 0.3% typical [DATA_NEEDED: confirm]

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