10AX115N2F45I1SG - Arria 10 GX FPGA, 1.15M LE, F45 | Intel / Altera
Référence : 10AX115N2F45I1SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9916.86 | $9 916,86 |
| 10 | $9420.01 | $94 200,10 |
| 100 | $8420.16 | $842 016,00 |
| 500 | $7650.5 | $3 825 250,00 |
| 1 000 | $7150 | $7 150 000,00 |
10AX115N2F45I1SG Présentation
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that engineers configure after manufacturing using a hardware description language (HDL) such as Verilog or VHDL. FPGAs sit hierarchically between general-purpose microcontrollers and fixed-function ASICs (Application-Specific Integrated Circuits): microcontrollers run software sequentially, ASICs implement fixed hardware for high-volume production, while FPGAs deliver custom hardware parallelism with no NRE cost and fast time-to-market.
Key features of the 10AX115N2F45I1SG include 1,150,000 logic elements, 68.86 Mbits of M20K embedded SRAM, 3,036 18x19 variable-precision multipliers, 24 transceivers at up to 17.4 Gbps (backplane capable), 768 general-purpose I/Os, and a 0.9 V core supply. The F45 package suffix denotes the 45 mm body size with F45 transceiver line rates, while the I1 speed grade and industrial temperature range (-40C to +100C) support ruggedized deployment.
Architecturally, Arria 10 GX uses a monolithic fabric with Adaptive Logic Modules (ALMs), distributed MLAB memory, and column-based DSP blocks. Hard PCI Express Gen3 x8 IP cores and 100 GbE MACs reduce soft-logic overhead. Partial reconfiguration is supported, allowing live logic swap for fault tolerance and power management.
Typical applications include 100G optical transport network line cards, wireless baseband processing (LTE/5G), military radar signal processing, medical imaging accelerators, broadcast video processing, and high-performance computing (HPC) coprocessors. The combination of transceivers, DSP, and large on-chip memory suits any latency-sensitive, parallelizable workload.
When designing with this device, ensure your PCB has a 1932-ball BGA layout with appropriate escape routing. Thermal management is critical - the F45 package has limited headroom in industrial airflow, so a heatsink and 8-layer PCB with thermal vias under the lid are recommended for full transceiver utilization.
This page synthesizes distributor pricing, drop-in same-brand Arria 10 variants, and practical design notes for the Arria 10 GX F45 footprint that go beyond the manufacturer datasheet front page.
Alternatives de remplacement direct pour 10AX115N2F45I1SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX115N2F45I1SG (même facteur de forme et même empreinte) — différant par Package, Process Technology, DSP Blocks, Speed Grade, Transceivers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX115N2F45E2SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3570 / unité
Voir la fiche technique →10AX115N2F40I2SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3750 / unité
Voir la fiche technique →10AX115N2F40I1SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3720 / unité
Voir la fiche technique →10AX115N1F45I1SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5120 / unité
Voir la fiche technique →10AX090N2F45I1SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6450 / unité
Voir la fiche technique →10AX115H2F34I1SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3700 / unité
Voir la fiche technique →10AX115N2F45I1SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 (68.86 Mbit) |
| DSP Blocks | 3,036 (18x19 multipliers) |
| User I/O Count | 768 |
| Boîtier | 1932-ball FC-FBGA (F45, 45 mm) |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Speed Grade | I1 (industrial, slowest) |
| Temperature Grade | Industrial (-40C to +100C) |
| Transceivers | 24 (up to 17.4 Gbps) |
| PCIe Hard IP | Gen3 x8 |
| Memory Interface | DDR4 up to 2666 Mbps, QDR IV |
| Adaptive Logic Modules (ALMs) | 427,200 |
| MLAB Memory (bits) | 8,812,800 |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Guide de configuration des broches du 10AX115N2F45I1SG 1932-ball fc-fbga (f45, 45 mm)
Configuration des broches du 10AX115N2F45I1SG (boîtier 1932-ball fc-fbga (f45, 45 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX115N2F45I1SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX115N2F45I1SG convient pour 7 applications: 100G Optical Transport Network Line Card, Wireless Baseband Processing (4G LTE / 5G NR), Military Radar Signal Processing, Medical Imaging Accelerator (CT / MRI Reconstruction), Broadcast Video Processing and Conversion, High-Performance Computing Coprocessor / Network Appliance, Test and Measurement Instrumentation.
100G Optical Transport Network Line Card
The 10AX115N2F45I1SG fits 100G OTN line cards because its 24 transceivers at 17.4 Gbps natively support 4x25.78G CAUI-4 for a single 100G port or 2x40G/4x25G with hitless switching. The 1.15M LE fabric implements framer, mapper, and FEC (RS-FEC/GFEC) cores in parallel, while 68.86 Mbit embedded memory buffers OTN overhead and GFP-F frames without external SRAM. The hardened 100 GbE MAC and PCIe Gen3 x8 cores cut soft-logic overhead by 30% versus competing FPGAs. Designers typically place the FPGA on an 8-layer PCB with a finned heatsink to keep the junction below 100C at full 35 W.
Recommandé
Wireless Baseband Processing (4G LTE / 5G NR)
The 10AX115N2F45I1SG handles LTE-A Pro and 5G NR baseband processing thanks to its 3,036 18x19 DSP blocks delivering up to 1.5 TMACS of fixed-point throughput at 600 MHz. This enables a single FPGA to implement a complete 4x4 MIMO layer plus channel coding (LDPC/turbo) and rate-matching for sub-6 GHz small cells. The 24 transceivers at 17.4 Gbps interface directly to CPRI 9.8G or eCPRI 25G fronthaul, eliminating external PHY chips. Industrial temperature grade (-40C to +100C) supports outdoor remote-radio-head (RRH) and small-cell deployments where commercial parts would derate.
Recommandé
Military Radar Signal Processing
The 10AX115N2F45I1SG is widely deployed in phased-array radar systems because 1.15M LE plus 3,036 DSP blocks run pulse compression, MTI/MTD filtering, and CFAR detection on 4-8 receive channels simultaneously. Embedded M20K memory holds radar range bins with zero external SRAM latency, critical for sub-microsecond processing windows. Industrial temperature grade and conformal-coat-ready FC-FBGA package meet MIL-STD-810 shock/vibration profiles. The 17.4 Gbps transceivers feed raw ADC data from A/D converters like the ADC12J4000 over JESD204B/C, simplifying board layout.
Recommandé
Medical Imaging Accelerator (CT / MRI Reconstruction)
The 10AX115N2F45I1SG accelerates CT back-projection and MRI Fourier reconstruction, where its 3,036 DSP blocks deliver the GFLOPs needed to reconstruct a 512x512 image in real time from raw sensor data. The 68.86 Mbit embedded memory holds projection sinograms without off-chip access stalls. Hardened PCIe Gen3 x8 connects to the host CPU at 8 GB/s, streaming raw data and returning reconstructed slices. Compared with GPU coprocessors, the FPGA offers deterministic sub-frame latency required for interventional imaging where motion artifacts are unacceptable.
Recommandé
Broadcast Video Processing and Conversion
The 10AX115N2F45I1SG supports broadcast workflows including 4K/UHD up-conversion, HDR (HLG/PQ) tone mapping, and ST 2059 / SMPTE 2110 IP video gateways. Its 24 transceivers handle 12G-SDI or 25G Ethernet IP-packet video, while the 1.15M LE fabric implements multi-channel scaling, de-interlacing, and color-space conversion in parallel. Hardened 100 GbE MAC aggregates 4x25G IP video streams into a single trunk. Industrial temperature grade supports fan-cooled broadcast racks where commercial FPGAs would otherwise fail.
Recommandé
High-Performance Computing Coprocessor / Network Appliance
The 10AX115N2F45I1SG functions as a PCIe Gen3 x8 coprocessor or SmartNIC in HPC and storage appliances, offloading cryptography, compression, or NVMe-oF acceleration. The 1.15M LE fabric implements 100G AES-XTS, gzip/zstd, and Reed-Solomon codecs at line rate, while 24 transceivers feed dual 100 GbE or four 25 GbE ports. The 68.86 Mbit embedded memory holds working-set crypto keys and dictionary tables, avoiding costly external SRAM lookups. Compared with merchant ASICs, this FPGA allows field upgrade for new algorithms and protocols.
Recommandé
Test and Measurement Instrumentation
The 10AX115N2F45I1SG is used in high-end oscilloscopes, BERTs, and protocol analyzers where it generates and captures waveforms at rates beyond what commodity ASICs handle. The 3,036 DSP blocks enable real-time FFT-based spectrum analysis on multi-GHz signals, while 24 transceivers at 17.4 Gbps feed parallel ADC/DAC arrays. 768 user I/Os interface to display controllers, DRAM, and trigger logic. The industrial temperature grade and conformal-coat-capable package support portable field test sets exposed to vibration and humidity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX115N2F45I1SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX115N2F45E2SG | 10AX115N2F40I2SG | 10AX115N2F40I1SG | 10AX115N1F45I1SG | 10AX090N2F45I1SG | 10AX115H2F34I1SG |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1932-ball FC-FBGA (F45 45 mm) | 1932-ball FC-FBGA (F45 45 mm) - same | 1932-ball FC-FBGA (F40 40 mm) - same ball count, smaller body | 1932-ball FC-FBGA (F40 40 mm) - same ball count, smaller body | 1932-ball FC-FBGA (F45 45 mm) - same | 1932-ball FC-FBGA (F45 45 mm) - same | 1152-ball FC-FBGA (F34 34 mm) - DIFFERENT package |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) | 1,150,000 |
| Embedded Memory | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 53.97 Mbit (-22%) | 68.86 Mbit |
| DSP Blocks (18x19) | 3,036 | 3,036 | 3,036 | 3,036 | 3,036 | 2,420 (-20%) | 3,036 |
| Transceivers | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 12.5 Gbps (-28%) |
| Speed Grade | I1 (industrial) | E2 (extended) | I2 (industrial faster) | I1 (industrial) | I1 (slower core, same temp) | I1 (industrial) | I1 (industrial) |
| User I/O | 768 | 768 | 768 | 768 | 768 | 768 | 480 (-38%) |
Principaux différenciateurs
- Same-package higher-speed drop-in alternative (vs 10AX115N2F40I2SG)
- Industrial temperature grade at lowest speed bin for cost-sensitive rugged applications (vs 10AX115N3F45I2SG)
- Full 1.15M LE capacity versus reduced 900K LE for cost-down designs (vs 10AX090N2F45I1SG)
Notes de conception
The 1932-ball FC-FBGA F45 package has a typical junction-to-ambient theta_JA of approximately 1.5 C/W with 8 thermal vias in a 4x4 array under the lid, but this rises above 8 C/W without forced airflow. At full 35 W load, expect junction temperature rise of 50-280 C above ambient depending on airflow. For industrial (-40C to +100C) reliability, design for at most 60 W/sqcm with 200 LFM airflow, or use a finned heatsink rated for 0.3 C/W.
1 mm pitch BGA escape routing requires 4-6 signal layers plus dedicated ground and power planes. Use 0.5 oz copper on outer layers and 1 oz on inner layers for transceiver channels. Microvia/stacked-via construction is recommended; through-via stubs degrade 17.4 Gbps transceiver eye margins by 10-15% per datasheet simulation. Place all 0.9 V core decoupling within 5 mm of BGA balls with 0402 or 0201 ceramics.
24 transceiver channels at 17.4 Gbps demand strict impedance control (100 ohm differential +/-10%) and length matching within 0.127 mm (5 mil). Use an 8-12 layer stackup with buried stripline for longest routes. AC-coupling capacitors must be placed at the receiver side per Arria 10 GX transceiver user guide. Reference clock jitter must remain below 150 fs RMS for 17.4 Gbps operation.
Common pitfalls include selecting the wrong F45 vs F34 footprint (different ball counts, NOT pin-compatible despite same family), under-sizing the 0.9 V regulator for inrush current during simultaneous 24-transceiver initialization, omitting MSL3 bake-out (FC-FBGA packages absorb moisture and crack at reflow above 245 C without pre-bake), and using Quartus Prime Standard instead of Pro for hierarchical partial reconfiguration.
Informations de conformité
RoHS and REACH compliant per Altera/Intel product page. AEC-Q100 not applicable (this is an FPGA, not a discrete automotive IC). Industrial temperature grade meets outdoor telecom and factory floor requirements.
