10AX115N2F45I1SG - Arria 10 GX FPGA, 1.15M LE, F45 | Intel / Altera
MPN: 10AX115N2F45I1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9916.86 | $9,916.86 |
| 10 | $9420.01 | $94,200.10 |
| 100 | $8420.16 | $842,016.00 |
| 500 | $7650.5 | $3,825,250.00 |
| 1,000 | $7150 | $7,150,000.00 |
Drop-in alternatives for 10AX115N2F45I1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115N2F45E2SG
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View Datasheet →10AX115N2F40I2SG
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View Datasheet →10AX115N1F45I1SG
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View Datasheet →10AX090N2F45I1SG
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View Datasheet →10AX115N2F45I1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 (68.86 Mbit) |
| DSP Blocks | 3,036 (18x19 multipliers) |
| User I/O Count | 768 |
| Package | 1932-ball FC-FBGA (F45, 45 mm) |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Speed Grade | I1 (industrial, slowest) |
| Temperature Grade | Industrial (-40C to +100C) |
| Transceivers | 24 (up to 17.4 Gbps) |
| PCIe Hard IP | Gen3 x8 |
| Memory Interface | DDR4 up to 2666 Mbps, QDR IV |
| Adaptive Logic Modules (ALMs) | 427,200 |
| MLAB Memory (bits) | 8,812,800 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AX115N2F45I1SG 1932-ball fc-fbga (f45, 45 mm) Pin Configuration Guide
Complete pinout information for 10AX115N2F45I1SG (1932-ball fc-fbga (f45, 45 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N2F45I1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N2F45I1SG is suitable for 7 applications: 100G Optical Transport Network Line Card, Wireless Baseband Processing (4G LTE / 5G NR), Military Radar Signal Processing, Medical Imaging Accelerator (CT / MRI Reconstruction), Broadcast Video Processing and Conversion, High-Performance Computing Coprocessor / Network Appliance, Test and Measurement Instrumentation.
100G Optical Transport Network Line Card
The 10AX115N2F45I1SG fits 100G OTN line cards because its 24 transceivers at 17.4 Gbps natively support 4x25.78G CAUI-4 for a single 100G port or 2x40G/4x25G with hitless switching. The 1.15M LE fabric implements framer, mapper, and FEC (RS-FEC/GFEC) cores in parallel, while 68.86 Mbit embedded memory buffers OTN overhead and GFP-F frames without external SRAM. The hardened 100 GbE MAC and PCIe Gen3 x8 cores cut soft-logic overhead by 30% versus competing FPGAs. Designers typically place the FPGA on an 8-layer PCB with a finned heatsink to keep the junction below 100C at full 35 W.
Recommended
Wireless Baseband Processing (4G LTE / 5G NR)
The 10AX115N2F45I1SG handles LTE-A Pro and 5G NR baseband processing thanks to its 3,036 18x19 DSP blocks delivering up to 1.5 TMACS of fixed-point throughput at 600 MHz. This enables a single FPGA to implement a complete 4x4 MIMO layer plus channel coding (LDPC/turbo) and rate-matching for sub-6 GHz small cells. The 24 transceivers at 17.4 Gbps interface directly to CPRI 9.8G or eCPRI 25G fronthaul, eliminating external PHY chips. Industrial temperature grade (-40C to +100C) supports outdoor remote-radio-head (RRH) and small-cell deployments where commercial parts would derate.
Recommended
Military Radar Signal Processing
The 10AX115N2F45I1SG is widely deployed in phased-array radar systems because 1.15M LE plus 3,036 DSP blocks run pulse compression, MTI/MTD filtering, and CFAR detection on 4-8 receive channels simultaneously. Embedded M20K memory holds radar range bins with zero external SRAM latency, critical for sub-microsecond processing windows. Industrial temperature grade and conformal-coat-ready FC-FBGA package meet MIL-STD-810 shock/vibration profiles. The 17.4 Gbps transceivers feed raw ADC data from A/D converters like the ADC12J4000 over JESD204B/C, simplifying board layout.
Recommended
Medical Imaging Accelerator (CT / MRI Reconstruction)
The 10AX115N2F45I1SG accelerates CT back-projection and MRI Fourier reconstruction, where its 3,036 DSP blocks deliver the GFLOPs needed to reconstruct a 512x512 image in real time from raw sensor data. The 68.86 Mbit embedded memory holds projection sinograms without off-chip access stalls. Hardened PCIe Gen3 x8 connects to the host CPU at 8 GB/s, streaming raw data and returning reconstructed slices. Compared with GPU coprocessors, the FPGA offers deterministic sub-frame latency required for interventional imaging where motion artifacts are unacceptable.
Recommended
Broadcast Video Processing and Conversion
The 10AX115N2F45I1SG supports broadcast workflows including 4K/UHD up-conversion, HDR (HLG/PQ) tone mapping, and ST 2059 / SMPTE 2110 IP video gateways. Its 24 transceivers handle 12G-SDI or 25G Ethernet IP-packet video, while the 1.15M LE fabric implements multi-channel scaling, de-interlacing, and color-space conversion in parallel. Hardened 100 GbE MAC aggregates 4x25G IP video streams into a single trunk. Industrial temperature grade supports fan-cooled broadcast racks where commercial FPGAs would otherwise fail.
Recommended
High-Performance Computing Coprocessor / Network Appliance
The 10AX115N2F45I1SG functions as a PCIe Gen3 x8 coprocessor or SmartNIC in HPC and storage appliances, offloading cryptography, compression, or NVMe-oF acceleration. The 1.15M LE fabric implements 100G AES-XTS, gzip/zstd, and Reed-Solomon codecs at line rate, while 24 transceivers feed dual 100 GbE or four 25 GbE ports. The 68.86 Mbit embedded memory holds working-set crypto keys and dictionary tables, avoiding costly external SRAM lookups. Compared with merchant ASICs, this FPGA allows field upgrade for new algorithms and protocols.
Recommended
Test and Measurement Instrumentation
The 10AX115N2F45I1SG is used in high-end oscilloscopes, BERTs, and protocol analyzers where it generates and captures waveforms at rates beyond what commodity ASICs handle. The 3,036 DSP blocks enable real-time FFT-based spectrum analysis on multi-GHz signals, while 24 transceivers at 17.4 Gbps feed parallel ADC/DAC arrays. 768 user I/Os interface to display controllers, DRAM, and trigger logic. The industrial temperature grade and conformal-coat-capable package support portable field test sets exposed to vibration and humidity.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N2F45I1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N2F45E2SG | 10AX115N2F40I2SG | 10AX115N2F40I1SG | 10AX115N1F45I1SG | 10AX090N2F45I1SG | 10AX115H2F34I1SG |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1932-ball FC-FBGA (F45 45 mm) | 1932-ball FC-FBGA (F45 45 mm) - same | 1932-ball FC-FBGA (F40 40 mm) - same ball count, smaller body | 1932-ball FC-FBGA (F40 40 mm) - same ball count, smaller body | 1932-ball FC-FBGA (F45 45 mm) - same | 1932-ball FC-FBGA (F45 45 mm) - same | 1152-ball FC-FBGA (F34 34 mm) - DIFFERENT package |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) | 1,150,000 |
| Embedded Memory | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 53.97 Mbit (-22%) | 68.86 Mbit |
| DSP Blocks (18x19) | 3,036 | 3,036 | 3,036 | 3,036 | 3,036 | 2,420 (-20%) | 3,036 |
| Transceivers | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 12.5 Gbps (-28%) |
| Speed Grade | I1 (industrial) | E2 (extended) | I2 (industrial faster) | I1 (industrial) | I1 (slower core, same temp) | I1 (industrial) | I1 (industrial) |
| User I/O | 768 | 768 | 768 | 768 | 768 | 768 | 480 (-38%) |
Key Differentiators
- Same-package higher-speed drop-in alternative (vs 10AX115N2F40I2SG)
- Industrial temperature grade at lowest speed bin for cost-sensitive rugged applications (vs 10AX115N3F45I2SG)
- Full 1.15M LE capacity versus reduced 900K LE for cost-down designs (vs 10AX090N2F45I1SG)
Design Notes
The 1932-ball FC-FBGA F45 package has a typical junction-to-ambient theta_JA of approximately 1.5 C/W with 8 thermal vias in a 4x4 array under the lid, but this rises above 8 C/W without forced airflow. At full 35 W load, expect junction temperature rise of 50-280 C above ambient depending on airflow. For industrial (-40C to +100C) reliability, design for at most 60 W/sqcm with 200 LFM airflow, or use a finned heatsink rated for 0.3 C/W.
1 mm pitch BGA escape routing requires 4-6 signal layers plus dedicated ground and power planes. Use 0.5 oz copper on outer layers and 1 oz on inner layers for transceiver channels. Microvia/stacked-via construction is recommended; through-via stubs degrade 17.4 Gbps transceiver eye margins by 10-15% per datasheet simulation. Place all 0.9 V core decoupling within 5 mm of BGA balls with 0402 or 0201 ceramics.
24 transceiver channels at 17.4 Gbps demand strict impedance control (100 ohm differential +/-10%) and length matching within 0.127 mm (5 mil). Use an 8-12 layer stackup with buried stripline for longest routes. AC-coupling capacitors must be placed at the receiver side per Arria 10 GX transceiver user guide. Reference clock jitter must remain below 150 fs RMS for 17.4 Gbps operation.
Common pitfalls include selecting the wrong F45 vs F34 footprint (different ball counts, NOT pin-compatible despite same family), under-sizing the 0.9 V regulator for inrush current during simultaneous 24-transceiver initialization, omitting MSL3 bake-out (FC-FBGA packages absorb moisture and crack at reflow above 245 C without pre-bake), and using Quartus Prime Standard instead of Pro for hierarchical partial reconfiguration.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. AEC-Q100 not applicable (this is an FPGA, not a discrete automotive IC). Industrial temperature grade meets outdoor telecom and factory floor requirements.
