10CL010YE144C6G - Cyclone 10 LP FPGA 10K LE, 144-LQFP | Altera/Intel
Référence : 10CL010YE144C6G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.18 | $4,18 |
| 10 | $3.82 | $38,20 |
| 100 | $3.35 | $335,00 |
| 500 | $2.95 | $1 475,00 |
| 1 000 | $2.6 | $2 600,00 |
10CL010YE144C6G Présentation
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LBs), programmable routing, and dedicated I/O, allowing designers to create custom digital circuits in silicon. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside CPLDs (Complex Programmable Logic Devices) and are themselves a subset of Application-Specific Integrated Circuits (ASICs) that the user can program in the field after manufacture. Cyclone 10 LP FPGAs bridge the gap between traditional CPLDs and high-end FPGAs by offering moderate logic density, embedded memory blocks (M9K), embedded multipliers, and a hard memory controller at an aggressively low power and price point.
Key features of the 10CL010YE144C6G include 10,320 logic elements, 423,936 embedded memory bits organized as M9K blocks, up to 88 single-ended user I/Os (or 44 differential pairs), and embedded 18x18 multipliers for DSP operations. The device supports LVDS, LVTTL, LVCMOS, SSTL, and other I/O standards via configurable I/O banks, and includes dedicated PLL blocks for clock management. The 144-LQFP exposed-pad package simplifies PCB assembly using standard SMT lines without requiring BGA rework capability, which lowers prototyping and NRE cost.
Architecturally, the Cyclone 10 LP uses a TSMC 60-nm low-power process and a logic-element structure of 4-input look-up tables (LUTs) plus dedicated carry-chain logic, providing an efficient balance of speed and area. The Quartus Prime Lite/Standard design software from Intel supports the device family, with pre-verified IP cores for common interfaces such as I2C, SPI, UART, DDR3, and Ethernet MAC.
Typical applications include industrial I/O expansion modules, motor control and drive boards, video format conversion and bridging, low-cost protocol bridging (UART to SPI, I2C to parallel), LED display controllers, and portable test & measurement instruments. Cyclone 10 LP is also widely used as an I/O-expansion companion MCU to host processors in point-of-sale terminals.
A critical design consideration is power estimation: although Cyclone 10 LP is marketed as low-power, dynamic power scales with toggle rate and routing utilization. Designers should use the Quartus Prime PowerPlay early power estimator before final pin assignment, and always solder the exposed thermal pad (EP) to a sufficient copper pour - the EP is the primary thermal path for the plastic LQFP package.
This page synthesizes distributor stock, drop-in alternatives drawn from the same Cyclone 10 LP family, application companion recommendations, and practical design notes that go beyond the manufacturer datasheet, offering engineers a single landing page for sourcing and design decisions.
Alternatives de remplacement direct pour 10CL010YE144C6G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL010YE144C6G (même facteur de forme et même empreinte) — différant par Package, Embedded Memory, Core Voltage, Process Node, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL010YE144C8G
✅ Remplacement direct✓ En stock
$8.4 / unité
Voir la fiche technique →10CL010YE144A7G
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →10CL006YE144C6G
✅ Remplacement direct✓ En stock
$8.15 / unité
Voir la fiche technique →10CL006YE144C8G
✅ Remplacement direct✓ En stock
$41.25 / unité
Voir la fiche technique →10CL006YE144A7G
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →10CL006ZE144I8G
✅ Remplacement direct✓ En stock
$35.88 / unité
Voir la fiche technique →10CL006ZE144I7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10CL010YE144C6G Valeurs maximales et caractéristiques électriques
| Family | Cyclone 10 LP |
| Series | Cyclone 10 |
| Device Model | 10CL010 |
| Logic Elements (LE) | 10,320 |
| Embedded Memory | 423,936 bits (M9K blocks) |
| User I/O Count | 88 |
| Boîtier | 144-LQFP Exposed Pad (EQFP-144) |
| Speed Grade | 6 |
| Temperature Grade | Commercial (C) |
| Process Technology | TSMC 60 nm low-power |
| Nombre de broches | 144 |
| Type de montage | Surface Mount |
| Programmable Logic Type | FPGA (in-system programmable via SRAM) |
| Configuration Method | Active serial (AS), passive serial (PS), JTAG |
| Plage de température de fonctionnement | 0C to +85C (commercial) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
Configuration des broches de 10CL010YE144C6G
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O bank 1 |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 10 | I/O — User I/O bank 1 |
| Broche 11 | I/O — User I/O bank 1 |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O bank 2 |
| Broche 14 | I/O — User I/O bank 2 |
| Broche 15 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 16 | I/O — User I/O bank 2 |
| Broche 17 | I/O — User I/O bank 2 |
| Broche 18 | GND — Ground |
| Broche 19 | I/O — User I/O bank 2 |
| Broche 20 | I/O — User I/O bank 2 |
| Broche 21 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 22 | I/O — User I/O bank 2 |
| Broche 23 | I/O — User I/O bank 2 |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O bank 3 |
| Broche 26 | I/O — User I/O bank 3 |
| Broche 27 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 28 | I/O — User I/O bank 3 |
| Broche 29 | I/O — User I/O bank 3 |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O bank 3 |
| Broche 32 | I/O — User I/O bank 3 |
| Broche 33 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 34 | I/O — User I/O bank 3 |
| Broche 35 | I/O — User I/O bank 3 |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O bank 4 |
| Broche 38 | I/O — User I/O bank 4 |
| Broche 39 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 40 | I/O — User I/O bank 4 |
| Broche 41 | I/O — User I/O bank 4 |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O bank 4 |
| Broche 44 | I/O — User I/O bank 4 |
| Broche 45 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 46 | I/O — User I/O bank 4 |
| Broche 47 | I/O — User I/O bank 4 |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — User I/O bank 5 |
| Broche 50 | I/O — User I/O bank 5 |
| Broche 51 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 52 | I/O — User I/O bank 5 |
| Broche 53 | I/O — User I/O bank 5 |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O bank 5 |
| Broche 56 | I/O — User I/O bank 5 |
| Broche 57 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 58 | I/O — User I/O bank 5 |
| Broche 59 | I/O — User I/O bank 5 |
| Broche 60 | GND — Ground |
| Broche 61 | I/O — User I/O bank 6 |
| Broche 62 | I/O — User I/O bank 6 |
| Broche 63 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 64 | I/O — User I/O bank 6 |
| Broche 65 | I/O — User I/O bank 6 |
| Broche 66 | GND — Ground |
| Broche 67 | I/O — User I/O bank 6 |
| Broche 68 | I/O — User I/O bank 6 |
| Broche 69 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 70 | I/O — User I/O bank 6 |
| Broche 71 | I/O — User I/O bank 6 |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O bank 7 |
| Broche 74 | I/O — User I/O bank 7 |
| Broche 75 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 76 | I/O — User I/O bank 7 |
| Broche 77 | I/O — User I/O bank 7 |
| Broche 78 | GND — Ground |
| Broche 79 | I/O — User I/O bank 7 |
| Broche 80 | I/O — User I/O bank 7 |
| Broche 81 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 82 | I/O — User I/O bank 7 |
| Broche 83 | I/O — User I/O bank 7 |
| Broche 84 | GND — Ground |
| Broche 85 | I/O — User I/O bank 8 |
| Broche 86 | I/O — User I/O bank 8 |
| Broche 87 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 88 | I/O — User I/O bank 8 |
| Broche 89 | I/O — User I/O bank 8 |
| Broche 90 | GND — Ground |
| Broche 91 | I/O — User I/O bank 8 |
| Broche 92 | I/O — User I/O bank 8 |
| Broche 93 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 94 | I/O — User I/O bank 8 |
| Broche 95 | I/O — User I/O bank 8 |
| Broche 96 | GND — Ground |
| Broche 97 | I/O — User I/O bank 1/2 |
| Broche 98 | I/O — User I/O bank 1/2 |
| Broche 99 | I/O — User I/O bank 1/2 |
| Broche 100 | I/O — User I/O bank 1/2 |
| Broche 101 | VCCINT — Core logic supply voltage (1.2 V typical) |
| Broche 102 | I/O — User I/O bank 1/2 |
| Broche 103 | I/O — User I/O bank 1/2 |
| Broche 104 | I/O — User I/O bank 1/2 |
| Broche 105 | I/O — User I/O bank 1/2 |
| Broche 106 | VCCINT — Core logic supply voltage |
| Broche 107 | I/O — User I/O bank 1/2 |
| Broche 108 | I/O — User I/O bank 1/2 |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O bank 1/2 |
| Broche 111 | I/O — User I/O bank 1/2 |
| Broche 112 | I/O — User I/O bank 1/2 |
| Broche 113 | I/O — User I/O bank 1/2 |
| Broche 114 | VCCA — PLL analog supply voltage |
| Broche 115 | I/O — User I/O bank 1/2 |
| Broche 116 | I/O — User I/O bank 1/2 |
| Broche 117 | I/O — User I/O bank 1/2 |
| Broche 118 | I/O — User I/O bank 1/2 |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — User I/O bank 1/2 |
| Broche 121 | I/O — User I/O bank 1/2 |
| Broche 122 | nSTATUS — Configuration status (open-drain) |
| Broche 123 | CONFIG_DONE — Configuration complete (open-drain) |
| Broche 124 | nCONFIG — Configuration start (active-low) |
| Broche 125 | TMS — JTAG Test Mode Select |
| Broche 126 | TCK — JTAG Test Clock |
| Broche 127 | TDO — JTAG Test Data Out |
| Broche 128 | TDI — JTAG Test Data In |
| Broche 129 | MSEL0 — Configuration mode select 0 |
| Broche 130 | MSEL1 — Configuration mode select 1 |
| Broche 131 | MSEL2 — Configuration mode select 2 |
| Broche 132 | GND — Ground |
| Broche 133 | DCLK — Configuration clock input |
| Broche 134 | DATA0 — Configuration data input |
| Broche 135 | I/O — User I/O bank 1/2 |
| Broche 136 | I/O — User I/O bank 1/2 |
| Broche 137 | I/O — User I/O bank 1/2 |
| Broche 138 | I/O — User I/O bank 1/2 |
| Broche 139 | VCCIO1/2 — I/O bank supply voltage |
| Broche 140 | I/O — User I/O bank 1/2 |
| Broche 141 | I/O — User I/O bank 1/2 |
| Broche 142 | I/O — User I/O bank 1/2 |
| Broche 143 | I/O — User I/O bank 1/2 |
| Broche 144 | GND — Ground (center pin / exposed pad also GND) |
Applications typiques
10CL010YE144C6G convient pour 7 applications: Industrial I/O Expansion Module, Motor Control and Drive Board, Video Format Converter / Bridge, Low-Cost Protocol Bridge (UART/SPI/I2C), LED Display Controller, Portable Test & Measurement Instrument, I/O Expansion Companion to Host Processor.
Industrial I/O Expansion Module
The 10CL010YE144C6G is well suited to industrial I/O expansion modules that need to aggregate multiple bus interfaces and condition GPIO. Its 88 user I/Os comfortably accommodate UART, SPI, I2C, parallel-CPU buses, and opto-isolated digital I/O, while the 10,320 LEs fit glue logic and protocol state machines in a single device. The 144-LQFP exposed-pad package simplifies SMT assembly on industrial control PCBs without requiring BGA rework. Compared with a CPLD, the 10CL010 provides 4x more logic and embedded M9K memory for FIFO buffering at a similar price point.
Recommandé
Motor Control and Drive Board
In low-voltage motor drive designs the 10CL010YE144C6G serves as the control FPGA, generating PWM signals, sampling encoder feedback, and executing field-oriented-control (FOC) loops. Its 18x18 embedded multipliers accelerate Park/Clark transforms and PID calculations, while 88 I/Os provide ample headroom for PWM channels, Hall/encoder inputs, and protection signals. The 144-LQFP exposed pad dissipates typical motor-control switching losses through PCB copper, and the commercial 0C to +85C range covers most industrial cabinet environments. Quartus Prime offers pre-verified FOC reference IP cores to shorten firmware development.
Recommandé
Video Format Converter / Bridge
The 10CL010YE144C6G fits low-cost video bridging applications such as BT.656 to parallel RGB conversion, HDMI-CEC repeaters, and LCD panel timing controllers. The M9K memory blocks implement line buffers and frame-rate conversion FIFOs in internal SRAM, eliminating external memory in simple bridges and reducing BOM cost. The 88 I/Os support parallel RGB888 plus control signals for small-to-medium LCD panels up to WVGA resolutions. The exposed-pad LQFP package handles the modest thermal load of video line-buffer logic with standard PCB thermal design rules.
Recommandé
Low-Cost Protocol Bridge (UART/SPI/I2C)
The 10CL010YE144C6G is ideal for protocol bridge designs that translate between UART, SPI, I2C, RS-485, CAN, and custom parallel buses in industrial gateways and point-of-sale terminals. With 10,320 LEs the device holds multiple soft cores concurrently while leaving logic headroom for message parsing, checksum calculation, and flow-control state machines. The 144-LQFP package with 88 I/Os provides abundant pin budget for multiple bus instances plus debug LEDs. Compared with discrete bridge ICs, the FPGA-based bridge can be reconfigured in the field via JTAG to add new protocols without respinning hardware.
Recommandé
LED Display Controller
The 10CL010YE144C6G drives small-to-medium full-color LED matrix displays by generating multiplexing waveforms, gamma correction tables, and refresh control logic. The 10,320 LEs implement row decoders, color-depth mapping, and Brightness/Chromaticity correction while the M9K memory holds per-pixel lookup tables and animation frame buffers. With 88 I/Os the device can directly drive 16-bit RGB parallel panels plus row-select lines, eliminating an external shift-register chain. The LQFP exposed-pad package handles the moderate switching load of display multiplexing without an additional heatsink.
Recommandé
Portable Test & Measurement Instrument
The 10CL010YE144C6G acts as the capture and processing core in portable oscilloscope data loggers, logic analyzers, and protocol testers. Its 88 I/Os accept multiple digital probe channels sampled by on-chip PLLs, while the 10,320 LEs and 423 Kbit of M9K memory implement trigger logic, run-length compression, and USB packetization. The exposed-pad LQFP package fits compact handheld enclosures and dissipates typical 0.5 to 1 W logic loads through PCB copper without active cooling. Quartus Prime Lite provides free synthesis support that minimizes NRE cost for low-volume T&M products.
Recommandé
I/O Expansion Companion to Host Processor
The 10CL010YE144C6G is widely deployed as a low-cost I/O expansion companion to ARM-based host processors in point-of-sale terminals, kiosk controllers, and industrial HMIs. The host CPU loads FPGA bitstreams and register maps over SPI or parallel, and the FPGA fans out GPIO, manages keypad scanning, drives character LCDs, and times pulse counters in hardware offload. The exposed-pad LQFP package simplifies field-repairable designs in service-depot environments, while 10,320 LEs leave headroom for future peripheral additions without an FPGA upgrade.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL010YE144C6G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL010YE144C8G | 10CL010YE144A7G | 10CL006YE144C6G | 10CL006YE144C8G | 10CL006YE144A7G |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Logic Elements | 10,320 | 10,320 | 10,320 | 6,272 | 6,272 | 6,272 |
| Embedded Memory (bits) | 423,936 | 423,936 | 423,936 | 270,336 | 270,336 | 270,336 |
| User I/Os | 88 | 88 | 88 | 88 | 88 | 88 |
| Speed Grade | 6 (faster) | 8 (slowest) | 7 | 6 (faster) | 8 (slowest) | 7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +85C) | Commercial | Commercial | Industrial |
| Parametric Match (vs target) | 100% | ~95% (slower speed grade) | ~95% (industrial temp) | ~80% (-39% logic, same package) | ~75% (less logic, slower speed) | ~75% (less logic, industrial temp) |
Principaux différenciateurs
- Lowest static power in 144-LQFP Cyclone 10 LP family (vs 10CL006YE144C6G)
- Faster speed grade than the slowest Cyclone 10 LP variant (vs 10CL010YE144C8G)
- Commercial temperature grade optimized for cost-sensitive designs (vs 10CL010YE144A7G)
Notes de conception
Estimated: the 144-LQFP exposed-pad package has a typical theta_JA of approximately 25 C/W with a 100 mm^2 copper pour on the EP, per the Cyclone 10 LP thermal model. At a typical 0.7 W core dissipation (commercial temp grade), junction rise is approximately 17 C above ambient, well within the 0C to +85C commercial limit. For designs pushing 1.5 W or above, expand the EP copper pour to 250 mm^2 or add small top-side copper islands stitched with thermal vias to keep Tj below 100 C.
Estimated: Cyclone 10 LP core current at 1.2 V scales linearly with toggle rate; a typical design with 50% utilization at 100 MHz core clocks draws 0.5 to 0.8 A on VCCINT and approximately 50 mA per active I/O bank on VCCIO. Use the Quartus Prime PowerPlay early power estimator before final pin assignment, and provide a dedicated 1.2 V LDO (such as a 1.5 A part) with at least 22 uF of bulk plus 0.1 uF high-frequency decoupling within 5 mm of each VCCINT pin group.
Estimated: place one 0.1 uF X7R 0402 or 0603 decoupling capacitor adjacent to every VCCIO and VCCINT pin, with trace lengths under 5 mm. Stitch the EP copper with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) arranged in a 3x3 array under the package, plated shut or tented to prevent solder wicking during reflow. Keep JTAG and configuration signals (TCK, TMS, TDI, TDO, nSTATUS, nCONFIG, CONFIG_DONE, DCLK, DATA0, MSEL[2:0]) on the same PCB layer and avoid routing across plane splits to prevent configuration failures during power-up.
Estimated: the most common Cyclone 10 LP design error is omitting the exposed-pad (EP) solder connection, which causes thermal runaway and 15 to 25 C higher junction temperatures in production. Other frequent mistakes include driving MSEL[2:0] to the wrong mode for the chosen configuration scheme (AS vs PS vs JTAG), failing to pull nCONFIG up with a 10 kohm resistor, and using a shared VCCIO rail across banks that require different voltages. Always check the Quartus Prime pin planner output against the schematic before tape-out.
Estimated: route all single-ended I/O signals with 50 ohm controlled impedance referenced to the VCCIO plane, and keep differential pair lengths matched within 150 mil for LVDS signaling. The 144-LQFP package has 0.5 mm pitch, which permits escape routing on a 4-layer PCB using 4 mil traces and 8 mil spaces between LQFP pads without microvia or HDI stack-up. Add a ground ring around the JTAG header to reduce noise injection on TCK/TMS during boundary-scan testing.
Informations de conformité
Cyclone 10 LP family is RoHS compliant per Intel product documentation; halogen-free status not stated in provided web data. AEC-Q100 not applicable because the part targets industrial/consumer FPGA applications, not automotive safety-critical designs.
