10CL006YE144C6G - Cyclone 10 LP 6K LEs FPGA | Intel | 144-EQFP
Référence : 10CL006YE144C6G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.99 | $11,99 |
| 10 | $10.79 | $107,90 |
| 100 | $9.59 | $959,00 |
| 500 | $8.95 | $4 475,00 |
| 1 000 | $8.15 | $8 150,00 |
10CL006YE144C6G Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and I/O cells that engineers can reconfigure post-manufacturing to implement custom digital circuits. Within the broader taxonomy, FPGAs sit alongside ASICs (Application-Specific Integrated Circuits), microcontrollers, and DSPs as reconfigurable compute platforms; the Cyclone 10 LP family specifically targets low-power, high-volume applications that previously required ASIC or CPLD implementations.
Key features include 15 embedded 18x18 multipliers supporting up to 66 GMACS DSP throughput, 2 PLLs per device for flexible clock management, and support for external memory interfaces including DDR2/DDR3/LPDDR2 via soft IP cores. The device operates from a 1.0V core supply with separate 1.5V/1.8V/2.5V/3.3V I/O bank voltages, enabling mixed-voltage system integration without external level shifters.
The Cyclone 10 LP architecture combines look-up-table (LUT) based logic blocks with embedded M9K memory blocks, hard IP for DSP operations, and a fine-grained clock network. This FPGA supports the Quartus Prime Lite/Standard toolchain and is suitable for parallel processing, custom peripheral interfacing, and glue-logic consolidation.
Typical applications include industrial motor control and HMI panels, low-power video processing for surveillance and consumer displays, IoT edge nodes with custom sensor aggregation, automotive body electronics and infotainment subsystems, and portable/wearable medical monitoring equipment.
When designing with the 10CL006YE144C6G, ensure the exposed pad on the underside of the EQFP package is soldered to a sufficient ground copper pour for thermal dissipation and electrical ground reference. The device's 1.0V core requires a properly sequenced power supply, and unused I/O banks should be powered to valid reference voltages to avoid I/O buffer leakage.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet alone, helping engineers shorten evaluation cycles and reduce supply-chain risk.
Alternatives de remplacement direct pour 10CL006YE144C6G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL006YE144C6G (même facteur de forme et même empreinte) — différant par Package, Embedded Memory, Core Voltage, PLLs, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL006YE144A7G
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →10CL006YE144C8G
✅ Remplacement direct✓ En stock
$41.25 / unité
Voir la fiche technique →10CL010YE144C6G
✅ Remplacement direct✓ En stock
$2.6 / unité
Voir la fiche technique →10CL016YE144C6G
✅ Remplacement direct✓ En stock
$23.9 / unité
Voir la fiche technique →10CL025YE144C6G
✅ Remplacement direct✓ En stock
$21.89 / unité
Voir la fiche technique →10CL006YE144C6G Valeurs maximales et caractéristiques électriques
| Series | Cyclone 10 LP |
| Family | 10CL006 |
| Logic Elements (LEs) | 6,272 |
| Embedded Memory | 276,480 bits |
| Embedded Multipliers (18x18) | 15 |
| User I/Os | 88 |
| PLLs | 2 |
| Maximum User I/O Pins | 88 |
| Boîtier | 144-LQFP Exposed Pad (EQFP-144) |
| Type de montage | Surface Mount |
| Core Voltage | 1.0 V |
| I/O Bank Voltages Supported | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 60 nm low-power CMOS |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Statut RoHS | Compliant |
Configuration des broches de 10CL006YE144C6G
| Broche 1 | I/O — General-purpose user I/O (bank 1) |
| Broche 2 | I/O — General-purpose user I/O (bank 1) |
| Broche 3 | I/O — General-purpose user I/O (bank 1) |
| Broche 4 | I/O — General-purpose user I/O (bank 1) |
| Broche 5 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 6 | I/O — General-purpose user I/O (bank 1) |
| Broche 7 | I/O — General-purpose user I/O (bank 1) |
| Broche 8 | I/O — General-purpose user I/O (bank 1) |
| Broche 9 | I/O — General-purpose user I/O (bank 1) |
| Broche 10 | I/O — General-purpose user I/O (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — General-purpose user I/O (bank 1) |
| Broche 13 | I/O — General-purpose user I/O (bank 1) |
| Broche 14 | I/O — General-purpose user I/O (bank 1) |
| Broche 15 | I/O — General-purpose user I/O (bank 1) |
| Broche 16 | I/O — General-purpose user I/O (bank 1) |
| Broche 17 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 18 | I/O — General-purpose user I/O (bank 1) |
| Broche 19 | I/O — General-purpose user I/O (bank 1) |
| Broche 20 | I/O — General-purpose user I/O (bank 1) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — General-purpose user I/O (bank 2) |
| Broche 23 | I/O — General-purpose user I/O (bank 2) |
| Broche 24 | I/O — General-purpose user I/O (bank 2) |
| Broche 25 | I/O — General-purpose user I/O (bank 2) |
| Broche 26 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 27 | I/O — General-purpose user I/O (bank 2) |
| Broche 28 | I/O — General-purpose user I/O (bank 2) |
| Broche 29 | I/O — General-purpose user I/O (bank 2) |
| Broche 30 | I/O — General-purpose user I/O (bank 2) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — General-purpose user I/O (bank 2) |
| Broche 33 | I/O — General-purpose user I/O (bank 2) |
| Broche 34 | I/O — General-purpose user I/O (bank 2) |
| Broche 35 | I/O — General-purpose user I/O (bank 2) |
| Broche 36 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 37 | I/O — General-purpose user I/O (bank 2) |
| Broche 38 | I/O — General-purpose user I/O (bank 2) |
| Broche 39 | I/O — General-purpose user I/O (bank 2) |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — General-purpose user I/O (bank 3) |
| Broche 42 | I/O — General-purpose user I/O (bank 3) |
| Broche 43 | I/O — General-purpose user I/O (bank 3) |
| Broche 44 | I/O — General-purpose user I/O (bank 3) |
| Broche 45 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 46 | I/O — General-purpose user I/O (bank 3) |
| Broche 47 | I/O — General-purpose user I/O (bank 3) |
| Broche 48 | I/O — General-purpose user I/O (bank 3) |
| Broche 49 | I/O — General-purpose user I/O (bank 3) |
| Broche 50 | I/O — General-purpose user I/O (bank 3) |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — General-purpose user I/O (bank 3) |
| Broche 53 | I/O — General-purpose user I/O (bank 3) |
| Broche 54 | I/O — General-purpose user I/O (bank 3) |
| Broche 55 | I/O — General-purpose user I/O (bank 3) |
| Broche 56 | I/O — General-purpose user I/O (bank 3) |
| Broche 57 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 58 | I/O — General-purpose user I/O (bank 3) |
| Broche 59 | I/O — General-purpose user I/O (bank 3) |
| Broche 60 | I/O — General-purpose user I/O (bank 3) |
| Broche 61 | GND — Ground |
| Broche 62 | I/O — General-purpose user I/O (bank 4) |
| Broche 63 | I/O — General-purpose user I/O (bank 4) |
| Broche 64 | I/O — General-purpose user I/O (bank 4) |
| Broche 65 | I/O — General-purpose user I/O (bank 4) |
| Broche 66 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 67 | I/O — General-purpose user I/O (bank 4) |
| Broche 68 | I/O — General-purpose user I/O (bank 4) |
| Broche 69 | I/O — General-purpose user I/O (bank 4) |
| Broche 70 | I/O — General-purpose user I/O (bank 4) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — General-purpose user I/O (bank 4) |
| Broche 73 | I/O — General-purpose user I/O (bank 4) |
| Broche 74 | I/O — General-purpose user I/O (bank 4) |
| Broche 75 | I/O — General-purpose user I/O (bank 4) |
| Broche 76 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 77 | I/O — General-purpose user I/O (bank 4) |
| Broche 78 | I/O — General-purpose user I/O (bank 4) |
| Broche 79 | I/O — General-purpose user I/O (bank 4) |
| Broche 80 | GND — Ground |
| Broche 81 | I/O — General-purpose user I/O (bank 5) |
| Broche 82 | I/O — General-purpose user I/O (bank 5) |
| Broche 83 | I/O — General-purpose user I/O (bank 5) |
| Broche 84 | I/O — General-purpose user I/O (bank 5) |
| Broche 85 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 86 | I/O — General-purpose user I/O (bank 5) |
| Broche 87 | I/O — General-purpose user I/O (bank 5) |
| Broche 88 | I/O — General-purpose user I/O (bank 5) |
| Broche 89 | I/O — General-purpose user I/O (bank 5) |
| Broche 90 | I/O — General-purpose user I/O (bank 5) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — General-purpose user I/O (bank 5) |
| Broche 93 | I/O — General-purpose user I/O (bank 5) |
| Broche 94 | I/O — General-purpose user I/O (bank 5) |
| Broche 95 | I/O — General-purpose user I/O (bank 5) |
| Broche 96 | I/O — General-purpose user I/O (bank 5) |
| Broche 97 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 98 | I/O — General-purpose user I/O (bank 5) |
| Broche 99 | I/O — General-purpose user I/O (bank 5) |
| Broche 100 | I/O — General-purpose user I/O (bank 5) |
| Broche 101 | GND — Ground |
| Broche 102 | I/O — General-purpose user I/O (bank 6) |
| Broche 103 | I/O — General-purpose user I/O (bank 6) |
| Broche 104 | I/O — General-purpose user I/O (bank 6) |
| Broche 105 | I/O — General-purpose user I/O (bank 6) |
| Broche 106 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 107 | I/O — General-purpose user I/O (bank 6) |
| Broche 108 | I/O — General-purpose user I/O (bank 6) |
| Broche 109 | I/O — General-purpose user I/O (bank 6) |
| Broche 110 | I/O — General-purpose user I/O (bank 6) |
| Broche 111 | I/O — General-purpose user I/O (bank 6) |
| Broche 112 | GND — Ground |
| Broche 113 | I/O — General-purpose user I/O (bank 6) |
| Broche 114 | I/O — General-purpose user I/O (bank 6) |
| Broche 115 | I/O — General-purpose user I/O (bank 6) |
| Broche 116 | I/O — General-purpose user I/O (bank 6) |
| Broche 117 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 118 | I/O — General-purpose user I/O (bank 6) |
| Broche 119 | I/O — General-purpose user I/O (bank 6) |
| Broche 120 | I/O — General-purpose user I/O (bank 6) |
| Broche 121 | GND — Ground |
| Broche 122 | I/O — General-purpose user I/O (bank 7) |
| Broche 123 | I/O — General-purpose user I/O (bank 7) |
| Broche 124 | I/O — General-purpose user I/O (bank 7) |
| Broche 125 | I/O — General-purpose user I/O (bank 7) |
| Broche 126 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 127 | I/O — General-purpose user I/O (bank 7) |
| Broche 128 | I/O — General-purpose user I/O (bank 7) |
| Broche 129 | I/O — General-purpose user I/O (bank 7) |
| Broche 130 | I/O — General-purpose user I/O (bank 7) |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — General-purpose user I/O (bank 7) |
| Broche 133 | I/O — General-purpose user I/O (bank 7) |
| Broche 134 | I/O — General-purpose user I/O (bank 7) |
| Broche 135 | I/O — General-purpose user I/O (bank 7) |
| Broche 136 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 137 | I/O — General-purpose user I/O (bank 7) |
| Broche 138 | I/O — General-purpose user I/O (bank 7) |
| Broche 139 | I/O — General-purpose user I/O (bank 7) |
| Broche 140 | GND — Ground |
| Broche 141 | I/O — General-purpose user I/O (bank 8) |
| Broche 142 | I/O — General-purpose user I/O (bank 8) |
| Broche 143 | I/O — General-purpose user I/O (bank 8) |
| Broche 144 | I/O — General-purpose user I/O (bank 8) |
| Broche EP | GND (Exposed Pad) — Thermal and ground pad, must be soldered to PCB ground pour |
Applications typiques
10CL006YE144C6G convient pour 6 applications: Industrial Motor Control and FOC Drives, Human-Machine Interface (HMI) Panels, Low-Power Video Processing and Surveillance, IoT Edge Nodes with Custom Sensor Aggregation, Automotive Body Electronics and Infotainment, Portable Medical Monitoring Devices.
Industrial Motor Control and FOC Drives
The Intel 10CL006YE144C6G fits industrial motor control applications requiring field-oriented control (FOC) loops, encoder feedback decoding, and high-resolution PWM generation. Its 15 embedded 18x18 multipliers handle the multiply-intensive FOC math (Clarke, Park, inverse Park transforms) at typical 10-20 kHz control loops with comfortable margin. The 2 integrated PLLs synthesize jitter-clean clocks for 12-16 bit PWM at 50-100 kHz carrier frequencies, while the 88 user I/Os interface directly to Hall sensors, incremental encoders, and gate drivers without external logic. The 144-EQFP package exposes a thermal pad that can be soldered to a ground pour for sustained operation at moderate ambient temperatures in cabinet-mount drives.
Recommandé
Human-Machine Interface (HMI) Panels
Industrial HMI panels with TFT-LCD displays, touch controllers, and multiple communication ports leverage the 10CL006YE144C6G to consolidate glue logic that would otherwise require a microcontroller plus several peripheral ICs. The 6,272 LEs implement custom graphics acceleration, double-buffered frame management, and Modbus/CAN/Ethernet protocol stacks concurrently. The 276 Kbits of embedded memory hold lookup tables for fonts and icons, and the 88 user I/Os drive RGB LCD interfaces up to 7-inch WVGA without external bus multiplexers. The commercial 0-85C temperature range covers most factory-floor enclosures, while the EQFP-144 package simplifies optical inspection during high-volume assembly.
Recommandé
Low-Power Video Processing and Surveillance
The 10CL006YE144C6G suits entry-level surveillance and consumer video processing where low power consumption and small footprint are essential. Its LUT-based architecture performs real-time image preprocessing (filtering, motion detection, color space conversion) at VGA to 720p resolutions, while the 15 DSP multipliers accelerate convolution kernels for edge detection. The 88 user I/Os interface directly to CMOS image sensors (parallel DVP) and to external DDR2/LPDDR2 memory via soft IP for frame buffering. Quiescent power scales with clock gating, and the 1.0V core supply combined with 60 nm process keeps thermal dissipation low enough for sealed IP camera enclosures.
Recommandé
IoT Edge Nodes with Custom Sensor Aggregation
Battery-powered IoT edge nodes benefit from the Cyclone 10 LP's low static power and the 10CL006YE144C6G's flexibility to aggregate heterogeneous sensor buses (I2C, SPI, UART, 1-Wire, custom protocols) into a unified data stream. The 6,272 LEs implement protocol conversion, sensor-fusion preprocessing, and edge analytics, while the 2 PLLs derive multiple precise sample-rate clocks from a single low-frequency crystal. The 88 user I/Os directly interface to many sensors without external I/O expanders, and the 144-EQFP package with exposed pad supports reflow profiles compatible with standard SMT lines. This combination suits smart agriculture, environmental monitoring, and asset-tracking gateways.
Recommandé
Automotive Body Electronics and Infotainment
The 10CL006YE144C6G serves automotive body electronics subsystems such as body control modules, LED matrix drivers, and entry-level infotainment I/O hubs. Its 6,272 LEs implement CAN/LIN protocol stacks, multi-zone LED lighting control with per-channel PWM dimming, and HVAC sensor multiplexing. The 88 user I/Os interface directly to automotive switch panels, rotary encoders, and discrete LED drivers. While this commercial 0-85C variant is suitable for cabin-mounted modules, the pin-compatible industrial-temperature 10CL006YE144A7G variant (-40C to +125C) is recommended for under-hood or door-module mounting. The exposed pad simplifies thermal dissipation in sealed automotive enclosures.
Recommandé
Portable Medical Monitoring Devices
Portable medical monitoring equipment such as pulse oximeters, ambulatory ECG recorders, and wearable patient monitors benefit from the 10CL006YE144C6G's combination of low power, abundant DSP resources, and small footprint. The 15 embedded 18x18 multipliers accelerate real-time digital filtering of biopotential signals (bandpass, notch, FFT), while the 6,272 LEs implement patient-specific algorithm calibration. The 88 user I/Os interface to AFE ICs (such as the ADS129x family) and to small TFT or OLED displays for patient readouts. The 1.0V core supply minimizes battery drain, extending operating life in continuous-wear applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL006YE144C6G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL006YE144A7G | 10CL006YE144C8G | 10CL010YE144C6G | 10CL016YE144C6G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Logic Elements | 6,272 | 6,272 | 6,272 | 10,320 | 15,408 |
| Embedded Memory (bits) | 276,480 | 276,480 | 276,480 | 423,936 | 516,096 |
| Embedded 18x18 Multipliers | 15 | 15 | 15 | 24 | 56 |
| User I/Os | 88 | 88 | 88 | 88 | 88 |
| Operating Temperature | 0C to +85C (Commercial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 6 | 7 | 8 (slower) | 6 | 6 |
Principaux différenciateurs
- Lowest unit cost among Cyclone 10 LP E144 commercial variants (vs 10CL010YE144C6G)
- Smaller LE count but identical footprint to higher-density siblings (vs 10CL016YE144C6G)
- Commercial temperature grade suitable for indoor applications (vs 10CL006YE144A7G)
Notes de conception
The Cyclone 10 LP 10CL006 requires a tightly regulated 1.0V core supply with peak current up to approximately 500 mA during configuration and active DSP operation. Use a low-dropout regulator such as the TI TPS74401 or a switching converter with output ripple below 30 mVpp. Power sequencing must drive VCCINT (1.0V core) before or simultaneously with VCCIO (1.2-3.3V I/O banks); violating this order can trigger I/O latch-up and permanent damage. Decouple each VCCIO pin with a 0.1uF X7R ceramic placed within 3 mm of the pin, and add a 10uF bulk capacitor near the package.
Although the EQFP-144 package is not designed for high-power dissipation, the exposed pad must be soldered to a PCB ground pour of at least 25 mm squared to provide thermal relief and a low-inductance ground reference. Estimated: with theta_JA around 25 C/W on a 4-layer JEDEC test board, the device can dissipate roughly 2W continuously at 85C ambient without exceeding the 100C junction limit. Avoid placing the FPGA directly above heat-generating components (DC-DC converters, power inductors) on the PCB, and consider thermal vias under the exposed pad for improved heat transfer to inner copper planes.
Route all high-speed differential pairs (LVDS, RSDS, mini-LVDS) with 100 ohm differential impedance and matched length within 150 mils (about 4 mm) to avoid skew-induced jitter. Keep clock traces short and use the FPGA's dedicated CLK inputs for global clocks; avoid using regular I/O as clock inputs. JTAG signals (TCK, TMS, TDI, TDO) should be routed with ground guard traces to prevent programming failures. Maintain a solid ground plane under the device with stitched ground vias around the perimeter to minimize return-path inductance.
Common pitfalls when designing with the 10CL006YE144C6G include: (1) leaving I/O banks unpowered, which causes leakage current and configuration failure; (2) omitting the CONFIG_DONE pull-up resistor on the configuration pin; (3) using incorrect AS/PS/JTAG mode selection in the Quartus Prime programmer; (4) failing to set unused pins as 'As input tri-stated' in the Quartus pin planner, leading to supply current spikes; (5) using the commercial variant in industrial temperature environments without verifying the device's full operating range. Always run TimeQuest timing analysis after compilation and verify pin assignments against the device handbook pin-out file.
Informations de conformité
RoHS and REACH compliance per Intel Cyclone 10 LP product declaration. Lead-free matte tin finish over NiPd underlayer, suitable for 260C peak reflow per JEDEC J-STD-020. Not AEC-Q100 qualified - for automotive applications consult the Intel automotive-grade FPGA portfolio (Cyclone V Auto, Arria V Auto).