A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
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Drop-in alternatives for A3PE3000-1FGG324I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →A3PE3000-1FGG324I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E (Flash-based FPGA) |
| System Gates | 3,000,000 |
| User I/Os (this package) | 221 |
| Max User I/Os (family) | 616 |
| Embedded SRAM | 504 kbits true dual-port |
| Supply Voltage (core) | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration | Flash-based, Live-at-Power-Up Level 0, single-chip |
| Soft CPU Support | Optional soft ARM support |
| Package | 324-BGA FBGA (19x19 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (TJ) |
| Number of Gates | 3,000,000 |
| Speed Grade | -1 |
| Packaging | Tray |
| RoHS Status | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
A3PE3000-1FGG324I 324-bga fbga (19x19 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for A3PE3000-1FGG324I (324-bga fbga (19x19 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-1FGG324I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-1FGG324I is suitable for 6 applications: Industrial Automation and Control, Aerospace and Defense Electronics, Communications and Networking Equipment, Medical Instrumentation, Test and Measurement Systems, Secure Embedded Systems.
Industrial Automation and Control
The A3PE3000-1FGG324I fits industrial automation controllers because its 3-million-gate flash fabric integrates PLC logic, motor-control state machines, and fieldbus interfaces in one chip, while its -40C to +100C junction rating covers harsh cabinet environments. Live-at-Power-Up flash configuration means the FPGA is functional within microseconds of supply ramp, eliminating boot delay in safety-relevant interlocks and removing the external configuration flash that adds a failure point on noisy factory floors. Used as the main control fabric between 1.5V core and 3.3V I/O banks, it implements deterministic logic with family performance up to ~310 MHz. Trade-off: as an LUT-based fabric rather than an MCU, control algorithms are implemented in HDL, and power dissipation must be budgeted since the part is not the lowest-power option in the ProASIC3 lineup.
Recommended
Aerospace and Defense Electronics
Flash-based ProASIC3E devices are widely used in aerospace and defense because the non-volatile flash switch technology is inherently resistant to bitstream interception and configuration readback, and the single-chip configuration removes SEU-prone external boot flash at power-up. The A3PE3000-1FGG324I provides 3 million system gates and 504 kbits of true dual-port SRAM, enough for sensor-interface bridging, encryption preprocessing, and bus protocol conversion (MIL-STD-1553-style interfaces built as soft IP). The -1 speed grade with industrial temperature operation suits avionics auxiliary processing where instant-on behavior matters more than peak fabric frequency. Design consideration: differential I/O pair usage reduces available single-ended I/O count per the datasheet, so pin budgeting in constrained 221-I/O designs requires early planning.
Recommended
Communications and Networking Equipment
In networking line cards and aggregation equipment, the A3PE3000-1FGG324I serves as glueless bridge logic between PHYs, MACs, and backplane interfaces. Its 221 user I/Os in a compact 19x19 mm 324-FBGA support multiple I/O standards with differential signaling options, and the 504-kbit true dual-port SRAM implements FIFOs and packet buffers without external memory for moderate throughput paths. The flash fabric starts operating instantly at power-up, which is valuable in systems with strict link-establishment timing, and reprogrammability enables in-field feature updates without board changes. Performance consideration: family fabric speed reaches approximately 310 MHz, sufficient for many protocol engines, but designs needing multi-gigabit SERDES must look to transceiver-equipped FPGA families instead, since ProASIC3E has no hardened serial links.
Recommended
Medical Instrumentation
Medical diagnostic equipment benefits from the A3PE3000-1FGG324I's deterministic, instant-on flash fabric for sensor timing, front-end sequencing, and interface conversion between analog front ends and host processors. The 3-million-gate capacity hosts soft ARM support for embedded control, while the true dual-port SRAM (504 kbits) buffers acquisition data with independent read/write ports. Live-at-Power-Up Level 0 support ensures measurement chains are ready before host software boots, shortening startup sequences in clinical workflows, and the reprogrammable fabric supports instrument reconfiguration for multi-modality platforms. The industrial-grade -40C to +100C junction range comfortably covers controlled clinical environments with margin. Designers should verify I/O bank voltages against sensor interface levels and budget thermal dissipation within enclosure airflow limits.
Recommended
Test and Measurement Systems
Bench instruments and automated test equipment use the A3PE3000-1FGG324I as a reconfigurable timing, triggering, and instrumentation-bus engine. The 3-million-gate fabric implements timestamping counters, trigger matrices, and protocol-decoding IP, while 221 user I/Os with multiple single-ended and differential standards connect to analog front ends and digital channel boards. Flash-based Live-at-Power-Up configuration guarantees the instrument's protection and interlock logic is active the instant power is applied - important for protecting devices under test. The 19x19 mm FBGA conserves card space in modular instrument chassis. Trade-off: the -1 speed grade's fabric performance (~310 MHz family maximum) is adequate for most triggering but designs requiring multi-GHz sampling control need dedicated ASIC or transceiver FPGA solutions.
Recommended
Secure Embedded Systems
Applications requiring design IP protection choose the A3PE3000-1FGG324I because flash-based FPGA configuration is stored on-chip and does not require loading a bitstream at boot, removing the interception window that SRAM FPGAs have during configuration. The single-chip Live-at-Power-Up architecture means no external configuration device can be probed or substituted. With 3 million system gates and optional soft ARM support, the device hosts proprietary processing logic plus soft-processor control, and 504 kbits of true dual-port SRAM supports on-chip buffering that minimizes external bus exposure. This makes it suitable for licensing-control dongles, secure industrial gateways, and proprietary algorithm acceleration. Consideration: flash cells have finite program/erase endurance, so field reprogramming frequency should be bounded per the datasheet endurance specification.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-1FGG324I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-2FGG324I | A3PE3000-FGG324I | A3PE3000L-FGG324I | A3PE3000L-1FGG324I |
|---|---|---|---|---|---|
| Package | 324-FBGA (19x19 mm, 1 mm pitch) | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 (low-power) | 3,000,000 (low-power) |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -2 (faster) | standard | standard (L) | -1 (L) |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Range | -40C to +100C (TJ, industrial) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) |
| Configuration | Flash-based, Live-at-Power-Up, single-chip | Flash-based - same | Flash-based - same | Flash-based - same | Flash-based - same |
| RoHS Status | ROHS3 Compliant | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lowest-cost speed grade with full 3M-gate capacity (vs A3PE3000-2FGG324I)
- Industrial temperature rating (vs A3PE3000-FGG324)
- Standard-grade alternative for non-timing-critical rebuilds (vs A3PE3000-FGG324I)
- Full-power fabric for maximum logic throughput (vs A3PE3000L-FGG324I)
Design Notes
The A3PE3000-1FGG324I requires a 1.5V core supply regulated to 1.425V-1.575V. Estimate core current by running static and dynamic power analysis in Libero SoC for your specific design; dynamic power scales with toggle rate and clock tree loading, and a 3M-gate fabric can dissipate watts at high utilization. Provide dedicated 1.5V and I/O bank regulators with adequate margin, and sequence I/O banks after core per the ProASIC3E datasheet power-up requirements to avoid latch-up risk.
The 324-ball FBGA at 1 mm pitch requires a fine-pitch BGA footprint with via-in-pad or dogbone escape routing; a 19x19 mm body with full 221-I/O usage may need 4+ signal layers plus dedicated power/ground planes for clean I/O bank returns. Solder the exposed ball array with a standard SAC lead-free profile per JEDEC-style BGA reflow guidelines and inspect with X-ray given the hidden joints. Follow the DS0098 datasheet ball map exactly when generating the land pattern.
Remember that each used differential I/O pair reduces available single-ended I/Os by two, and for A3PE3000 devices the usage of certain I/O standards is limited (per the DS0098 datasheet). Designers converting from SRAM FPGAs often forget the flash fabric is instant-on: ensure board power sequencing assumes the FPGA I/O may drive immediately at power-up. Also note the -40C to +100C rating is junction temperature (TJ), not ambient - derate for self-heating in enclosed systems.
Compliance Information
ROHS3 Compliant per Microchip USA distributor listing. REACH, halogen-free, and conflict-minerals status not stated in retrieved data - confirm on official Microchip product page.
