EP1C3T100C7N - Cyclone I FPGA, 2,910 LEs, 100-TQFP | Intel
Référence : EP1C3T100C7N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.42 | $16,42 |
| 10 | $14.78 | $147,80 |
| 100 | $13.11 | $1 311,00 |
| 500 | $11.85 | $5 925,00 |
| 1 000 | $10.6 | $10 600,00 |
EP1C3T100C7N Présentation
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the programmable-logic hierarchy between simple PLDs and ASICs: they offer higher logic density and richer I/O than CPLDs, while remaining far cheaper and faster to prototype than full-custom ASICs. The Cyclone I family targets cost-sensitive, low-to-mid-volume designs where an MCU is too rigid and an ASIC is uneconomical.
Key features of the EP1C3T100C7N include 2,910 logic elements, 58,896 bits of embedded RAM, 1 phase-locked loop for clock management, and support for LVDS, LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards. The 100-pin TQFP package is a thin, plastic surface-mount format with a 0.5 mm lead pitch, well-suited to hand-prototyping, low-speed production runs, and educational platforms where fine-pitch BGA handling is impractical.
The architecture pairs four-input look-up tables (LUTs) with embedded memory, allowing each LE to be configured as either combinational logic or a small shift register. The single PLL supports clock multiplication, division, and phase shift, enabling reliable timing closure on designs up to roughly 100 MHz system clock. The device is SRAM-based, so configuration must be reloaded at every power-up from a serial configuration flash such as the EPCS1 or EPCS4.
Typical applications for the EP1C3T100C7N include industrial control glue logic, legacy MRO replacement of obsolete ASICs, education and training boards, low-volume I/O expansion bridges, and protocol conversion such as UART-to-SPI or parallel-to-LVDS. The 100-TQFP package makes it a popular choice on dev kits and university lab cards where through-hole-friendly QFP footprints simplify rework.
When designing with this part, note that the Cyclone I family is mature: Intel recommends migrating to Cyclone IV or Cyclone V for new designs, but the EP1C3T100C7N remains widely available in the distribution channel for sustaining legacy products. Always load the configuration bitstream from an external serial flash at every power-up; the FPGA has no built-in non-volatile memory.
This page synthesizes distributor pricing, drop-in Cyclone I alternatives, and practical design notes - including JTAG chain and configuration flash guidance - that go beyond the datasheet bullet list to support engineers sustaining legacy Cyclone I designs.
Alternatives de remplacement direct pour EP1C3T100C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C3T100C7N (même facteur de forme et même empreinte) — différant par Package, Family, Speed Grade, Operating Temperature, Total RAM Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C3T100C8N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EP1C3T100C6N
✅ Remplacement direct✓ En stock
$13.5 / unité
Voir la fiche technique →EP1C3T100I7N
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EP1C3T100C7
✅ Remplacement direct✓ En stock
$10.88 / unité
Voir la fiche technique →EP1C3T100C6
✅ Remplacement direct✓ En stock
$13.4 / unité
Voir la fiche technique →EP1C6T100C8N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1C3T100C7N Valeurs maximales et caractéristiques électriques
| Family | Cyclone I |
| Logic Elements | 2,910 |
| Embedded RAM Bits | 58,896 |
| M4K RAM Blocks | 13 |
| PLLs | 1 |
| Maximum User I/O | 65 |
| Boîtier | 100-pin TQFP (T100) |
| Lead Pitch | 0.5 mm |
| Core Voltage | 1.5 V |
| Process Technology | 0.13 µm SRAM |
| Speed Grade | -7 |
| Température de fonctionnement | 0 °C to +85 °C (Commercial) |
| Type de montage | Surface Mount |
| Configuration Method | Serial (EPCS1/EPCS4) or JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL-2, SSTL-3 |
| Statut RoHS | Compliant |
Configuration des broches de EP1C3T100C7N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | VCCIO1 — I/O bank 1 supply (3.3 V) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | VCCINT — Core supply (1.5 V) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | GND — Ground |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | VCCIO2 — I/O bank 2 supply (3.3 V) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | VCCINT — Core supply (1.5 V) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | VCCIO3 — I/O bank 3 supply (3.3 V) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | GND — Ground |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | VCCINT — Core supply (1.5 V) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | VCCIO4 — I/O bank 4 supply (3.3 V) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | I/O — User I/O pin (bank 4) |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | I/O — User I/O pin (bank 4) |
| Broche 82 | VCCINT — Core supply (1.5 V) |
| Broche 83 | nCONFIG — Configuration start (active-low) |
| Broche 84 | nSTATUS — Configuration status (active-low) |
| Broche 85 | CONF_DONE — Configuration complete |
| Broche 86 | TCK — JTAG clock |
| Broche 87 | TMS — JTAG mode select |
| Broche 88 | TDI — JTAG data in |
| Broche 89 | TDO — JTAG data out |
| Broche 90 | MSEL0 — Configuration mode select bit 0 |
| Broche 91 | MSEL1 — Configuration mode select bit 1 |
| Broche 92 | MSEL2 — Configuration mode select bit 2 |
| Broche 93 | DCLK — Configuration clock (AS mode) |
| Broche 94 | DATA0 — Configuration data (AS mode) |
| Broche 95 | nCE — Chip enable (active-low) |
| Broche 96 | CLK0 — PLL clock input 0 |
| Broche 97 | CLK1 — PLL clock input 1 |
| Broche 98 | GND — Ground |
| Broche 99 | VCCIO1 — I/O bank 1 supply (3.3 V) |
| Broche 100 | I/O — User I/O pin (bank 1) |
Applications typiques
EP1C3T100C7N convient pour 6 applications: Industrial Control Glue Logic, Legacy ASIC Replacement / MRO, Education and FPGA Training Boards, Protocol Conversion Bridges, Low-Volume I/O Expansion, Data Acquisition Front-End.
Industrial Control Glue Logic
The EP1C3T100C7N's 2,910 logic elements and 65 user I/Os fit industrial glue-logic such as stepper-motor pulse generation, encoder quadrature decoding, and parallel-bus arbitration. The 100-TQFP package supports hand-rework on production panels, while the single PLL generates precise timing references for encoder inputs. The 1.5 V core draws low enough power that no heatsink is required even inside sealed IP65 enclosures; the commercial 0 °C to +85 °C window covers most factory-floor installations.
Recommandé
Legacy ASIC Replacement / MRO
Maintenance-repair-overhaul operations use the EP1C3T100C7N to substitute end-of-life ASICs in legacy equipment where firmware revisions are frozen. The SRAM-based fabric can be reprogrammed in-circuit via JTAG to match the original ASIC's register map without PCB changes. The 100-TQFP package is footprint-compatible with many 1990s-era ASIC pinouts when bridging glue is required, and the 65 user I/Os cover the address/data bus widths of most legacy microcontrollers.
Recommandé
Education and FPGA Training Boards
The EP1C3T100C7N's 100-TQFP 0.5 mm-pitch package is friendly to university lab hand-soldering, while the 2,910 logic elements provide enough headroom for full RISC-V, MIPS, and basic image-filter lab projects. Quartus Prime Lite supports the EP1C3 family free of charge, lowering the entry cost for students. The NRND status has not affected lab stocking because the C7N remains widely available in the authorized channel as of 2026-09-06.
Recommandé
Protocol Conversion Bridges
The EP1C3T100C7N serves as a UART-to-SPI, I2C-to-parallel, or RS-485-to-CAN bridge in industrial gateways, where 2,910 logic elements are sufficient for protocol state machines plus FIFO buffers using the 13 M4K RAM blocks. The 1.5 V core with LVTTL/LVCMOS I/O interfaces cleanly to 3.3 V MCUs via series resistors, and the 65 user I/Os handle multiple concurrent channels. The Cyclone I single PLL derives any baud-rate clock from a single 50 MHz crystal, eliminating external clock-generator ICs.
Recommandé
Low-Volume I/O Expansion
Embedded systems use the EP1C3T100C7N as an I/O-expander companion to microcontrollers that lack enough pins for parallel displays, keypads, or stepper motors. The 65 user I/Os and 13 M4K RAM blocks (58,896 bits) provide FIFO depth for SPI-to-parallel display bridges, and the 100-TQFP 0.5 mm pitch enables compact 4-layer PCBs. The single PLL generates pixel clocks directly from a 25 MHz crystal, supporting small TFT-LCD panels up to 320x240 resolution.
Recommandé
Data Acquisition Front-End
The EP1C3T100C7N's 65 user I/Os and 13 M4K RAM blocks handle multi-channel ADC/DAC multiplexing and small FIR-filter preprocessing in data-acquisition front-ends. The single PLL aligns ADC sampling clocks to within 100 ps jitter, sufficient for 12-bit at 1 MSPS systems, and the LVDS-capable I/Os interface directly to modern serial ADCs. The Cyclone I family's documented logic-analyzer IP cores let engineers add protocol decoding without external logic analyzer hardware.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C3T100C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C3T100C8N | EP1C3T100C6N | EP1C3T100I7N | EP1C3T100C7 | EP1C3T100C6 | EP1C6T100C8N |
|---|---|---|---|---|---|---|---|
| Package | 100-TQFP (T100) | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Family | Cyclone I | Cyclone I - same | Cyclone I - same | Cyclone I - same | Cyclone I - same | Cyclone I - same | Cyclone I - same |
| Logic Elements | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 | 5,980 |
| Speed Grade | -7 | -8 (faster) | -6 (slower) | -7 (same speed, industrial temp) | -7 (same) | -6 (slower) | -8 (faster) |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Maximum User I/O | 65 | 65 | 65 | 65 | 65 | 65 | 65 |
| Embedded RAM Bits | 58,896 | 58,896 | 58,896 | 58,896 | 58,896 | 58,896 | 92,160 |
| PLLs | 1 | 1 | 1 | 1 | 1 | 1 | 2 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Speed grade -7 is the optimal balance for cost-sensitive designs (vs EP1C3T100C6N)
- Commercial temperature grade is the lowest-cost option in the family (vs EP1C3T100I7N)
- Logic density scales within the same TQFP footprint to EP1C6 (vs EP1C6T100C8N)
Notes de conception
The EP1C3T100C7N requires three supply rails: VCCINT at 1.5 V (±5%) for the core logic, VCCIO1-VCCIO4 at 3.3 V for the four I/O banks, and a clean ground reference on every GND pin (pins 11, 19, 30, 40, 53, 62, 75, 98). Decouple each VCCINT pin with a 0.1 µF X7R ceramic plus a 10 µF tantalum bulk capacitor placed within 5 mm of the pin; place 0.1 µF ceramics on each VCCIO pin. Insufficient decoupling is the leading cause of JTAG-chain instability and silent configuration failures during power-up. The Cyclone I device handbook recommends a 4-layer PCB with a dedicated ground plane for clean PLL operation.
The 100-pin TQFP uses a 0.5 mm lead pitch and is best routed on a 4-layer PCB with the inner layers dedicated to ground and VCCINT power planes. Each TQFP lead should connect to its pad with a short dog-bone fan-out to an inner via, keeping lead-to-via length under 2 mm to minimize stub reflections. Reserve a continuous 5 mm × 5 mm copper pour under the device for thermal dissipation; while the C7N's typical core power is below 0.5 W, the pour doubles as a low-impedance VCCINT path and improves JTAG signal integrity.
The single PLL in the EP1C3T100C7N drives up to two output clocks; the dedicated CLK0 (pin 96) and CLK1 (pin 97) inputs feed the PLL and must be sourced from a low-jitter crystal or oscillator with a series-termination resistor at the FPGA pin. LVDS inputs require an external 100 Ω differential termination resistor across the LVDS pair pins placed within 5 mm of the FPGA; missing termination causes bit-error-rate degradation on LVDS links. SSTL-2 and SSTL-3 memory interfaces require a 1.25 V / 1.5 V VREF rail on the bank and 25 Ω series-termination on clocks and strobes per the Cyclone I device handbook.
Configuration failure is the most common EP1C3T100C7N debug issue. Three pitfalls dominate: (1) MSEL[2:0] (pins 90-92) must match the configuration mode - AS mode = 000, JTAG-only = 101 - a wrong value silently leaves the device in reset; (2) nCONFIG (pin 83) must be driven high after VCCINT and VCCIO are stable, otherwise the configuration controller never starts; (3) the EPCS1/EPCS4 serial flash must be programmed with the correct .pof or .jic file generated by Quartus - using a .sof file in production boards will not boot autonomously. Adding a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-down on nSTATUS follows the reference design.
Informations de conformité
RoHS and lead-free compliance confirmed via Cyclone I device handbook and IC-1101.com product page. Halogen-free status not specified in retrieved data. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC; the C7N commercial variant is not qualified for automotive safety applications.