EP2C8T144C6N - Cyclone II FPGA, 8K LE, 144-LQFP | Intel
Référence : EP2C8T144C6N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $35.37 | $35,37 |
| 10 | $30.5 | $305,00 |
| 100 | $22.8 | $2 280,00 |
| 500 | $17.95 | $8 975,00 |
| 1 000 | $14.2 | $14 200,00 |
EP2C8T144C6N Présentation
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows designers to implement arbitrary digital logic functions through an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. FPGAs sit in the digital logic hierarchy alongside ASICs and CPLDs, offering higher density than CPLDs while providing lower non-recurring engineering cost than ASICs. The Cyclone II family is positioned as a low-power, low-cost alternative to ASICs for volume production in consumer, industrial, and automotive applications.
Key features of the EP2C8T144C6N include 8,256 logic elements distributed across 36 logic array blocks (LABs), 36 embedded 18x18 multipliers for DSP-style arithmetic, two PLLs for clock synthesis, and embedded memory totaling approximately 165 Kbits. The 144-pin LQFP package exposes 85 user I/O pins supporting LVTTL, LVCMOS, PCI, SSTL, and LVDS I/O standards, enabling flexible interfacing with a wide range of external peripherals and memory devices.
The Cyclone II architecture uses a 4-input lookup table (LUT) as its fundamental logic element, with embedded multiplier blocks and M4K memory blocks providing dedicated arithmetic and storage resources. Configuration data is stored in SRAM cells, requiring a configuration device (such as the EPCS series) or a JTAG/microcontroller-based scheme to load the bitstream at power-up. The 90 nm process provides an optimal balance between cost, power, and density for mid-range FPGA designs.
Typical applications include digital signal processing front-ends, motor control, video processing bridges, industrial automation controllers, telecommunications glue logic, and educational FPGA platforms. The combination of low unit cost and ample DSP resources makes the EP2C8T144C6N particularly attractive for prototyping and small-to-medium volume production runs.
When designing with the EP2C8T144C6N, plan a robust configuration strategy using JTAG for development and an EPCS configuration flash for production. The 144-pin LQFP package supports hand-solderable prototypes, but multi-layer PCB design with dedicated ground and power planes is essential for signal integrity at higher toggle rates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers the complete picture for selecting and sourcing the EP2C8T144C6N.
Alternatives de remplacement direct pour EP2C8T144C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2C8T144C6N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2C8T144C8N
✅ Remplacement direct✓ En stock
$41.5 / unité
Voir la fiche technique →EP2C8T144C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$20.85 / unité
Voir la fiche technique →EP2C8T144I8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.5 / unité
Voir la fiche technique →EP2C8T144I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP2C8T144C6
✅ Remplacement direct✓ En stock
$22.62 / unité
Voir la fiche technique →EP2C5T144C8N
✅ Remplacement direct✓ En stock
$19.8 / unité
Voir la fiche technique →EP2C5T144C6N
✅ Remplacement direct✓ En stock
$5.1 / unité
Voir la fiche technique →EP2C8T144C6N Valeurs maximales et caractéristiques électriques
| Family | Cyclone II |
| Logic Elements | 8,256 |
| Total RAM Bits | 165,888 |
| Number of Logic Elements / Cells | 8,256 |
| Total Memory Bits | 165,888 |
| Number of I/O | 85 |
| Voltage - Supply | 1.15 V to 1.25 V (core) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Boîtier / Format | 144-LQFP (TQFP) |
| Supplier Device Package | 144-TQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Process Technology | 90 nm CMOS SRAM |
| Configuration Method | SRAM - volatile (EPCS/JTAG required) |
Configuration des broches de EP2C8T144C6N
| Broche 1 | I/O — User I/O (Bank 1) |
| Broche 2 | I/O — User I/O (Bank 1) |
| Broche 3 | I/O — User I/O (Bank 1) |
| Broche 4 | I/O — User I/O (Bank 1) |
| Broche 5 | I/O — User I/O (Bank 1) |
| Broche 6 | I/O — User I/O (Bank 1) |
| Broche 7 | I/O — User I/O (Bank 1) |
| Broche 8 | I/O — User I/O (Bank 1) |
| Broche 9 | I/O — User I/O (Bank 1) |
| Broche 10 | I/O — User I/O (Bank 1) |
| Broche 11 | VCCIO1 — I/O Bank 1 supply voltage |
| Broche 12 | I/O — User I/O (Bank 1) |
| Broche 13 | I/O — User I/O (Bank 1) |
| Broche 14 | I/O — User I/O (Bank 1) |
| Broche 15 | I/O — User I/O (Bank 1) |
| Broche 16 | I/O — User I/O (Bank 1) |
| Broche 17 | I/O — User I/O (Bank 1) |
| Broche 18 | I/O — User I/O (Bank 1) |
| Broche 19 | I/O — User I/O (Bank 1) |
| Broche 20 | I/O — User I/O (Bank 1) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O (Bank 2) |
| Broche 23 | I/O — User I/O (Bank 2) |
| Broche 24 | I/O — User I/O (Bank 2) |
| Broche 25 | I/O — User I/O (Bank 2) |
| Broche 26 | I/O — User I/O (Bank 2) |
| Broche 27 | I/O — User I/O (Bank 2) |
| Broche 28 | I/O — User I/O (Bank 2) |
| Broche 29 | I/O — User I/O (Bank 2) |
| Broche 30 | I/O — User I/O (Bank 2) |
| Broche 31 | I/O — User I/O (Bank 2) |
| Broche 32 | I/O — User I/O (Bank 2) |
| Broche 33 | VCCIO2 — I/O Bank 2 supply voltage |
| Broche 34 | I/O — User I/O (Bank 2) |
| Broche 35 | I/O — User I/O (Bank 2) |
| Broche 36 | I/O — User I/O (Bank 2) |
| Broche 37 | I/O — User I/O (Bank 2) |
| Broche 38 | I/O — User I/O (Bank 2) |
| Broche 39 | I/O — User I/O (Bank 2) |
| Broche 40 | I/O — User I/O (Bank 2) |
| Broche 41 | I/O — User I/O (Bank 2) |
| Broche 42 | I/O — User I/O (Bank 2) |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O (Bank 3) |
| Broche 45 | I/O — User I/O (Bank 3) |
| Broche 46 | I/O — User I/O (Bank 3) |
| Broche 47 | I/O — User I/O (Bank 3) |
| Broche 48 | I/O — User I/O (Bank 3) |
| Broche 49 | I/O — User I/O (Bank 3) |
| Broche 50 | I/O — User I/O (Bank 3) |
| Broche 51 | I/O — User I/O (Bank 3) |
| Broche 52 | I/O — User I/O (Bank 3) |
| Broche 53 | I/O — User I/O (Bank 3) |
| Broche 54 | I/O — User I/O (Bank 3) |
| Broche 55 | VCCIO3 — I/O Bank 3 supply voltage |
| Broche 56 | I/O — User I/O (Bank 3) |
| Broche 57 | I/O — User I/O (Bank 3) |
| Broche 58 | I/O — User I/O (Bank 3) |
| Broche 59 | I/O — User I/O (Bank 3) |
| Broche 60 | I/O — User I/O (Bank 3) |
| Broche 61 | I/O — User I/O (Bank 3) |
| Broche 62 | I/O — User I/O (Bank 3) |
| Broche 63 | I/O — User I/O (Bank 3) |
| Broche 64 | I/O — User I/O (Bank 3) |
| Broche 65 | I/O — User I/O (Bank 3) |
| Broche 66 | GND — Ground |
| Broche 67 | nSTATUS — Configuration status (open-drain) |
| Broche 68 | DCLK — Configuration clock (PS mode) |
| Broche 69 | DATA0 — Configuration data input (PS mode) |
| Broche 70 | nCONFIG — Configuration control (active-low) |
| Broche 71 | CONF_DONE — Configuration done (open-drain) |
| Broche 72 | MSEL0 — Configuration mode select bit 0 |
| Broche 73 | MSEL1 — Configuration mode select bit 1 |
| Broche 74 | MSEL2 — Configuration mode select bit 2 |
| Broche 75 | VCCINT — Core supply voltage (1.2V) |
| Broche 76 | GND — Ground |
| Broche 77 | TDI — JTAG test data input |
| Broche 78 | TMS — JTAG test mode select |
| Broche 79 | TCK — JTAG test clock |
| Broche 80 | TDO — JTAG test data output |
| Broche 81 | nCE — Chip enable (active-low) |
| Broche 82 | VCCIO4 — I/O Bank 4 supply voltage |
| Broche 83 | I/O — User I/O (Bank 4) |
| Broche 84 | I/O — User I/O (Bank 4) |
| Broche 85 | I/O — User I/O (Bank 4) |
| Broche 86 | I/O — User I/O (Bank 4) |
| Broche 87 | I/O — User I/O (Bank 4) |
| Broche 88 | I/O — User I/O (Bank 4) |
| Broche 89 | I/O — User I/O (Bank 4) |
| Broche 90 | I/O — User I/O (Bank 4) |
| Broche 91 | I/O — User I/O (Bank 4) |
| Broche 92 | I/O — User I/O (Bank 4) |
| Broche 93 | VCCIO4 — I/O Bank 4 supply voltage |
| Broche 94 | I/O — User I/O (Bank 4) |
| Broche 95 | I/O — User I/O (Bank 4) |
| Broche 96 | I/O — User I/O (Bank 4) |
| Broche 97 | I/O — User I/O (Bank 4) |
| Broche 98 | I/O — User I/O (Bank 4) |
| Broche 99 | I/O — User I/O (Bank 4) |
| Broche 100 | I/O — User I/O (Bank 4) |
| Broche 101 | I/O — User I/O (Bank 4) |
| Broche 102 | I/O — User I/O (Bank 4) |
| Broche 103 | I/O — User I/O (Bank 4) |
| Broche 104 | GND — Ground |
| Broche 105 | I/O — User I/O (Bank 1) |
| Broche 106 | I/O — User I/O (Bank 1) |
| Broche 107 | I/O — User I/O (Bank 1) |
| Broche 108 | I/O — User I/O (Bank 1) |
| Broche 109 | I/O — User I/O (Bank 1) |
| Broche 110 | I/O — User I/O (Bank 1) |
| Broche 111 | I/O — User I/O (Bank 1) |
| Broche 112 | I/O — User I/O (Bank 1) |
| Broche 113 | I/O — User I/O (Bank 1) |
| Broche 114 | I/O — User I/O (Bank 1) |
| Broche 115 | I/O — User I/O (Bank 1) |
| Broche 116 | I/O — User I/O (Bank 1) |
| Broche 117 | VCCIO1 — I/O Bank 1 supply voltage |
| Broche 118 | I/O — User I/O (Bank 1) |
| Broche 119 | I/O — User I/O (Bank 1) |
| Broche 120 | I/O — User I/O (Bank 1) |
| Broche 121 | I/O — User I/O (Bank 1) |
| Broche 122 | I/O — User I/O (Bank 1) |
| Broche 123 | I/O — User I/O (Bank 1) |
| Broche 124 | I/O — User I/O (Bank 1) |
| Broche 125 | I/O — User I/O (Bank 1) |
| Broche 126 | I/O — User I/O (Bank 1) |
| Broche 127 | I/O — User I/O (Bank 1) |
| Broche 128 | GND — Ground |
| Broche 129 | CLK0 — PLL Clock input 0 (Bank 3) |
| Broche 130 | CLK1 — PLL Clock input 1 (Bank 3) |
| Broche 131 | I/O — User I/O (Bank 3) |
| Broche 132 | I/O — User I/O (Bank 3) |
| Broche 133 | I/O — User I/O (Bank 3) |
| Broche 134 | I/O — User I/O (Bank 3) |
| Broche 135 | I/O — User I/O (Bank 3) |
| Broche 136 | I/O — User I/O (Bank 3) |
| Broche 137 | I/O — User I/O (Bank 3) |
| Broche 138 | I/O — User I/O (Bank 3) |
| Broche 139 | I/O — User I/O (Bank 3) |
| Broche 140 | I/O — User I/O (Bank 3) |
| Broche 141 | I/O — User I/O (Bank 3) |
| Broche 142 | I/O — User I/O (Bank 3) |
| Broche 143 | VCCIO3 — I/O Bank 3 supply voltage |
| Broche 144 | VCCINT — Core supply voltage (1.2V) |
Applications typiques
EP2C8T144C6N convient pour 6 applications: Industrial Motor Control, Video Processing Bridge, Digital Signal Processing Front-End, Industrial Communications and Glue Logic, Educational and Prototyping Platform, Consumer Electronics Control Logic.
Industrial Motor Control
The EP2C8T144C6N's 8,256 logic elements and 36 embedded 18x18 multipliers make it a strong fit for industrial motor control loops, including field-oriented control (FOC) and space-vector PWM (SVPWM). With 85 user I/O in the 144-LQFP package, designers can interface directly to Hall sensors, encoder inputs, gate drivers, and ADC feedback channels without external logic. The two PLLs allow flexible clock generation for encoder sampling and PWM switching frequencies, while the M4K memory blocks provide lookup-table storage for sine and Clarke transforms. Drop-in speed-grade flexibility (C6 to C8) gives design teams a margin to handle timing closure without PCB redesign.
Recommandé
Video Processing Bridge
For bridging between image sensors, video processors, and display panels, the EP2C8T144C6N provides ample LUT capacity for color-space conversion, frame-rate conversion, and timing generator logic. The 36 embedded 18x18 multipliers support real-time scaling and chroma resampling at standard video rates (480p to 720p). Its 85 I/O are sufficient to handle parallel RGB, BT.656, or LVDS video interfaces directly, while the 165,888 bits of RAM buffer a full video line for deinterlacing or scaling. The 144-LQFP package is hand-solderable, making it ideal for prototype video bridges used in surveillance, signage, or machine-vision applications.
Recommandé
Digital Signal Processing Front-End
With 36 dedicated 18x18 multipliers and 8,256 logic elements, the EP2C8T144C6N implements FIR filters, FFTs, and other DSP functions at baseband or audio sample rates. The M4K memory blocks (totaling 165,888 bits) can store filter coefficients and sample buffers, while the PLLs generate the precise clocks needed for ADC/DAC interfaces. Its low unit cost makes it attractive for production DSP front-ends in audio processing, biomedical instrumentation, or software-defined radio baseband. Quartus II DSP Builder and Verilog/VHDL flows are fully supported, with reference designs available from Intel for common FIR and FFT implementations.
Recommandé
Industrial Communications and Glue Logic
The EP2C8T144C6N is well suited for industrial protocol bridging, protocol conversion, and complex glue logic between microcontrollers, sensors, and communication transceivers. It can implement Modbus, CANopen, EtherCAT slave, PROFINET IRT, or custom industrial protocols in parallel with protocol translation. The 144-LQFP package's 85 I/O are sufficient to bridge multiple UART/SPI/I2C buses, while the embedded RAM supports packet buffering and protocol state machines. The commercial temperature grade (0C to +85C) is adequate for indoor cabinet environments; for harsher industrial sites, choose the EP2C8T144I8N drop-in alternative with -40C to +100C support.
Recommandé
Educational and Prototyping Platform
The combination of low unit cost, hand-solderable 144-LQFP package, and free Quartus II Web Edition toolchain makes the EP2C8T144C6N a popular choice for university FPGA courses, hobbyist projects, and engineering prototypes. The 8,256 logic elements provide enough capacity for full RISC-V soft cores (e.g. PicoRV32), custom instruction sets, and graduate-level projects without immediately running out of resources. Reference boards (e.g. Altera Cyclone II Starter Kit) pair this FPGA with EPCS configuration flash, SDRAM, VGA, and GPIO headers - enabling end-to-end learning of HDL design, synthesis, place-and-route, and verification.
Recommandé
Consumer Electronics Control Logic
In consumer products such as smart appliances, set-top boxes, and home entertainment peripherals, the EP2C8T144C6N provides the logic capacity to handle user-interface decoding, LED matrix driving, IR receiver decoding, and peripheral multiplexing. Its 85 I/O are sufficient to drive 7-segment displays, key-scan matrices, and multiple PWM channels for backlight or motor control. The low unit cost and proven Cyclone II reliability make it attractive for consumer volumes where ASIC NRE cannot be amortized. Reference designs from Intel cover I2C/SPI master-slave bridging, HDMI CEC handling, and IR protocol decoding.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2C8T144C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2C8T144C8N | EP2C8T144C7N | EP2C8T144I8N | EP2C5T144C8N | EP2C5T144C6N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 4,608 | 4,608 |
| Speed Grade | -C6 (fast) | -C8 (slower) | -C7 (intermediate) | -I8 (industrial) | -C8 (slower) | -C6 (matches) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/O | 85 | 85 | 85 | 85 | 89 | 89 |
| Embedded RAM (bits) | 165,888 | 165,888 | 165,888 | 165,888 | 119,808 | 119,808 |
Principaux différenciateurs
- Largest Cyclone II LE density in the 144-LQFP package (vs EP2C5T144C6N)
- Fastest speed grade available in 144-LQFP (-C6) (vs EP2C8T144C8N)
- Commercial temperature only - industrial variant is a drop-in upgrade (vs EP2C8T144I8N)
Notes de conception
The EP2C8T144C6N requires separate VCCINT (core, 1.15-1.25 V) and VCCIO1/VCCIO2/VCCIO3/VCCIO4 (I/O banks, 1.5/1.8/2.5/3.3 V) supplies. Decouple each VCCINT pin with one 0.1 uF ceramic plus one 10 uF bulk capacitor placed within 5 mm of the pin. Each VCCIO bank should have its own 0.1 uF + 10 uF decoupling pair to prevent switching noise from coupling between banks and corrupting logic levels on adjacent I/O standards.
Use a 4-layer PCB stackup (signal-GND-VCC-signal) with one continuous GND plane and one continuous VCC plane. The 144-TQFP package has a 0.5 mm pin pitch - route two traces between adjacent pads using 0.20 mm trace width with 0.20 mm clearance. Place a 4x4 via array (0.3 mm drilled, 0.5 mm pad) under the package thermal pad area (none for LQFP, but place ground vias around the package perimeter for thermal spreading and signal return paths).
Do not leave MSEL[2:0] floating - tie them to VCCINT or GND through 1 kohm resistors to define configuration mode. CONF_DONE and nSTATUS are open-drain and require a 10 kohm pull-up to VCCIO. The Cyclone II configuration sequence is sensitive to nCONFIG rising-edge timing - ensure power supplies have stabilized and PLL clock inputs are stable before nCONFIG is released, otherwise configuration may fail intermittently.
Cyclone II LVDS inputs require an external 100-ohm differential termination resistor across the pair placed within 5 mm of the FPGA pin. SSTL and HSTL I/O standards require external VTT termination at the receiver end. For clock inputs CLK0/CLK1, keep traces short and impedance-controlled (50-ohm single-ended or 100-ohm differential) to avoid jitter exceeding the PLL input specification. Always refer to the Cyclone II Device Handbook chapter 'I/O Features' for the specific standard being used.
Informations de conformité
RoHS, REACH, halogen-free, and conflict-mineral status were not explicitly confirmed in the Verified Web Data for this part - see Intel/Altera product page for current compliance documentation. The 'N' suffix in the MPN indicates lead-free / Pb-free plating per Altera's legacy naming convention.