EP2C8T144C8 - Cyclone II FPGA, 8K LEs, 144-TQFP | Intel
Référence : EP2C8T144C8 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.8 | $2 880,00 |
| 500 | $24.5 | $12 250,00 |
| 1 000 | $21.6 | $21 600,00 |
EP2C8T144C8 Présentation
A Field-Programmable Gate Array is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that engineers can re-program in-system to implement arbitrary digital functions. The Cyclone II family sits in the low-cost FPGA tier of the Intel product portfolio, below the high-performance Stratix series and the low-power MAX series, targeting cost-sensitive applications where unit cost and design simplicity outweigh raw logic density. FPGAs differ from microcontrollers in that logic is implemented in parallel hardware rather than sequential firmware, providing deterministic timing and high I/O throughput.
Key feature highlights include 8,256 LEs, 36 M4K (4 Kbit) RAM blocks totaling 165,888 RAM bits, up to 18 embedded 18 x 18 multipliers, two PLLs for clock management, and configuration via passive serial (PS), fast passive parallel (FPP), or Altera configuration devices such as EPCS series flash. The TQFP-144 package is offered in commercial (0C to +85C junction) and industrial (-40C to +100C ambient) variants; the 'C8' suffix denotes commercial temperature range with the medium-fast speed grade.
Typical applications include industrial motor control, low-cost video processing, education and development kits, consumer display controllers, and prototyping bridges for ASIC emulation. Designers select Cyclone II when they need more parallel logic or I/O bandwidth than a microcontroller can provide but want to avoid the PCB complexity of fine-pitch BGA packages. Quartus II Web Edition software (legacy, replaced by Quartus Prime Lite for newer device families) supports full synthesis, place-and-route, and JTAG programming for Cyclone II designs.
When designing with Cyclone II, observe that core 1.2 V must be generated from an external regulator, JTAG pinout follows IEEE 1149.1, and unused I/O pins should be configured as tri-stated inputs with weak pull-ups to avoid floating-node contention. The 90 nm process has higher static leakage than modern 28/14 nm FPGAs, so thermal management matters more in enclosed industrial housings. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone II family, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP2C8T144C8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2C8T144C8 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2C8T144C8N
✅ Remplacement direct✓ En stock
$41.5 / unité
Voir la fiche technique →EP2C8T144C7N
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →EP2C8T144C6N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EP2C8T144C7
✅ Remplacement direct✓ En stock
$28.75 / unité
Voir la fiche technique →EP2C8T144C6
✅ Remplacement direct✓ En stock
$22.62 / unité
Voir la fiche technique →EP2C8T144I8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.5 / unité
Voir la fiche technique →EP2C8T144I8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.5 / unité
Voir la fiche technique →EP2C5T144C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$19.8 / unité
Voir la fiche technique →EP2C8T144C8 Valeurs maximales et caractéristiques électriques
| Family | Cyclone II |
| Logic Elements (LE) | 8,256 |
| Total RAM Bits | 165,888 |
| Embedded Multipliers (18x18) | Up to 18 |
| User I/O Pins | 85 |
| PLLs | 2 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V (typical) |
| Boîtier | 144-pin TQFP (TQFP-144) |
| Température de fonctionnement | 0C to +85C (commercial, 'C8' grade) |
| Speed Grade | 8 |
| Configuration Modes | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de EP2C8T144C8
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | VCCINT — Core voltage (1.2 V) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | GND — Ground |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | I/O — User I/O pin (bank 3) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 3) |
| Broche 71 | VCCINT — Core voltage (1.2 V) |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | I/O — User I/O pin (bank 3) |
| Broche 76 | I/O — User I/O pin (bank 3) |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — User I/O pin (bank 3) |
| Broche 79 | I/O — User I/O pin (bank 3) |
| Broche 80 | I/O — User I/O pin (bank 3) |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | I/O — User I/O pin (bank 3) |
| Broche 83 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | I/O — User I/O pin (bank 4) |
| Broche 86 | I/O — User I/O pin (bank 4) |
| Broche 87 | I/O — User I/O pin (bank 4) |
| Broche 88 | I/O — User I/O pin (bank 4) |
| Broche 89 | I/O — User I/O pin (bank 4) |
| Broche 90 | I/O — User I/O pin (bank 4) |
| Broche 91 | I/O — User I/O pin (bank 4) |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 94 | GND — Ground |
| Broche 95 | I/O — User I/O pin (bank 4) |
| Broche 96 | I/O — User I/O pin (bank 4) |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | I/O — User I/O pin (bank 4) |
| Broche 100 | I/O — User I/O pin (bank 4) |
| Broche 101 | VCCINT — Core voltage (1.2 V) |
| Broche 102 | I/O — User I/O pin (bank 4) |
| Broche 103 | I/O — User I/O pin (bank 4) |
| Broche 104 | I/O — User I/O pin (bank 4) |
| Broche 105 | I/O — User I/O pin (bank 4) |
| Broche 106 | I/O — User I/O pin (bank 4) |
| Broche 107 | I/O — User I/O pin (bank 4) |
| Broche 108 | I/O — User I/O pin (bank 4) |
| Broche 109 | I/O — User I/O pin (bank 4) |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | I/O — User I/O pin (bank 4) |
| Broche 114 | I/O — User I/O pin (bank 4) |
| Broche 115 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 116 | I/O — User I/O pin (bank 4) |
| Broche 117 | I/O — User I/O pin (bank 4) |
| Broche 118 | TDI — JTAG Test Data In |
| Broche 119 | TMS — JTAG Test Mode Select |
| Broche 120 | TCK — JTAG Test Clock |
| Broche 121 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 122 | TDO — JTAG Test Data Out |
| Broche 123 | GND — Ground |
| Broche 124 | nCE — Chip Enable (active low) |
| Broche 125 | nCONFIG — Configuration start (active low) |
| Broche 126 | nSTATUS — Configuration status (active low) |
| Broche 127 | CONF_DONE — Configuration done (open drain) |
| Broche 128 | MSEL0 — Configuration mode select bit 0 |
| Broche 129 | MSEL1 — Configuration mode select bit 1 |
| Broche 130 | VCCINT — Core voltage (1.2 V) |
| Broche 131 | DCLK — Configuration clock (PS/FPP mode) |
| Broche 132 | DATA0 — Configuration data input bit 0 |
| Broche 133 | GND — Ground |
| Broche 134 | I/O — User I/O pin (bank 1) |
| Broche 135 | I/O — User I/O pin (bank 1) |
| Broche 136 | I/O — User I/O pin (bank 1) |
| Broche 137 | I/O — User I/O pin (bank 1) |
| Broche 138 | I/O — User I/O pin (bank 1) |
| Broche 139 | I/O — User I/O pin (bank 1) |
| Broche 140 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 141 | I/O — User I/O pin (bank 1) |
| Broche 142 | I/O — User I/O pin (bank 1) |
| Broche 143 | I/O — User I/O pin (bank 1) |
| Broche 144 | I/O — User I/O pin (bank 1) |
Applications typiques
EP2C8T144C8 convient pour 7 applications: Industrial Motor Control, Video Frame Buffer / Display Controller, University / Educational Digital-Logic Lab, ASIC Prototyping / Logic Replacement, Legacy Industrial Glue Logic Aggregation, Communications Protocol Bridge, Low-Cost Digital Signal Processing.
Industrial Motor Control
The EP2C8T144C8 fits industrial motor-control boards where 8,256 logic elements handle encoder quadrature decoding, Hall-sensor input conditioning, and field-oriented control (FOC) state machines concurrently. Its two embedded PLLs generate the 50 kHz PWM switching frequency and the 10 MHz encoder sampling clock from a single 50 MHz crystal, eliminating extra timing components. The 85 user I/Os route 3-phase PWM outputs, 6-7 servo encoder channels, and CAN/RS-485 transceivers without external mux ICs, while the 18x18 multipliers accelerate Clarke/Park transforms in hardware instead of software. The TQFP-144 footprint allows hand-reworkable assembly for low-volume industrial OEM batches.
Recommandé
Video Frame Buffer / Display Controller
The EP2C8T144C8's 165,888 embedded RAM bits (36 M4K blocks) are sufficient for dual-port line buffering of VGA 640x480@60Hz streams (307 KB) or partial QVGA 320x240 buffering in 24-bit color. Designers implement a VGA-to-LVDS bridge or OSD overlay in the 8,256 logic elements, with the I/O driving HSYNC/VSYNC and 24-bit RGB directly from the LVCMOS33 pins. Two PLLs generate the 25 MHz pixel clock and a 2x oversampled clock for edge alignment, while 18 multipliers enable simple image scaling and gamma correction without an external DSP. The TQFP-144 pin count exposes full 24-bit color plus sync and control lines without bus multiplexing.
Recommandé
University / Educational Digital-Logic Lab
The Cyclone II EP2C8T144C8 with 8,256 LEs provides students with enough capacity to implement entire RISC-V cores, VGA drivers, and audio processing chains within a single semester project. Its TQFP-144 package solders easily onto lab dev boards with 0.5 mm pitch pads and can be reworked with a hot-air station when student projects release magic smoke. The well-documented Quartus II Web Edition toolchain (free download) supports Verilog, VHDL, and schematic entry with built-in simulation, making it accessible to undergraduates. The 1.2 V core regulator and JTAG programming via USB-Blaster simplify lab PSU and programmer provisioning.
Recommandé
ASIC Prototyping / Logic Replacement
Designers use the EP2C8T144C8 to prototype ASIC functionality before committing to mask costs, taking advantage of 18 embedded multipliers and 165 KB RAM to model DSP and buffer subsystems. The 85 I/Os at LVCMOS33 interface directly with legacy ASIC pads, and TQFP-144 footprint allows quick breadboard iterations with through-hole adapters. The 1.2 V core regulator can be powered from a bench supply, and the JTAG port allows in-system reconfiguration within seconds to validate RTL changes. For ASIC emulators, multiple EP2C8 boards are daisy-chained via expansion headers to build larger logic capacity.
Recommandé
Legacy Industrial Glue Logic Aggregation
The EP2C8T144C8 aggregates 5-15 discrete 74-series logic ICs into a single programmable device, reducing PCB area by 50-70% in legacy industrial controllers facing component obsolescence. Engineers port existing discrete-logic schematics into Verilog or VHDL and compile them into the 8K LEs, with the 85 I/Os replacing up to 30 discrete gates per IO bank. The two PLLs replace external clock-distribution buffers, while the embedded 36 multipliers cover CRC and Manchester encoding tasks. Industrial temperature variants (EP2C8T144I8N) are pin-compatible for harsh-environment deployments.
Recommandé
Communications Protocol Bridge
In protocol-bridge applications, the EP2C8T144C8 implements UART/SPI/I2C to CAN or Modbus conversion, with 18x18 multipliers handling CRC16/CRC32 calculation at wire speed. The 85 I/Os expose up to 4 UART channels, 3 SPI masters, 2 I2C buses, and 2 CAN controllers concurrently, replacing a microcontroller plus 3-4 external bus-expanders. The two PLLs generate independent baud-rate clocks for each interface from a single 50 MHz reference, and the 165 KB RAM buffers messages between asynchronous buses. TQFP-144 fits into standard 4-layer industrial PCBs with hand-reworkable assembly.
Recommandé
Low-Cost Digital Signal Processing
The 18 embedded 18x18 multipliers in the EP2C8T144C8 deliver up to 1.1 GMAC throughput at 250 MHz, enough for FIR filters, FFT radix-2 butterflies, and DCT transforms in audio and image preprocessing. Designers pair the multipliers with the 36 M4K RAM blocks for coefficient storage and sample buffers, achieving 16-tap FIR at 50 MSPS in a single device. Two PLLs generate the required 50-250 MHz DSP clock and the 48 kHz audio rate from a master oscillator. The 85 I/Os accept parallel ADC data and output processed streams to DACs without an intermediate ASIC.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2C8T144C8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2C8T144C8N | EP2C8T144C7N | EP2C8T144C6N | EP2C8T144I8N | EP2C5T144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 4,608 |
| Speed Grade | C8 | C8 | C7 (faster) | C6 (fastest) | I8 (industrial) | C8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial |
| User I/O Count | 85 | 85 | 85 | 85 | 85 | 89 (more I/O with same LE count) |
| Embedded RAM (bits) | 165,888 | 165,888 | 165,888 | 165,888 | 165,888 | 119,808 |
| 18x18 Multipliers | 18 | 18 | 18 | 18 | 18 | 13 |
| Approx Unit Price (qty 100) | ~$28.80 USD | ~$28.80 USD | ~$33.00 USD | ~$38.00 USD | ~$45.00 USD | ~$22.00 USD |
Principaux différenciateurs
- Combined 8,256 LEs + 18 multipliers + 85 user I/Os in TQFP-144 (vs EP2C5T144C8N)
- Same TQFP-144 package across the entire Cyclone II family (vs EP2C8F256C8N (BGA-256))
- C8 speed grade optimized for industrial temperature operation (vs EP2C8T144I8N)
Notes de conception
The EP2C8T144C8 requires three separate supply rails: VCCINT (1.2 V core, +/-5% tolerance), VCCIO1-4 (1.5/1.8/2.5/3.3 V per bank), and VCCA_PLL (1.2 V analog PLL supply). Each rail must be decoupled with 0.1 uF ceramic capacitors placed within 0.25 inch of the respective supply pin, plus 100 uF bulk capacitors on each rail near the package. Use a low-noise LDO such as LT3021 or TPS7A45 for VCCA_PLL to minimize PLL jitter. Power-on sequencing is not strictly required but is recommended: VCCINT before VCCIO to avoid I/O driver latch-up.
Estimated: at 25C ambient with all 8,256 LEs switching at 50% toggle rate, the EP2C8T144C8 dissipates approximately 0.6-0.9 W. The TQFP-144 package has theta_JA around 28 C/W with standard JEDEC 4-layer test PCB, yielding a junction temperature rise of 17-25C above ambient. For enclosed industrial housings above 50C ambient, use a top-side copper heatsink or thermal vias to a bottom-side ground pour. Active cooling (fan) is generally not required at C8 speed grade.
The TQFP-144 package uses 0.5 mm pitch leads; PCB design rules require 0.2 mm trace width and 0.15 mm trace clearance. Place all VCCINT decoupling capacitors on the same side as the FPGA within 5 mm of the supply pins. Use a continuous ground plane on layer 2 with via stitching every 25 mm around the FPGA perimeter. JTAG chain signals (TCK, TMS, TDI, TDO) should be routed with 50 ohm controlled impedance and length-matched within 25 mm to avoid boundary-scan issues.
Do not exceed 1.26 V on VCCINT - permanent damage occurs above 1.4 V. Unused I/O pins must be configured in the Quartus II assignment as 'tri-stated input with weak pull-up' to avoid floating-node leakage. Do not hot-swap power supplies - the Cyclone II lacks hot-swap tolerance. The MSEL[1:0] pins must match the desired configuration mode (00 = AS, 01 = PS, 10 = FPP) or configuration will fail silently. Always include a 10 kohm pull-up on nCONFIG and CONF_DONE for reliable startup.
Informations de conformité
EP2C8T144C8 (without N suffix) is original Pb-bearing assembly per Intel ordering code conventions. For RoHS compliance, use EP2C8T144C8N variant. AEC-Q100 not applicable for non-automotive FPGA grade.