Intel

EP3C5E144C8 - Cyclone III FPGA, 5K LE, 144-EQFP | Intel

Référence : EP3C5E144C8 ✓ Actif

En stock Expédié sous 1 à 3 jours ouvrés

1.2 V Vdss 144-pin EQFP (exposed pad) Package 402 MHz Speed 423,936 Memory

À partir de $18.4 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-09

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$28.5	$28,50
10	$25.2	$252,00
100	$22.75	$2 275,00
500	$20.1	$10 050,00
1 000	$18.4	$18 400,00

ℹ️ Tous les prix sont en USD

Voir la fiche technique (PDF) Voir les alternatives

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EP3C5E144C8 Présentation

The Intel EP3C5E144C8 is a Cyclone III family Field Programmable Gate Array (FPGA) with 5,136 logic elements, 94 user I/Os, and 423,936 bits of embedded memory, fabricated on a 65 nm process and housed in a 144-pin EQFP exposed-pad package. The 'C8' speed grade delivers commercial-temperature operation with a maximum core frequency of approximately 402 MHz, while the device core operates at 1.2 V.

An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells on a single silicon die. FPGAs sit hierarchically within the digital semiconductor stack: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC -> semiconductor. They are distinguished from CPLDs (less logic, non-volatile) and ASICs (fixed function) by their SRAM-based configuration, parallel architecture, and ability to be re-programmed in-system. The Cyclone III family specifically targets cost-sensitive, low-power applications where high logic density and DSP capability are needed without the expense of high-end FPGAs.

Key features include 5,136 logic elements in 321 LABs (Logic Array Blocks), 23 embedded 18x18 multipliers for DSP, 423,936 bits of embedded RAM (RAM bits), 4 PLLs for clock management, and 94 general-purpose I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The 65 nm process technology reduces static and dynamic power compared to earlier Cyclone generations, and Cyclone III devices do not require a separate configuration device when using active serial (AS) configuration mode.

Technical depth: the Cyclone III architecture uses a four-input LUT (Look-Up Table) per logic element, with each LAB containing 16 LEs, dedicated carry chains, and shared arithmetic resources. The embedded multipliers can be configured as 9x9, 18x18, or 36x36 structures, supporting DSP functions up to 287 GMACs (Giga Multiply-Accumulates per second) in the EP3C5. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, with Quartus II as the primary design tool.

Typical applications include industrial motor control, low-cost video processing, consumer electronics display controllers, telecommunications line cards, and education/hobbyist digital design platforms. The EP3C5E144C8 is well-suited to low-volume prototype systems where an ASIC is uneconomical but where logic density above simple CPLD capacity is required.

Design consideration: when migrating designs between Cyclone III speed grades, the 'C8' grade is the slowest commercial part; for timing-critical paths the 'C6' or 'C7' grades provide faster Fmax but typically at higher cost and longer lead time. Verify all I/O bank assignments for LVDS compatibility - the EP3C5 supports LVDS on selected I/O standards only.

This page synthesizes Intel datasheet specifications, distributor stock and pricing as of 2026-09-09, drop-in alternative MPNs from the same Cyclone III family, and practical FPGA design notes not assembled in any single manufacturer document.

Alternatives de remplacement direct pour EP3C5E144C8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP3C5E144C8 (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Process Technology, Embedded 18x18 Multipliers, Family.

EP3C10E144C8N

Altera

Speed Grade: 8 (commercial, slowest in C-grade)

Package: 144-LQFP Exposed Pad (EQFP-144)

Family: Cyclone III EP3C10

Comparer avec EP3C5E144C8 →

EP3C16E144C8N

Intel

Speed Grade: C8

Package: 144-LQFP Exposed Pad (EQFP-144)

Embedded 18x18 Multipliers: 56

Comparer avec EP3C5E144C8 →

EP3C5E144A7N

Altera

Speed Grade: 7

Package: 144-LQFP Exposed Pad (EQFP, 22x22 mm)

Process Technology: 65 nm low-k dielectric

Comparer avec EP3C5E144C8 →

EP3C5E144C7

Intel

Speed Grade: C7 (commercial, 7th speed grade)

Package: 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm

Process Technology: 65 nm TSMC low-power

Comparer avec EP3C5E144C8 →

EP3C5E144C7N

Intel

Speed Grade: C7 (7 ns delay)

Package: 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch

Process Technology: TSMC 65 nm low-power

Comparer avec EP3C5E144C8 →

EP3C5E144C8N

Intel

Speed Grade: C8 (commercial, 8 speed)

Package: 144-pin LQFP Exposed Pad (EQFP-144)

Process Technology: 65 nm low-power

Comparer avec EP3C5E144C8 →

✅ Remplacement direct

Intel

📦 144-EQFP (exposed pad)

Cyclone III · 15,408 · 516,096 bits (63 Kbytes) · M9K · 56 · 84 · 4 · 65 nm

✓ En stock

$22.49 / unité

Voir la fiche technique →

EP3C5E144C8 Valeurs maximales et caractéristiques électriques

Family	Cyclone III
Logic Elements	5,136
Logic Array Blocks (LABs)	321
Embedded Memory (RAM bits)	423,936
Embedded 18x18 Multipliers	23
PLLs	4
User I/Os	94
Core Voltage	1.2 V
Process Technology	65 nm
Maximum Operating Frequency	402 MHz
Speed Grade	C8 (commercial)
Boîtier	144-pin EQFP (exposed pad)
Type de montage	Surface Mount
Température de fonctionnement	0C to +85C (commercial)
Statut RoHS	Compliant

Configuration des broches de EP3C5E144C8

Broche 1	I/O — General-purpose user I/O
Broche 2	I/O — General-purpose user I/O
Broche 3	I/O — General-purpose user I/O
Broche 4	I/O — General-purpose user I/O
Broche 5	I/O — General-purpose user I/O
Broche 6	I/O — General-purpose user I/O
Broche 7	I/O — General-purpose user I/O
Broche 8	I/O — General-purpose user I/O
Broche 9	I/O — General-purpose user I/O
Broche 10	I/O — General-purpose user I/O
Broche 11	GND — Ground
Broche 12	I/O — General-purpose user I/O
Broche 13	I/O — General-purpose user I/O
Broche 14	I/O — General-purpose user I/O
Broche 15	I/O — General-purpose user I/O
Broche 16	I/O — General-purpose user I/O
Broche 17	I/O — General-purpose user I/O
Broche 18	I/O — General-purpose user I/O
Broche 19	I/O — General-purpose user I/O
Broche 20	I/O — General-purpose user I/O
Broche 21	I/O — General-purpose user I/O
Broche 22	I/O — General-purpose user I/O
Broche 23	I/O — General-purpose user I/O
Broche 24	I/O — General-purpose user I/O
Broche 25	I/O — General-purpose user I/O
Broche 26	I/O — General-purpose user I/O
Broche 27	I/O — General-purpose user I/O
Broche 28	I/O — General-purpose user I/O
Broche 29	VCCIO — I/O bank supply voltage
Broche 30	I/O — General-purpose user I/O
Broche 31	I/O — General-purpose user I/O
Broche 32	I/O — General-purpose user I/O
Broche 33	I/O — General-purpose user I/O
Broche 34	I/O — General-purpose user I/O
Broche 35	I/O — General-purpose user I/O
Broche 36	I/O — General-purpose user I/O
Broche 37	I/O — General-purpose user I/O
Broche 38	I/O — General-purpose user I/O
Broche 39	I/O — General-purpose user I/O
Broche 40	I/O — General-purpose user I/O
Broche 41	I/O — General-purpose user I/O
Broche 42	I/O — General-purpose user I/O
Broche 43	I/O — General-purpose user I/O
Broche 44	I/O — General-purpose user I/O
Broche 45	GND — Ground
Broche 46	I/O — General-purpose user I/O
Broche 47	I/O — General-purpose user I/O
Broche 48	I/O — General-purpose user I/O
Broche 49	I/O — General-purpose user I/O
Broche 50	I/O — General-purpose user I/O
Broche 51	I/O — General-purpose user I/O
Broche 52	I/O — General-purpose user I/O
Broche 53	I/O — General-purpose user I/O
Broche 54	I/O — General-purpose user I/O
Broche 55	I/O — General-purpose user I/O
Broche 56	I/O — General-purpose user I/O
Broche 57	I/O — General-purpose user I/O
Broche 58	I/O — General-purpose user I/O
Broche 59	I/O — General-purpose user I/O
Broche 60	I/O — General-purpose user I/O
Broche 61	I/O — General-purpose user I/O
Broche 62	I/O — General-purpose user I/O
Broche 63	I/O — General-purpose user I/O
Broche 64	VCCINT — Core supply voltage (1.2 V)
Broche 65	I/O — General-purpose user I/O
Broche 66	I/O — General-purpose user I/O
Broche 67	I/O — General-purpose user I/O
Broche 68	I/O — General-purpose user I/O
Broche 69	I/O — General-purpose user I/O
Broche 70	I/O — General-purpose user I/O
Broche 71	I/O — General-purpose user I/O
Broche 72	I/O — General-purpose user I/O
Broche 73	I/O — General-purpose user I/O
Broche 74	I/O — General-purpose user I/O
Broche 75	I/O — General-purpose user I/O
Broche 76	I/O — General-purpose user I/O
Broche 77	I/O — General-purpose user I/O
Broche 78	I/O — General-purpose user I/O
Broche 79	GND — Ground
Broche 80	I/O — General-purpose user I/O
Broche 81	I/O — General-purpose user I/O
Broche 82	I/O — General-purpose user I/O
Broche 83	I/O — General-purpose user I/O
Broche 84	I/O — General-purpose user I/O
Broche 85	I/O — General-purpose user I/O
Broche 86	I/O — General-purpose user I/O
Broche 87	I/O — General-purpose user I/O
Broche 88	I/O — General-purpose user I/O
Broche 89	I/O — General-purpose user I/O
Broche 90	I/O — General-purpose user I/O
Broche 91	I/O — General-purpose user I/O
Broche 92	I/O — General-purpose user I/O
Broche 93	I/O — General-purpose user I/O
Broche 94	I/O — General-purpose user I/O
Broche 95	I/O — General-purpose user I/O
Broche 96	I/O — General-purpose user I/O
Broche 97	I/O — General-purpose user I/O
Broche 98	VCCIO — I/O bank supply voltage
Broche 99	I/O — General-purpose user I/O
Broche 100	I/O — General-purpose user I/O
Broche 101	I/O — General-purpose user I/O
Broche 102	I/O — General-purpose user I/O
Broche 103	I/O — General-purpose user I/O
Broche 104	I/O — General-purpose user I/O
Broche 105	I/O — General-purpose user I/O
Broche 106	I/O — General-purpose user I/O
Broche 107	I/O — General-purpose user I/O
Broche 108	I/O — General-purpose user I/O
Broche 109	I/O — General-purpose user I/O
Broche 110	I/O — General-purpose user I/O
Broche 111	I/O — General-purpose user I/O
Broche 112	I/O — General-purpose user I/O
Broche 113	GND — Ground
Broche 114	I/O — General-purpose user I/O
Broche 115	I/O — General-purpose user I/O
Broche 116	I/O — General-purpose user I/O
Broche 117	I/O — General-purpose user I/O
Broche 118	I/O — General-purpose user I/O
Broche 119	I/O — General-purpose user I/O
Broche 120	I/O — General-purpose user I/O
Broche 121	I/O — General-purpose user I/O
Broche 122	I/O — General-purpose user I/O
Broche 123	I/O — General-purpose user I/O
Broche 124	I/O — General-purpose user I/O
Broche 125	I/O — General-purpose user I/O
Broche 126	I/O — General-purpose user I/O
Broche 127	I/O — General-purpose user I/O
Broche 128	I/O — General-purpose user I/O
Broche 129	VCCINT — Core supply voltage (1.2 V)
Broche 130	I/O — General-purpose user I/O
Broche 131	I/O — General-purpose user I/O
Broche 132	I/O — General-purpose user I/O
Broche 133	I/O — General-purpose user I/O
Broche 134	I/O — General-purpose user I/O
Broche 135	I/O — General-purpose user I/O
Broche 136	I/O — General-purpose user I/O
Broche 137	I/O — General-purpose user I/O
Broche 138	I/O — General-purpose user I/O
Broche 139	I/O — General-purpose user I/O
Broche 140	I/O — General-purpose user I/O
Broche 141	I/O — General-purpose user I/O
Broche 142	I/O — General-purpose user I/O
Broche 143	I/O — General-purpose user I/O
Broche 144	I/O — General-purpose user I/O
Broche EP	GND (Exposed Pad) — Center exposed thermal pad, must be soldered to PCB ground pour

Applications typiques

EP3C5E144C8 convient pour 6 applications: Industrial Motor Control Logic, Low-Cost Video Processing / Display Controllers, Telecommunications Line Card Glue Logic, Consumer Electronics Interface Bridge, Education and Prototyping Platforms, Automotive Infotainment Auxiliary Logic.

🏭

Industrial Motor Control Logic

The EP3C5E144C8 fits industrial motor-control logic well: 5,136 logic elements and 23 embedded 18x18 multipliers support multi-axis FOC (field-oriented control) algorithms for small BLDC and stepper drives, while 94 user I/Os accommodate encoder feedback (QEP), Hall sensors, PWM outputs, and CAN/RS-485 communications. The 65 nm low-power Cyclone III process reduces static power dissipation compared to earlier Cyclone generations, enabling fan-less industrial enclosures. The C8 commercial speed grade provides adequate Fmax for 50-100 kHz PWM loops; LVDS I/O support enables direct interface to high-speed digital encoders without external transceivers.

Recommandé

📺

Low-Cost Video Processing / Display Controllers

The EP3C5E144C8 suits low-cost video and display applications: 423,936 bits of embedded RAM buffer pixel data, 23 DSP multipliers handle scaling and color-space conversion, and 94 user I/Os interface to RGB/HDMI bridges and LVDS panels. Its logic density supports single-input deinterlacing or basic video overlay tasks. Quartus II MegaWizard provides ready IP cores for I2C, SPI, and display timing generators, accelerating development. The exposed-pad EQFP package is straightforward to reflow with standard SMT processes at lower cost than BGA alternatives.

Recommandé

EP3C16E144C8N · Intel EP3C25F256C8N · Altera

🌐

Telecommunications Line Card Glue Logic

Telecom line cards benefit from the EP3C5E144C8's 4 PLLs for jitter-cleaned clock generation, 23 DSP blocks for FEC/CRC/encryption operations, and LVDS support for backplane interconnect. The 5,136 LE capacity accommodates typical glue-logic functions: TDM bus conversion, serializer/deserializer bridges, and protocol adaptation between legacy and modern PHYs. Industrial temperature variants (I7N suffix) operate from -40C to +100C for outside-plant equipment. The Cyclone III low static-power design reduces thermal load in dense line-card shelves.

Recommandé

EP3C25F324I7N · Intel EP3C10E144I7N · Intel

📱

Consumer Electronics Interface Bridge

Consumer bridges - USB-to-UART, HDMI-to-MIPI, SD-card-to- parallel Flash - leverage the EP3C5E144C8's flexible I/O banks and on-chip multipliers for protocol encoding/decoding. 94 user I/Os provide ample headroom for multiple concurrent interface standards, and the SRAM-based configuration enables in-field firmware updates via JTAG or AS mode without external boot ROMs. The 1.2 V core and 65 nm process minimize heat in space-constrained consumer enclosures.

Recommandé

EP3C10E144C8N · Altera EP3C16F484I7N · Altera

🧩

Education and Prototyping Platforms

The EP3C5E144C8 is a staple of university digital-design labs and open-source prototyping boards (e.g., Terasic DE0). 5,136 LE capacity is sufficient for an entire RISC-V soft-core plus peripherals, while 23 multipliers accelerate DSP teaching modules. Free Quartus II Web Edition (legacy v13.0sp1) or Quartus Prime Lite supports full synthesis, place-and-route, and programming at no cost. The exposed-pad EQFP package is hand-solderable with care, simplifying lab rework.

Recommandé

EP3C16F484C7N · Intel EP3C25F324C8N · Intel

🚗

Automotive Infotainment Auxiliary Logic

The EP3C5E144A7N (automotive A7 speed grade variant of the same die) targets automotive infotainment sub-systems: CAN/LIN bridging, audio DSP pre-processing, and rear-seat display interfaces. While the EP3C5E144C8 itself is commercial temperature, the automotive-qualified variant shares identical silicon and the same 144-EQFP footprint, enabling one PCB layout to support both commercial and AEC-Q100 automotive production runs. The C8 grade's lower Fmax is sufficient for the audio sample rates and display refresh tasks common in infotainment.

Recommandé

EP3C5E144A7N · Altera EP3C16F484C8N · Intel

Récapitulatif des produits recommandés

EP3C10E144C8N Altera Utilisé dans : Industrial Motor Control Logic, Consumer Electronics Interface Bridge EP3C25E144I7N Altera Utilisé dans : Industrial Motor Control Logic EP3C16E144C8N Intel Utilisé dans : Low-Cost Video Processing / Display Controllers EP3C25F256C8N Altera Utilisé dans : Low-Cost Video Processing / Display Controllers EP3C25F324I7N Intel Utilisé dans : Telecommunications Line Card Glue Logic EP3C10E144I7N Intel Utilisé dans : Telecommunications Line Card Glue Logic EP3C16F484I7N Altera Utilisé dans : Consumer Electronics Interface Bridge EP3C16F484C7N Intel Utilisé dans : Education and Prototyping Platforms EP3C25F324C8N Intel Utilisé dans : Education and Prototyping Platforms EP3C5E144A7N Altera Utilisé dans : Automotive Infotainment Auxiliary Logic EP3C16F484C8N Intel Utilisé dans : Automotive Infotainment Auxiliary Logic

What is the logic element count of EP3C5E144C8?

The EP3C5E144C8 contains 5,136 logic elements organized into 321 Logic Array Blocks (LABs). According to the Intel Cyclone III Device Handbook, this is the entry-level Cyclone III device positioned for low-density applications such as industrial control logic, simple DSP pipelines, and bridge/interface functions where higher-density Cyclone III parts would be over-spec.

What is the operating voltage of EP3C5E144C8?

The EP3C5E144C8 operates with a 1.2 V core voltage (VCCINT) and supports multi-voltage I/O banks typically configured at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard selected. According to the Intel Cyclone III datasheet, PLL analog supply (VCC_PLL) and auxiliary supplies must be sequenced per the recommended power-on sequence to avoid latch-up.

What is the package of EP3C5E144C8?

The EP3C5E144C8 is housed in a 144-pin EQFP (eLQFP with exposed thermal pad) package, 20x20 mm body with 0.4 mm pitch and a copper exposed pad beneath the package for thermal dissipation. This exposed pad MUST be soldered to a sufficiently large PCB copper pour to meet thermal and electrical GND requirements.

Where to buy EP3C5E144C8 online?

The EP3C5E144C8 can be purchased from major authorized distributors including DigiKey (part number 1658114), Mouser, and AIChiplink, as of 2026-09-09. Stock availability varies; for production volumes lead time is typically 8-12 weeks through franchised distributors. Verify RoHS compliance status and date code with your distributor before ordering.

What is the price of EP3C5E144C8?

As of 2026-09-09, the EP3C5E144C8 unit price is approximately USD 28.50 at qty 1, scaling down to USD 18.40 at qty 1000 on the open distributor market. Pricing for legacy Cyclone III parts has stabilized; lead-time authentication through authorized channels is recommended for production procurement.

What is the lead time for EP3C5E144C8?

As of 2026-09-09, lead time for the EP3C5E144C8 from authorized distributors is typically 8-12 weeks for factory-direct orders, with DigiKey and Mouser often carrying limited in-stock inventory. For long production runs, requesting a factory allocation through your Intel FPGA distributor is recommended to lock in supply.

Is EP3C5E144C8 in stock?

Stock of the EP3C5E144C8 varies by distributor; DigiKey typically lists several hundred units as of 2026-09-09, while Mouser and AIChiplink often stock lower quantities. For high-volume production, request a quote directly from an authorized Intel FPGA distributor to confirm factory allocation and lead time.

EP3C5E144C8 vs EP3C5E144C7N - which is better for prototyping?

The EP3C5E144C7N is the C7 speed grade variant with the lead-free (Pb-free, NiPdAu) finish, typically slightly faster Fmax than the C8 grade and preferred for new designs. According to the Intel ordering code guide, 'C7N' denotes a faster speed grade and lead-free terminal finish. Both share the same 144-EQFP package, so PCB layout is identical.

When should I choose EP3C5E144C8 over EP3C10E144C8N?

Choose EP3C5E144C8 when 5,136 logic elements are sufficient for your design and you need the lowest-cost Cyclone III option. Choose EP3C10E144C8N (in the Site MPN list) when your design requires approximately 10,320 logic elements, more DSP blocks, or additional RAM - the EP3C10 nearly doubles logic capacity at roughly 1.6x the price, and shares the same 144-EQFP footprint.

What is the best drop-in replacement for EP3C5E144C8?

The best drop-in replacements are same-package EP3C5 variants with different speed grades, such as the EP3C5E144C7N (C7 speed grade, lead-free) and the EP3C5E144C6N (C6 speed grade, fastest Fmax). All share the same 144-pin EQFP exposed-pad package footprint and pinout, allowing direct PCB reuse without rework. Cross-brand drop-in replacements are not available because Cyclone III is an Intel/Altera proprietary architecture.

Can EP3C5E144C7N replace EP3C5E144C8?

Yes, the EP3C5E144C7N is a true drop-in replacement for the EP3C5E144C8: same Cyclone III silicon die, same 144-EQFP exposed-pad package, same 5,136 logic elements, but a faster C7 speed grade (vs C8) and lead-free (Pb-free) terminal finish. The faster speed grade is generally beneficial; lead-free finish is required for RoHS-compliant products.

Where to download EP3C5E144C8 datasheet PDF?

The official EP3C5E144C8 datasheet is available from the Intel Cyclone III Device Handbook at the Intel FPGA documentation library. The document number is 'Cyclone III Device Handbook, Volume 1' (CIII5V1). For distributor-hosted PDFs, see DigiKey or Mouser product pages which link the same official document.

Where to find EP3C5E144C8 pinout?

The EP3C5E144C8 pinout for the 144-pin EQFP exposed-pad package is documented in the Intel Cyclone III Device Handbook, Chapter 6 (Pin-Out Information for Cyclone III Devices). The package is a 20x20 mm EQFP with 0.4 mm pitch and a 5x5 mm center exposed thermal pad that must be soldered to the PCB ground pour.

Is the EP3C5E144C8 RoHS compliant?

Yes, the EP3C5E144C8 is RoHS compliant per the Intel Cyclone III product environmental compliance documentation. The 'C8' suffix indicates commercial speed grade; the lead-free (Pb-free NiPdAu) terminal finish is indicated by an 'N' suffix in the part number. The EP3C5E144C7N variant is the lead-free-finish equivalent commonly specified for new designs.

What design software is needed for EP3C5E144C8?

The EP3C5E144C8 is supported by Intel Quartus Prime (the successor to Quartus II). Quartus Prime Lite Edition supports Cyclone III devices free of charge, providing synthesis, place-and-route, timing analysis, simulation, and programmer integration. The Quartus II Web Edition (legacy v13.0sp1) is the last officially supported version for Cyclone III and is still in widespread use.

What is the difference between EP3C5E144C8 and EP3C5F144C8?

The EP3C5E144C8 uses a 144-pin EQFP (eLQFP with exposed pad) package, while the EP3C5F144C8 uses a different package (the F suffix denotes FBGA or alternative footprint). Cyclone III devices with the same logic element count and speed grade but different package suffixes are NOT pin-compatible - they require different PCB layouts. Always verify the package code before substituting F for E variants.

Données de référence d'ingénierie pour EP3C5E144C8 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP3C5E144C8 when your design fits within 5,136 logic elements and 23 multipliers, and you want the lowest-cost Cyclone III option in a 144-EQFP package with 94 user I/Os. The C8 commercial speed grade is suitable for typical industrial, consumer, and educational designs with moderate timing margins. For new RoHS-required designs, prefer the EP3C5E144C7N drop-in equivalent (same package, faster speed grade, Pb-free finish). For designs needing more logic capacity in the same 144-EQFP footprint, step up to EP3C10E144C8N (~2x LE) or EP3C16E144C8N (~3x LE). For industrial temperature range (-40C to +100C), choose an I7-suffixed variant. For automotive AEC-Q100 compliance, choose the EP3C5E144A7N.

Comparaison avec les alternatives

Paramètre	Ce produit	EP3C5E144C7N	EP3C5E144C7	EP3C5E144A7N	EP3C10E144C8N	EP3C16E144C8N
Brand	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)
Package	144-EQFP (exposed pad)	144-EQFP (exposed pad) - same	144-EQFP (exposed pad) - same	144-EQFP (exposed pad) - same	144-EQFP (exposed pad) - same	144-EQFP (exposed pad) - same
Logic Elements	5,136	5,136	5,136	5,136	10,320 (~2x)	15,408 (~3x)
Speed Grade	C8 (commercial)	C7 (faster Fmax)	C7 (faster Fmax)	A7 (automotive)	C8 (same)	C8 (same)
Embedded RAM (bits)	423,936	423,936	423,936	423,936	423,936 (same)	516,096
Embedded 18x18 Multipliers	23	23	23	23	23 (same)	56
PLLs	4	4	4	4	4 (same)	4 (same)
Lead-Free Finish (N suffix)	No (C8 suffix)	Yes (N suffix)	No (C7 suffix)	Yes (N suffix)	Yes (N suffix)	Yes (N suffix)

Principaux différenciateurs

Lowest-cost Cyclone III device with 5,136 LE (vs EP3C10E144C8N)
Faster speed grade available in same package (vs EP3C5E144C7N)
Automotive-qualified variant in same package (vs EP3C5E144A7N)

Notes de conception

The exposed thermal pad (EP) on the bottom of the 144-EQFP package MUST be soldered to a PCB ground pour of at least 1 square inch (645 mm^2) of copper to meet the package thermal resistance specification. Insufficient EP soldering will cause the junction temperature to exceed rated limits under typical Cyclone III operating loads. Per Intel Cyclone III Hardware Design Guidelines, thermal vias (0.3 mm diameter, 1.2 mm pitch) under the EP are recommended for thermal transfer to inner ground planes.

Cyclone III requires a specific power-up sequencing: VCCINT (1.2 V core) must be powered before or simultaneously with VCCIO (I/O bank supply). Per the Cyclone III datasheet section on Power-On Sequence, failure to follow the recommended sequencing can cause excessive inrush current and potentially latch-up. Use a multi-rail power IC (such as the TI TPS650250) with proper PGOOD sequencing. Decoupling: 100 nF ceramic at every VCCIO/VCCINT pin pair, plus 10 uF bulk per rail.

Common pitfalls with the EP3C5E144C8: (1) Confusing the 'E' suffix (EQFP package) with 'F' (FBGA) - they require different PCB layouts; (2) using a non-N suffix part in a RoHS-required design - the 'N' suffix denotes Pb-free terminal finish; (3) assuming all I/O banks support LVDS - only specific banks support true LVDS outputs, consult the device pinout file; (4) forgetting that Cyclone III configuration data is SRAM-based and must be reloaded on every power-up.

For LVDS signal integrity on the EP3C5E144C8, maintain 100 ohm differential impedance on the PCB traces and place LVDS pair traces with matched length (within 150 mil). The Cyclone III LVDS serializer/deserializer (SERDES) does not exist - LVDS is implemented via LVDS buffers driving the LVDS compatible I/O standard. Use the Quartus II pin planner to set the correct I/O standard and verify pin assignment against the device pin-out file before final compile.

Informations de conformité

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

Sans plomb

Sans halogène

Yes

Minerais de conflit

Compliant

RoHS-compliant per Intel product environmental documentation. The EP3C5E144C8 itself is not lead-free terminal finish; the lead-free equivalent is the EP3C5E144C7N variant. Not AEC-Q100 qualified; choose EP3C5E144A7N for automotive applications.

Données vérifiées le : 2026-09-09 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Manufacturer Datasheet, Distributor, Distributor, Distributor, Octopart

Recherches associées

EP3C5E144C8 EP3C5E144C8 datasheet Intel Cyclone III EP3C5 EP3C5E144C8 price buy Cyclone III 5136 LE FPGA 144-EQFP EP3C5E144C8 vs EP3C10E144C8N EP3C5E144C8 drop-in replacement Cyclone III C8 speed grade FPGA EP3C5E144C8 pinout EQFP FPGA 94 I/O industrial motor control Altera Cyclone III 65nm low power FPGA what is the logic element count of EP3C5E144C8

Composants & termes associés

Intel Altera EP3C5E144C8 EP3C5E144C7N EP3C5E144C7 EP3C5E144A7N EP3C10E144C8N EP3C16E144C8N Cyclone III FPGA Field Programmable Gate Array Programmable Logic Device Logic Element Logic Array Block LAB Embedded RAM Embedded Multiplier PLL 144-EQFP eLQFP Exposed Thermal Pad AEC-Q100 RoHS Quartus II JTAG LVDS 65nm process Industrial motor control Video processing Telecommunications line card