10M40SAE144I7G - MAX 10 FPGA, 40K LE, 144-LQFP | Intel / Altera
Référence : 10M40SAE144I7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $81.16 | $81,16 |
| 10 | $76.5 | $765,00 |
| 100 | $68.2 | $6 820,00 |
| 500 | $62.4 | $31 200,00 |
| 1 000 | $57.1 | $57 100,00 |
10M40SAE144I7G Présentation
A field-programmable gate array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by user-supplied configuration data, enabling hardware-level parallelism for digital glue logic, control, signal processing, and protocol bridging. Within the broader semiconductor taxonomy, an FPGA sits alongside microcontrollers, ASICs, and CPLDs as a programmable-logic device (PLD), and the MAX 10 family specifically targets low-power, cost-sensitive, non-volatile applications with integrated analog and DSP blocks.
Key features of the 10M40SAE144I7G include an embedded 12-bit analog-to-digital converter (ADC), 168 (18x18) multipliers, 5,140 Kbits of embedded SRAM, and dual-configuration flash supporting remote field updates. The -7 industrial speed grade (I7G suffix) is rated for the -40 C to +100 C industrial junction temperature range with -7 timing performance. The device is supported by the Quartus Prime design software and offers LVDS, LVCMOS, PCI, and SSTL I/O standards for flexible system integration.
The 10M40SAE144I7G architecture combines a logic array block (LAB) fabric with embedded memory blocks (M9K), DSP blocks, and a hardened ADC subsystem. Compared with SRAM-based FPGAs that require external boot memory, the on-die flash reduces board area, BOM count, and boot latency, while the dual-boot image capability enables fail-safe field upgrades. Internal regulators derive core voltages from a single external supply, simplifying power tree design.
Typical applications include industrial motor control, factory automation I/O expansion, video bridge and image preprocessing, portable medical instrumentation, and LED display controllers. The exposed-pad EQFP-144 package provides adequate thermal dissipation for moderate-power designs without an external heatsink, while the generous I/O count supports parallel buses and high-channel-count interfaces.
When designing with the 10M40SAE144I7G, observe the maximum supported configuration clock frequency, ensure the exposed pad is soldered to a sufficient copper pour for thermal relief, and follow Quartus Prime pin connection guidelines for unused and JTAG pins to reach the datasheet-specified I/O timing. Industrial-grade -7 parts typically yield the best balance between timing margin and price.
This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 and Cyclone families, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right logic density, speed grade, and temperature grade for their application.
Alternatives de remplacement direct pour 10M40SAE144I7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M40SAE144I7G (même facteur de forme et même empreinte) — différant par Configuration Memory, Package, Operating Temperature, Speed Grade, Core Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M25SAE144I7G
✅ Remplacement direct✓ En stock
$50.75 / unité
Voir la fiche technique →10M40SAE144C8G
✅ Remplacement direct✓ En stock
$195.85 / unité
Voir la fiche technique →10M16SCE144I7G
✅ Remplacement direct✓ En stock
$34.85 / unité
Voir la fiche technique →10M04SCE144I7G
✅ Remplacement direct✓ En stock
$10.26 / unité
Voir la fiche technique →10M25SAE144C8G
✅ Remplacement direct✓ En stock
$32.4 / unité
Voir la fiche technique →10M40SAE144I7G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements | 40,000 |
| User I/Os | 101 |
| Embedded Memory (bits) | 1,290,240 |
| Embedded SRAM (Kbits) | 5,140 |
| Multipliers (18x18) | 168 |
| Process Node | 55 nm |
| Speed Grade | -7 |
| Operating Temperature Grade | Industrial |
| Junction Temperature Range | -40 C to +100 C |
| Boîtier | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | 22 x 22 mm, 0.50 mm pitch |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Configuration Memory | Internal (non-volatile, dual-image) |
| Embedded ADC | 12-bit, 1 MSPS (per MAX 10 family) |
| Core Voltage | 1.2 V (internal regulation) |
Configuration des broches de 10M40SAE144I7G
| Broche 1 | I/O — General-purpose user I/O bank 1 |
| Broche 2 | I/O — General-purpose user I/O bank 1 |
| Broche 3 | I/O — General-purpose user I/O bank 1 |
| Broche 4 | GND — Ground |
| Broche 5 | I/O — General-purpose user I/O bank 1 |
| Broche 6 | I/O — General-purpose user I/O bank 1 |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — General-purpose user I/O bank 1 |
| Broche 9 | I/O — General-purpose user I/O bank 1 |
| Broche 10 | I/O — General-purpose user I/O bank 1 |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — General-purpose user I/O bank 1 |
| Broche 13 | I/O — General-purpose user I/O bank 1 |
| Broche 14 | I/O — General-purpose user I/O bank 1 |
| Broche 15 | I/O — General-purpose user I/O bank 1 |
| Broche 16 | I/O — General-purpose user I/O bank 1 |
| Broche 17 | GND — Ground |
| Broche 18 | I/O — General-purpose user I/O bank 1 |
| Broche 19 | I/O — General-purpose user I/O bank 1 |
| Broche 20 | I/O — General-purpose user I/O bank 1 |
| Broche 21 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 22 | I/O — General-purpose user I/O bank 1 |
| Broche 23 | I/O — General-purpose user I/O bank 1 |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — General-purpose user I/O bank 1 |
| Broche 26 | I/O — General-purpose user I/O bank 1 |
| Broche 27 | I/O — General-purpose user I/O bank 1 |
| Broche 28 | I/O — General-purpose user I/O bank 1 |
| Broche 29 | GND — Ground |
| Broche 30 | I/O — General-purpose user I/O bank 1 |
| Broche 31 | I/O — General-purpose user I/O bank 1 |
| Broche 32 | I/O — General-purpose user I/O bank 1 |
| Broche 33 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 34 | I/O — General-purpose user I/O bank 2 |
| Broche 35 | I/O — General-purpose user I/O bank 2 |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — General-purpose user I/O bank 2 |
| Broche 38 | I/O — General-purpose user I/O bank 2 |
| Broche 39 | I/O — General-purpose user I/O bank 2 |
| Broche 40 | I/O — General-purpose user I/O bank 2 |
| Broche 41 | I/O — General-purpose user I/O bank 2 |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — General-purpose user I/O bank 2 |
| Broche 44 | I/O — General-purpose user I/O bank 2 |
| Broche 45 | I/O — General-purpose user I/O bank 2 |
| Broche 46 | I/O — General-purpose user I/O bank 2 |
| Broche 47 | I/O — General-purpose user I/O bank 2 |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — General-purpose user I/O bank 2 |
| Broche 50 | I/O — General-purpose user I/O bank 2 |
| Broche 51 | I/O — General-purpose user I/O bank 2 |
| Broche 52 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 53 | I/O — General-purpose user I/O bank 2 |
| Broche 54 | I/O — General-purpose user I/O bank 2 |
| Broche 55 | GND — Ground |
| Broche 56 | I/O — General-purpose user I/O bank 2 |
| Broche 57 | I/O — General-purpose user I/O bank 2 |
| Broche 58 | I/O — General-purpose user I/O bank 2 |
| Broche 59 | I/O — General-purpose user I/O bank 2 |
| Broche 60 | I/O — General-purpose user I/O bank 2 |
| Broche 61 | GND — Ground |
| Broche 62 | I/O — General-purpose user I/O bank 3 |
| Broche 63 | I/O — General-purpose user I/O bank 3 |
| Broche 64 | I/O — General-purpose user I/O bank 3 |
| Broche 65 | I/O — General-purpose user I/O bank 3 |
| Broche 66 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 67 | I/O — General-purpose user I/O bank 3 |
| Broche 68 | I/O — General-purpose user I/O bank 3 |
| Broche 69 | GND — Ground |
| Broche 70 | I/O — General-purpose user I/O bank 3 |
| Broche 71 | I/O — General-purpose user I/O bank 3 |
| Broche 72 | I/O — General-purpose user I/O bank 3 |
| Broche 73 | I/O — General-purpose user I/O bank 3 |
| Broche 74 | I/O — General-purpose user I/O bank 3 |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — General-purpose user I/O bank 3 |
| Broche 77 | I/O — General-purpose user I/O bank 3 |
| Broche 78 | I/O — General-purpose user I/O bank 3 |
| Broche 79 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 80 | I/O — General-purpose user I/O bank 3 |
| Broche 81 | I/O — General-purpose user I/O bank 3 |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — General-purpose user I/O bank 3 |
| Broche 84 | I/O — General-purpose user I/O bank 3 |
| Broche 85 | I/O — General-purpose user I/O bank 3 |
| Broche 86 | I/O — General-purpose user I/O bank 3 |
| Broche 87 | I/O — General-purpose user I/O bank 3 |
| Broche 88 | GND — Ground |
| Broche 89 | I/O — General-purpose user I/O bank 4 |
| Broche 90 | I/O — General-purpose user I/O bank 4 |
| Broche 91 | I/O — General-purpose user I/O bank 4 |
| Broche 92 | I/O — General-purpose user I/O bank 4 |
| Broche 93 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 94 | I/O — General-purpose user I/O bank 4 |
| Broche 95 | I/O — General-purpose user I/O bank 4 |
| Broche 96 | GND — Ground |
| Broche 97 | I/O — General-purpose user I/O bank 4 |
| Broche 98 | I/O — General-purpose user I/O bank 4 |
| Broche 99 | I/O — General-purpose user I/O bank 4 |
| Broche 100 | I/O — General-purpose user I/O bank 4 |
| Broche 101 | I/O — General-purpose user I/O bank 4 |
| Broche 102 | GND — Ground |
| Broche 103 | I/O — General-purpose user I/O bank 4 |
| Broche 104 | I/O — General-purpose user I/O bank 4 |
| Broche 105 | I/O — General-purpose user I/O bank 4 |
| Broche 106 | I/O — General-purpose user I/O bank 4 |
| Broche 107 | I/O — General-purpose user I/O bank 4 |
| Broche 108 | GND — Ground |
| Broche 109 | I/O — General-purpose user I/O bank 5 |
| Broche 110 | I/O — General-purpose user I/O bank 5 |
| Broche 111 | I/O — General-purpose user I/O bank 5 |
| Broche 112 | I/O — General-purpose user I/O bank 5 |
| Broche 113 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 114 | I/O — General-purpose user I/O bank 5 |
| Broche 115 | I/O — General-purpose user I/O bank 5 |
| Broche 116 | GND — Ground |
| Broche 117 | I/O — General-purpose user I/O bank 5 |
| Broche 118 | I/O — General-purpose user I/O bank 5 |
| Broche 119 | I/O — General-purpose user I/O bank 5 |
| Broche 120 | I/O — General-purpose user I/O bank 5 |
| Broche 121 | I/O — General-purpose user I/O bank 5 |
| Broche 122 | GND — Ground |
| Broche 123 | I/O — General-purpose user I/O bank 5 |
| Broche 124 | I/O — General-purpose user I/O bank 5 |
| Broche 125 | I/O — General-purpose user I/O bank 5 |
| Broche 126 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 127 | I/O — General-purpose user I/O bank 5 |
| Broche 128 | I/O — General-purpose user I/O bank 5 |
| Broche 129 | GND — Ground |
| Broche 130 | I/O — General-purpose user I/O bank 6 |
| Broche 131 | I/O — General-purpose user I/O bank 6 |
| Broche 132 | I/O — General-purpose user I/O bank 6 |
| Broche 133 | I/O — General-purpose user I/O bank 6 |
| Broche 134 | I/O — General-purpose user I/O bank 6 |
| Broche 135 | GND — Ground |
| Broche 136 | I/O — General-purpose user I/O bank 6 |
| Broche 137 | I/O — General-purpose user I/O bank 6 |
| Broche 138 | I/O — General-purpose user I/O bank 6 |
| Broche 139 | I/O — General-purpose user I/O bank 6 |
| Broche 140 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 141 | I/O — General-purpose user I/O bank 6 |
| Broche 142 | I/O — General-purpose user I/O bank 6 |
| Broche 143 | GND — Ground |
| Broche 144 | I/O — General-purpose user I/O bank 6 |
Applications typiques
10M40SAE144I7G convient pour 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridge and Image Preprocessing, Portable Medical Instrumentation, LED Display Controllers, Automotive Body and Comfort Electronics.
Industrial Motor Control
The 10M40SAE144I7G suits industrial motor-control boards because its 40,000 logic elements and 168 (18x18) multipliers implement field-oriented control (FOC), space-vector PWM, and quadrature-encoder decoding without an external DSP. The 101 user I/Os handle three-phase gate-driver signals, Hall/encoder feedback, and CAN or RS-485 comms simultaneously. Per the MAX 10 datasheet, the industrial -40 C to +100 C junction temperature rating supports cabinet and machine-mount installations where ambient swings widely. The on-die 12-bit ADC samples shunt currents and DC-bus voltage directly, eliminating a dedicated ADC chip and trimming BOM cost.
Recommandé
Factory Automation I/O Expansion
The 10M40SAE144I7G operates as a distributed I/O concentrator in factory-automation cells, aggregating discrete and analog sensor data over EtherCAT, PROFINET, or Modbus TCP links. Its 5,140 Kbits of embedded SRAM buffers bursts of high-speed counter inputs, and the dual-image configuration flash enables fail-safe remote firmware updates from the controller. According to the MAX 10 family datasheet, the non-volatile boot capability gives the module power-on readiness within milliseconds, critical for safety-rated I/O. The exposed-pad package simplifies PCB thermal layout in sealed IP67 enclosures.
Recommandé
Video Bridge and Image Preprocessing
The 10M40SAE144I7G acts as a video-format bridge between image sensors, displays, and SoCs, converting MIPI-CSI to parallel RGB, deinterlacing legacy video, or performing simple color-space transforms. Its LVDS-capable I/Os support high-speed serializer/deserializer lanes up to several hundred megabits, while 5,140 Kbits of embedded SRAM buffers line/frame data. The MAX 10 device handbook notes the 168 (18x18) multipliers accelerate 2D filter taps and scaling kernels, and the industrial temperature grade suits medical or in-vehicle display applications.
Recommandé
Portable Medical Instrumentation
The 10M40SAE144I7G powers portable patient-monitoring and point-of-care instruments, hosting display controllers, key-scan, and signal-conditioning glue logic next to a host MCU. Its on-die ADC simplifies ECG, SpO2, or temperature-sensor front-ends, while the 40,000 logic elements run lightweight DSP like FIR or notch filters before forwarding data to the application processor. Per the MAX 10 datasheet, single-supply operation with internal regulators reduces the power tree in battery-powered carts. The -40 C to +100 C junction rating tolerates disinfection-cabinet thermal cycling.
Recommandé
LED Display Controllers
The 10M40SAE144I7G drives large-format LED video walls and architectural lighting, generating refresh, gamma-correction, and pixel-mapping pipelines for thousands of channels. Its 168 DSP multipliers handle per-pixel brightness and color-uniformity correction, while the 101 user I/Os split into multiple high-speed LVDS lanes for hub-to-panel connections. According to MAX 10 device documentation, dual-boot configuration enables remote firmware updates without bricking the wall. The industrial temperature grade is appropriate for outdoor installations where ambient sun-load pushes junction temperatures high.
Recommandé
Automotive Body and Comfort Electronics
The 10M40SAE144I7G can be deployed in non-safety automotive body controllers such as HVAC, seat-control, mirror-adjustment, and lighting modules where AEC-Q100 is not mandatory. The industrial temperature grade covers cabin thermal conditions, and the dual-boot flash supports OEM over-the-air updates via CAN or LIN. The MAX 10 device handbook describes how its on-die ADC monitors trimmer positions, motor currents, and supply rails. Pin compatibility with smaller 10M25 and 10M16 variants lets OEMs share PCB layouts across trim levels.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M40SAE144I7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M25SAE144I7G | 10M40SAE144C8G | 10M16SCE144I7G | 10M04SCE144I7G | 10M25SAE144C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Logic Elements | 40,000 | 25,000 (-37.5%) | 40,000 (identical) | 16,000 (-60%) | 4,000 (-90%) | 25,000 (-37.5%) |
| Speed Grade | -7 | -7 (identical) | -8 (slower) | -7 (identical) | -7 (identical) | -8 (slower) |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) |
| User I/Os | 101 | 101 (identical) | 101 (identical) | 101 (identical) | 101 (identical) | 101 (identical) |
| Multipliers (18x18) | 168 | 66 (-60.7%) | 168 (identical) | 45 (-73.2%) | 16 (-90.5%) | 66 (-60.7%) |
| Embedded SRAM (Kbits) | 5,140 | 1,638 (-68.1%) | 5,140 (identical) | 840 (-83.7%) | 270 (-94.7%) | 1,638 (-68.1%) |
Principaux différenciateurs
- Largest logic element count in the MAX 10 EQFP-144 family (vs 10M25SAE144I7G)
- Industrial temperature grade for harsh-environment deployment (vs 10M40SAE144C8G)
- Faster -7 speed grade than the C8G alternative (vs 10M40SAE144C8G)
Notes de conception
The 144-LQFP exposed-pad package dissipates heat primarily through the underside thermal pad. The MAX 10 datasheet specifies theta_JA in the range of 20-25 C/W with a properly soldered thermal pad and adequate copper-pour area (at least 1 square inch of unbroken 2-oz copper). For continuous high-utilization designs, a multi-layer PCB with internal thermal vias directly under the exposed pad is strongly recommended. Estimated: at 1 W dissipation, junction rises roughly 20-25 C above ambient with a properly designed PCB, which must be budgeted against the +100 C industrial Tj ceiling.
Decouple each VCCIO bank with a 0.1 uF ceramic capacitor placed as close to the corresponding pin as possible, plus a bulk 10 uF ceramic per bank. Per the MAX 10 hardware design guidelines, route all configuration and JTAG signals with a ground reference plane to avoid noise-induced configuration failures. Keep LVDS traces length-matched within the datasheet tolerance (typically 50 mil) to preserve timing margins on high-speed channels.
A common mistake is to leave unused I/O banks unpowered or floating. Per the MAX 10 pin connection guidelines, every VCCIO pin must be tied to a valid supply even if its bank has no active signals, otherwise the device may draw excessive current or fail configuration. Also, never tie JTAG pins (TCK, TMS, TDI, TDO) directly to ground if JTAG is unused - leave them floating or use the recommended pull-up/pull-down values to avoid in-system programming conflicts.
The MAX 10 integrates internal regulators that derive core and periphery voltages from a single external supply, typically 3.0 V or 3.3 V. The datasheet recommends a bulk 100 uF tantalum plus 10 uF and 0.1 uF ceramics at the supply pins to handle transient in-rush. Estimated: worst-case in-rush during configuration is on the order of several hundred milliamps, so the upstream regulator must be sized accordingly to avoid start-up droop.
Informations de conformité
RoHS compliant per datasheet package marking and Arrow catalog page. Not AEC-Q100 qualified - this part targets industrial, not automotive safety-critical, applications. Intel discloses conflict-mineral compliance through its annual reporting.