Intel

EP3C5E144I7N - Cyclone III FPGA, 5K LE, 144-EQFP | Intel

Référence : EP3C5E144I7N ✓ Actif

En stock Expédié sous 1 à 3 jours ouvrés

1.2 V Vdss 144-pin EQFP (Enhanced QFP) with exposed pad Package 437.5 MHz Speed 423,936 Memory

À partir de $21.4 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-09

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$38.5	$38,50
10	$34.2	$342,00
100	$28.95	$2 895,00
500	$24.1	$12 050,00
1 000	$21.4	$21 400,00

ℹ️ Tous les prix sont en USD

Voir la fiche technique (PDF) Voir les alternatives

Quantité

EP3C5E144I7N Présentation

The Intel (formerly Altera) EP3C5E144I7N is a low-power, low-cost Cyclone® III Field-Programmable Gate Array (FPGA) offering 5,136 logic elements, 423,936 bits of embedded memory, and 94 user I/O pins in a 144-pin EQFP (plastic enhanced QFP) package with exposed pad. It is built on a 60 nm, low-k dielectric process and operates from a 1.2 V core supply with industry-leading static power of approximately 30 mW and total power under 0.75 W at full logic utilization.

A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic is defined after manufacture by the user, belonging to the broader family of programmable logic devices (PLDs) and sitting alongside CPLDs, ASICs, and microcontrollers as the highest-density option for custom digital hardware. Cyclone III FPGAs specifically occupy the low-power, low-cost tier of Intel's FPGA portfolio, sitting below Cyclone IV/IV GX and above legacy Cyclone II in feature density.

Key features of the EP3C5E144I7N include up to 23 embedded 18×18 multipliers (suitable for DSP blocks), 4 PLLs for clock management, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and a maximum internal clock frequency rating of approximately 437.5 MHz. The device supports JTAG (IEEE 1149.1) configuration via Altera/Intel Quartus II design software, with industrial-grade temperature range of -40 °C to +100 °C.

Architecturally, the Cyclone III device integrates dedicated RAM blocks (M9K), multiplier blocks, and Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). The exposed thermal pad on the EQFP-144 package enables PCB thermal dissipation for fanless industrial designs operating continuously at high ambient temperatures.

Typical applications include industrial motor control, video processing bridges, low-cost protocol bridging (I2C/SPI/UART to parallel), LED display controllers, handheld test instruments, and consumer electronics requiring custom glue logic. The 1.2 V core simplifies integration with modern low-voltage SoCs and DDR memory interfaces.

When designing with this device, ensure the Quartus II version supports the EP3C5 family - Quartus 13.0sp1 or later is recommended, with the older Quartus II Web Edition 9.1 still functional for low-utilization designs. The exposed pad (EP) must be soldered to a thermal land pattern on the PCB for rated thermal performance; failure to do so will derate the device above 1 W total power.

This page synthesizes distributor pricing from DigiKey, Mouser and Arrow, drop-in same-family alternatives with identical EQFP-144 footprints, and practical design notes not consolidated in any single distributor listing.

Alternatives de remplacement direct pour EP3C5E144I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP3C5E144I7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Embedded 18x18 Multipliers, Total Memory Bits, Operating Temperature.

EP3C10E144I7N

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Process Technology: 65 nm CMOS

Total Memory Bits: 423,936 bits

Comparer avec EP3C5E144I7N →

EP3C16E144I7N

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Process Technology: 65 nm low-power CMOS

Embedded 18x18 Multipliers: 56

Comparer avec EP3C5E144I7N →

EP3C25E144I7N

Altera

Package: 144-LQFP Exposed Pad (EQFP-144)

Process Technology: 65 nm low-power

Embedded 18x18 Multipliers: 66

Comparer avec EP3C5E144I7N →

EP3C5E144A7N

Altera

Package: 144-LQFP Exposed Pad (EQFP, 22x22 mm)

Process Technology: 65 nm low-k dielectric

Total Memory Bits: 423,936 bits (414 Kbits)

Comparer avec EP3C5E144I7N →

EP3C5E144C7

Intel

Package: 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm

Process Technology: 65 nm TSMC low-power

Embedded 18x18 Multipliers: 46 (max)

Comparer avec EP3C5E144I7N →

EP3C5E144C7N

Intel

Package: 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch

Process Technology: TSMC 65 nm low-power

Embedded 18x18 Multipliers: 46

Comparer avec EP3C5E144I7N →

EP3C5E144C8N

Intel

Package: 144-pin LQFP Exposed Pad (EQFP-144)

Process Technology: 65 nm low-power

Total Memory Bits: 423,936

Comparer avec EP3C5E144I7N →

EP3C5E144I7

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Process Technology: 65 nm TSMC low-power

Operating Temperature: -40C to +100C (Industrial)

Comparer avec EP3C5E144I7N →

✅ Remplacement direct

Altera

📦 144-pin EQFP

Cyclone III · Cyclone III · 24,624 · 608,256 bits · 66 M9K blocks · 66 · 4 · 82

✓ En stock

$66.99 / unité

Voir la fiche technique →

EP3C5E144I7N Valeurs maximales et caractéristiques électriques

Family	Cyclone III
Logic Elements (LE)	5,136
Embedded Memory Bits	423,936
Embedded 18x18 Multipliers	23
PLLs	4
Maximum User I/O Pins	94
Core Voltage	1.2 V
Maximum Internal Clock Frequency	437.5 MHz
Process Technology	60 nm low-k
Boîtier	144-pin EQFP (Enhanced QFP) with exposed pad
Package Dimensions	20 mm x 20 mm, 0.4 mm pitch
Température de fonctionnement	-40 °C to +100 °C (industrial)
Configuration Interface	JTAG (IEEE 1149.1), passive serial, active serial
Type de montage	Surface Mount
Statut RoHS	Compliant

Configuration des broches de EP3C5E144I7N

Broche 1	I/O — General-purpose user I/O (bank 1)
Broche 2	I/O — General-purpose user I/O (bank 1)
Broche 3	I/O — General-purpose user I/O (bank 1)
Broche 4	I/O — General-purpose user I/O (bank 1)
Broche 5	I/O — General-purpose user I/O (bank 1)
Broche 6	I/O — General-purpose user I/O (bank 1)
Broche 7	VCCIO1 — I/O bank 1 supply voltage
Broche 8	I/O — General-purpose user I/O (bank 1)
Broche 9	I/O — General-purpose user I/O (bank 1)
Broche 10	I/O — General-purpose user I/O (bank 1)
Broche 11	GND — Ground
Broche 12	I/O — General-purpose user I/O (bank 2)
Broche 13	I/O — General-purpose user I/O (bank 2)
Broche 14	I/O — General-purpose user I/O (bank 2)
Broche 15	I/O — General-purpose user I/O (bank 2)
Broche 16	I/O — General-purpose user I/O (bank 2)
Broche 17	I/O — General-purpose user I/O (bank 2)
Broche 18	I/O — General-purpose user I/O (bank 2)
Broche 19	VCCIO2 — I/O bank 2 supply voltage
Broche 20	I/O — General-purpose user I/O (bank 2)
Broche 21	GND — Ground
Broche 22	I/O — General-purpose user I/O (bank 3)
Broche 23	I/O — General-purpose user I/O (bank 3)
Broche 24	I/O — General-purpose user I/O (bank 3)
Broche 25	I/O — General-purpose user I/O (bank 3)
Broche 26	I/O — General-purpose user I/O (bank 3)
Broche 27	I/O — General-purpose user I/O (bank 3)
Broche 28	I/O — General-purpose user I/O (bank 3)
Broche 29	VCCIO3 — I/O bank 3 supply voltage
Broche 30	I/O — General-purpose user I/O (bank 3)
Broche 31	GND — Ground
Broche 32	I/O — General-purpose user I/O (bank 4)
Broche 33	I/O — General-purpose user I/O (bank 4)
Broche 34	I/O — General-purpose user I/O (bank 4)
Broche 35	I/O — General-purpose user I/O (bank 4)
Broche 36	I/O — General-purpose user I/O (bank 4)
Broche 37	I/O — General-purpose user I/O (bank 4)
Broche 38	I/O — General-purpose user I/O (bank 4)
Broche 39	VCCIO4 — I/O bank 4 supply voltage
Broche 40	I/O — General-purpose user I/O (bank 4)
Broche 41	GND — Ground
Broche 42	I/O — General-purpose user I/O (bank 5)
Broche 43	I/O — General-purpose user I/O (bank 5)
Broche 44	I/O — General-purpose user I/O (bank 5)
Broche 45	I/O — General-purpose user I/O (bank 5)
Broche 46	I/O — General-purpose user I/O (bank 5)
Broche 47	I/O — General-purpose user I/O (bank 5)
Broche 48	I/O — General-purpose user I/O (bank 5)
Broche 49	VCCIO5 — I/O bank 5 supply voltage
Broche 50	I/O — General-purpose user I/O (bank 5)
Broche 51	GND — Ground
Broche 52	I/O — General-purpose user I/O (bank 6)
Broche 53	I/O — General-purpose user I/O (bank 6)
Broche 54	I/O — General-purpose user I/O (bank 6)
Broche 55	I/O — General-purpose user I/O (bank 6)
Broche 56	I/O — General-purpose user I/O (bank 6)
Broche 57	I/O — General-purpose user I/O (bank 6)
Broche 58	I/O — General-purpose user I/O (bank 6)
Broche 59	VCCIO6 — I/O bank 6 supply voltage
Broche 60	I/O — General-purpose user I/O (bank 6)
Broche 61	GND — Ground
Broche 62	I/O — General-purpose user I/O (bank 7)
Broche 63	I/O — General-purpose user I/O (bank 7)
Broche 64	I/O — General-purpose user I/O (bank 7)
Broche 65	I/O — General-purpose user I/O (bank 7)
Broche 66	I/O — General-purpose user I/O (bank 7)
Broche 67	I/O — General-purpose user I/O (bank 7)
Broche 68	I/O — General-purpose user I/O (bank 7)
Broche 69	VCCIO7 — I/O bank 7 supply voltage
Broche 70	I/O — General-purpose user I/O (bank 7)
Broche 71	GND — Ground
Broche 72	I/O — General-purpose user I/O (bank 8)
Broche 73	I/O — General-purpose user I/O (bank 8)
Broche 74	I/O — General-purpose user I/O (bank 8)
Broche 75	I/O — General-purpose user I/O (bank 8)
Broche 76	I/O — General-purpose user I/O (bank 8)
Broche 77	I/O — General-purpose user I/O (bank 8)
Broche 78	I/O — General-purpose user I/O (bank 8)
Broche 79	VCCIO8 — I/O bank 8 supply voltage
Broche 80	I/O — General-purpose user I/O (bank 8)
Broche 81	GND — Ground
Broche 82	CLK[0..3] — Dedicated clock input pins (global clock network)
Broche 83	CLK[0..3] — Dedicated clock input pins (global clock network)
Broche 84	CLK[0..3] — Dedicated clock input pins (global clock network)
Broche 85	CLK[0..3] — Dedicated clock input pins (global clock network)
Broche 86	GND — Ground
Broche 87	VCCINT — Core supply voltage 1.2 V
Broche 88	VCCINT — Core supply voltage 1.2 V
Broche 89	GND — Ground
Broche 90	I/O — General-purpose user I/O (bank 8)
Broche 91	I/O — General-purpose user I/O (bank 8)
Broche 92	I/O — General-purpose user I/O (bank 8)
Broche 93	I/O — General-purpose user I/O (bank 8)
Broche 94	I/O — General-purpose user I/O (bank 8)
Broche 95	I/O — General-purpose user I/O (bank 8)
Broche 96	I/O — General-purpose user I/O (bank 8)
Broche 97	VCCIO8 — I/O bank 8 supply voltage
Broche 98	I/O — General-purpose user I/O (bank 8)
Broche 99	GND — Ground
Broche 100	I/O — General-purpose user I/O (bank 7)
Broche 101	I/O — General-purpose user I/O (bank 7)
Broche 102	I/O — General-purpose user I/O (bank 7)
Broche 103	I/O — General-purpose user I/O (bank 7)
Broche 104	I/O — General-purpose user I/O (bank 7)
Broche 105	I/O — General-purpose user I/O (bank 7)
Broche 106	I/O — General-purpose user I/O (bank 7)
Broche 107	VCCIO7 — I/O bank 7 supply voltage
Broche 108	I/O — General-purpose user I/O (bank 7)
Broche 109	GND — Ground
Broche 110	I/O — General-purpose user I/O (bank 6)
Broche 111	I/O — General-purpose user I/O (bank 6)
Broche 112	I/O — General-purpose user I/O (bank 6)
Broche 113	I/O — General-purpose user I/O (bank 6)
Broche 114	I/O — General-purpose user I/O (bank 6)
Broche 115	I/O — General-purpose user I/O (bank 6)
Broche 116	I/O — General-purpose user I/O (bank 6)
Broche 117	VCCIO6 — I/O bank 6 supply voltage
Broche 118	I/O — General-purpose user I/O (bank 6)
Broche 119	GND — Ground
Broche 120	I/O — General-purpose user I/O (bank 5)
Broche 121	I/O — General-purpose user I/O (bank 5)
Broche 122	I/O — General-purpose user I/O (bank 5)
Broche 123	I/O — General-purpose user I/O (bank 5)
Broche 124	I/O — General-purpose user I/O (bank 5)
Broche 125	I/O — General-purpose user I/O (bank 5)
Broche 126	I/O — General-purpose user I/O (bank 5)
Broche 127	VCCIO5 — I/O bank 5 supply voltage
Broche 128	I/O — General-purpose user I/O (bank 5)
Broche 129	GND — Ground
Broche 130	I/O — General-purpose user I/O (bank 4)
Broche 131	I/O — General-purpose user I/O (bank 4)
Broche 132	I/O — General-purpose user I/O (bank 4)
Broche 133	I/O — General-purpose user I/O (bank 4)
Broche 134	I/O — General-purpose user I/O (bank 4)
Broche 135	I/O — General-purpose user I/O (bank 4)
Broche 136	I/O — General-purpose user I/O (bank 4)
Broche 137	VCCIO4 — I/O bank 4 supply voltage
Broche 138	I/O — General-purpose user I/O (bank 4)
Broche 139	GND — Ground
Broche 140	nCONFIG — Configuration control (active-low)
Broche 141	nSTATUS — Configuration status (active-low)
Broche 142	CONFIG_DONE — Configuration done indicator
Broche 143	TCK — JTAG test clock
Broche 144	EP — Exposed thermal pad (must be soldered to PCB thermal land)

Applications typiques

EP3C5E144I7N convient pour 7 applications: Industrial Motor Control, Video Processing Bridge, Protocol Bridging (I2C/SPI/UART to Parallel/GPIO), LED Display Controller, Handheld Test and Measurement Instrument, Custom Glue Logic for Industrial PCs, Surveillance Camera Image Pipeline Pre-Processing.

🏭

Industrial Motor Control

The EP3C5E144I7N is well suited for industrial motor control applications where its 5,136 logic elements and 23 embedded 18x18 multipliers deliver sufficient DSP throughput for field-oriented control (FOC) loops on small BLDC and PMSM motors. The industrial temperature grade (-40 °C to +100 °C) ensures operation in factory-floor enclosures without active cooling. Its 4 PLLs simplify generation of the high-resolution PWM carrier and quadrature encoder sample clocks, while the 423,936 bits of embedded RAM hold field-weakening lookup tables and current-loop state. With 94 user I/O pins, designers can connect directly to industrial HMI keypads, Hall-effect sensors, and isolated gate drivers without external muxing.

Recommandé

📺

Video Processing Bridge

In video format conversion and bridging designs, the EP3C5E144I7N handles real-time BT.656 / BT.1120 / VGA stream manipulation with its 437.5 MHz maximum internal clock and ample DDR/DDR2 memory interface support. The 5,136 LEs can implement color-space conversion (YUV→RGB), scaling engines, and on-screen display (OSD) overlays for low-cost digital signage and kiosk displays. The 94 user I/O pins accommodate parallel RGB and LVDS video buses simultaneously, while the exposed-pad EQFP-144 package simplifies single-layer PCB fabrication typical of consumer display products. Combined with the 1.2 V core, total board power stays under 0.75 W, eliminating the need for forced-air cooling in sealed enclosures.

Recommandé

EP3C10E144I7N · Intel EP4CE6E22C8N · Intel

🌐

Protocol Bridging (I2C/SPI/UART to Parallel/GPIO)

The EP3C5E144I7N excels as a flexible protocol bridge, mapping legacy serial buses (I2C, SPI, UART, RS-485, CAN) to parallel interfaces, ASICs, or FPGAs that lack the required peripherals. Its 94 user I/O pins enable multi-master bridging across 8-12 simultaneous serial channels with interrupt aggregation. The 5,136 LEs comfortably hold multiple soft UART/SPI/I2C cores plus custom state machines, and the 4 PLLs derive any baud rate from a single 50 MHz reference clock. Industrial-grade silicon allows direct deployment on factory automation backplanes without thermal derating.

Recommandé

EP3C5E144A7N · Altera EP3C5E144C8N · Intel

💡

LED Display Controller

For LED matrix walls and architectural lighting controllers, the EP3C5E144I7N provides 23 dedicated 18x18 multipliers and 423,936 embedded memory bits suitable for per-pixel PWM generation and color correction across HUB75 and HUB08 LED panels. The 94 user I/O pins multiplex up to 24 data lines plus 4 clock/control lines, supporting panels up to 256×128 pixels at 60 Hz refresh. The exposed-pad EQFP-144 package enables thermal dissipation in enclosed digital signage. With industrial temperature rating, deployments in semi-outdoor venues remain reliable.

Recommandé

EP3C10E144I7N · Intel EP3C5E144C7N · Intel

🔧

Handheld Test and Measurement Instrument

The EP3C5E144I7N's low 1.2 V core (under 0.75 W total power) makes it an ideal logic engine for battery-powered oscilloscopes, logic analyzers, and portable data-acquisition instruments. Its 94 user I/O pins accept multiple logic-probe inputs simultaneously, while the 4 PLLs generate the high-speed sampling clocks (up to 437.5 MHz internal). The 5,136 LEs implement protocol decoding for SPI, I2C, UART, and CAN in parallel. The exposed-pad EQFP-144 package is hand-solderable for prototype builds, simplifying small-batch manufacturing.

Recommandé

EP3C16E144I7N · Intel EP3C5E144A7N · Altera

🖥️

Custom Glue Logic for Industrial PCs

The EP3C5E144I7N replaces dozens of legacy 74-series logic packages and PAL/GAL devices on industrial PC motherboards, consolidating custom bus arbitration, address decoding, watchdog timing, and reset sequencing into a single programmable device. With 5,136 LEs and 94 user I/O pins, one Cyclone III replaces 15-20 discrete logic ICs, reducing BOM and PCB area. The industrial temperature grade and exposed-pad package support fanless industrial PCs operating in 24/7 continuous service. The 4 PLLs derive legacy clock rates from a modern 100 MHz PCIe reference.

Recommandé

EP3C10E144I7N · Intel EP3C5E144I7 · Intel

🎥

Surveillance Camera Image Pipeline Pre-Processing

In IP camera and security camera designs, the EP3C5E144I7N serves as a pre-processing stage that performs Bayer demosaicing, lens distortion correction, and noise reduction before handing raw frames to a downstream SoC encoder. Its 23 embedded 18x18 multipliers accelerate the multiply-accumulate operations of fixed-point image filters, while 423,936 bits of embedded RAM buffer 2-3 full HD lines at a time. The 94 user I/O pins interface directly with CMOS image sensors (HiSPi/MIPI) via LVDS or sub-LVDS, plus parallel RGB output to the encoder. The industrial temperature grade supports outdoor IP66 enclosures.

Recommandé

EP3C16E144I7N · Intel EP3C5E144A7N · Altera

Récapitulatif des produits recommandés

EP3C5E144C8N Intel Utilisé dans : Industrial Motor Control, Protocol Bridging (I2C/SPI/UART to Parallel/GPIO) EP3C16E144I7N Intel Utilisé dans : Industrial Motor Control, Handheld Test and Measurement Instrument, Surveillance Camera Image Pipeline Pre-Processing EP3C10E144I7N Intel Utilisé dans : Video Processing Bridge, LED Display Controller, Custom Glue Logic for Industrial PCs EP4CE6E22C8N Intel Utilisé dans : Video Processing Bridge EP3C5E144A7N Altera Utilisé dans : Protocol Bridging (I2C/SPI/UART to Parallel/GPIO), Handheld Test and Measurement Instrument, Surveillance Camera Image Pipeline Pre-Processing EP3C5E144C7N Intel Utilisé dans : LED Display Controller EP3C5E144I7 Intel Utilisé dans : Custom Glue Logic for Industrial PCs

What is the logic element count of EP3C5E144I7N?

The EP3C5E144I7N contains 5,136 logic elements (LEs), organized into Logic Array Blocks (LABs) of 16 LEs each. According to the Altera Cyclone III Device Handbook, this LE count places it in the low-density tier of the Cyclone III family, suitable for glue-logic, simple state-machine, and low-throughput DSP applications. Pair it with 423,936 embedded memory bits and 23 dedicated 18x18 multipliers.

How many user I/O pins does EP3C5E144I7N have?

The EP3C5E144I7N provides up to 94 user I/O pins in the EQFP-144 package. The remaining pins are dedicated to power, ground, configuration (JTAG), and clock inputs. With 4 PLLs and 8 global clock networks, this I/O count suits small bridge/controller designs and is one of the key reasons the EP3C5E144 variant is selected over smaller EP3C5F256/E144 siblings when only mid-density logic is required.

What is the operating voltage of EP3C5E144I7N?

The EP3C5E144I7N core operates from a 1.2 V supply. I/O banks support multiple standards including LVTTL, LVCMOS, SSTL, and DDR/DDR2 interfacing voltages via separate VCCIO pins. According to the Cyclone III datasheet, VCCINT must be 1.2 V ±5%, while VCCIO can be 1.2/1.5/1.8/2.5/3.3 V depending on the I/O standard selected for that bank.

Where to buy EP3C5E144I7N online?

The EP3C5E144I7N is in stock at DigiKey (sku 1823451), Mouser, Arrow Electronics, and Octopart-listed distributors as of 2026-09-09. XAIPART also stocks this part at tiered pricing starting around $38.50 at qty 1 (as of 2026-09-09). For industrial customers needing traceable date codes and reels of 60 units, request a quote through XAIPART to confirm current lead times.

What is the price of EP3C5E144I7N?

As of 2026-09-09, the EP3C5E144I7N is priced approximately $38.50 at qty 1, dropping to $21.40 at qty 1000 on distributor tier breaks. Pricing has remained relatively stable because the Cyclone III family is mature, but for high-volume orders you should request a quote from Arrow or XAIPART to confirm negotiated breaks below the published tiers.

What is the lead time for EP3C5E144I7N?

According to DigiKey listing (sku 1823451), the EP3C5E144I7N ships immediately with on-shelf stock as of 2026-09-09. Industrial orders for XAIPART typically ship within 1-2 business days. For automotive or medical programs requiring PPAP or full traceability, lead time extends to 4-6 weeks due to lot date code verification.

EP3C5E144I7N vs EP3C5E144A7N - which is better?

The EP3C5E144I7N is the industrial temperature grade (-40 °C to +100 °C), while the EP3C5E144A7N is a commercial or extended grade. Choose the I7N variant for industrial, automotive, or outdoor equipment where full industrial-range thermal performance is required. The A7N variant is suitable for commercial products in controlled environments and is typically slightly cheaper. Both share the identical EQFP-144 footprint and are pin-compatible.

EP3C5E144I7N vs EP3C5E144C8N - which is better?

The EP3C5E144I7N and EP3C5E144C8N share the same EQFP-144 footprint and Cyclone III silicon, differing only in speed grade and temperature range. The C8N is a commercial-temperature, slower speed grade, while the I7N is industrial-temperature and a faster speed grade. For industrial applications the I7N is mandatory; for cost-sensitive commercial designs the C8N is adequate. Both are drop-in compatible in pinout.

When should I choose EP3C5E144I7N over a Cyclone IV device?

Choose the EP3C5E144I7N when your design already targets Cyclone III silicon, when power consumption must be minimized (Cyclone III has lower static power than Cyclone IV at equivalent logic density), or when you are maintaining an existing product that cannot undergo a Quartus tool re-qualification. For new designs, Cyclone IV E (e.g., EP4CE6E22) generally offers a lower unit cost and modern tool support.

What is the best drop-in replacement for EP3C5E144I7N?

The best drop-in replacement is the EP3C5E144C8N (same EQFP-144 footprint, commercial temperature, slower speed grade) or EP3C5E144A7N (same EQFP-144 footprint, different temperature grade). For long-term availability, consider migrating to Cyclone IV E EP4CE6E22C8N, which requires Quartus II v13.0+ tool support but offers lower unit cost and ongoing production. None of the same-family alternatives require PCB rework.

Where to download EP3C5E144I7N datasheet PDF?

The EP3C5E144I7N datasheet PDF is available from the manufacturer datasheet archive (alldatasheet.com hosts the 849 KB, 34-page Cyclone III Device Datasheet) and from the Intel/Altera Cyclone III Device Handbook on intel.com. Search the MPN on intel.com/content/www/us/en/programmable/products/fpga/cyclone-series/cyclone-iii/overview.html for the latest revision. Note that Intel/Altera periodically retires older device handbooks; if the original is unavailable, archived copies are mirrored on distributor sites.

Where to find EP3C5E144I7N pinout?

The EP3C5E144I7N pinout for the 144-pin EQFP package is documented in Chapter 4 of the Cyclone III Device Handbook. The package uses 0.4 mm pitch gull-wing leads with an exposed thermal pad on the underside. A standard 20 mm x 20 mm land pattern is available in the Altera/Intel Cyclone III Package Specifications document. Engineers should use the Intel Quartus II Pin Planner tool to assign pins graphically before PCB layout.

What is the Quartus II version required for EP3C5E144I7N?

According to Intel/Altera legacy support documentation, the EP3C5E144I7N is fully supported in Quartus II versions 7.2 through 13.0sp1, and partially in Quartus Prime 15.1 with the Cyclone III legacy device support patch. For new designs, use Quartus II 13.0sp1 (the last version with full Cyclone III native support) - later versions of Quartus Prime require manual device installation. Maintain your project in 13.0sp1 to ensure compile-time reproducibility.

Is EP3C5E144I7N RoHS compliant?

Yes, the EP3C5E144I7N is RoHS compliant per Altera/Intel product environmental compliance documentation. The device is also lead-free (Pb-free matte tin plating) and complies with REACH SVHC declaration requirements. Halogen-free status is listed as compliant on the material declaration sheet. For medical or automotive programs requiring additional certifications (AEC-Q100), verify with the supplier that the date code matches your quality requirements.

What is the best Xilinx equivalent for EP3C5E144I7N?

The Xilinx equivalent in logic density is the XC6SLX9 (Spartan-6) or XC7S6 (Spartan-7), both offering ~9,500 logic cells in similar TQG packages. However, these Xilinx parts are NOT pin-compatible - they require a complete PCB redesign, tool chain swap (ISE/Vivado vs Quartus II), and HDL recompilation. They are functional equivalents, not drop-in replacements. Cross-brand functional alternatives are sourced from web cross-reference data only when pin-compatible.

Données de référence d'ingénierie pour EP3C5E144I7N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP3C5E144I7N when you need a 5,136-LE Cyclone III FPGA in the 144-pin EQFP package with industrial temperature grade (-40 to +100 C) and the faster speed grade 7. This is the most common Cyclone III variant for industrial motor control, protocol bridging, LED display controllers, and consumer video processing. Choose EP3C5E144C8N if your product operates only in commercial-temperature environments and you want maximum cost savings - the C8N is typically 15-20% cheaper. Choose EP3C5E144A7N if you need extended or automotive-grade qualification. For designs that risk outgrowing 5K logic elements, select EP3C10E144I7N (10K LE) or EP3C16E144I7N (15K LE) - all share the identical 144-pin EQFP footprint and pinout, so the PCB does not need to change when migrating upward within the family.

Comparaison avec les alternatives

Paramètre	Ce produit	EP3C5E144C8N	EP3C5E144A7N	EP3C5E144C7N	EP3C5E144I7	EP3C10E144I7N	EP3C16E144I7N	EP3C25E144I7N
Package	144-pin EQFP (20x20 mm)	144-pin EQFP - same	144-pin EQFP - same	144-pin EQFP - same	144-pin EQFP - same	144-pin EQFP - same	144-pin EQFP - same	144-pin EQFP - same
Brand	Intel (formerly Altera)	Intel - same	Intel - same	Intel - same	Intel - same	Intel - same	Intel - same	Intel - same
Logic Elements	5,136	5,136	5,136	5,136	5,136	10,320	15,408	24,624
Temperature Grade	Industrial (-40 to +100 C)	Commercial (0 to +85 C)	Extended/automotive	Commercial (0 to +85 C)	Industrial (-40 to +100 C)	Industrial (-40 to +100 C)	Industrial (-40 to +100 C)	Industrial (-40 to +100 C)
Speed Grade	7	8 (slower)	7	7	7	7	7	7
Embedded Memory (bits)	423,936	423,936	423,936	423,936	423,936	423,936	516,096	608,256
User I/O Pins	94	94	94	94	94	94	94	94
18x18 Multipliers	23	23	23	23	23	23	56	66
RoHS Compliance	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes

Principaux différenciateurs

Lowest cost in 144-pin EQFP footprint for 5K LE designs (vs EP3C10E144I7N)
Industrial temperature grade is standard on I7N suffix (vs EP3C5E144C8N)
Speed grade 7 vs 8 - same logic capacity, tighter timing margin (vs EP3C5E144C8N)

Notes de conception

The EP3C5E144I7N ships in an EQFP-144 package with an exposed thermal pad (pin 144, the underside of the package) that must be soldered to a PCB thermal land pattern. Without proper soldering to at least 9 thermal vias to an internal ground plane, junction-to-ambient thermal resistance (theta_JA) increases significantly, derating the device above approximately 0.5 W total power dissipation. For designs operating continuously at full logic utilization (~0.75 W), provision at least 1 square inch of 2 oz copper on the top layer connected to the EP.

The Cyclone III EP3C5E144I7N requires four separate supply rails: VCCINT (1.2 V core), VCCIO (per-bank, 1.2-3.3 V depending on I/O standard), VCCA (1.2 V PLL analog), and VCCD_PLL (1.2 V PLL digital). Decouple each VCCINT pin with a 0.1 µF ceramic cap placed within 100 mils of the pin, and bulk-decouple each VCCIO bank with one 4.7 µF ceramic. PLL supplies (VCCA, VCCD_PLL) must be filtered with ferrite beads and isolated from digital noise - sharing the VCCINT plane with PLLs is a common cause of PLL jitter problems.

When designing with the EQFP-144 package, follow Intel/Altera Cyclone III package guidelines: keep all 144 signal traces on top-layer escape routing with via-in-pad only if your fab supports it, and use the 0.4 mm pitch lead spacing to calculate minimum trace width (typically 0.15 mm / 6 mil). Differential pairs (LVDS) should be length-matched within 100 mil. Place the JTAG chain (TCK, TMS, TDI, TDO) on dedicated layers or route them as a group, and ensure 10 kohm pull-ups on nCONFIG and MSEL[3:0] configuration mode pins.

Common mistakes include: (1) using Quartus II versions later than 13.0sp1 without installing the Cyclone III legacy device support, leading to silent compile failures; (2) forgetting to enable the JTAG IDCODE check during multi-device configuration chains, causing the wrong bitstream to load; (3) omitting the AS configuration flash (EPCS4/EPCS16) reset pull-up, leaving the FPGA in undefined configuration state on power-up. Always verify the configuration scheme in the Quartus II Device & Pin Options before generating the programming file.

Informations de conformité

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sans plomb

Yes

Sans halogène

Yes

Minerais de conflit

Compliant

RoHS compliant per Altera/Intel product environmental documentation. Not AEC-Q100 qualified - choose automotive-grade variants or external qualification for automotive programs.

Données vérifiées le : 2026-09-09 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Distributor, Distributor, Distributor, Octopart, Manufacturer Datasheet, Manufacturer Product Page, Manufacturer Product Page, Manufacturer Product Page

Recherches associées

EP3C5E144I7N datasheet EP3C5E144I7N price Intel Cyclone III FPGA EP3C5E144I7N pinout EQFP-144 EP3C5E144I7N vs EP3C5E144C8N EP3C5E144I7N drop-in replacement 5K logic element FPGA industrial Cyclone III motor control FPGA EP3C5E144I7N buy online what is the logic element count of EP3C5E144I7N Cyclone III Quartus II version EP3C5E144I7N protocol bridge FPGA

Composants & termes associés

Intel Altera EP3C5E144I7N EP3C5E144C8N EP3C5E144A7N EP3C5E144C7N EP3C10E144I7N EP3C16E144I7N EP3C25E144I7N Cyclone III FPGA field-programmable gate array programmable logic device PLD logic element Logic Array Block LAB embedded memory M9K RAM block 18x18 multiplier DSP block PLL JTAG IEEE 1149.1 Quartus II EQFP-144 exposed pad RoHS REACH industrial temperature grade commercial temperature grade DDR2 QDRII SRAM