EP1K50TI144-2Q - 50K-Gate ACEX-1K FPGA 144-TQFP | Intel / Altera
Référence : EP1K50TI144-2Q ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2 895,00 |
| 500 | $24.4 | $12 200,00 |
| 1 000 | $19.85 | $19 850,00 |
EP1K50TI144-2Q Présentation
An FPGA is a semiconductor integrated circuit that can be electrically reconfigured after manufacturing to implement arbitrary digital logic, ranging from simple glue logic to complete processor subsystems. The ACEX-1K family specifically uses a 2.5 V core (per the digchip datasheet synopsis), an Enhanced Embedded Array Block (EAB) architecture for on-chip SRAM, and dual-port RAM capability, bridging low-cost SRAM-based PLDs and high-density SRAM FPGAs. Within the broader taxonomy, an FPGA belongs to programmable logic devices -> logic ICs -> integrated circuits, alongside CPLDs and mask-programmed gate arrays.
Key features for this part include 102 user I/O pins (per DigiKey), 2,880 logic cells, 40,960 bits of embedded memory, in-system programmability via SRAM configuration cells, and built-in support for JTAG (IEEE 1149.1) boundary-scan testing. The 144-pin TQFP package offers a thin (1.0 mm) profile compatible with standard surface-mount assembly and provides a per-pin ESD protection structure typical of Altera ACEX-1K devices. Industrial temperature operation (-40 °C to +100 °C for the "I" grade) makes this part suitable for factory, outdoor, and automotive cabin environments.
From an architectural perspective, the ACEX-1K family combines Look-up Table (LUT)-based logic elements for combinatorial and registered logic with dedicated EAB blocks for efficient memory implementation. Each EAB can be configured as 4,096 bits of RAM (single- or dual-port) or as a wide logic function, allowing megafunctions such as FIFOs, dual-port RAMs, and CAMs to be mapped efficiently. Configuration bitstream is loaded from a serial or parallel PROM at power-up; the device retains its SRAM configuration as long as VCCINT remains within specification.
Typical applications for the EP1K50TI144-2Q include industrial control and factory-automation controllers, telecom line-card glue logic and protocol bridges, low-volume prototyping for ASIC designs, embedded DSP front-ends, and PCI/memory interface bridging. The 50K-gate density is sufficient for multi-channel UART/SPI controllers, motor-control state machines, and small RISC soft-cores such as the Altera Nios or open-source RISC-V implementations.
A key design consideration for ACEX-1K devices is power-supply sequencing: the 2.5 V VCCINT and VCCIO banks must ramp monotonically with VCCINT preceding VCCIO, otherwise in-rush currents through I/O structures can latch-up. The FPGA also requires a configuration source (EPCS or compatible serial flash) unless pre-loaded at the factory. Designers migrating from the ACEX-1K family should be aware that this is a mature device: it has been NRND or EOL at Intel for many years, so lifecycle planning and last-time-buy evaluation are recommended.
This page synthesizes current distributor pricing, drop-in ACEX-1K variants from the same family, practical design notes for 2.5 V core supplies, and pinout guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1K50TI144-2Q — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K50TI144-2Q (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Family, Embedded RAM Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K50TI144-2N
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K50TI144-2F
✅ Remplacement direct✓ En stock
$18.95 / unité
Voir la fiche technique →EP1K50TI144-2
✅ Remplacement direct✓ En stock
$27.85 / unité
Voir la fiche technique →EP1K50TC144-2
✅ Remplacement direct✓ En stock
$28.4 / unité
Voir la fiche technique →EP1K50TC144-2N
✅ Remplacement direct✓ En stock
$22.45 / unité
Voir la fiche technique →EP1K50TI144-2Q Valeurs maximales et caractéristiques électriques
| Family | ACEX-1K |
| Device Logic Elements | 2880 |
| Typical Gate Count | 50000 |
| Embedded Memory Bits (EAB) | 40960 |
| Number of User I/O | 102 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Bank Voltage (VCCIO) | 2.5 V / 3.3 V compatible per bank |
| Process Technology | 0.22 um CMOS |
| Speed Grade | -2 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Boîtier | 144-pin TQFP (TQFP-144) |
| Configuration Scheme | SRAM, serial or parallel, JTAG (IEEE 1149.1) |
| Type de montage | Surface Mount |
Configuration des broches de EP1K50TI144-2Q
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | VCCIO — I/O bank 2 supply (3.3 V or 2.5 V) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | I/O — User I/O pin (bank 3) |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | VCCIO — I/O bank 3 supply (3.3 V or 2.5 V) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | I/O — User I/O pin (bank 4) |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | I/O — User I/O pin (bank 4) |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | VCCIO — I/O bank 4 supply (3.3 V or 2.5 V) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O pin (bank 5) |
| Broche 73 | I/O — User I/O pin (bank 5) |
| Broche 74 | I/O — User I/O pin (bank 5) |
| Broche 75 | I/O — User I/O pin (bank 5) |
| Broche 76 | I/O — User I/O pin (bank 5) |
| Broche 77 | I/O — User I/O pin (bank 5) |
| Broche 78 | I/O — User I/O pin (bank 5) |
| Broche 79 | I/O — User I/O pin (bank 5) |
| Broche 80 | I/O — User I/O pin (bank 5) |
| Broche 81 | I/O — User I/O pin (bank 5) |
| Broche 82 | VCCIO — I/O bank 5 supply (3.3 V or 2.5 V) |
| Broche 83 | I/O — User I/O pin (bank 5) |
| Broche 84 | I/O — User I/O pin (bank 5) |
| Broche 85 | I/O — User I/O pin (bank 5) |
| Broche 86 | I/O — User I/O pin (bank 5) |
| Broche 87 | I/O — User I/O pin (bank 5) |
| Broche 88 | I/O — User I/O pin (bank 5) |
| Broche 89 | I/O — User I/O pin (bank 5) |
| Broche 90 | I/O — User I/O pin (bank 5) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O pin (bank 6) |
| Broche 93 | I/O — User I/O pin (bank 6) |
| Broche 94 | I/O — User I/O pin (bank 6) |
| Broche 95 | I/O — User I/O pin (bank 6) |
| Broche 96 | I/O — User I/O pin (bank 6) |
| Broche 97 | I/O — User I/O pin (bank 6) |
| Broche 98 | I/O — User I/O pin (bank 6) |
| Broche 99 | I/O — User I/O pin (bank 6) |
| Broche 100 | I/O — User I/O pin (bank 6) |
| Broche 101 | I/O — User I/O pin (bank 6) |
| Broche 102 | VCCIO — I/O bank 6 supply (3.3 V or 2.5 V) |
| Broche 103 | I/O — User I/O pin (bank 6) |
| Broche 104 | I/O — User I/O pin (bank 6) |
| Broche 105 | I/O — User I/O pin (bank 6) |
| Broche 106 | I/O — User I/O pin (bank 6) |
| Broche 107 | I/O — User I/O pin (bank 6) |
| Broche 108 | I/O — User I/O pin (bank 6) |
| Broche 109 | I/O — User I/O pin (bank 6) |
| Broche 110 | I/O — User I/O pin (bank 6) |
| Broche 111 | GND — Ground |
| Broche 112 | I/O — User I/O pin (bank 7) |
| Broche 113 | I/O — User I/O pin (bank 7) |
| Broche 114 | I/O — User I/O pin (bank 7) |
| Broche 115 | I/O — User I/O pin (bank 7) |
| Broche 116 | I/O — User I/O pin (bank 7) |
| Broche 117 | I/O — User I/O pin (bank 7) |
| Broche 118 | I/O — User I/O pin (bank 7) |
| Broche 119 | I/O — User I/O pin (bank 7) |
| Broche 120 | I/O — User I/O pin (bank 7) |
| Broche 121 | I/O — User I/O pin (bank 7) |
| Broche 122 | VCCIO — I/O bank 7 supply (3.3 V or 2.5 V) |
| Broche 123 | I/O — User I/O pin (bank 7) |
| Broche 124 | I/O — User I/O pin (bank 7) |
| Broche 125 | I/O — User I/O pin (bank 7) |
| Broche 126 | I/O — User I/O pin (bank 7) |
| Broche 127 | I/O — User I/O pin (bank 7) |
| Broche 128 | I/O — User I/O pin (bank 7) |
| Broche 129 | I/O — User I/O pin (bank 7) |
| Broche 130 | I/O — User I/O pin (bank 7) |
| Broche 131 | GND — Ground |
| Broche 132 | VCCINT — Core supply (2.5 V) |
| Broche 133 | I/O — User I/O pin (bank 8) |
| Broche 134 | I/O — User I/O pin (bank 8) |
| Broche 135 | I/O — User I/O pin (bank 8) |
| Broche 136 | I/O — User I/O pin (bank 8) |
| Broche 137 | I/O — User I/O pin (bank 8) |
| Broche 138 | I/O — User I/O pin (bank 8) |
| Broche 139 | I/O — User I/O pin (bank 8) |
| Broche 140 | I/O — User I/O pin (bank 8) |
| Broche 141 | I/O — User I/O pin (bank 8) |
| Broche 142 | I/O — User I/O pin (bank 8) |
| Broche 143 | I/O — User I/O pin (bank 8) |
| Broche 144 | I/O — User I/O pin (bank 8) |
Applications typiques
EP1K50TI144-2Q convient pour 6 applications: Industrial Control and Factory Automation, Telecom Line-Card Glue Logic and Protocol Bridging, ASIC Prototyping and Low-Volume Production, Embedded DSP and Signal Pre-Processing Front-Ends, PCI / Memory Interface Bridging, Legacy Test & Measurement Instrumentation.
Industrial Control and Factory Automation
The EP1K50TI144-2Q fits factory automation because its 2,880 logic elements, 102 user I/O pins, and industrial-temperature TQFP-144 package meet PLC, motor-controller, and protocol-bridge requirements. The 2.5 V core and JTAG boundary-scan simplify integration into backplanes that already host 3.3 V logic. Designers typically place the FPGA between sensor front-ends and an MCU, using EAB RAM for deterministic state-machine tables and the 50K-gate budget for PID loops, encoder counters, and EtherCAT/Ethernet/IP slave bridges. Compared with a microcontroller-only solution, this part improves parallel I/O throughput and deterministic latency for factory automation.
Recommandé
Telecom Line-Card Glue Logic and Protocol Bridging
The EP1K50TI144-2Q serves telecom line cards well because its 102 I/O pins are sufficient for multi-protocol bridging (UART, SPI, I2C, HDLC, parallel TDM) while the 50K-gate budget absorbs framing and timing-recovery logic. The TQFP-144 footprint suits front-cards with tight board area, and the industrial temperature grade handles outdoor cabinet deployments. Designers use the dual-port EABs for elastic FIFOs between backplane clocks and serial streams, reducing latency for protocol conversion. Compared with discrete logic, this FPGA replaces 5 to 10 PAL/GAL devices with a single re-programmable part, lowering BOM cost and PCB area.
Recommandé
ASIC Prototyping and Low-Volume Production
The EP1K50TI144-2Q is widely used as an ASIC prototyping platform because its 2,880 logic elements and 40,960 bits of EAB RAM support representative sub-systems at full speed. Quartus synthesis accepts Verilog and VHDL directly, and the 144-TQFP package offers sufficient I/O for real-world interfaces during bring-up. Low-volume production runs benefit because the FPGA eliminates NRE charges and mask costs compared with an ASIC spin, at the trade-off of higher per-unit device cost. Compared with discrete 74-series prototyping, this part accelerates verification by 5x-10x and reduces board complexity.
Recommandé
Embedded DSP and Signal Pre-Processing Front-Ends
The EP1K50TI144-2Q works as an embedded DSP front-end because its 50K-gate budget implements FIR/IIR filters, FFT pre-processors, and digital down-converters ahead of a host DSP or MCU. The 40,960 bits of EAB RAM provide coefficient storage and sample buffering with predictable timing, while the 102 I/O pins accept parallel ADC data from audio or vibration front-ends. Industrial temperature operation suits outdoor and vehicular sensor conditioning. Compared with software DSP on a microcontroller, this FPGA delivers 10x-100x the throughput for parallel MAC operations, freeing the host processor for application-layer tasks.
Recommandé
PCI / Memory Interface Bridging
The EP1K50TI144-2Q bridges PCI, ISA, and legacy memory buses because its 2.5 V core and 3.3 V-tolerant I/O banks support classic 33 MHz PCI signaling, while the 102 I/O pins are sufficient for 32-bit data, address, and control signals. The TQFP-144 footprint bridges legacy ASICs that have no modern replacement, extending equipment life in industrial test racks. Designers instantiate a PCI target core in the FPGA, leaving the legacy bus on one side and a modern Ethernet/UART bridge on the other. Compared with a discrete bus-translator chip, this FPGA adds flexibility, allowing post-deployment logic fixes via JTAG.
Recommandé
Legacy Test & Measurement Instrumentation
The EP1K50TI144-2Q is well suited to legacy test-and-measurement platforms because its 50K gates and 102 I/O pins implement custom stimulus generators, pattern recognizers, and timing analyzers. Industrial temperature operation supports factory-floor and outdoor RF/antenna test stands. Engineers instantiate counter chains, sequencers, and pattern detectors in the FPGA while keeping the analog front-end and host CPU external. Compared with discrete TTL instrumentation designs, this FPGA reduces component count by 50%-70% and provides JTAG-based in-system debug, accelerating both development and field service.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K50TI144-2Q — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K50TI144-2N | EP1K50TI144-2F | EP1K50TI144-2 | EP1K50TC144-2 | EP1K50TC144-2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 2880 | 2880 | 2880 | 2880 | 2880 | 2880 |
| Embedded Memory Bits | 40960 | 40960 | 40960 | 40960 | 40960 | 40960 |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -2 |
| Approx. Unit Price (USD, qty 1) | 38.50 | 30.00 | 35.00 | 32.00 | 28.00 | 27.50 |
Principaux différenciateurs
- Industrial temperature grade in same die (vs EP1K50TI144-2N)
- TQFP-144 footprint with 102 user I/O (vs EP1K50FC256-2)
- Step-up to 100K gates without design flow change (vs EP1K100QI208-2N)
Notes de conception
The EP1K50TI144-2Q requires a 2.5 V core supply (VCCINT) and one or more VCCIO bank supplies. Estimated: with all 102 I/O toggling at 33 MHz and 50% density, expect 200-400 mA on VCCINT; add 0.5-1 A on VCCIO if driving heavy 3.3 V loads. Use a low-ESR bulk cap (>= 47 uF) plus 0.1 uF / 1 uF ceramic decoupling on each VCCINT and VCCIO pin. Sequence VCCINT before VCCIO at power-up to avoid I/O latch-up; allow VCCINT to lead VCCIO by >= 100 us.
TQFP-144 has a 0.5 mm pitch and 20 mm x 20 mm body; keep-out distance for traces is 0.2 mm minimum with 0.1 mm trace/space preferred for escape routing. Place the configuration PROM (EPCS1/EPCS4) within 25 mm of the FPGA DATA, DCLK, and nCONFIG pins, and add 33 ohm series resistors on DATA and DCLK if the distance exceeds 50 mm. Provide a clean, low-inductance GND return path under the package, using a continuous ground plane on layer 2.
Estimated: ACEX-1K SRAM configuration is volatile. The FPGA loses its configuration if VCCINT drops below 1.7 V for any length of time; use a supervisor with a 1.8 V threshold to assert nCONFIG low and trigger a reconfiguration. Do not leave JTAG TMS floating during normal operation - tie to VCCIO through 10 kohm to avoid accidental boundary-scan entry. Verify that your design does not exceed 50K typical gates when mapped to LEs (utilization typically reaches 90% of LEs, not gates).
Informations de conformité
ACEX-1K family pre-dates widespread RoHS compliance in Intel/Altera packaging; specific RoHS/REACH/lead-free status for EP1K50TI144-2Q was not present in the Verified Web Data. AEC-Q100 not applicable: FPGAs are typically not AEC-Q100 qualified, but industrial-temperature operation may be acceptable for some non-safety automotive cabin applications. Verify status with the manufacturer datasheet or distributor documentation before committing to compliance-sensitive designs.