EPM5192JC - 192-Macrocell Classic CPLD | Intel / Altera
Référence : EPM5192JC ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.75 | $287,50 |
| 100 | $24.1 | $2 410,00 |
| 500 | $19.8 | $9 900,00 |
| 1 000 | $16.4 | $16 400,00 |
EPM5192JC Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile, deterministic-latency programmable logic device that combines multiple PAL-like macrocell blocks on a single die. The hierarchy runs: macrocell -> LAB (Logic Array Block) -> CPLD -> programmable logic -> semiconductor. Compared to FPGAs, CPLDs offer instant-on operation, predictable timing, and high drive strength, making them ideal for system-level glue logic, address decoding, and I/O expansion.
The EPM5192JC features 192 macrocells, 12 LABs, and a PIA-based interconnect fabric that delivers consistent pin-to-pin propagation delays across all logic paths. Its UV-erasable windowed ceramic package enables multiple design iterations during prototyping, while the CMOS EPROM-based architecture provides non-volatile configuration retention without an external boot PROM. Programmable I/O architecture supports flexible voltage interfacing.
Typical applications include bus-interface bridging, address decoding and chip-select generation in microprocessor systems, state-machine implementation, glue logic for ASIC replacement, and legacy industrial-control retrofits. The EPM5192JC's deterministic timing also suits real-time control loops and synchronous interface adaptation.
When designing, consider the propagation delay budget, macrocell utilization per LAB, and I/O standard compatibility. The ceramic JC package is suited for development and military applications where UV reprogrammability is required; for production, plastic JI/JC variants or JTAG-programmed equivalents are typically preferred.
This page synthesizes distributor availability, cross-reference alternatives, and practical selection guidance not found in the original Altera datasheet, supporting both new designs and legacy maintenance scenarios.
Alternatives de remplacement direct pour EPM5192JC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM5192JC (même facteur de forme et même empreinte) — différant par Package, Process Technology, Mounting Type, Device Type, Propagation Delay (tPD).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM5192JC-1
✅ Remplacement direct✓ En stock
$22.4 / unité
Voir la fiche technique →EPM5192JC-2
✅ Remplacement direct✓ En stock
$22.5 / unité
Voir la fiche technique →EPM5192GC-1
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPM5192GC-2
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EPM5192GC1
✅ Remplacement direct✓ En stock
$24.5 / unité
Voir la fiche technique →EPM5192LC-1
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EPM5192LC1
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →EPM5192JC Valeurs maximales et caractéristiques électriques
| Product Type | CPLD (Complex Programmable Logic Device) |
| Series | EPM5192 (Classic / MAX-class) |
| Macrocells | 192 |
| Logic Array Blocks (LABs) | 12 |
| Interconnect Architecture | Programmable Interconnect Array (PIA) |
| Process Technology | CMOS EPROM (UV-erasable) |
| Boîtier | 68-pin PLCC (JC) windowed ceramic |
| Type de montage | Surface Mount |
| Programming Method | UV-erase + EPROM programmer |
| Non-Volatile Configuration | Yes (EPROM cell array) |
| Logic Family | Classic CPLD (EPM5xxx series) |
Configuration des broches de EPM5192JC
| Broche 1 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 2 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 3 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 4 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 5 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 6 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 7 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 8 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 9 | VCC — Supply voltage (5V nominal) |
| Broche 10 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 11 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 12 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 13 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 14 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 15 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 16 | I/O — Bidirectional I/O pin (bank 1) |
| Broche 17 | GND — Ground |
| Broche 18 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 19 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 20 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 21 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 22 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 23 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 24 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 25 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 26 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 27 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 28 | VCC — Supply voltage (5V nominal) |
| Broche 29 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 30 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 31 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 32 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 33 | I/O — Bidirectional I/O pin (bank 2) |
| Broche 34 | GND — Ground |
| Broche 35 | INPUT — Dedicated input - Global Clock |
| Broche 36 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 37 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 38 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 39 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 40 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 41 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 42 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 43 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 44 | INPUT — Dedicated input - Global OE |
| Broche 45 | VCC — Supply voltage (5V nominal) |
| Broche 46 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 47 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 48 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 49 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 50 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 51 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 52 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 53 | I/O — Bidirectional I/O pin (bank 3) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 56 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 57 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 58 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 59 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 60 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 61 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 62 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 63 | VCC — Supply voltage (5V nominal) |
| Broche 64 | INPUT — Dedicated input - Global Clear |
| Broche 65 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 66 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 67 | I/O — Bidirectional I/O pin (bank 4) |
| Broche 68 | I/O — Bidirectional I/O pin (bank 4) |
Applications typiques
EPM5192JC convient pour 6 applications: Microprocessor Bus Interface Bridging, Address Decoding and Chip-Select Generation, State Machine and Sequencer Implementation, ASIC Replacement and Logic Consolidation, Legacy Industrial Control Retrofit, Test Equipment and Instrumentation Logic.
Microprocessor Bus Interface Bridging
The EPM5192JC's 192 macrocells, deterministic PIA routing, and 5V-tolerant I/O make it well suited to bridging between legacy microprocessors (8086, 68000, Z80) and modern peripherals with mismatched bus widths or timing. Place the CPLD between the CPU and peripheral to translate 8-bit to 16-bit transactions, generate wait-state insertion, or implement interrupt-acknowledge sequencing with predictable 10-15 ns pin-to-pin delays. Unlike FPGAs, the EPM5192JC's instant-on EPROM configuration eliminates boot-PROM complexity for critical glue logic. Compared to discrete 74-series TTL, the EPM5192JC consolidates a full board of decode logic into a single 68-pin PLCC, reducing PCB area and improving noise immunity on long bus runs.
Recommandé
Address Decoding and Chip-Select Generation
The EPM5192JC's product-term architecture and 12 LABs are ideal for address-decode and chip-select generation in microprocessor memory systems. Each LAB implements 16 macrocells that combine with the PIA to produce 16-32 decoded chip-select outputs with single-pass propagation delay - far faster than cascaded 74LS138 decoders. In a 1MB memory map, the 192 macrocells can decode up to 24 address lines with multiple qualifier inputs, supporting bank-switching, boot-region selection, and peripheral gating. The non-volatile EPROM configuration means the decode map is in place at power-on with no boot latency, critical for deterministic cold-start in industrial controllers.
Recommandé
State Machine and Sequencer Implementation
With 192 macrocells, each containing a flip-flop and configurable product-term logic, the EPM5192JC is well matched to multi-state FSMs in instrumentation, motor-control, and protocol-conversion designs. The deterministic timing of the PIA-based interconnect ensures the same state-transition latency regardless of which LABs the inputs and outputs occupy - critical for safety-relevant state machines. A typical 32-state sequencer with 24 transitions consumes approximately 80-100 macrocells, leaving headroom for I/O adaptation. UV-erase reprogrammability of the JC package makes iterative state-machine debugging fast: erase, reprogram, and re-test in seconds rather than the minutes required for OTP devices.
Recommandé
ASIC Replacement and Logic Consolidation
The EPM5192JC is a popular ASIC replacement when NRE cost is unjustified for low-to-medium volume production (typically 100-10,000 units). Designers can replace 5-15 discrete 74-series TTL/MSI packages (gates, muxes, latches, decoders) with a single EPM5192JC, reducing board area, BOM cost, and assembly time. The 12 LABs provide enough capacity for typical gate-array conversions of 2000-3000 equivalent gates. UV-erase development cycles on the JC package accelerate design iteration, while plastic LC or windowless GC variants provide cost-down OTP options for volume production - all sharing the same PLCC-68 footprint for PCB reuse.
Recommandé
Legacy Industrial Control Retrofit
The EPM5192JC's longevity in industrial automation systems - many of which have 20-30 year service life requirements - makes it a common retrofit part when repairing or upgrading obsolete controllers. Its 5V CMOS I/O tolerance, robust ceramic packaging, and Altera/Intel long-term support make it ideal for PLCs, CNC controllers, and process-control systems where re-spinning the controller board is prohibitively expensive. The 192-macrocell capacity supports typical retrofit scope: scan-matrix re-implementation, I/O-expansion decoding, and protocol-adaptation glue logic. Distributors specializing in obsolete Altera silicon maintain traceability records for industrial-grade EPM5192 stock.
Recommandé
Test Equipment and Instrumentation Logic
The EPM5192JC's deterministic timing and reconfigurable EPROM cells are valuable in test-and-measurement instruments where stimulus sequencing, handshake generation, and parallel-data formatting must execute with repeatable timing. A typical application generates IEEE-488 (GPIB) handshapes, formats parallel data for LCD/VFD displays, or sequences relay-driver control lines. The 192 macrocells comfortably implement an 8-channel 16-state sequencer with handshake, leaving capacity for status-decoding logic. UV-erase cycles enable on-bench logic updates without removing the device - ideal during firmware-development phases of bench-top test gear.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM5192JC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM5192JC-1 | EPM5192JC-2 | EPM5192GC-1 | EPM5192GC-2 | EPM5192LC-1 |
|---|---|---|---|---|---|---|
| Package | PLCC-68 (JC) windowed ceramic | PLCC-68 (JC) - same | PLCC-68 (JC) - same | PLCC-68 (GC) windowless ceramic - same footprint | PLCC-68 (GC) windowless ceramic - same footprint | PLCC-68 (LC) plastic - same footprint |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 |
| Logic Array Blocks | 12 | 12 | 12 | 12 | 12 | 12 |
| Programming Method | UV-erasable EPROM | UV-erasable EPROM | UV-erasable EPROM | OTP (windowless) | OTP (windowless) | OTP (plastic, one-time programmable) |
| Speed Grade | Standard (- unspecified) | Faster (-1) | Fastest (-2) | Faster (-1) | Fastest (-2) | Faster (-1) |
| Application Target | Development / prototyping (UV window) | Development / prototyping | Development / prototyping | Production (windowless) | Production (windowless) | Production (plastic, low-cost) |
| Package Lid / Window | UV-transparent quartz window | UV-transparent quartz window | UV-transparent quartz window | Ceramic lid (opaque) | Ceramic lid (opaque) | Plastic body (no window) |
Principaux différenciateurs
- UV-erasable windowed ceramic package supports multiple design iterations (vs EPM5192LC-1)
- Identical silicon die with broader operating-temperature envelope than plastic LC (vs EPM5192LC-1)
- Highest logic density in PLCC-68 footprint (vs EPM5130JC-1)
Notes de conception
The EPM5192JC's UV-erasable EPROM cell array is sensitive to ambient light through the quartz window. In production environments, always apply opaque label tape over the window after programming, or migrate to the windowless GC/LC variant for deployed systems. Exposure to fluorescent lighting or sunlight for extended periods can slowly erase the configuration and cause logic corruption in the field. This is the single most common cause of 'bit rot' failures in windowed CPLDs and EPROMs in industrial settings.
The 68-pin PLCC socket is recommended over direct soldering during development to allow UV-erase cycles without desoldering. Use a high-quality machined-pin PLCC socket (e.g., 3M Textool or similar) rated for repeated insertion cycles. For production, the LC plastic variant can be soldered directly. Decoupling: place a 0.1 uF ceramic capacitor at each VCC pin (4 VCC pins total on the EPM5192JC) and a single 10 uF tantalum bulk capacitor near the package. Maintain a ground plane under the device to control switching noise on the PIA interconnect.
Each LAB's I/O pins are grouped together on the PLCC-68 pinout; when designing pin assignments, place high-fanout signals (clocks, global clear, output enables) on the dedicated INPUT pins (35, 44, 64) to drive the LAB-wide control networks rather than consuming general-purpose I/O. This preserves I/O resources for user logic and ensures deterministic distribution of control signals. Leave at least 2-3 I/O pins unused as 'no-connect' to provide timing margin and routing flexibility during place-and-route iterations.
Estimated: at a typical CMOS toggle rate of 50% with all 192 macrocells active, the EPM5192JC draws approximately 100-300 mW depending on VCC (5V) and frequency. With the ceramic JC package's thermal resistance of approximately 25-30 C/W theta-JA, junction temperature rise above ambient is 3-9 C - well within the commercial 0-70 C operating range. The windowed ceramic package actually provides slightly better thermal dissipation than the plastic LC variant due to higher thermal conductivity of the ceramic body.
Informations de conformité
Original Altera EPM5192 family parts were manufactured before RoHS directives took effect. The ceramic JC package contains lead-bearing solder terminations. For RoHS-compliant designs, consider MAX II / MAX V families or EPM5192LC variants in RoHS-screened lots.
