EPM570GT144C5 - 570 LEs CPLD MAX II 144TQFP | Intel
Référence : EPM570GT144C5 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $25.86 | $25,86 |
| 10 | $23.1 | $231,00 |
| 100 | $19.45 | $1 945,00 |
| 500 | $16.85 | $8 425,00 |
| 1 000 | $14.2 | $14 200,00 |
EPM570GT144C5 Présentation
What is a CPLD? A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple SPLDs and large FPGAs in the programmable logic hierarchy: SPLD -> CPLD -> FPGA -> programmable logic -> digital semiconductor. CPLDs use non-volatile flash or EEPROM configuration cells, giving them instant-on behavior at power-up with no external boot PROM, low static power, deterministic timing, and predictable routing delays. The EPM570GT144C5 specifically belongs to Intel's MAX II G family, which adds high-speed LVDS I/O support on top of the standard MAX II architecture, positioning it for low-cost glue-logic, bus bridging, I/O expansion, and power-sequencing roles.
Key features include 440 macrocells across two logic array blocks, 8.0 Kbits of internal user flash memory for storing user-defined data, MultiVolt I/O supporting 1.5V/1.8V/2.5V/3.3V interfacing from a single 3.3V VCCINT supply, a 1.71V-1.89V VCCIO core range with internal regulator, JTAG-based IEEE Std 1149.1 in-system programmability, and high-speed LVDS I/O at up to 300 Mbps. The 144 TQFP provides 80 general-purpose user I/O pins.
The MAX II G architecture combines a uniform interconnect fabric with Look-Up Table (LUT) based logic elements and a Flash-based configuration block, eliminating the need for an external configuration device. MultiVolt core and I/O structures let each I/O bank operate independently, simplifying mixed-voltage designs.
Primary applications include I/O expansion for microcontrollers and ASICs, bus interface bridging (e.g., SPI-to-parallel, I2C-to-GPIO), power-supply sequencing and supervisory logic, address decoding and glue logic in embedded systems, and high-speed LVDS signal conditioning in industrial control and communications hardware.
When designing, ensure the VCCINT internal regulator is properly bypassed with 0.1uF and 10uF capacitors as shown in the datasheet typical application circuit, and respect MultiVolt I/O bank grouping constraints when assigning mixed-voltage signals.
This page synthesizes distributor pricing, pin-compatible MAX II G alternatives, and engineering design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPM570GT144C5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570GT144C5 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Programming Interface, Process Technology, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570GT144C4
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$22.1 / unité
Voir la fiche technique →EPM570GT144C4N
✅ Remplacement direct✓ En stock
$22.5 / unité
Voir la fiche technique →EPM570GT144C3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$28.95 / unité
Voir la fiche technique →EPM570GT144C3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.5 / unité
Voir la fiche technique →EPM570GT144C5 Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Family | MAX II G |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/O Pins | 80 |
| User Flash Memory | 8.0 Kbits |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Programmable Type | In-System Programmable (Flash) |
| Core Voltage VCCINT | 1.71 V to 1.89 V (internal regulator) |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| LVDS Support | Yes (MAX II G feature, up to 300 Mbps) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Boîtier | 144-TQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de EPM570GT144C5
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | GND — Ground |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | I/O — User I/O pin (bank 2) |
| Broche 53 | I/O — User I/O pin (bank 2) |
| Broche 54 | I/O — User I/O pin (bank 2) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 59 | I/O — User I/O pin (bank 3) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | I/O — User I/O pin (bank 3) |
| Broche 62 | I/O — User I/O pin (bank 3) |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 3) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | I/O — User I/O pin (bank 3) |
| Broche 76 | I/O — User I/O pin (bank 3) |
| Broche 77 | I/O — User I/O pin (bank 3) |
| Broche 78 | I/O — User I/O pin (bank 3) |
| Broche 79 | I/O — User I/O pin (bank 3) |
| Broche 80 | I/O — User I/O pin (bank 3) |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | I/O — User I/O pin (bank 3) |
| Broche 83 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | I/O — User I/O pin (bank 3) |
| Broche 86 | I/O — User I/O pin (bank 3) |
| Broche 87 | I/O — User I/O pin (bank 3) |
| Broche 88 | I/O — User I/O pin (bank 3) |
| Broche 89 | I/O — User I/O pin (bank 3) |
| Broche 90 | I/O — User I/O pin (bank 3) |
| Broche 91 | TDI — JTAG Test Data In |
| Broche 92 | TCK — JTAG Test Clock |
| Broche 93 | TMS — JTAG Test Mode Select |
| Broche 94 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 95 | I/O — User I/O pin (bank 4) |
| Broche 96 | I/O — User I/O pin (bank 4) |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | I/O — User I/O pin (bank 4) |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — User I/O pin (bank 4) |
| Broche 102 | I/O — User I/O pin (bank 4) |
| Broche 103 | I/O — User I/O pin (bank 4) |
| Broche 104 | I/O — User I/O pin (bank 4) |
| Broche 105 | I/O — User I/O pin (bank 4) |
| Broche 106 | I/O — User I/O pin (bank 4) |
| Broche 107 | I/O — User I/O pin (bank 4) |
| Broche 108 | TDO — JTAG Test Data Out |
| Broche 109 | I/O — User I/O pin (bank 4) |
| Broche 110 | I/O — User I/O pin (bank 4) |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | I/O — User I/O pin (bank 4) |
| Broche 114 | I/O — User I/O pin (bank 4) |
| Broche 115 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 116 | I/O — User I/O pin (bank 4) |
| Broche 117 | I/O — User I/O pin (bank 4) |
| Broche 118 | I/O — User I/O pin (bank 4) |
| Broche 119 | I/O — User I/O pin (bank 4) |
| Broche 120 | I/O — User I/O pin (bank 4) |
| Broche 121 | GND — Ground |
| Broche 122 | I/O — User I/O pin (bank 4) |
| Broche 123 | I/O — User I/O pin (bank 4) |
| Broche 124 | I/O — User I/O pin (bank 4) |
| Broche 125 | I/O — User I/O pin (bank 4) |
| Broche 126 | I/O — User I/O pin (bank 4) |
| Broche 127 | I/O — User I/O pin (bank 4) |
| Broche 128 | I/O — User I/O pin (bank 4) |
| Broche 129 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 130 | I/O — User I/O pin (bank 4) |
| Broche 131 | I/O — User I/O pin (bank 4) |
| Broche 132 | I/O — User I/O pin (bank 4) |
| Broche 133 | I/O — User I/O pin (bank 1) |
| Broche 134 | I/O — User I/O pin (bank 1) |
| Broche 135 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 136 | I/O — User I/O pin (bank 1) |
| Broche 137 | I/O — User I/O pin (bank 1) |
| Broche 138 | I/O — User I/O pin (bank 1) |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — User I/O pin (bank 1) |
| Broche 141 | I/O — User I/O pin (bank 1) |
| Broche 142 | I/O — User I/O pin (bank 1) |
| Broche 143 | I/O — User I/O pin (bank 1) |
| Broche 144 | I/O — User I/O pin (bank 1) |
Applications typiques
EPM570GT144C5 convient pour 6 applications: Microcontroller I/O Expansion, Bus Interface Bridging, Power Supply Sequencing and Supervisory Logic, Address Decoding and Memory Interfacing, Industrial Control Logic, Communications Equipment Glue Logic.
Microcontroller I/O Expansion
The EPM570GT144C5 expands microcontroller GPIO count by 80 user I/O pins through simple register-mapped logic, making it ideal when an MCU runs out of pins but does not justify a full FPGA. With 570 LEs and 440 macrocells it can implement multiple SPI-to-parallel, I2C-to-GPIO, or shift-register interfaces simultaneously. The 5.4 ns pin-to-pin delay ensures deterministic timing for handshake protocols, and instant-on flash configuration eliminates boot latency. MultiVolt I/O banks support 1.5V/1.8V/2.5V/3.3V peripherals from a single 3.3V supply, simplifying mixed-voltage designs.
Recommandé
Bus Interface Bridging
The EPM570GT144C5 bridges mismatched bus protocols such as SPI to parallel, I2C to GPIO, or UART to LVDS, providing glue logic between processors running at different voltages. Its deterministic 5.4 ns tPD guarantees clean setup/hold timing at common bus speeds up to ~150 MHz. MAX II G family LVDS support at 300 Mbps is sufficient for many industrial fieldbus and inter-IC bridging scenarios. The non-volatile flash-based configuration means the bridge is operational within microseconds of power-up, no boot PROM required.
Recommandé
Power Supply Sequencing and Supervisory Logic
The EPM570GT144C5 implements power supply sequencers and supervisor logic for multi-rail systems, replacing discrete timing circuits with a single programmable device. Its 80 user I/O pins easily handle 8-12 power rails with enable, fault, and PGOOD signals plus analog monitoring logic via comparators. The deterministic 5.4 ns timing ensures precise rail-to-rail sequencing delays down to the nanosecond. Instant-on flash configuration means the sequencer is operational before any downstream regulator is released, eliminating start-up glitches in processor power trees.
Recommandé
Address Decoding and Memory Interfacing
The EPM570GT144C5 provides high-speed address decoding and chip-select logic for processor-to-memory and processor-to-peripheral interfaces, replacing multiple 74-series decoders with one device. With 5.4 ns tPD it can decode addresses well within a single clock cycle at 100 MHz, enabling zero-wait-state memory interfaces. The 570 LEs support multi-bank chip-select logic with multiple address windows per chip, and the JTAG in-system programmability lets you reconfigure memory maps on the fly during development. The 80 I/O pins are sufficient for 4-6 chip selects plus control signal generation.
Recommandé
Industrial Control Logic
The EPM570GT144C5 serves as the central logic engine in industrial control boards, implementing deterministic state machines, encoder counters, and PWM generation. Its 440 macrocells handle multiple encoder inputs and motor-control timing logic simultaneously. The MAX II G family LVDS support enables high-noise-immunity communication in factory environments. MultiVolt I/O banks connect directly to 3.3V MCUs and 5V-tolerant sensors through level shifting. The 0C to +85C commercial grade is suitable for enclosed industrial enclosures; -40C to +100C industrial versions are available in the same package under different ordering codes.
Recommandé
Communications Equipment Glue Logic
The EPM570GT144C5 implements glue logic in networking and telecom equipment, including line-card interface logic, clock distribution steering, and protocol converters. The 5.4 ns pin-to-pin delay supports deterministic timing for high-speed serial interfaces and bus arbitration logic. MAX II G family LVDS I/O at 300 Mbps handles inter-board communication without external transceivers. The 144-TQFP package offers enough user I/O for line-card designs needing 40-60 signal connections plus JTAG, and the non-volatile instant-on configuration is critical for telecom equipment requiring sub-millisecond power-up.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570GT144C5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570GT144C4 | EPM570GT144C4N | EPM570GT144C3N | EPM570GT144C3 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 |
| User I/O Pins | 80 | 80 | 80 | 80 | 80 |
| Pin-to-Pin Delay (tPD) | 5.4 ns (C5) | ~7 ns (C4) | ~7 ns (C4) | ~10 ns (C3) | ~10 ns (C3) |
| User Flash Memory | 8.0 Kbits | 8.0 Kbits | 8.0 Kbits | 8.0 Kbits | 8.0 Kbits |
| Temperature Grade | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lead-Free Finish | SnPb (standard) | SnPb | Lead-free (Pb-free) | Lead-free (Pb-free) | SnPb |
Principaux différenciateurs
- Fastest C5 speed within MAX II G 144-TQFP family (vs EPM570GT144C4)
- SnPb lead finish availability (vs EPM570GT144C4N)
- High I/O count for the 144-TQFP package (vs EPM570GT100C5)
Notes de conception
The EPM570GT144C5 requires a stable 3.3V VCCIO supply for the I/O banks and an internal 1.71V-1.89V VCCINT rail generated by an on-chip voltage regulator from VCCIO. Bypass each VCCIO pin with a 0.1uF ceramic capacitor placed within 5 mm of the pin, and place one bulk 10uF ceramic or tantalum capacitor near the package. According to the MAX II datasheet typical application circuit, the internal regulator needs adequate bulk capacitance to handle inrush during configuration loading. Estimated: total inrush during flash configuration is approximately 50 mA peak for 100-200 us.
Route JTAG signals TCK, TMS, TDI, TDO with 50-ohm controlled impedance and keep traces under 100 mm to avoid signal integrity issues. Place the JTAG header or connector within 50 mm of the device. The four VCCIO bank pins must each be bypassed individually per the MAX II datasheet. MultiVolt bank assignment must be done in the Quartus pin planner before PCB layout to ensure each bank has its own VCCIO rail. Estimated: board area for proper decoupling is approximately 30 mm x 30 mm for the TQFP-144 footprint.
For MAX II G family LVDS operation, route LVDS pairs as 100-ohm differential impedance matched-length within 0.5 mm. Maximum LVDS data rate is 300 Mbps. Use AC-coupling capacitors at the LVDS link boundaries if connecting across connector or backplane interfaces. The remaining GPIO pins default to Schmitt-trigger inputs after power-up; configure unused pins as outputs driving low or as inputs with internal pull-ups enabled to avoid floating-input current draw. Estimated: floating-input leakage per pin is approximately 10 uA.
Common mistakes with the EPM570GT144C5 include: (1) forgetting that each VCCIO bank needs its own bypass capacitor and supply rail, (2) assigning 3.3V and 1.8V signals to the same bank (banks are independent but each bank has one VCCIO voltage), (3) using an external clock on a regular I/O instead of a dedicated CLK pin, which can introduce jitter, and (4) attempting in-system programming without pulling the nCONFIG/nCE pins correctly during reset. Always consult the Quartus II or Quartus Prime device pinout file for the exact bank assignments before PCB layout.
Informations de conformité
RoHS compliant per distributor listing; SnPb finish (not lead-free) is the standard C5 variant - choose N-suffix variants (e.g. EPM570GT144C5N) for lead-free Pb-free RoHS-compliant finishes. Not AEC-Q100 qualified - choose industrial-grade MAX II variants for automotive.
