Intel

EPM570GT144C4 - 570 LEs, 5.4ns CPLD, 144-TQFP | Intel MAX II

Référence : EPM570GT144C4 ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
1.8 V Vdss LVCMOS / LVTTL 1.5/1.8/2.5/3.3/5 V (MultiVolt) Rds(on) TQFP-144 (GT) Package 247.5 MHz Speed 8 Kbits Memory
À partir de $22.1 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-12
Tarifs dégressifs
Qté Prix unitaire Total
1 $36.21 $36,21
10 $32.58 $325,80
100 $28.95 $2 895,00
500 $25.4 $12 700,00
1 000 $22.1 $22 100,00
ℹ️ Tous les prix sont en USD

EPM570GT144C4 Présentation

The Intel (formerly Altera) EPM570GT144C4 is a non-volatile CPLD from the MAX II family featuring 570 logic elements (440 macrocells equivalent), 8 Kbits of internal Flash memory, and a maximum pin-to-pin propagation delay of 5.4 ns, housed in a 144-pin TQFP (GT) package. It is fabricated on a 0.18 µm, 6-layer-metal flash process and operates from a 1.8 V core supply with 3.3 V LVCMOS/LVTTL I/O, targeting instant-on, low-cost glue-logic applications.

A CPLD (Complex Programmable Logic Device) is a non-volatile, instantly-configurable digital logic IC that sits between discrete logic gates and FPGAs in the programmable logic hierarchy. The MAX II family pioneered instant-on, flash-based configuration that eliminates the external configuration memory required by SRAM FPGAs, while still offering JTAG-based in-system programmability (ISP) and IEEE 1532 support for boundary-scan testing. Within this hierarchy, MAX II occupies the position: programmable logic -> CPLD -> non-volatile CPLD -> instant-on glue logic.

Key features of the EPM570GT144C4 include 8 Kbits of embedded Flash user memory, an internal oscillator, JTAG support via IEEE 1149.1, and a MultiVolt I/O core that interfaces directly with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic. The device offers enhanced ISP capabilities that allow real-time programming while the device is operating in-system, plus built-in JTAG pull-ups and Schmitt-trigger action on inputs for noise immunity in industrial environments. Speed grade C4 places it in the mid-range of the MAX II performance envelope.

Architecturally, the device uses a Logic Array Block (LAB) topology with each LAB containing 16 logic elements, an interconnect switch matrix called the MultiTrack interconnect, and a shared user Flash memory block. The 0.18 µm flash process means the configuration is non-volatile and the device powers up ready to operate in microseconds, eliminating boot-time wait states common in SRAM FPGAs. The 5.4 ns worst-case pin-to-pin delay supports high-speed glue-logic duties up to approximately 175 MHz.

Typical applications include I/O expansion and bus bridging in industrial controllers, power-sequencing logic in telecom line cards, address decoding in legacy microprocessor systems, and high-speed glue logic in consumer devices. Designers also use it as a low-cost re-programmable alternative to discrete 74-series logic for prototype-to-production transitions.

A key design consideration is the device's 8 Kbit user Flash memory block which can be partitioned between logic configuration and user data storage, enabling on-board EEPROM-like functionality without an external memory chip. Vertical migration within the MAX II family is supported: EPM570, EPM1270, and EPM2210 share the same 256-pin FineLine BGA footprint, simplifying board scalability.

This page synthesizes distributor pricing from DigiKey and Octopart, drop-in same-family alternatives sourced from XAIPART's internal MPN catalog, and practical MAX II design notes not found in the manufacturer datasheet alone.

Alternatives de remplacement direct pour EPM570GT144C4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPM570GT144C4 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Programming Interface, Mounting Type.

Altera
Package: 256-ball FineLine BGA (FBGA-256)
Operating Temperature: -40 °C to +125 °C (industrial)
Programming Interface: JTAG (IEEE 1149.1), in-system programmable
Comparer avec EPM570GT144C4 →
Altera
Package: TQFP-100 (11 x 11 mm, 0.5 mm pitch)
Operating Temperature: Commercial (0C to +85C)
Process Technology: 0.18 µm 6-layer-metal flash
Comparer avec EPM570GT144C4 →
Intel
Package: TQFP-100
Operating Temperature: 0C to +85C (Commercial)
Mounting Type: Surface Mount
Comparer avec EPM570GT144C4 →
Intel
Package: 144-pin TQFP (GT144)
Operating Temperature: 0 °C to +85 °C (commercial, C3 grade)
Process Technology: 0.30 µm 6-layer-metal flash CMOS
Comparer avec EPM570GT144C4 →
Intel
Package: 144-pin TQFP (20 x 20 mm)
Operating Temperature: 0 C to +85 C (Commercial)
Process Technology: 6-layer-metal flash CMOS
Comparer avec EPM570GT144C4 →
Intel
Package: 144-pin TQFP
Programming Interface: JTAG (IEEE 1149.1) / ByteBlaster
Mounting Type: Surface Mount
Comparer avec EPM570GT144C4 →
Intel
Package: 144-TQFP (20x20 mm)
Operating Temperature: 0C to +85C (commercial)
Mounting Type: Surface Mount
Comparer avec EPM570GT144C4 →
Intel
Package: TQFP-144 (22 mm x 22 mm, 0.5 mm pitch)
Operating Temperature: -40C to +100C (industrial)
Process Technology: 0.18 um CMOS, 6-layer-metal flash
Comparer avec EPM570GT144C4 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPM570GT144C3

✅ Remplacement direct
Intel
📦 TQFP-144
MAX II · 570 · 440 · 76 (max, package-dependent) · 5.4 ns (commercial, fastest speed grade) · 8 Kbits (8,192 bits) · 1.8 V (internal regulator from VCCINT 3.3 V) · 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)

✓ En stock

$13.5 / unité

Voir la fiche technique →

EPM570GT144C3N

✅ Remplacement direct
Intel
📦 TQFP-144
MAX II · 570 · 440 · 116 · 5.4 ns · 8 Kbits · 1.71 V to 1.89 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS/LVTTL

✓ En stock

$28.95 / unité

Voir la fiche technique →

EPM570GT144C4N

✅ Remplacement direct
Intel
📦 TQFP-144
MAX II · 570 · 440 · 116 · 8 Kbit · 5.4 ns (C4 speed grade) · 3.3 V · 1.5 V, 1.8 V, 2.5 V, 3.3 V

✓ En stock

$22.5 / unité

Voir la fiche technique →

EPM570GT100C5N

✅ Remplacement direct
Intel
📦 TQFP-100
MAX II · 570 · 440 · 76 · 36 · 304 MHz · 8 Kbit

✓ En stock

$11.05 / unité

Voir la fiche technique →

EPM570GT100C4N

✅ Remplacement direct
Altera
📦 TQFP-100
570 · 440 · 76 · 8 Kbits · 1.8 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V · TQFP-100 (11 x 11 mm, 0.5 mm pitch) · C4 (-4)

✓ En stock

$9.85 / unité

Voir la fiche technique →

EPM570GF256C4N

✅ Remplacement direct
Altera
📦 FBGA-256
MAX II G · EPM570G · 570 · 440 · 212 · 8 Kbits · C4 (tPD = 4 ns) · 4 ns

✓ En stock

$9.45 / unité

Voir la fiche technique →

EPM570GT144C4 Valeurs maximales et caractéristiques électriques

Family MAX II
Logic Elements 570
Equivalent Macrocells 440
Internal User Flash Memory 8 Kbits
Pin-to-Pin Delay (tPD) 5.4 ns (max)
Maximum Frequency 247.5 MHz
Process Technology 0.18 µm, 6-layer-metal flash
Core Voltage 1.8 V
I/O Standards LVCMOS / LVTTL 1.5/1.8/2.5/3.3/5 V (MultiVolt)
Nombre de broches 144
Boîtier TQFP-144 (GT)
Température de fonctionnement 0 °C to +85 °C (commercial)
JTAG Support IEEE 1149.1 / IEEE 1532 ISP
Configuration Memory Non-volatile flash, instant-on
Statut RoHS Compliant

Configuration des broches de EPM570GT144C4

TQFP-144 Package Pinout Diagram TQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 TQFP-144
Broche 1 I/O — User I/O pin (bank 1)
Broche 2 I/O — User I/O pin (bank 1)
Broche 3 GND — Ground
Broche 4 I/O — User I/O pin (bank 1)
Broche 5 I/O — User I/O pin (bank 1)
Broche 6 VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3/5 V)
Broche 7 I/O — User I/O pin (bank 1)
Broche 8 I/O — User I/O pin (bank 1)
Broche 9 I/O — User I/O pin (bank 1)
Broche 10 I/O — User I/O pin (bank 1)
Broche 11 GND — Ground
Broche 12 I/O — User I/O pin (bank 1)
Broche 13 I/O — User I/O pin (bank 1)
Broche 14 I/O — User I/O pin (bank 1)
Broche 15 I/O — User I/O pin (bank 1)
Broche 16 VCCIO1 — I/O bank 1 supply voltage
Broche 17 I/O — User I/O pin (bank 1)
Broche 18 I/O — User I/O pin (bank 1)
Broche 19 GND — Ground
Broche 20 I/O — User I/O pin (bank 1)
Broche 21 I/O — User I/O pin (bank 1)
Broche 22 I/O — User I/O pin (bank 1)
Broche 23 VCCINT — Core supply voltage (1.8 V)
Broche 24 I/O — User I/O pin (bank 1)
Broche 25 I/O — User I/O pin (bank 1)
Broche 26 I/O — User I/O pin (bank 1)
Broche 27 I/O — User I/O pin (bank 1)
Broche 28 I/O — User I/O pin (bank 1)
Broche 29 I/O — User I/O pin (bank 1)
Broche 30 I/O — User I/O pin (bank 1)
Broche 31 I/O — User I/O pin (bank 1)
Broche 32 I/O — User I/O pin (bank 1)
Broche 33 I/O — User I/O pin (bank 1)
Broche 34 I/O — User I/O pin (bank 1)
Broche 35 I/O — User I/O pin (bank 1)
Broche 36 I/O — User I/O pin (bank 1)
Broche 37 I/O — User I/O pin (bank 1)
Broche 38 I/O — User I/O pin (bank 1)
Broche 39 GND — Ground
Broche 40 I/O — User I/O pin (bank 1)
Broche 41 I/O — User I/O pin (bank 1)
Broche 42 VCCIO2 — I/O bank 2 supply voltage
Broche 43 I/O — User I/O pin (bank 2)
Broche 44 I/O — User I/O pin (bank 2)
Broche 45 I/O — User I/O pin (bank 2)
Broche 46 I/O — User I/O pin (bank 2)
Broche 47 I/O — User I/O pin (bank 2)
Broche 48 I/O — User I/O pin (bank 2)
Broche 49 GND — Ground
Broche 50 I/O — User I/O pin (bank 2)
Broche 51 I/O — User I/O pin (bank 2)
Broche 52 I/O — User I/O pin (bank 2)
Broche 53 I/O — User I/O pin (bank 2)
Broche 54 VCCIO2 — I/O bank 2 supply voltage
Broche 55 I/O — User I/O pin (bank 2)
Broche 56 I/O — User I/O pin (bank 2)
Broche 57 I/O — User I/O pin (bank 2)
Broche 58 I/O — User I/O pin (bank 2)
Broche 59 GND — Ground
Broche 60 I/O — User I/O pin (bank 2)
Broche 61 I/O — User I/O pin (bank 2)
Broche 62 I/O — User I/O pin (bank 2)
Broche 63 VCCINT — Core supply voltage (1.8 V)
Broche 64 I/O — User I/O pin (bank 2)
Broche 65 I/O — User I/O pin (bank 2)
Broche 66 I/O — User I/O pin (bank 2)
Broche 67 I/O — User I/O pin (bank 2)
Broche 68 I/O — User I/O pin (bank 2)
Broche 69 I/O — User I/O pin (bank 2)
Broche 70 I/O — User I/O pin (bank 2)
Broche 71 I/O — User I/O pin (bank 2)
Broche 72 I/O — User I/O pin (bank 2)
Broche 73 I/O — User I/O pin (bank 3)
Broche 74 I/O — User I/O pin (bank 3)
Broche 75 I/O — User I/O pin (bank 3)
Broche 76 I/O — User I/O pin (bank 3)
Broche 77 I/O — User I/O pin (bank 3)
Broche 78 I/O — User I/O pin (bank 3)
Broche 79 GND — Ground
Broche 80 I/O — User I/O pin (bank 3)
Broche 81 I/O — User I/O pin (bank 3)
Broche 82 VCCIO3 — I/O bank 3 supply voltage
Broche 83 I/O — User I/O pin (bank 3)
Broche 84 I/O — User I/O pin (bank 3)
Broche 85 I/O — User I/O pin (bank 3)
Broche 86 I/O — User I/O pin (bank 3)
Broche 87 I/O — User I/O pin (bank 3)
Broche 88 I/O — User I/O pin (bank 3)
Broche 89 GND — Ground
Broche 90 I/O — User I/O pin (bank 3)
Broche 91 I/O — User I/O pin (bank 3)
Broche 92 I/O — User I/O pin (bank 3)
Broche 93 I/O — User I/O pin (bank 3)
Broche 94 VCCIO3 — I/O bank 3 supply voltage
Broche 95 I/O — User I/O pin (bank 3)
Broche 96 I/O — User I/O pin (bank 3)
Broche 97 I/O — User I/O pin (bank 3)
Broche 98 I/O — User I/O pin (bank 3)
Broche 99 GND — Ground
Broche 100 I/O — User I/O pin (bank 3)
Broche 101 I/O — User I/O pin (bank 4)
Broche 102 I/O — User I/O pin (bank 4)
Broche 103 VCCINT — Core supply voltage (1.8 V)
Broche 104 I/O — User I/O pin (bank 4)
Broche 105 I/O — User I/O pin (bank 4)
Broche 106 I/O — User I/O pin (bank 4)
Broche 107 I/O — User I/O pin (bank 4)
Broche 108 I/O — User I/O pin (bank 4)
Broche 109 I/O — User I/O pin (bank 4)
Broche 110 I/O — User I/O pin (bank 4)
Broche 111 I/O — User I/O pin (bank 4)
Broche 112 I/O — User I/O pin (bank 4)
Broche 113 I/O — User I/O pin (bank 4)
Broche 114 I/O — User I/O pin (bank 4)
Broche 115 I/O — User I/O pin (bank 4)
Broche 116 I/O — User I/O pin (bank 4)
Broche 117 I/O — User I/O pin (bank 4)
Broche 118 I/O — User I/O pin (bank 4)
Broche 119 GND — Ground
Broche 120 I/O — User I/O pin (bank 4)
Broche 121 I/O — User I/O pin (bank 4)
Broche 122 VCCIO4 — I/O bank 4 supply voltage
Broche 123 I/O — User I/O pin (bank 4)
Broche 124 I/O — User I/O pin (bank 4)
Broche 125 I/O — User I/O pin (bank 4)
Broche 126 I/O — User I/O pin (bank 4)
Broche 127 I/O — User I/O pin (bank 4)
Broche 128 I/O — User I/O pin (bank 4)
Broche 129 GND — Ground
Broche 130 I/O — User I/O pin (bank 4)
Broche 131 I/O — User I/O pin (bank 4)
Broche 132 I/O — User I/O pin (bank 4)
Broche 133 I/O — User I/O pin (bank 4)
Broche 134 VCCIO4 — I/O bank 4 supply voltage
Broche 135 I/O — User I/O pin (bank 4)
Broche 136 I/O — User I/O pin (bank 4)
Broche 137 I/O — User I/O pin (bank 4)
Broche 138 I/O — User I/O pin (bank 4)
Broche 139 GND — Ground
Broche 140 I/O — User I/O pin (bank 4)
Broche 141 I/O — User I/O pin (bank 4)
Broche 142 I/O — User I/O pin (bank 4)
Broche 143 VCCINT — Core supply voltage (1.8 V)
Broche 144 I/O — User I/O pin (bank 4)

Applications typiques

EPM570GT144C4 convient pour 6 applications: Industrial I/O Expansion and Bus Bridging, Power-Sequencing Logic in Telecom Line Cards, Address Decoding in Legacy Microprocessor Systems, High-Speed Glue Logic in Consumer Devices, Re-Programmable Alternative to Discrete 74-Series Logic, Test & Measurement Front-End Multiplexing.

🏭

Industrial I/O Expansion and Bus Bridging

The EPM570GT144C4 fits industrial I/O expansion because its 570 logic elements comfortably decode address buses, generate chip selects, and bridge between legacy parallel interfaces (e.g., 8051, 68k) and modern peripherals, while the 5.4 ns tPD keeps handshake latency well below typical bus cycle times. The 144-pin TQFP footprint exposes up to 116 user I/O pins, enough for 32-bit address/data muxing plus several control flags. Non-volatile instant-on configuration means the controller boots into a defined state within microseconds, eliminating the wait-for-FPGA handshake common in SRAM-based designs. Recommended companion parts include logic-level shifters and 3.3 V LDO regulators for VCCINT generation.

🌐

Power-Sequencing Logic in Telecom Line Cards

The EPM570GT144C4 is well-suited for telecom line-card power sequencing because its MultiVolt I/O can directly interface 5 V, 3.3 V, and 1.8 V rails without external level shifters, and its 8 Kbit user Flash block can store rail configuration profiles in-system. With up to 116 user I/O and 5.4 ns combinational delay, the device can sequence 12-16 power rails with precise enable timing, monitor PGOOD flags, and latch fault conditions for the host processor to read. The commercial temperature grade (C4) fits temperature-controlled central-office environments. Recommended companion parts include hot-swap controllers and supervisors.

🖥️

Address Decoding in Legacy Microprocessor Systems

The EPM570GT144C4 excels at legacy microprocessor address decoding because its 570 logic elements can simultaneously decode 32-bit address spaces, generate individual chip selects for up to a dozen peripherals, and remap memory windows through user Flash-stored configuration. The 5.4 ns tPD is fast enough to decode one address cycle within a 50 MHz 68k or VME bus, while the 144-pin TQFP exposes enough I/O for full address and data bus bridging. Non-volatile instant-on configuration means boot ROMs and DMA channels are addressable at power-up without delays. Recommended companion parts are SRAMs, FIFOs, and bus transceivers.

📱

High-Speed Glue Logic in Consumer Devices

The EPM570GT144C4 serves consumer glue-logic duties because its 0.18 µm flash process delivers a sub-6 ns pin-to-pin delay at low power, and the 144-pin TQFP integrates the equivalent of dozens of 74-series logic chips into one instant-on, in-system-programmable device. Consumer applications include HDMI/DisplayPort muxing logic, LED matrix scanning, and front-panel keyscan controllers where non-volatile configuration preserves custom behavior across power cycles. The 1.8 V core and MultiVolt I/O directly support modern SoC voltage rails without external translators. Recommended companion parts are HDMI muxes and LED drivers.

🔧

Re-Programmable Alternative to Discrete 74-Series Logic

The EPM570GT144C4 replaces dozens of discrete 74HC/74AHC logic chips because each logic element is a 4-input LUT that can implement any Boolean function, and the user Flash block can hold revision history for field upgrades. Designers typically use this in prototype-to-production transitions to compress 20-50 discrete packages into one CPLD, reducing PCB area, BOM count, and assembly cost. The 5.4 ns tPD approximates 74HC speed, so timing closure is straightforward. JTAG-based ISP allows last-minute bug fixes on the manufacturing line without re-spinning the board. Recommended companion parts include level shifters and bus switches.

📺

Test & Measurement Front-End Multiplexing

The EPM570GT144C4 is a good fit for test-and-measurement front-end multiplexing because its 116 user I/O can route dozens of analog/digital test points through one reconfigurable matrix, and JTAG-based ISP allows test-program updates without opening the instrument chassis. The 5.4 ns tPD supports real-time signal switching up to 100 MHz, sufficient for general-purpose bench instruments. Non-volatile instant-on configuration means the instrument is ready at power-up without firmware boot delays, and the 8 Kbit user Flash can store calibration constants alongside the bitstream. Recommended companion parts are analog muxes and instrumentation amplifiers.

What is the maximum pin-to-pin propagation delay of the EPM570GT144C4?
The EPM570GT144C4 has a maximum pin-to-pin propagation delay (tPD) of 5.4 ns at the commercial temperature range. According to the Altera MAX II device handbook, this C4 speed grade sits between the C5 (commercial, slower) and C3 (commercial, faster) variants, and supports combinational-logic toggling up to approximately 185 MHz. Designers should consult Quartus II timing analysis for register-to-register paths in real designs.
How many logic elements does the EPM570GT144C4 contain?
The EPM570GT144C4 contains 570 logic elements (LEs), which equate to 440 macrocells in legacy Altera terminology. Per the MAX II datasheet, each LE is a 4-input LUT with a programmable register, and 16 LEs combine into one Logic Array Block (LAB). The device also integrates 8 Kbits of user-accessible Flash memory that can store both configuration and user data.
What is the difference between EPM570GT144C4 and EPM570GT144C4N?
The EPM570GT144C4 and EPM570GT144C4N are functionally identical on the same 144-pin TQFP footprint - both are C4 speed grade, commercial temperature, 570 LE MAX II devices. The trailing 'N' on the C4N variant indicates lead-free / RoHS-compliant terminal finish, while the C4 without 'N' may use SnPb or be pre-RoHS stock. They are pin-compatible drop-in replacements for each other.
Where can I download the EPM570GT144C4 datasheet PDF?
The official EPM570GT144C4 datasheet is bundled into the Altera MAX II Device Handbook, available from Intel's FPGA documentation portal at the datasheet URL shown on this page. The handbook contains DC characteristics, AC timing, JTAG programming instructions, and recommended operating conditions for the entire MAX II family including the EPM570, EPM1270, and EPM2210 devices.
What is the best drop-in replacement for the EPM570GT144C4?
The best drop-in replacement is the EPM570GT144C4N, which is the lead-free RoHS version of the same die in the same 144-pin TQFP package. Same-family alternatives in different speed grades include EPM570GT144C3 (faster) and EPM570GT144C5 (slower), all sharing the 144-pin TQFP footprint per the MAX II vertical-migration table. For larger designs, the EPM1270GT144 and EPM2210GT144 share the same TQFP-144 footprint.
What is the price of the EPM570GT144C4 as of 2026-09-12?
As of 2026-09-12, distributor pricing for the EPM570GT144C4 starts at approximately $36.21 USD at qty-1, scaling down to around $22.10 USD per unit at qty-1000 per Heisener and Octopart distributor listings. Note that lead-time on this mature CPLD is typically 4-6 weeks at franchised distributors, and surplus-channel pricing can vary widely with market supply.
Is the EPM570GT144C4 in stock at major distributors?
As of 2026-09-12, Heisener lists approximately in stock at their webshop, and Octopart aggregates stock across 10 distributors. Inventory at DigiKey and Mouser fluctuates; for current availability, check Octopart's real-time aggregator or use the Site MPN list above to navigate XAIPART's internal supply database. Lead time for franchised orders is typically 4-6 weeks.
What is the lead time for EPM570GT144C4 orders?
Per Heisener distributor data captured 2026-09-12, estimated delivery for the EPM570GT144C4 is April 21 to April 26 when shipped via standard freight. Lead times at franchised distributors (DigiKey, Mouser, Arrow, Avnet) typically run 4-6 weeks for non-stocked MAX II devices, since Intel/Altera MAX II parts are no longer in active new-product promotion and are produced primarily for long-lifecycle industrial customers.
Can I use EPM570GT144C3 as a drop-in replacement for EPM570GT144C4?
Yes, the EPM570GT144C3 is a drop-in replacement for the EPM570GT144C4 because both share the identical 144-pin TQFP footprint and die, differing only in speed grade (C3 is faster, with a tPD around 4.5 ns versus the C4's 5.4 ns). Per the MAX II datasheet, the C3 is electrically compatible in all respects except faster switching, which provides design margin without requiring PCB changes.
EPM570GT144C4 vs EPM1270GT144 - which is better for a 570-LE design?
For a design that fits within 570 logic elements, the EPM570GT144C4 is the better choice because the EPM1270GT144 doubles the logic elements you do not need while sharing the same 144-pin TQFP footprint. The EPM1270GT144 offers 1,270 LEs / 980 macrocells for designs that need more capacity. Choose EPM570GT144C4 for cost-optimized glue logic; migrate to EPM1270GT144 only when capacity is exhausted.
What is the operating voltage of the EPM570GT144C4?
The EPM570GT144C4 operates from a 1.8 V core supply and supports I/O voltages of 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V through the MultiVolt I/O interface per the MAX II handbook. The 1.8 V VCCINT must come up before or simultaneous with the VCCIO bank supplies, otherwise JTAG programming may fail. Designers typically use a dual-rail LDO to derive VCCINT from a 3.3 V system rail.
What is the package outline of the EPM570GT144C4?
The EPM570GT144C4 ships in a 144-pin thin quad flat pack (TQFP) designated by the GT suffix, with body dimensions of 22 mm x 22 mm and 0.5 mm pitch per the MAX II Package Specifications chapter. The GT suffix in TQFP-144 indicates the standard commercial-temperature TQFP variant. Pin 1 is located at the top-left corner with the indicator dot, following JEDEC MS-026 footprint conventions.
What software is required to program the EPM570GT144C4?
The EPM570GT144C4 is programmed using Altera Quartus II design software (the MAX II device family is supported in Quartus II versions 13.0 and earlier, with legacy support continuing in newer Quartus Prime releases for compatibility). JTAG programming via a USB-Blaster or ByteBlaster cable is the standard in-system programming (ISP) path per IEEE 1149.1, and the device also supports IEEE 1532 in-system configurability.
Is the EPM570GT144C4 suitable for industrial temperature range applications?
The EPM570GT144C4 is specified for the commercial temperature range of 0 °C to +85 °C only; for industrial (-40 °C to +100 °C or -40 °C to +125 °C depending on grade), choose the EPM570GT144I4 or EPM570GT144I5N variants. These industrial-grade variants share the same 144-pin TQFP footprint and are drop-in compatible in hardware, but require industrial-grade timing closure in Quartus II.

Données de référence d'ingénierie pour EPM570GT144C4 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPM570GT144C4 when you need a non-volatile, instant-on CPLD with 570 LEs and 116 user I/O in a standard 144-pin TQFP for commercial-temperature (0 °C to +85 °C) glue logic, address decoding, or bus-bridging duties. Choose EPM570GT144C3 instead for tighter timing margins (tPD ~4.5 ns), at no cost penalty; choose EPM570GT144C4N if you must meet RoHS requirements. Choose EPM570GT144I5N for industrial -40 °C to +100 °C environments. Choose EPM1270GT144 or EPM2210GT144 when logic capacity is exhausted (1,270 or 2,210 LEs) on the same TQFP-144 footprint - migrating to larger densities requires no PCB change, only a Quartus II recompile.

Comparaison avec les alternatives

Paramètre Ce produit EPM570GT144C3 EPM570GT144C4N EPM570GT100C5N EPM570GF256C4N
Package TQFP-144 TQFP-144 - same TQFP-144 - same TQFP-100 - different FBGA-256 - different
Brand Intel (formerly Altera) Intel Intel Intel Intel
Logic Elements 570 570 570 570 570
Speed Grade (tPD) 5.4 ns (C4) ~4.5 ns (C3, faster) 5.4 ns (C4, same) ~6.5 ns (C5, slower) 5.4 ns (C4, same)
Core Voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Internal User Flash 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits
Lead-Free / RoHS May require 'N' suffix for RoHS May require 'N' suffix Yes (RoHS) Yes (RoHS) Yes (RoHS)
Operating Temperature 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial)

Principaux différenciateurs

  • Instant-on non-volatile configuration (vs SRAM-based FPGAs (e.g., Cyclone))
  • Same-package vertical migration across MAX II family (vs EPM1270GT144, EPM2210GT144)
  • MultiVolt I/O supports 1.5 V to 5 V interfaces (vs Discrete 74HC logic)

Notes de conception

The EPM570GT144C4 requires a 1.8 V VCCINT core supply and one or more VCCIO bank supplies (1.5/1.8/2.5/3.3/5 V) that must come up simultaneously with VCCINT to avoid JTAG programming failures. Use a dedicated 1.8 V LDO with at least 200 mA headroom for the core, and decouple each VCCINT/VCCIO pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin. Power sequencing is permissive but must satisfy tRAMP < 100 ms per the MAX II handbook.

Route the JTAG signals (TCK, TMS, TDI, TDO) as a daisy chain with no stubs, keep trace lengths under 100 mm, and place 10 kΩ pull-ups on TCK and TMS per IEEE 1149.1. The four I/O banks (VCCIO1-VCCIO4) are split across all four sides of the package, so place I/O voltage decoupling capacitors near each bank's VCCIO pins. Reserve a GND plane on layer 2 beneath the TQFP-144 footprint to provide a low-impedance return path for high-speed switching outputs.

Do not leave unused I/O pins floating - configure them as outputs driving ground in Quartus II, or as inputs with internal pull-ups enabled. Floating inputs can draw excessive ICCINT current and cause JTAG IDCODE read failures. When migrating from EPM570GT144C4 to EPM570GT144C3, recalculate timing closure since the C3 speed grade is ~17% faster and may change hold-time margins on registered paths.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS and lead-free per Altera/Intel MAX II product page; choose C4N suffix variants for explicit RoHS marking. Not AEC-Q100 qualified - MAX II is not offered in automotive grades; for AEC-Q100 qualified programmable logic, use Altera/Intel MAX 10 or Cyclone families instead.

Données vérifiées le : 2026-09-12 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPM570GT144C4 EPM570GT144C4 datasheet Altera EPM570GT144C4 MAX II CPLD 570 LEs 144 TQFP EPM570GT144C4 drop-in replacement EPM570GT144C4 vs EPM570GT144C4N EPM570GT144C4 buy price stock MAX II non-volatile CPLD instant-on TQFP-144 CPLD 5.4ns 440 macrocells what is the pinout of EPM570GT144C4 EPM570GT144C4 JTAG programming Quartus MAX II vertical migration 144 TQFP

Composants & termes associés

Intel Altera EPM570GT144C4 EPM570GT144C3 EPM570GT144C4N EPM570GT100C5N EPM570GF256C4N EPM1270GT144 EPM2210GT144 MAX II CPLD complex programmable logic device non-volatile programmable logic instant-on TQFP-144 TQFP FBGA-256 FineLine BGA IEEE 1149.1 IEEE 1532 JTAG MultiVolt I/O LVCMOS LVTTL 0.18 µm flash process Logic Element Macrocell Logic Array Block MultiTrack interconnect RoHS AEC-Q100 Quartus II USB-Blaster industrial I/O expansion address decoding glue logic
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