K9PRGY8S7M-CCK0 - Samsung NAND Flash Memory BGA | Samsung
Référence : K9PRGY8S7M-CCK0 ✓ Actif| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
K9PRGY8S7M-CCK0 Présentation
NAND flash is a type of non-volatile storage technology that retains data without power. Within the memory hierarchy, NAND flash sits above raw storage media and below system-level SSDs and eMMC/UFS modules: a raw NAND device such as the K9PRGY8S7M-CCK0 provides the memory array and interface, while the host controller manages wear leveling, bad-block management, and error correction code (ECC). Raw NAND is used by designers who want full control of the flash translation layer in their own firmware or controller.
Verified web data confirms this part is RoHS / lead-free compliant per distributor listings (Worldway), packaged in BGA, and targeted at applications including automotive body electronics and lighting, communications equipment, wireless infrastructure, personal electronics, and connected peripherals and printers. Samsung NAND family members such as the related K90KGY8S7M-CCK0 (128 GB class) and K9DMGY8J5B-CCK0 share the K9 naming scheme and BGA packaging philosophy.
Because this is a raw NAND component, the host system must implement ECC and block management; the exact page size, block size, bus width, supply voltage, and density of the K9PRGY8S7M-CCK0 are not stated in the retrieved web data and must be confirmed from the official Samsung datasheet before design-in.
Typical use cases include embedded boards where a dedicated storage controller (for example, an SSD controller such as Samsung's MEX series used in consumer SSDs) manages multiple raw NAND packages.
Design consideration: raw NAND requires careful power-rail sequencing, strong ECC (LDPC or BCH depending on the cell type), and thermal management of the BGA solder joints in automotive environments.
This page synthesizes distributor listings, family cross-references, and sourcing information for the K9PRGY8S7M-CCK0 not consolidated in any single manufacturer document.
Alternatives de remplacement direct pour K9PRGY8S7M-CCK0 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec K9PRGY8S7M-CCK0 (même facteur de forme et même empreinte) — différant par Mounting Type, Memory Type, RoHS Status, Package, Product Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
K9PRGY8S7M
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Voir la fiche technique →K90KGY8S7M-CCK0
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K9DMGY8J5B-CCK0
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
K9PRGY8S7M-CCK0 Valeurs maximales et caractéristiques électriques
| Type de mémoire | NAND Flash |
| Manufacturer | Samsung Electronics |
| Boîtier | BGA (surface mount) |
| Type de montage | Surface Mount |
| Statut RoHS | Lead free / RoHS compliant |
Guide de configuration des broches du K9PRGY8S7M-CCK0 bga (surface mount)
Configuration des broches du K9PRGY8S7M-CCK0 (boîtier bga (surface mount)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour K9PRGY8S7M-CCK0.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
K9PRGY8S7M-CCK0 convient pour 6 applications: SSD and Embedded Storage, Automotive Body Electronics and Lighting, Communications Equipment, Personal Electronics, Connected Peripherals and Printers, Industrial Data Logging.
SSD and Embedded Storage
Samsung K9-family NAND flash such as the K9PRGY8S7M-CCK0 is the storage medium inside SSDs and embedded storage arrays. Samsung's own 850 PRO SSD pairs Samsung raw NAND with the Samsung MEX controller (S4LN045X01), demonstrating the standard controller-plus-NAND architecture. The K9PRGY8S7M-CCK0's BGA surface-mount package allows multiple devices to be placed around a controller on dense PCBs. Because it is raw NAND, the controller supplies ECC and wear leveling; the benefit is lowest cost per gigabyte and full firmware control, while the trade-off is that the controller must be parameterized for this device's exact page and block geometry.
Recommandé
Automotive Body Electronics and Lighting
Distributor data (Worldway) explicitly lists the Samsung K9 NAND family as applicable to automotive body electronics and lighting, where non-volatile storage holds firmware, calibration data, and event logs. The K9PRGY8S7M-CCK0's BGA package withstands automotive vibration better than leaded packages, and RoHS/lead-free compliance supports automotive environmental requirements. In these systems, NAND typically stores code-on-demand images beside a microcontroller, with the host controller implementing ECC suited to the NAND cell type. Designers must confirm the operating temperature grade in the Samsung datasheet, since standard commercial grades may not cover the full automotive ambient range.
Recommandé
Communications Equipment
Communications and wireless infrastructure equipment - routers, baseband units, switches - uses high-density NAND flash to store boot images, configuration, and log data. The K9PRGY8S7M-CCK0 provides gigabyte-class capacity in a compact BGA footprint that fits line-card and small-cell boards where board area is scarce. Its raw-NAND interface allows the system's network processor to manage flash translation directly. Capacity density and bus width details must be taken from the Samsung datasheet; the key performance consideration is that raw NAND write throughput depends on the controller's program/erase scheduling rather than on the NAND alone, so the host firmware defines effective storage performance.
Recommandé
Personal Electronics
In personal electronics such as tablets, set-top boxes, and portable media devices, Samsung K9-family NAND provides the bulk non-volatile storage at the lowest cost per gigabyte. The K9PRGY8S7M-CCK0's surface-mount BGA package suits compact consumer PCBs, and RoHS compliance satisfies consumer-market environmental regulations. The SoC in these devices typically integrates the NAND controller, so firmware-level bad-block and ECC management come built in. Because consumer devices endure moderate write loads, NAND endurance (P/E cycle rating in the Samsung datasheet) is rarely the limiting factor; cost and capacity are the primary selection drivers for this application class.
Recommandé
Connected Peripherals and Printers
The Worldway distributor listing names connected peripherals and printers as an application domain for the Samsung K9 NAND family. Printers and multifunction devices use NAND flash to store firmware, fonts, job queues, and user settings. The K9PRGY8S7M-CCK0's non-volatile BGA- packaged array provides reliable retention across power cycles without battery backup. Peripheral controllers commonly execute-in-place boot code from DRAM loaded at startup out of NAND, making page-read latency and correct ECC configuration the relevant performance parameters. Firmware should also reserve replacement blocks, since printers have long service lives where block wear-out is a realistic failure mode.
Recommandé
Industrial Data Logging
Industrial automation and monitoring systems log process data to non-volatile storage, and Samsung K9 NAND such as the K9PRGY8S7M-CCK0 offers the capacity and cost profile needed for long-duration logging. The BGA package provides a robust solder attachment on industrial PCBs subject to thermal cycling. Because industrial loggers write continuously for years, wear leveling quality in the host firmware directly determines service life - a controller should distribute writes across the full block pool and monitor block wear counters. Designers should verify the operating temperature range in the official Samsung datasheet and derate endurance at elevated temperatures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour K9PRGY8S7M-CCK0 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | K9PRGY8S7M | K90KGY8S7M-CCK0 | K9DMGY8J5B-CCK0 |
|---|---|---|---|---|
| Package | BGA | BGA | BGA | BGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Type | NAND Flash | NAND Flash | NAND Flash | NAND Flash |
Principaux différenciateurs
- RoHS/lead-free compliant BGA NAND (vs K90KGY8S7M-CCK0)
- Samsung vertical integration (vs K9DMGY8J5B-CCK0)
- Raw NAND flexibility with cost advantage (vs Managed eMMC/UFS modules)
Notes de conception
Raw NAND interfaces toggle address, command, and data lines at high rates. Route the NAND bus as short as possible, keep all chip-enable and ready/busy lines away from switching power rails, and add series termination (22-33 ohm, verify with IBIS simulation) on address/command lines to control ringing. For BGA NAND like the K9PRGY8S7M-CCK0, match trace lengths within the data byte-lane group to avoid setup/hold violations at high access-clock settings.
Decouple each NAND VCC/VCCQ rail with at least one 10 uF bulk ceramic plus 0.1 uF per supply ball, placed within a few millimeters of the BGA balls through short vias to the plane. Raw NAND program operations draw burst currents; insufficient local decoupling causes rail droop that corrupts in-flight program operations. Ensure supply sequencing satisfies the datasheet order if separate VCC and VCCQ rails are used.
The most common failure mode when using Samsung K9-family NAND is controller firmware configured for the wrong page/block geometry or ECC strength - especially after substituting a family sibling such as K90KGY8S7M-CCK0 or K9DMGY8J5B-CCK0. Always read the geometry from the device ONFI parameter page or datasheet, re-run ECC qualification for the target cell type, and reserve replacement blocks per the datasheet bad-block management guidance. Also honor the specified thermal profile for BGA reflow; NAND die are moisture-sensitive (MSL-rated) and require proper bake before reflow.
Informations de conformité
RoHS / lead-free status from Worldway Electronic distributor listing for the Samsung K9 NAND family. AEC-Q100 status not stated; confirm with Samsung for automotive use.
