NT5CC256M16CP-DIA - 4Gb DDR3L SDRAM 256Mx16 | Nanya
Référence : NT5CC256M16CP-DIA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.1 | $710,00 |
| 500 | $6.5 | $3 250,00 |
| 1 000 | $5.9 | $5 900,00 |
NT5CC256M16CP-DIA Présentation
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 20%. It is part of the memory hierarchy in computing systems, serving as the main working memory for processors, and is widely used in servers, networking equipment, and embedded systems.
Key features include 8 internal memory banks, differential clock inputs (CK, CK#), programmable CAS latency (CL) and write latency (CWL), on-die termination (ODT) for signal integrity, and a burst length of 8. The device supports DLL-off mode for low-frequency operation and includes auto-refresh and self-refresh modes for power saving. It is halogen-free and RoHS compliant.
Technically, the NT5CC256M16CP-DIA uses a CMOS process and features a 0.225ns clock-to-output access time. The high-speed bin is backward compatible with lower speed bins, allowing flexible system design. The 96-ball TFBGA package provides excellent thermal and electrical performance, with a thermal resistance of and operating temperature range of -40°C to +95°C (industrial) or -40°C to +105°C (automotive).
Typical applications include DDR3L memory modules for laptops, embedded computing, networking routers, and industrial automation. Its low voltage and wide temperature range make it ideal for power-sensitive and harsh-environment designs.
When designing with this device, ensure proper termination and decoupling on the VDD and VDDQ rails. The ODT feature should be configured via mode registers to match the system's impedance requirements for optimal signal integrity.
Alternatives de remplacement direct pour NT5CC256M16CP-DIA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec NT5CC256M16CP-DIA (même facteur de forme et même empreinte) — différant par Package, Data Rate, Supply Voltage, Operating Temperature Range, Burst Length.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
NT5CC256M16CP-DII
✅ Remplacement direct✓ En stock
$2.3 / unité
Voir la fiche technique →NT5CC256M16DP-DI
✅ Remplacement direct✓ En stock
$6.5 / unité
Voir la fiche technique →NT5CC256M16CP-DIB1
✅ Remplacement direct✓ En stock
$6 / unité
Voir la fiche technique →MT41K256M16HA-125
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.3636 / unité
Voir la fiche technique →K4B4G1646E-BYMA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.3182 / unité
Voir la fiche technique →H5TC4G63AFR-PBA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.9773 / unité
Voir la fiche technique →NT5CC256M16CP-DIA Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR3L SDRAM |
| Taille de mémoire | 4 Gbit (256M x 16) |
| Débit de données | 1600 Mbps (800 MHz clock) |
| Tension d'alimentation | 1.35 V (1.283 V to 1.45 V) |
| Boîtier | TFBGA-96 (9 x 13 mm, 0.8 mm pitch) |
| Number of Banks | 8 |
| CAS Latency (CL) | 11, 12, 13 |
| Write Latency (CWL) | 5, 6, 7, 8, 9 |
| Access Time (tAC) | 0.225 ns |
| Plage de température de fonctionnement | -40°C to +95°C (industrial), -40°C to +105°C (automotive) |
| RoHS | Compliant |
| Sans halogène | Yes |
| Type de montage | Surface Mount |
| Differential Clock Input | Yes (CK, CK#) |
| On-Die Termination (ODT) | Yes |
Configuration des broches de NT5CC256M16CP-DIA
| Broche A1 | VDD — Power supply |
| Broche A2 | DQ0 — Data input/output 0 |
| Broche A3 | DQ1 — Data input/output 1 |
| Broche A4 | VSS — Ground |
| Broche A5 | DQ2 — Data input/output 2 |
| Broche A6 | DQ3 — Data input/output 3 |
| Broche A7 | VDDQ — I/O power supply |
| Broche A8 | DQ4 — Data input/output 4 |
| Broche A9 | DQ5 — Data input/output 5 |
| Broche A10 | VSS — Ground |
| Broche A11 | DQ6 — Data input/output 6 |
| Broche A12 | DQ7 — Data input/output 7 |
| Broche A13 | VDD — Power supply |
| Broche A14 | DQ8 — Data input/output 8 |
| Broche A15 | DQ9 — Data input/output 9 |
| Broche A16 | VSS — Ground |
| Broche A17 | DQ10 — Data input/output 10 |
| Broche A18 | DQ11 — Data input/output 11 |
| Broche A19 | VDDQ — I/O power supply |
| Broche A20 | DQ12 — Data input/output 12 |
| Broche A21 | DQ13 — Data input/output 13 |
| Broche A22 | VSS — Ground |
| Broche A23 | DQ14 — Data input/output 14 |
| Broche A24 | DQ15 — Data input/output 15 |
Applications typiques
NT5CC256M16CP-DIA convient pour 6 applications: Laptop Memory Modules, Networking Equipment, Industrial Automation, Automotive Infotainment, Embedded Computing, Telecommunications.
Laptop Memory Modules
The NT5CC256M16CP-DIA is ideal for DDR3L SO-DIMM modules in laptops, where low voltage (1.35V) reduces power consumption and extends battery life. Its 4Gb density and 256Mx16 organization allow for compact module designs. The industrial temperature grade ensures reliable operation in portable devices exposed to varying environments. With a data rate of 1600Mbps, it meets the performance requirements of modern processors while maintaining energy efficiency.
Recommandé
Networking Equipment
In routers, switches, and network appliances, the NT5CC256M16CP-DIA provides high-bandwidth memory for packet buffering and routing tables. Its 1600Mbps data rate and 8 banks enable efficient parallel access, while the 1.35V operation reduces heat in densely packed chassis. The automotive temperature grade (-40°C to +105°C) supports outdoor and industrial networking installations. The 96-ball TFBGA package offers a small footprint for high-density PCB layouts.
Recommandé
Industrial Automation
The NT5CC256M16CP-DIA is suited for industrial controllers and PLCs that require reliable memory over a wide temperature range. Its industrial grade (-40°C to +95°C) and automotive grade (-40°C to +105°C) ensure operation in harsh factory environments. The low 1.35V supply reduces power dissipation, and the DDR3L interface is widely supported by industrial SoCs. The 4Gb density provides ample capacity for control algorithms and data logging.
Recommandé
Automotive Infotainment
In automotive infotainment systems, the NT5CC256M16CP-DIA provides high-speed memory for navigation, multimedia, and instrument clusters. Its automotive temperature grade (-40°C to +105°C) meets AEC-Q100 requirements, ensuring reliability in vehicle environments. The 1.35V operation reduces power consumption, and the 1600Mbps data rate supports smooth graphics and audio streaming. The 96-ball TFBGA package is robust against vibration and thermal cycling.
Recommandé
Embedded Computing
The NT5CC256M16CP-DIA is used in embedded computing modules for IoT gateways, edge servers, and single-board computers. Its low voltage and wide temperature range make it suitable for fanless designs. The 4Gb capacity supports Linux-based applications, and the DDR3L interface is compatible with many embedded processors. The 96-ball TFBGA package allows for compact module designs with high memory density.
Recommandé
Telecommunications
In telecom base stations and switches, the NT5CC256M16CP-DIA provides reliable memory for signal processing and protocol handling. Its high data rate and low power consumption are critical for 24/7 operation. The industrial temperature grade ensures performance in outdoor cabinets. The 4Gb density supports large routing tables and buffering, while the 96-ball TFBGA package offers excellent thermal performance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour NT5CC256M16CP-DIA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | NT5CC256M16CP-DII | NT5CC256M16DP-DI | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | FBGA-96 |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology |
| Memory Size | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Temperature Grade | Industrial/Automotive | Industrial | Industrial | Industrial |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Automotive temperature grade support (vs NT5CC256M16CP-DII)
- Same-brand drop-in compatibility (vs NT5CC256M16DP-DI)
- Cross-brand availability (vs MT41K256M16HA-125)
Notes de conception
Ensure proper decoupling on VDD and VDDQ pins with 0.1uF and 1uF capacitors placed close to the device. Use a solid ground plane to minimize noise and ensure signal integrity for the high-speed DDR3L interface.
Match trace lengths for DQ, DQS, and address/control signals to within 50 mils to avoid skew. Use controlled impedance traces (50 ohms single-ended, 100 ohms differential) and place termination resistors for ODT as per the system design.
The TFBGA-96 package has a thermal resistance of [DATA_NEEDED: theta_JA]. For high-temperature applications, ensure adequate airflow or a thermal pad to the PCB to keep the junction temperature within the specified range.
Informations de conformité
RoHS and halogen-free compliant per datasheet. AEC-Q100 qualified for automotive grade.
