PIC32MZ1025DAS176-I/2J - 32-bit 200MHz MCU, 176-LQFP | Microchip
Référence : PIC32MZ1025DAS176-I/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.62 | $136,20 |
| 100 | $12.1 | $1 210,00 |
| 500 | $11.05 | $5 525,00 |
| 1 000 | $10.2 | $10 200,00 |
PIC32MZ1025DAS176-I/2J Présentation
A 32-bit microcontroller (MCU) is an integrated computing device that combines a processor core, program memory, data memory, and a rich set of peripherals on a single silicon die. The PIC32MZ DAS family extends this concept by integrating a Graphics Controller, Graphics Processor, 12-bit 18 MSPS ADC with up to 45 analog inputs, HS USB, CAN, and an external DDR2 DRAM interface capable of addressing up to 128MB of external memory. These features position the family at the boundary between microcontroller and microprocessor, hence the Microchip positioning of "MPU-like performance with MCU ease of design."
Key features of the PIC32MZ1025DAS176-I/2J include 1MB Flash / 256KB SRAM in this -I/2J SKU within the DAS graphics sub-family, a MIPS32 microAptiv core running at 200MHz, and DDR2 DRAM external bus support that scales to 32MB or 128MB depending on board population. Integrated peripherals include a Graphics LCD Controller, High-Speed USB 2.0 OTG, two CAN 2.0b controllers, and the 12-bit 18 MSPS ADC with up to 45 analog inputs cited in the family datasheet. The 176-LQFP package exposes the full external memory bus plus rich I/O for parallel graphics panels, making it the preferred footprint when a TFT-LCD is hard-mounted on the same PCB.
Architecturally, the PIC32MZ DAS relies on a multi-layer AHB/APB bus matrix to feed the GPU, LCD controller, and DMA channels from Flash and external DDR2 without stalling the CPU. Compared with the EF (Ethernet) variants, the DAS parts sacrifice Ethernet MACs for graphics IP, while sharing the same core, Flash size tier, and package pinout across DAK/DAL/DAR/DAS suffixes. This commonality enables a single PCB layout to serve GUI vs. connectivity variants by changing only the populated MCU.
Typical applications span industrial HMI panels, automotive infotainment, point-of-sale terminals, medical patient monitors, and IoT gateways with a built-in display. The 200MHz core plus dedicated graphics pipeline and the 176-pin LQFP package make it a strong fit for mid-resolution TFT-LCD designs where BOM and board area must remain conservative.
When designing with the PIC32MZ1025DAS176-I/2J, ensure the DDR2 routing follows the family reference design's length-matched impedance rules, since the external bus is the performance bottleneck. The -I industrial temperature grade (-40C to +85C) is suitable for most HMI enclosures; step up to -V for -40C to +105C automotive cabins.
This page synthesizes distributor stock, drop-in cross-references and a parametric comparison that goes beyond the manufacturer datasheet, helping procurement and design engineers evaluate the PIC32MZ1025DAS176-I/2J for new GUI product designs.
Alternatives de remplacement direct pour PIC32MZ1025DAS176-I/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1025DAS176-I/2J (même facteur de forme et même empreinte) — différant par CAN, USB, Package, Graphics Controller, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAK176-I/2J
✅ Remplacement direct✓ En stock
$15.75 / unité
Voir la fiche technique →PIC32MZ1025DAL176-I/2J
✅ Remplacement direct✓ En stock
$5.5 / unité
Voir la fiche technique →PIC32MZ1025DAS176-V/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAR176-V/2J
✅ Remplacement direct✓ En stock
$15.92 / unité
Voir la fiche technique →PIC32MZ1025DAA176-I/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAS176-I/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| Sub-family Suffix | DAS (graphics, no Ethernet MAC) |
| Core Speed | 200 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 256 KB (per family data sheet SKU table) |
| External Memory Bus | DDR2 DRAM controller, up to 32MB on-chip addressable / 128MB externally addressable |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics IP | Integrated Graphics Controller + Graphics Processor |
| USB | High-Speed USB 2.0 OTG |
| CAN | 2x CAN 2.0b controllers |
| Operating Voltage | 1.8V core supply family |
| Température de fonctionnement | -40C to +85C (Industrial, -I grade) |
| Boîtier | 176-LQFP, 20x20 mm, exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ1025DAS176-I/2J 176-lqfp, 20x20 mm, exposed pad
Configuration des broches du PIC32MZ1025DAS176-I/2J (boîtier 176-lqfp, 20x20 mm, exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1025DAS176-I/2J.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1025DAS176-I/2J convient pour 6 applications: Industrial HMI Touch Panels, Automotive Infotainment Displays, Point-of-Sale Terminals, Medical Patient Monitors, Smart Home Control Panels, Industrial IoT Gateways with Display.
Industrial HMI Touch Panels
The PIC32MZ1025DAS176-I/2J is engineered for industrial HMI panels where a 200 MHz MIPS32 microAptiv core drives the GUI stack while the integrated Graphics Controller and Graphics Processor offload TFT-LCD rendering. Its 1 MB internal Flash stores the application and asset images, and the DDR2 external memory bus scales up to 32 MB addressable for full-screen frame buffers at WVGA resolution. The 176-LQFP package exposes parallel LCD data lines, plus CAN, HS USB, and the 12-bit 18 MSPS ADC for back-panel sensing. The -I grade -40C to +85C rating covers factory-floor enclosures, and the family datasheet DS60001565D provides the timing budgets for capacitive touch controllers typically paired with this MCU.
Recommandé
Automotive Infotainment Displays
The PIC32MZ1025DAS176-V/2J variant at -40C to +105C automotive grade makes the PIC32MZ DAS family a fit for cabin-mounted infotainment clusters and HVAC control panels. The -I/2J industrial SKU in this listing can be used during development before switching to the -V/2J automotive grade for production. The integrated Graphics Controller drives TFT panels up to WVGA without an external GPU, and the dual CAN 2.0b controllers interface directly with the vehicle CAN-FD gateway. The DDR2 controller addresses up to 128 MB external for map data caches, and HS USB supports CarPlay/AndroidAuto bridging. Reference the family datasheet DS60001565D for AEC-Q100 compliance notes on the -V variant.
Recommandé
Point-of-Sale Terminals
POS terminals need a responsive touch-driven GUI plus reliable peripheral connectivity, which the PIC32MZ1025DAS176-I/2J delivers via its 200 MHz MIPS32 core, HS USB 2.0 OTG, and CAN 2.0b controllers. The 1 MB Flash stores the payment application and TLS certificates, while the DDR2 interface can host larger transaction logs. The integrated 12-bit 18 MSPS ADC with up to 45 analog inputs reads battery telemetry and printer feedback sensors. The 176-LQFP package supports a parallel TFT-LCD panel and capacitive touch I2C bus simultaneously. Reference the family datasheet DS60001565D for EMV-compliant touch firmware integration patterns.
Recommandé
Medical Patient Monitors
Bedside patient monitors combine a high-resolution TFT display with multiple analog channels, and the PIC32MZ1025DAS176-I/2J fits this profile via its 12-bit 18 MSPS ADC with up to 45 analog inputs and integrated Graphics Controller. The 200 MHz MIPS32 core runs waveform rendering, alarm logic, and the user interface simultaneously. The DDR2 controller supports frame buffers for real-time ECG/EEG/SpO2 traces, while HS USB isolates the host interface from the medical sensor bus. The 176-LQFP package exposes enough I/O to drive both a primary TFT and a secondary status display. Reference DS60001565D for IEC 60601-related EMI/ESD layout guidance.
Recommandé
Smart Home Control Panels
Wall-mounted smart home control panels require a vibrant TFT-LCD, capacitive touch, and wireless gateway connectivity, and the PIC32MZ1025DAS176-I/2J provides the GUI foundation with its integrated Graphics Controller and 200 MHz core. The HS USB 2.0 OTG connects a Wi-Fi/BLE co-processor for Matter/Thread/Zigbee bridging, while CAN 2.0b supports wired HVAC bus integration. The 176-LQFP package fits behind a 4-7 inch capacitive touch panel, and the 1 MB Flash stores the local UI assets and Matter fabric credentials. Reference the family datasheet DS60001565D for capacitive touch firmware integration patterns.
Recommandé
Industrial IoT Gateways with Display
Edge IoT gateways increasingly integrate a local TFT for diagnostics, and the PIC32MZ1025DAS176-I/2J serves both the GUI and gateway functions. The 200 MHz core runs TLS and protocol stacks, the HS USB interfaces LTE/Wi-Fi modems, and CAN 2.0b connects to industrial fieldbuses. The 176-LQFP package fits a 5-inch TFT with capacitive touch, while the DDR2 controller hosts large MQTT/CoAP buffers. The -40C to +85C industrial grade covers outdoor enclosures with proper thermal design. The 12-bit 18 MSPS ADC monitors supply rails and ambient sensors. Reference DS60001565D for layout guidance on mixed-signal routing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1025DAS176-I/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAK176-I/2J | PIC32MZ1025DAL176-I/2J | PIC32MZ1025DAS176-V/2J | PIC32MZ1025DAR176-V/2J | PIC32MZ1025DAA176-I/2J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) |
| Core | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz |
| Program Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Graphics Controller | Yes (integrated GPU + LCD controller) | Yes | Yes | Yes | Yes | Yes |
| Temperature Grade | -40C to +85C (Industrial -I) | -40C to +85C (Industrial -I) | -40C to +85C (Industrial -I) | -40C to +105C (Automotive -V) | -40C to +105C (Automotive -V) | -40C to +85C (Industrial -I) |
| DDR2 External Memory | Yes, up to 128 MB externally addressable | Yes | Yes | Yes | Yes | Yes |
| Sub-family Suffix | DAS (graphics, no Ethernet) | DAK | DAL | DAS (auto grade) | DAR | DAA (legacy) |
Principaux différenciateurs
- Same 176-LQFP pinout across DAK/DAL/DAS/DAR sub-family variants (vs PIC32MZ1025DAK176-I/2J)
- Industrial vs Automotive temperature grade option (vs PIC32MZ1025DAS176-V/2J)
- Integrated Graphics Controller and GPU offload (vs PIC32MZ1025DAA176-I/2J)
- DDR2 controller supporting up to 128 MB external (vs PIC32MX795F512L-80I/PF)
Notes de conception
Estimated: The 176-LQFP package exposes the full DDR2 external memory bus, and routing at this speed is the most common cause of boot failures on PIC32MZ DAS boards. Reference design notes in DS60001565D require length-matched traces (typically within +/- 25 mil) between the MCU and DDR2, with controlled impedance (50 ohm single-ended, 100 ohm differential for clock). The exposed thermal pad must be soldered to a continuous ground plane with at least 9 thermal vias (0.3 mm drill, 0.635 mm pitch) to keep junction temperature in range during DDR2 switching.
The PIC32MZ1025DAS176-I/2J operates from a 1.8V core supply with separate rails for the DDR2 PHY (typically 1.8V) and ADC AVdd (clean 3.3V). Decoupling follows the family datasheet: 100 nF X7R ceramic on every Vdd/Vss pair within 2 mm of the pin, plus 4.7 uF bulk on each rail. The HS USB PHY requires its own 1.0 uF decoupling on the USB Vdd pin to comply with USB 2.0 high-speed signal integrity. ADC AVdd must be filtered with a ferrite bead from the digital 3.3V rail to avoid coupling switching noise into the 12-bit ADC measurements.
Estimated: at the maximum core frequency of 200 MHz with DDR2 active and USB HS transmitting, the PIC32MZ1025DAS176-I/2J consumes approximately 350-450 mA from the 1.8V core rail. The 176-LQFP with exposed pad and a JEDEC 4-layer board achieves roughly 28 C/W theta_JA, giving a 12-15 C rise over a 25 C ambient. With the -I industrial grade ceiling at +85 C, the design margin is sufficient only when the thermal pad is properly soldered to a ground plane with adequate vias. Failures in field applications are most often traced to inadequate thermal pad soldering rather than ambient temperature.
Common PIC32MZ DAS mistakes include: (1) forgetting to configure the DDR2 PHY impedance calibration resistors per family reference design; (2) using the wrong DDR2 timing parameter file from the MPLAB Harmony configurator - the family datasheet DS60001565D specifies the exact speed bin; (3) leaving the JTAG pins floating instead of pulling them to defined states per the family pinout table; (4) sharing the parallel LCD data pins with the DDR2 bus, which is permitted only if the LCD is not used simultaneously with external memory; (5) attempting to use the DAA suffix as a drop-in replacement without verifying the DDR2 controller revision - the DAA predates some DDR2 PHY fixes.
Estimated: The 176-LQFP at 0.5 mm pitch requires 0.20 mm trace width with 0.20 mm clearance for fanout, which is at the limit of standard 1 oz PCB processes. Use micro-via-in-pad (0.10 mm laser vias) on the inner pads of the package to escape the inner rows, or use a 4-layer stack-up with dedicated signal layers between two ground planes. The exposed pad must be split into a 3x3 via array under the package center; do not route any signal traces through this array. Reference the family reference design Gerber package for the exact via pattern.
Informations de conformité
RoHS and lead-free per Microchip product page. The -V/2J SKU is AEC-Q100 qualified for automotive; the -I/2J SKU in this listing is industrial grade and not AEC-Q100 qualified. Per Microchip ordering code scheme, /2J denotes the LQFP-176 package type within the family.
