PIC32MZ2025DAK169-V/HF - 200MHz 32-bit MCU, 2MB Flash, Graphics, V-temp | Microchip
Référence : PIC32MZ2025DAK169-V/HF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.12 | $16,12 |
| 10 | $14.51 | $145,10 |
| 100 | $11.05 | $1 105,00 |
| 500 | $9.42 | $4 710,00 |
| 1 000 | $7.94 | $7 940,00 |
PIC32MZ2025DAK169-V/HF Présentation
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a high-throughput CPU, on-chip memory (Flash for code, SRAM for data), and a broad set of peripherals (ADC, timers, communication controllers, GPIO). The PIC32MZ family extends the classic PIC microcontroller lineage with a MIPS32 microAptiv core, instruction-cache architecture, and DMA, positioning these MCUs above 8/16-bit MCUs but below full microprocessors in complexity. The PIC32MZ Graphics (DAK/DAL/DAR/DAS) family specifically adds an integrated graphics controller, a graphics processor, and an external DDR2 DRAM interface to enable LCD-TFT panels up to WVGA without external graphics silicon.
Key features of the PIC32MZ2025DAK169-V/HF include a 12-bit 18 MSPS ADC with up to 45 analog inputs, two CAN modules, HS USB with on-chip transceiver, an integrated graphics controller with hardware-accelerated rendering, and support for up to 32 MB on-chip or 128 MB externally addressable DDR2 DRAM. The 169-LFBGA package exposes the wide data path needed to drive parallel RGB displays and connect to external DDR2 memory.
Architecturally, the device pairs a single-issue MIPS32 microAptiv core with tightly-coupled instruction cache and a dedicated graphics DMA path, allowing the CPU to remain responsive while the GPU streams frame-buffer data to the LCD. The 200 MHz core delivers 330 DMIPS and 3.46 CoreMark/MHz-class efficiency for the segment.
Typical applications span industrial HMI panels with TFT LCDs, medical patient-monitoring displays, point-of-sale terminals, automotive-infotainment prototypes, and home-automation touch-screen controllers. Engineers select the DAK169 variant when the design needs a 169-ball BGA footprint for compact board layout and high-pin-count LCD interface routing.
Designers should review the package thermal resistance, the DDR2 PCB layout rules, and the Graphics Controller middleware licensing before committing. The PIC32MZ Graphics Family datasheet (DS60001565) covers register definitions, the DDR2 controller timing, and the recommended LCD-TFT interface.
This page synthesizes distributor pricing from DigiKey/Mouser/LCSC, the Microchip product family listing, and drop-in same-family alternatives sourced from the verified cross-reference data to help engineers compare, source, and qualify the part more efficiently than reading the 169-ball pinout alone.
Alternatives de remplacement direct pour PIC32MZ2025DAK169-V/HF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAK169-V/HF (même facteur de forme et même empreinte) — différant par USB, CAN, Core Architecture, Mounting Type, Graphics Controller.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2025DAK169T-V/HF
✅ Remplacement direct✓ En stock
$10.45 / unité
Voir la fiche technique →PIC32MZ2064DAK169
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1064DAK169
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAK169-I/HF
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →PIC32MZ1025DAK169-I/HF
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →PIC32MZ1064DAB169T-I/HF
✅ Remplacement direct✓ En stock
$4.52 / unité
Voir la fiche technique →PIC32MZ2025DAK169-V/HF Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Core Count | Single-core |
| Maximum CPU Frequency | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Instruction Cache | Yes (cache-based MCU) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated |
| Graphics Processor | Integrated |
| External Memory Bus | DDR2 DRAM, up to 128 MB externally addressable |
| CAN Modules | 2 |
| USB | Hi-Speed USB with on-chip transceiver |
| Plage de température de fonctionnement | -40C to +105C (V-temp) |
| Boîtier | 169-LFBGA (11x11 mm) |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Compliant (per Microchip product page) |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
Guide de configuration des broches du PIC32MZ2025DAK169-V/HF 169-lfbga (11x11 mm)
Configuration des broches du PIC32MZ2025DAK169-V/HF (boîtier 169-lfbga (11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ2025DAK169-V/HF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ2025DAK169-V/HF convient pour 6 applications: Industrial HMI with TFT LCD, Medical Patient Monitoring Display, Point-of-Sale Terminal, Home Automation Touchscreen Controller, Automotive Infotainment Prototype, Industrial Control Panel with Connectivity.
Industrial HMI with TFT LCD
The PIC32MZ2025DAK169-V/HF fits industrial HMI panels because its integrated graphics controller, integrated graphics processor, and 200 MHz MIPS32 microAptiv core deliver smooth 2D rendering for WVGA panels up to 800x480 without external GPU silicon. The 640 KB SRAM plus externally addressable DDR2 (up to 128 MB) provides ample frame buffer, while the 2 MB Flash stores asset data and application code.
Recommandé
Medical Patient Monitoring Display
The PIC32MZ2025DAK169-V/HF suits medical patient monitoring displays because the V-temp range (-40 to +105 C) covers continuous-operation equipment enclosures, while 12-bit 18 MSPS ADC with up to 45 analog inputs digitizes multiple sensor channels simultaneously for ECG, SpO2, and temperature inputs. The integrated graphics controller renders crisp LCD graphics for waveform displays at 60 Hz refresh.
Recommandé
Point-of-Sale Terminal
The PIC32MZ2025DAK169-V/HF targets point-of-sale terminals because Hi-Speed USB with on-chip transceiver supports barcode scanners and receipt printers, while two CAN modules connect to back-office peripherals and weigh scales. The integrated graphics controller drives the cashier-facing color TFT, and the 2 MB Flash holds multilingual UI assets, fonts, and transaction logs for offline operation.
Recommandé
Home Automation Touchscreen Controller
The PIC32MZ2025DAK169-V/HF drives home automation touchscreens because the integrated graphics processor accelerates icons and animations, while the 169-LFBGA package exposes capacitive touch controller interfaces and RGB LCD data bus. Two CAN modules connect to HVAC and lighting bus systems, Hi-Speed USB enables firmware updates, and the 2 MB Flash stores GUI assets and protocol stacks.
Recommandé
Automotive Infotainment Prototype
The PIC32MZ2025DAK169-V/HF is used in automotive infotainment prototypes because the V-temp range handles vehicle cabin thermal environments, two CAN modules interface with vehicle networks (CAN-FD capable), and the integrated graphics controller renders cluster and center-stack displays. Designers pair it with the Q1-graded PIC32MZ family members when AEC-Q100 qualification is needed for production.
Recommandé
Industrial Control Panel with Connectivity
The PIC32MZ2025DAK169-V/HF powers industrial control panels because the 200 MHz core runs real-time control loops while the integrated graphics controller drives a status TFT. Hi-Speed USB with on-chip transceiver enables programming and PC connectivity, two CAN modules interface with industrial CANopen or DeviceNet networks, and the 12-bit ADC digitizes sensor feedback at 18 MSPS.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2025DAK169-V/HF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2025DAK169T-V/HF | PIC32MZ2064DAK169 | PIC32MZ1064DAK169 | PIC32MZ1025DAK169 | PIC32MZ1025DAK169-I/HF | PIC32MZ1064DAB169T-I/HF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core Architecture | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) | 2 MB | 2 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 704 KB | 704 KB | 320 KB | 320 KB | 704 KB |
| Integrated Graphics Controller | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature Range | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
Principaux différenciateurs
- Highest-memory variant in the DAK169 BGA family (vs PIC32MZ1025DAK169)
- Drop-in tape-and-reel variant for volume assembly (vs PIC32MZ2025DAK169T-V/HF)
- V-temp industrial-extended range versus I-temp (vs PIC32MZ1025DAK169-I/HF)
Notes de conception
Estimated: at 200 MHz with the graphics controller active and DDR2 in self-refresh, the 169-LFBGA dissipates ~0.8-1.2 W typical. With a typical theta_JA of ~25 C/W for the 11x11 mm LFBGA on a 4-layer JEDEC board, junction temperature rise is ~20-30 C above ambient. Ensure the PCB includes a continuous ground plane under the BGA and thermal vias in the center balls for sustained DDR2 throughput workloads.
Route the DDR2 address/command traces with matched lengths within +/-25 mils and the data byte lanes within +/-50 mils per the PIC32MZ Graphics Family datasheet DDR2 controller timing section. Use 100 ohm differential impedance for HS USB and place the 24 MHz crystal within 5 mm of the XTAL pins with a guard ring to reduce EMI coupling into the graphics data bus.
Do not assume all PIC32MZ DAK variants share the same Flash size - the PIC32MZ1025DAK169 family members have only 1 MB Flash, which is half the PIC32MZ2025DAK169 capacity. If migrating downward, audit the linker script and unused-function declarations; migrating upward (e.g., 1064 -> 2025) is safer since the larger Flash simply leaves unused space.
Decouple the PIC32MZ2025DAK169-V/HF with a 10 uF bulk capacitor plus four 0.1 uF ceramics placed within 3 mm of the package power balls. The BGA's center balls are typically power/ground; connect them to internal planes with multiple small thermal vias (0.2 mm drill, 0.4 mm pad) to reduce inductance and improve thermal dissipation.
Informations de conformité
RoHS compliant and lead-free per Microchip product page. The standard PIC32MZ2025DAK169-V/HF is NOT AEC-Q100 qualified - use AEC-Q100-graded PIC32MZ family members (Q1/Q5 suffix) for automotive production. Halogen-free status not stated in verified data; set to unknown per data authenticity rules.