PIC32MZ2025DAS169T-V/6J - 32-bit MCU 200MHz 2MB Flash 169-LFBGA | Microchip
Référence : PIC32MZ2025DAS169T-V/6J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $17.2 | $172,00 |
| 100 | $15.8 | $1 580,00 |
| 500 | $14.4 | $7 200,00 |
| 1 000 | $12.9 | $12 900,00 |
PIC32MZ2025DAS169T-V/6J Présentation
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a processor core, program and data memory, peripherals, and I/O. PIC32MZ DA parts sit at the high end of the MCU hierarchy, delivering MPU-like performance with MCU simplicity for graphics-intensive human-machine interface (HMI) designs. Within the broader taxonomy, this part belongs to MCU -> 32-bit MCU -> MIPS-based MCU -> graphics-enabled MCU -> embedded processor.
Key features include 200 MHz core with hardware graphics acceleration, integrated 32 MB DDR2 DRAM eliminating external memory in many designs, 2 MB Flash with 640 KB SRAM, 12-bit ADC at 18 MSPS for high-speed analog capture, and automotive-grade temperature range. The LFBGA-169 package balances high I/O count with a compact 11x11 mm footprint, suitable for space-constrained GUI applications.
The DAS variant adds an on-chip 32 MB DDR2 controller and graphics peripherals over the base DA family. This enables smooth rendering of TFT LCD panels without external memory, reducing BOM cost and PCB complexity in industrial, automotive cluster, and medical display applications.
Typical applications include automotive instrument clusters, industrial HMI panels, medical patient monitors, point-of-sale terminals, and IoT edge gateways with local graphics rendering. The combination of high-speed ADC and graphics controller makes it well-suited for systems that combine sensor acquisition with display output.
When designing with this part, account for LFBGA routing complexity and provide adequate via-in-pad escape for the BGA. The integrated DDR2 controller still requires careful PCB stackup and impedance matching for signal integrity. Junction temperature must remain within automotive-grade limits when used in vehicle environments.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the standalone datasheet, helping engineers evaluate this MCU for next-generation graphics-enabled embedded designs.
Alternatives de remplacement direct pour PIC32MZ2025DAS169T-V/6J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAS169T-V/6J (même facteur de forme et même empreinte) — différant par Graphics Controller, ADC, USB, Graphics Processor, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2025DAR169T-V/6J
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →PIC32MZ2025DAB169T-I/HF
✅ Remplacement direct✓ En stock
$12.62 / unité
Voir la fiche technique →PIC32MZ2025DAG169T-I/6J
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →PIC32MZ2025DAH169T-I/6J
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →PIC32MZ1025DAR169T-I/6J
✅ Remplacement direct✓ En stock
$11.88 / unité
Voir la fiche technique →PIC32MZ2025DAS169T-V/6J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Core Family | PIC32MZ DA |
| Core Count | 1 (single-core) |
| Maximum CPU Clock | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Integrated DRAM | 32 MB DDR2 (on-chip) |
| Boîtier | 169-LFBGA (11x11 mm) |
| Type de montage | Surface Mount |
| GPIO Count | 120 |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated |
| Graphics Processor | Integrated |
| USB | High-Speed USB |
| CAN | Yes |
| Temperature Grade | V (Automotive: -40C to +125C) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du PIC32MZ2025DAS169T-V/6J 169-lfbga (11x11 mm)
Configuration des broches du PIC32MZ2025DAS169T-V/6J (boîtier 169-lfbga (11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ2025DAS169T-V/6J.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ2025DAS169T-V/6J convient pour 6 applications: Automotive Instrument Cluster, Industrial HMI Control Panel, Medical Patient Monitor, Point-of-Sale Terminal, IoT Edge Gateway with Local Display, Audio Mixing Console with Touch Display.
Automotive Instrument Cluster
The PIC32MZ2025DAS169T-V/6J fits automotive instrument clusters because its 200 MHz MIPS32 microAptiv core, integrated graphics controller, and 32 MB on-chip DDR2 deliver smooth TFT rendering of gauges and warning icons without external memory. Its V-temperature grade covers -40C to +125C for under-dash environments, and HS USB plus CAN provide diagnostic and vehicle-network connectivity. The 169-LFBGA package keeps the cluster PCB compact while the 12-bit 18 MSPS ADC supports analog sensor acquisition for fuel, temperature, and battery monitoring.
Recommandé
Industrial HMI Control Panel
In factory-floor HMI panels, the PIC32MZ2025DAS169T-V/6J delivers MPU-class responsiveness with 2 MB Flash, 640 KB SRAM, and an integrated graphics processor driving TFT LCDs up to WVGA resolution. The 12-bit 18 MSPS ADC samples analog process variables while CAN and HS USB link to PLCs and configuration tools. LFBGA-169 supports dense I/O routing on a compact PCB. Designers gain a single-chip solution that simplifies BOM, reduces firmware complexity, and lowers long-term support cost.
Recommandé
Medical Patient Monitor
The PIC32MZ2025DAS169T-V/6J supports patient monitors by combining the 12-bit 18 MSPS ADC for high-fidelity vital-sign capture with the integrated graphics controller for waveform rendering. Its 200 MHz MIPS32 core processes filter algorithms in real time, and the 32 MB DDR2 holds full-screen ECG, SpO2, and respiration traces. Surface-mount LFBGA suits portable device form factors, and the wide GPIO count simplifies routing to multiple sensor front ends, audio alarms, and TFT/LCD display interfaces.
Recommandé
Point-of-Sale Terminal
Point-of-sale terminals benefit from the PIC32MZ2025DAS169T-V/6J's HS USB for peripherals (barcode scanners, receipt printers), its integrated graphics controller driving customer-facing color displays, and CAN for back-office networked terminals. The 32 MB on-chip DDR2 supports animated menu graphics, while the 200 MHz core handles encryption and payment-processing libraries. The compact 169-LFBGA package (11x11 mm) frees board space for card readers and wireless modules, making the BOM more competitive.
Recommandé
IoT Edge Gateway with Local Display
IoT edge gateways with local HMI displays use the PIC32MZ2025DAS169T-V/6J to aggregate sensor data, render status screens, and bridge to cloud networks. The 200 MHz core runs TCP/IP stacks while the 12-bit ADC samples analog sensors, and the integrated graphics controller drives TFT status panels. HS USB supports Wi-Fi/BLE module attachment, and the automotive V-temp grade allows outdoor cabinet deployment. The 32 MB DDR2 holds connection state, log buffers, and graphical assets.
Recommandé
Audio Mixing Console with Touch Display
Audio mixing consoles leverage the PIC32MZ2025DAS169T-V/6J's 12-bit 18 MSPS ADC for high-quality analog input sampling, integrated graphics for the touch-screen UI, and HS USB for multichannel audio streaming to a host DAW. The 200 MHz MIPS32 core processes DSP effects while the 32 MB DDR2 holds sample buffers and UI graphics. The 169-LFBGA package fits dense mixer channel layouts, and the GPIO-rich design supports motorized faders, LED meters, and rotary encoders simultaneously.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2025DAS169T-V/6J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2025DAR169T-V/6J | PIC32MZ2025DAB169T-I/HF | PIC32MZ2025DAG169T-I/6J | PIC32MZ2025DAH169T-I/6J | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Family | MIPS32 microAptiv / PIC32MZ DA | MIPS32 microAptiv / PIC32MZ DA | MIPS32 microAptiv / PIC32MZ DA | MIPS32 microAptiv / PIC32MZ DA | MIPS32 microAptiv / PIC32MZ DA | MIPS32 microAptiv / PIC32MZ DA |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| Integrated DRAM | 32 MB DDR2 | None (external) | 32 MB DDR2 | 32 MB DDR2 | 32 MB DDR2 | None (external) |
| Graphics Controller | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| Temperature Grade | V (Automotive: -40C to +125C) | V (Automotive: -40C to +125C) | I (Industrial: -40C to +85C) | I (Industrial: -40C to +85C) | I (Industrial: -40C to +85C) | I (Industrial: -40C to +85C) |
Principaux différenciateurs
- Integrated 32 MB DDR2 eliminates external memory (vs PIC32MZ2025DAR169T-V/6J)
- Automotive V-temp grade available on identical footprint (vs PIC32MZ2025DAG169T-I/6J)
- Higher Flash density for richer firmware (vs PIC32MZ1025DAR169T-I/6J)
Notes de conception
The 169-LFBGA package requires via-in-pad PCB technology with filled and plated-over vias for reliable solder joints. Estimate a 6-layer stackup minimum with the top layer dedicated to fanout and one inner layer for ground. Place at least 4 thermal vias under the center BGA balls to conduct heat from the die to the inner ground plane. Land pattern must follow IPC-7351 nominal-density rules with 0.5 mm pitch.
The integrated 32 MB DDR2 controller demands controlled-impedance routing on the BGA escape. Estimated: target 50 ohm single-ended and 100 ohm differential impedance for the DDR2 signals, with length matching within 50 mils for byte lanes and within 25 mils for differential pairs. Use fly-by topology for SDRAM address/command and keep reference planes continuous under all DDR2 traces to prevent impedance discontinuities.
At 200 MHz with full graphics and USB activity, the die can dissipate 1-2 W. Estimated: with a 169-LFBGA package theta_JA around 25 C/W on a JEDEC 4-layer test board, junction temperature rise is 25-50 C above ambient. For automotive V-temp operation up to +125 C junction, ensure ambient + dissipation stays below this limit; copper pours on top and inner layers aid spreading.
Do not omit the external 32.768 kHz crystal on SOSC for RTC operation - the internal FRC drift is too high for timekeeping. Decouple each AVDD pin with a 0.1 uF ceramic plus a 10 uF bulk capacitor placed within 3 mm of the pin. Do not drive HS USB D+/D- lines without the mandatory 45 ohm series resistors and ESD protection array.
Informations de conformité
AEC-Q100 qualification typical for V-temp variants in the PIC32MZ2025DAS family per Microchip automotive-grade catalog. RoHS/REACH compliance per DigiKey and Microchip product page listings.