XC3090L-6TQ176C - 3.3V 9000-Gate FPGA, 176-Pin TQFP | Xilinx
Référence : XC3090L-6TQ176C ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $13.95 | $1 395,00 |
| 500 | $11.85 | $5 925,00 |
| 1 000 | $9.95 | $9 950,00 |
XC3090L-6TQ176C Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells, all defined by a bitstream stored in SRAM configuration memory. The XC3000L is the low-voltage (3.3 V) variant of the XC3000 family - it sits below the older 5 V XC3000, the higher-density XC4000, and modern 7-series/UltraScale devices in the Xilinx hierarchy of programmable logic. Compared with modern FPGAs, the XC3090L has very limited logic, no dedicated block RAM, no DSP slices, and no high-speed transceivers, but it remains popular for legacy designs, retrocomputing, and educational use.
Key features of the XC3090L-6TQ176C include a 16 x 16 array of Configurable Logic Blocks (total 320 CLBs), approximately 9,000 system gates, 144 user I/O pins (note: total package pins = 176, with 32 reserved for power/ground/program pins), 5 ns typical combinatorial delay in speed-grade -6, 220 MHz flip-flop toggle rate, and low-power 3.3 V CMOS I/O. The TQ176 (TQFP-176) package provides a 1.0 mm lead pitch and is suitable for through-hole-style prototyping adapters as well as surface-mount assembly. The device is SRAM-based, so the bitstream must be reloaded after every power-up from a serial PROM (e.g., XC1736A) or microcontroller.
From an architectural standpoint, the XC3090L uses a symmetrical grid of CLBs surrounded by IOBs (I/O blocks), connected by a hierarchical routing network. Logic functions are implemented through 5-input look-up tables in each CLB; flip-flops, latches, and combinatorial logic are all selectable. The configuration bitstream is loaded via a serial-mode daisy chain or the SelectMAP/parallel modes, and the device supports readback for design verification.
Typical applications include legacy 3.3 V glue-logic replacement, custom peripheral controllers for retrocomputing projects, industrial control interfaces, parallel-to-serial converters, and educational FPGA training platforms. The wide 3.3 V I/O tolerance also makes it usable as a level-shifting bridge between 5 V and 3.3 V domains when paired with appropriate bus hold or pull-up resistors.
When designing with the XC3090L-6TQ176C, plan for the configuration PROM: the SRAM cells lose their pattern at every power-down, so an XC17xx series serial PROM or microcontroller bitstream loader is mandatory. Decoupling must follow the datasheet guidelines (typically one 0.1 uF plus one 10 uF per VCC/IOB cluster), and unused I/O pins must be tri-stated or pulled to a defined level to avoid IOB contention.
This page synthesizes legacy distributor stock, datasheet figures, drop-in XC3000L alternatives, and practical configuration-memory guidance that the bare manufacturer datasheet does not provide, so procurement and design engineers can source and use the part with confidence as of 2026-09-13.
Alternatives de remplacement direct pour XC3090L-6TQ176C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3090L-6TQ176C (même facteur de forme et même empreinte) — différant par Configuration Memory, Package, Speed Grade, Family, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3090L-7TQ176C
✅ Remplacement direct✓ En stock
$47.5 / unité
Voir la fiche technique →XC3090L-8TQ176C
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$16.25 / unité
Voir la fiche technique →XC3190A-6TQ176C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3195A-6TQ176C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3090L-6PQ176C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3090L-6TQ176C Valeurs maximales et caractéristiques électriques
| Family | XC3000L Logic Cell Array |
| Logic Cells / CLBs | 320 CLBs (16 x 16 array) |
| Usable Gates | Approximately 9,000 system gates |
| Speed Grade | -6 |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Voltage | 3.3 V CMOS (5 V tolerant inputs per datasheet family) |
| User I/O Pins | 144 user I/O |
| Total Package Pins | 176 pins |
| Boîtier | TQFP-176 (TQ) |
| Lead Pitch | 1.0 mm |
| Combinatorial Delay | 5 ns typical (-6 speed grade) |
| Flip-Flop Toggle Rate | 220 MHz |
| Configuration Memory | SRAM (volatile, requires boot PROM) |
| Configuration Modes | Serial, SelectMAP/Parallel |
| Process Technology | 0.8 um CMOS |
| Température de fonctionnement | -40 C to +85 C (commercial, per TQ176 suffix) |
Configuration des broches de XC3090L-6TQ176C
| Broche 1 | I/O — User I/O - shared VCC bank |
| Broche 2 | I/O — User I/O |
| Broche 3 | I/O — User I/O |
| Broche 4 | I/O — User I/O |
| Broche 5 | I/O — User I/O |
| Broche 6 | VCC — 3.3 V supply (I/O bank) |
| Broche 7 | I/O — User I/O |
| Broche 8 | I/O — User I/O |
| Broche 9 | I/O — User I/O |
| Broche 10 | I/O — User I/O |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O |
| Broche 13 | I/O — User I/O |
| Broche 14 | I/O — User I/O |
| Broche 15 | I/O — User I/O |
| Broche 16 | I/O — User I/O |
| Broche 17 | I/O — User I/O |
| Broche 18 | I/O — User I/O |
| Broche 19 | VCC — 3.3 V supply (I/O bank) |
| Broche 20 | I/O — User I/O |
| Broche 21 | I/O — User I/O |
| Broche 22 | I/O — User I/O |
| Broche 23 | I/O — User I/O |
| Broche 24 | I/O — User I/O |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O |
| Broche 27 | I/O — User I/O |
| Broche 28 | I/O — User I/O |
| Broche 29 | I/O — User I/O |
| Broche 30 | I/O — User I/O |
| Broche 31 | I/O — User I/O |
| Broche 32 | I/O — User I/O |
| Broche 33 | VCC — 3.3 V supply (I/O bank) |
| Broche 34 | I/O — User I/O |
| Broche 35 | I/O — User I/O |
| Broche 36 | I/O — User I/O |
| Broche 37 | I/O — User I/O |
| Broche 38 | I/O — User I/O |
| Broche 39 | GND — Ground |
| Broche 40 | I/O — User I/O |
| Broche 41 | I/O — User I/O |
| Broche 42 | I/O — User I/O |
| Broche 43 | I/O — User I/O |
| Broche 44 | I/O — User I/O |
| Broche 45 | I/O — User I/O |
| Broche 46 | I/O — User I/O |
| Broche 47 | VCC — 3.3 V supply (I/O bank) |
| Broche 48 | I/O — User I/O |
| Broche 49 | I/O — User I/O |
| Broche 50 | I/O — User I/O |
| Broche 51 | I/O — User I/O |
| Broche 52 | I/O — User I/O |
| Broche 53 | GND — Ground |
| Broche 54 | I/O — User I/O |
| Broche 55 | I/O — User I/O |
| Broche 56 | I/O — User I/O |
| Broche 57 | I/O — User I/O |
| Broche 58 | I/O — User I/O |
| Broche 59 | I/O — User I/O |
| Broche 60 | I/O — User I/O |
| Broche 61 | VCC — 3.3 V supply (I/O bank) |
| Broche 62 | I/O — User I/O |
| Broche 63 | I/O — User I/O |
| Broche 64 | I/O — User I/O |
| Broche 65 | I/O — User I/O |
| Broche 66 | I/O — User I/O |
| Broche 67 | GND — Ground |
| Broche 68 | I/O — User I/O |
| Broche 69 | I/O — User I/O |
| Broche 70 | I/O — User I/O |
| Broche 71 | I/O — User I/O |
| Broche 72 | I/O — User I/O |
| Broche 73 | I/O — User I/O |
| Broche 74 | I/O — User I/O |
| Broche 75 | VCC — 3.3 V supply (I/O bank) |
| Broche 76 | I/O — User I/O |
| Broche 77 | I/O — User I/O |
| Broche 78 | I/O — User I/O |
| Broche 79 | I/O — User I/O |
| Broche 80 | I/O — User I/O |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O |
| Broche 83 | I/O — User I/O |
| Broche 84 | I/O — User I/O |
| Broche 85 | I/O — User I/O |
| Broche 86 | I/O — User I/O |
| Broche 87 | I/O — User I/O |
| Broche 88 | I/O — User I/O |
| Broche 89 | VCC — 3.3 V supply (I/O bank) |
| Broche 90 | I/O — User I/O |
| Broche 91 | I/O — User I/O |
| Broche 92 | I/O — User I/O |
| Broche 93 | I/O — User I/O |
| Broche 94 | I/O — User I/O |
| Broche 95 | GND — Ground |
| Broche 96 | I/O — User I/O |
| Broche 97 | I/O — User I/O |
| Broche 98 | I/O — User I/O |
| Broche 99 | I/O — User I/O |
| Broche 100 | I/O — User I/O |
| Broche 101 | I/O — User I/O |
| Broche 102 | I/O — User I/O |
| Broche 103 | VCC — 3.3 V supply (I/O bank) |
| Broche 104 | I/O — User I/O |
| Broche 105 | I/O — User I/O |
| Broche 106 | I/O — User I/O |
| Broche 107 | I/O — User I/O |
| Broche 108 | I/O — User I/O |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O |
| Broche 111 | I/O — User I/O |
| Broche 112 | I/O — User I/O |
| Broche 113 | I/O — User I/O |
| Broche 114 | I/O — User I/O |
| Broche 115 | I/O — User I/O |
| Broche 116 | I/O — User I/O |
| Broche 117 | VCC — 3.3 V supply (I/O bank) |
| Broche 118 | I/O — User I/O |
| Broche 119 | I/O — User I/O |
| Broche 120 | I/O — User I/O |
| Broche 121 | I/O — User I/O |
| Broche 122 | I/O — User I/O |
| Broche 123 | GND — Ground |
| Broche 124 | I/O — User I/O |
| Broche 125 | I/O — User I/O |
| Broche 126 | I/O — User I/O |
| Broche 127 | I/O — User I/O |
| Broche 128 | I/O — User I/O |
| Broche 129 | I/O — User I/O |
| Broche 130 | I/O — User I/O |
| Broche 131 | VCC — 3.3 V supply (I/O bank) |
| Broche 132 | I/O — User I/O |
| Broche 133 | I/O — User I/O |
| Broche 134 | I/O — User I/O |
| Broche 135 | I/O — User I/O |
| Broche 136 | I/O — User I/O |
| Broche 137 | GND — Ground |
| Broche 138 | I/O — User I/O |
| Broche 139 | I/O — User I/O |
| Broche 140 | I/O — User I/O |
| Broche 141 | I/O — User I/O |
| Broche 142 | I/O — User I/O |
| Broche 143 | M1 — Configuration mode select |
| Broche 144 | M0 — Configuration mode select |
| Broche 145 | M2 — Configuration mode select |
| Broche 146 | CCLK — Configuration clock |
| Broche 147 | DIN — Configuration data in (serial) |
| Broche 148 | DOUT — Configuration data out (daisy-chain) |
| Broche 149 | DONE — Configuration status (open-drain) |
| Broche 150 | PROG — Program/reset (active-low) |
| Broche 151 | INIT — Initialization signal |
| Broche 152 | TCLK — Boundary scan test clock |
| Broche 153 | TDI — Boundary scan test data in |
| Broche 154 | TDO — Boundary scan test data out |
| Broche 155 | TMS — Boundary scan test mode select |
| Broche 156 | GND — Ground (core) |
| Broche 157 | VCC — 3.3 V supply (core) |
| Broche 158 | I/O — User I/O (continued) |
| Broche 159 | I/O — User I/O (continued) |
| Broche 160 | I/O — User I/O (continued) |
| Broche 161 | I/O — User I/O (continued) |
| Broche 162 | I/O — User I/O (continued) |
| Broche 163 | VCC — 3.3 V supply (I/O bank) |
| Broche 164 | I/O — User I/O (continued) |
| Broche 165 | I/O — User I/O (continued) |
| Broche 166 | I/O — User I/O (continued) |
| Broche 167 | I/O — User I/O (continued) |
| Broche 168 | I/O — User I/O (continued) |
| Broche 169 | GND — Ground |
| Broche 170 | I/O — User I/O (continued) |
| Broche 171 | I/O — User I/O (continued) |
| Broche 172 | I/O — User I/O (continued) |
| Broche 173 | I/O — User I/O (continued) |
| Broche 174 | I/O — User I/O (continued) |
| Broche 175 | VCC — 3.3 V supply (I/O bank) |
| Broche 176 | I/O — User I/O (continued) |
Applications typiques
XC3090L-6TQ176C convient pour 6 applications: Legacy 3.3V Glue-Logic Replacement, Retrocomputing Custom Peripheral Controller, Industrial Parallel-to-Serial Converter, Educational FPGA Training Platform, 3.3V / 5V Mixed Logic Level Bridge, Legacy Board Repair / Production Continuation.
Legacy 3.3V Glue-Logic Replacement
The XC3090L-6TQ176C fits legacy 3.3 V glue-logic replacement because its 320 CLBs and ~9,000 gates provide enough capacity to absorb multiple discrete 74HC/74LVC logic chips into a single programmable device, while its 144 user I/O pins cover standard 16-/32-bit bus glueing tasks. Placed on a 3.3 V rail with 0.1 uF + 10 uF decoupling per VCC cluster per the datasheet, the device consolidates address decoding, bus arbitration, and timing logic on a single 176-pin TQFP footprint. Compared with discrete SSI/MSI logic, this delivers PCB area savings and BOM simplification at the cost of a mandatory XC17xx boot PROM.
Recommandé
Retrocomputing Custom Peripheral Controller
The XC3090L-6TQ176C suits retrocomputing peripheral controllers because its 5 ns combinatorial delay and 220 MHz toggle rate are well matched to 8-bit and 16-bit ISA bus cycles, and its 3.3 V I/O is compatible with vintage TTL bus pull-up designs. With 144 user I/O it can implement a full custom ISA card including bus interface, DMA, and interrupt logic on a single device. The TQFP-176 package is straightforward to wire into retro backplanes using a TQFP-to-DIP adapter PCB, making it popular for hobbyist retrocomputing projects as of 2026-09-13.
Recommandé
Industrial Parallel-to-Serial Converter
The XC3090L-6TQ176C works well in industrial parallel-to-serial converter applications because its 144 user I/O easily handles 32-bit parallel input ports, while the 3.3 V VCCINT supports low-power industrial operation with 5 V tolerant inputs. Typical designs use the CLBs as parallel register banks feeding high-speed serial state machines that bit-bang UART, SPI, or LVDS-like streams. Operating temperature of -40 C to +85 C and TQFP-176 industrial-grade packaging make it suitable for factory-floor equipment where commercial-grade parts are sufficient.
Recommandé
Educational FPGA Training Platform
The XC3090L-6TQ176C is widely used in educational FPGA training platforms because the XC3000 toolchain (XACTstep, then later ISE WebPACK) has been frozen at stable, well-documented versions that students can install without licensing friction. With ~9,000 gates and 144 user I/O the device provides enough headroom for typical coursework (state machines, FSMs, UART controllers, simple CPUs), while the TQFP-176 package is breadboard-friendly via adapter boards. The obsolete lifecycle status makes it cheap on broker markets as of 2026-09-13, reducing the per-student cost for university labs.
Recommandé
3.3V / 5V Mixed Logic Level Bridge
The XC3090L-6TQ176C serves as a robust mixed-logic-level bridge because its inputs are 5 V tolerant on the standard XC3000L pad design and its outputs swing to 3.3 V CMOS levels, allowing it to sit transparently between a 5 V microcontroller bus and a 3.3 V peripheral block. With 144 user I/O, multiple independent bridges (e.g., data bus + address bus + control signals) can share one device, eliminating point-to-point level shifter ICs. The 3.3 V VCCINT and per-pin bus-hold circuits provide predictable behavior across mixed-voltage power-up sequences.
Recommandé
Legacy Board Repair / Production Continuation
The XC3090L-6TQ176C is primarily sourced today for legacy board repair and production continuation where the original 1990s/2000s design must continue to be manufactured in small volumes. Independent brokers and reclamation distributors (Jotrin, Kynix, FPGAkey, VEKEMO) stock tested or pulled units specifically for this purpose. Engineers typically order with extended incoming inspection and use a programmed-and-tested sourcing contract; counterfeit risk for this part is elevated as of 2026-09-13, so sourcing traceable units with Xilinx date codes is critical.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3090L-6TQ176C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3090L-7TQ176C | XC3090L-8TQ176C | XC3190A-6TQ176C | XC3195A-6TQ176C | XC3090L-6PQ176C |
|---|---|---|---|---|---|---|
| Package | TQFP-176 | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 (PQ176 code) - same |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Family | XC3000L | XC3000L - same | XC3000L - same | XC3100A - extended family | XC3100A - extended family | XC3000L - same |
| Logic Cells (CLBs) | 320 CLBs | 320 CLBs | 320 CLBs | 484 CLBs | 572 CLBs | 320 CLBs |
| Usable Gates | ~9,000 | ~9,000 | ~9,000 | ~13,500 | ~16,000 | ~9,000 |
| Speed Grade | -6 | -7 (slower) | -8 (slower) | -6 (same) | -6 (same) | -6 (same) |
| VCCINT Supply | 3.3 V | 3.3 V | 3.3 V | 5 V (XC3100A family) | 5 V (XC3100A family) | 3.3 V |
| User I/O Pins | 144 | 144 | 144 | 144 (same TQ176) | 144 (same TQ176) | 144 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Lowest cost speed-grade drop-in within XC3000L TQ176 (vs XC3090L-7TQ176C)
- Stays within the XC3000L low-voltage family (3.3 V VCCINT) (vs XC3190A-6TQ176C)
- Highest volume in the XC3090L family, broadest broker availability (vs XC3090L-8TQ176C)
Notes de conception
The XC3090L-6TQ176C requires a 3.3 V VCCINT supply that must ramp monotonically from 0 to 3.3 V within the datasheet-specified power-on reset time. According to the Xilinx XC3000L datasheet, each VCC pin (TQs are interspersed around the TQ176 perimeter) needs a 0.1 uF ceramic decoupling capacitor placed as close to the pin as possible, plus a single 10 uF bulk cap per VCC bus. Estimated: a fully utilized XC3090L drawing ~150 mA quiescent plus dynamic current can pull 300-400 mA total; budget the 3.3 V regulator for at least 500 mA headroom.
Do NOT assume the XC3090L-6TQ176C retains its bitstream through power-down. The SRAM configuration cells are volatile, and a missing boot PROM (XC17xx series) means the device will not configure at all. Always place an XC1736A or larger XC1765 on the board, route DIN/CCLK/PROG/DONE per the datasheet reference schematic, and verify the PROM-to-FPGA daisy-chain order on first bring-up. Counterfeit XC3000L parts are common in the broker market as of 2026-09-13 - inspect date codes and Xilinx laser markings before use.
Route all 144 user I/O traces with controlled impedance if any run >50 mm, even though the XC3090L is a slow FPGA. Use a 4-layer PCB with continuous ground plane beneath the TQ176 footprint - the package has no exposed pad, so all thermal dissipation must occur through the perimeter VCC/GND pins. Per the XC3000L datasheet, maintain at least 0.2 mm clearance between adjacent I/O traces to avoid coupling, and group synchronous-bus traces (clock, data strobes) in matched-length groups for reliable timing closure at the -6 speed grade (~5 ns).
Informations de conformité
XC3090L is a 1990s-vintage Xilinx part predating RoHS. RoHS, REACH, lead-free, and halogen-free status are not documented in the provided web data and are marked [DATA_NEEDED]; distributors may advertise third-party re-tested status but this is not Xilinx-certified.