XC7VX330T-3FFG1157E - Virtex-7 XT FPGA 326K Logic Cells | AMD
MPN: XC7VX330T-3FFG1157E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1100 | $110,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $990 | $990,000.00 |
Drop-in alternatives for XC7VX330T-3FFG1157E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7VX330T-2FFG1157E
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-1FFG1157E
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-3FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FFG1157I
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet β10AX115N2F45I1SG
β‘ Same Packageπ Reference alternative (not in catalog)
XC7VX330T-3FFG1157E Maximum Ratings & Electrical Characteristics
| Family | Virtex-7 XT |
| Number of Logic Elements/Cells | 326400 |
| Number of LABs/CLBs | 25500 |
| Total RAM Bits | 27648000 |
| Number of I/O | 600 |
| Package | 1156-BBGA, FCBGA (35x35 mm) |
| Supplier Device Package | 1157-FCBGA (35x35) |
| Mounting Style | SMD |
| Operating Temperature | 0Β°C ~ 100Β°C |
| Core Voltage | 1V |
| Process Technology | 28nm HPL |
| Speed Grade | -3 |
| Number of Terminals | 1157 |
| Package Shape | SQUARE |
| Form of Terminal | BALL |
XC7VX330T-3FFG1157E Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O pin |
| Pin A2 | IO_L1N_T0 β User I/O pin |
| Pin B1 | IO_L2P_T0 β User I/O pin |
| Pin B2 | IO_L2N_T0 β User I/O pin |
| Pin C1 | VCCINT β Core logic power supply (1V) |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L3P_T0 β User I/O pin |
| Pin D2 | IO_L3N_T0 β User I/O pin |
| Pin E1 | VCCAUX β Auxiliary power supply |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L4P_T0 β User I/O pin |
| Pin F2 | IO_L4N_T0 β User I/O pin |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VX330T-3FFG1157E is suitable for 6 applications: High-Performance Computing, Wired Communications, Aerospace and Defense, Medical Imaging, Test and Measurement, Data Center Acceleration.
High-Performance Computing
The XC7VX330T-3FFG1157E delivers 326,400 logic cells and 27.6 Mb of block RAM, making it ideal for compute-intensive workloads such as data center acceleration and scientific simulation. Its 600 I/O pins enable high-bandwidth connectivity to external memory and accelerators. The -3 speed grade ensures maximum clock rates for demanding algorithms. Designers can implement custom arithmetic pipelines and parallel processing architectures to achieve significant speedups over general-purpose CPUs. The 28nm HPL process balances performance with power efficiency, allowing dense logic integration without excessive thermal load. For applications requiring real-time processing, the FPGA's deterministic latency and reconfigurability provide a distinct advantage over fixed-function ASICs.
Recommended
Wired Communications
In wired networking equipment, the XC7VX330T-3FFG1157E provides the logic density and I/O count needed for protocol processing, packet switching, and traffic management. Its 600 user I/O pins can interface with multiple high-speed SerDes transceivers and network PHYs. The device supports partial reconfiguration, enabling dynamic updates to protocol stacks without service interruption. The -3 speed grade allows for high-frequency clock domains, essential for line-rate processing. The 28nm HPL process ensures low power consumption, critical for dense line cards. Designers can implement flexible, software-defined networking functions that adapt to evolving standards. The FPGA's parallel processing capabilities enable simultaneous handling of multiple data streams, improving overall throughput.
Recommended
Aerospace and Defense
The XC7VX330T-3FFG1157E is well-suited for aerospace and defense applications such as radar signal processing, electronic warfare, and secure communications. Its high logic density and 600 I/O pins enable complex beamforming and signal analysis algorithms. The device operates over 0Β°C to 100Β°C, suitable for many ruggedized environments. The 28nm HPL process provides a balance of performance and power, important for airborne and space-borne systems. The FPGA's reconfigurability allows for in-field updates to adapt to changing mission requirements. Designers can implement advanced encryption and anti-jamming techniques with the device's flexible logic fabric. The -3 speed grade ensures real-time processing of high-bandwidth sensor data.
Recommended
Medical Imaging
In medical imaging systems like CT scanners and ultrasound machines, the XC7VX330T-3FFG1157E accelerates image reconstruction and processing. Its 326,400 logic cells can implement complex filtering and transform algorithms in parallel, reducing latency. The 600 I/O pins interface with high-speed ADCs and image sensors. The -3 speed grade enables real-time processing of high-resolution images. The 28nm HPL process ensures low power consumption, important for portable devices. The FPGA's reconfigurability allows for algorithm updates without hardware changes. Designers can achieve significant performance improvements over DSP-based implementations. The device's deterministic timing is critical for synchronized image acquisition and processing.
Recommended
Test and Measurement
The XC7VX330T-3FFG1157E is ideal for test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. Its high logic density enables complex trigger and analysis functions. The 600 I/O pins connect to high-speed ADCs and DACs. The -3 speed grade supports high-bandwidth signal acquisition. The 28nm HPL process provides low power consumption for benchtop instruments. The FPGA's reconfigurability allows for firmware updates to add new measurement capabilities. Designers can implement custom digital signal processing for accurate measurements. The device's parallel processing enables simultaneous analysis of multiple channels.
Recommended
Data Center Acceleration
In data centers, the XC7VX330T-3FFG1157E accelerates workloads such as database processing, compression, and encryption. Its 326,400 logic cells can implement custom accelerators that offload tasks from CPUs. The 600 I/O pins enable high-bandwidth connections to host servers via PCIe. The -3 speed grade ensures low-latency processing. The 28nm HPL process balances performance with power efficiency, critical for dense server racks. The FPGA's reconfigurability allows for workload-specific optimization. Designers can achieve significant performance-per-watt improvements over general-purpose processors. The device's parallel architecture is well-suited for data-parallel algorithms.
Recommended
Recommended Products Summary
Engineering reference data for XC7VX330T-3FFG1157E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VX330T-2FFG1157E | XC7VX330T-1FFG1157E | XC7VX330T-3FFG1157I | XC7VX330T-2FFG1157I | 10AX115N2F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) |
| Brand | AMD | AMD | AMD | AMD | AMD | Intel |
| Logic Cells | 326400 | 326400 | 326400 | 326400 | 326400 | 1150000 |
| Block RAM (bits) | 27648000 | 27648000 | 27648000 | 27648000 | 27648000 | 55302400 |
| Number of I/O | 600 | 600 | 600 | 600 | 600 | 672 |
| Speed Grade | -3 | -2 | -1 | -3 | -2 | -2 |
| Operating Temperature | 0Β°C to 100Β°C | 0Β°C to 100Β°C | 0Β°C to 100Β°C | -40Β°C to 100Β°C | -40Β°C to 100Β°C | 0Β°C to 100Β°C |
| Core Voltage | 1V | 1V | 1V | 1V | 1V | 0.9V |
Key Differentiators
- Highest speed grade in the Virtex-7 XT family (vs XC7VX330T-2FFG1157E)
- Large logic density with 326,400 cells (vs 10AX115N2F45I1SG)
- 600 user I/O pins (vs 10AX115N2F45I1SG)
Design Notes
The XC7VX330T-3FFG1157E requires a clean 1V core supply (VCCINT) and auxiliary supplies. Use multiple decoupling capacitors (100nF and 10uF) placed close to the power pins. A dedicated power plane is recommended to minimize impedance. Refer to the Virtex-7 PCB Design Guide for detailed recommendations.
With 326,400 logic cells and a -3 speed grade, power dissipation can be significant. Ensure adequate heatsinking and airflow. The FCBGA package has a thermal resistance that requires a heatsink for high utilization designs. Use thermal vias under the package to improve heat transfer to the PCB.
The 1156-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Follow the layout guidelines in UG865 for pinout and routing. Use blind and buried vias to route signals efficiently. Ensure proper ground plane continuity for return currents.
Compliance Information
Compliance data not explicitly provided in the verified web data. RoHS and REACH compliance assumed based on AMD's standard product compliance. AEC-Q100 not applicable for this FPGA.
