DSPIC33FJ256GP710A-H/PF - 16-bit DSC, 40 MIPS, 256KB Flash | Microchip
MPN: DSPIC33FJ256GP710A-H/PF ✓ פעילDSPIC33FJ256GP710A-H/PF סקירה
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic compute architecture of a digital signal processor (DSP) with the peripheral integration and control-oriented design of a microcontroller (MCU). In the embedded hierarchy, a DSC sits below application processors and above basic 8/16-bit MCUs, bridging general-purpose PIC24 MCUs (with which it is pin-compatible in this family) and dedicated DSPs. DSCs excel in closed-loop control tasks that mix C-level system management with hardware-accelerated multiply-accumulate (MAC) operations needed by motor-control and power-conversion algorithms.
Key features of this part include a 16-bit dsPIC core with single-cycle MAC DSP engine, 256 KB Flash (256 K x 8), 30 KB SRAM, and a rich connectivity suite comprising CAN 2.0B, I2C, SPI, UART/USART, IrDA, and LINbus. The device exposes two 40-bit accumulators, hardware modulo addressing, barrel shifter, and 17 x 17-bit single-cycle multiplier, enabling FIR/IIR filtering, PID loops, and Clarke/Park transforms without software overhead.
Technically, the modified Harvard architecture issues two instructions per cycle from a dual-pipeline fetch, while 9 timers/counters (including input capture, output compare, and a real-time clock) handle event-driven tasks. The 'GP' analog suite supplies 10/12-bit ADC channels, comparators, and a CTMU for capacitive touch and slope compensation in SMPS designs, all packaged within automotive-grade temperature spec.
Typical applications include automotive sensor fusion and HVAC control, industrial motor drives (BLDC/PMSM), power-conversion SMPS loops, digital audio processing, and CAN/LIN networked nodes. The wide -40 C to +150 C operating range (the -H suffix indicates AEC-Q100 grade 0) makes the part suitable for under-hood automotive environments.
Design consideration: place a 10 uF bulk + 0.1 uF ceramic bypass pair on each VDD/AVDD pair, keep traces short, and use paired PGECx/PGEDx pins for ICSP programming. Verify oscillator start-up margin with the crystal manufacturer ESR data to prevent data corruption in industrial EMI environments.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
חלופות תחליף ישיר עבור DSPIC33FJ256GP710A-H/PF — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם DSPIC33FJ256GP710A-H/PF (אותו גורם צורה וטביעת רגל) — שונים ב Package, Core Architecture, Operating Temperature, ADC, Maximum CPU Speed.
DSPIC33FJ256GP710A-I/PF
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DSPIC33FJ256GP710-I/PF
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DSPIC33FJ256GP710A-H/MR
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DSPIC33FJ256GP710A-H/PF דירוגים מרביים ומאפיינים חשמליים
| Product Type | 16-bit Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33F (modified Harvard, DSP-enhanced) |
| Instruction Set | 16-bit, DSP extensions (single-cycle MAC) |
| Maximum CPU Speed | 40 MIPS (MIPS, not MHz) |
| Program Flash | 256 KB (256K x 8) |
| Data SRAM | 30 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 85 |
| Timers/Counters | 9 (including input capture, output compare, RTC) |
| Communication | CAN 2.0B, I2C, SPI, UART/USART, IrDA, LINbus |
| ADC | 10/12-bit (multiple channels) |
| מארז | TQFP-100 (PF) 14x14 mm |
| סוג הרכבה | Surface Mount |
| טמפרטורת פעולה | -40 C to +150 C (AEC-Q100 grade 0) |
| סטטוס RoHS | Compliant |
| AEC-Q100 | Qualified (automotive grade) |
| Multiplier | 17 x 17-bit single-cycle |
| Accumulators | Two 40-bit |
תצורת פינים של DSPIC33FJ256GP710A-H/PF
| פין 1 | RP2/CN17/RD2 — I/O port RPD2 / PWM |
| פין 2 | RP3/CN18/RD3 — I/O port RPD3 / PWM |
| פין 3 | RP4/CN19/RD4 — I/O port RPD4 |
| פין 4 | RP5/CN20/RD5 — I/O port RPD5 |
| פין 5 | VSS — Ground reference |
| פין 6 | VDD — Positive supply for I/O and core logic |
| פין 7 | RP6/CN21/RD6 — I/O port RPD6 |
| פין 8 | RP7/CN22/RD7 — I/O port RPD7 |
| פין 9 | RP8/CN23/RF0 — I/O port RPF0 |
| פין 10 | RP9/CN24/RF1 — I/O port RPF1 |
| פין 11 | RP10/CN25/RF2 — I/O port RPF2 |
| פין 12 | RP11/CN26/RF3 — I/O port RPF3 |
| פין 13 | RP12/CN27/RF4 — I/O port RPF4 |
| פין 14 | RP13/CN28/RF5 — I/O port RPF5 |
| פין 15 | VSS — Ground reference |
| פין 16 | VDD — Positive supply for I/O and core logic |
| פין 17 | OSC1/RC12 — Crystal oscillator input / port RC12 |
| פין 18 | OSC2/RC15 — Crystal oscillator output / port RC15 |
| פין 19 | RC13 — I/O port RC13 |
| פין 20 | RC14 — I/O port RC14 |
| פין 21 | VSS — Ground reference |
| פין 22 | VDD — Positive supply for I/O and core logic |
| פין 23 | RA0 — I/O port RA0 |
| פין 24 | RA1 — I/O port RA1 |
| פין 25 | RA2 — I/O port RA2 |
| פין 26 | RA3 — I/O port RA3 |
| פין 27 | RA4 — I/O port RA4 |
| פין 28 | RA5 — I/O port RA5 |
| פין 29 | RA6 — I/O port RA6 |
| פין 30 | RA7 — I/O port RA7 |
| פין 31 | VSS — Ground reference |
| פין 32 | AVDD1 — Analog positive supply 1 |
| פין 33 | AVSS1 — Analog ground 1 |
| פין 34 | RB0 — I/O port RB0 |
| פין 35 | RB1 — I/O port RB1 |
| פין 36 | RB2 — I/O port RB2 |
| פין 37 | RB3 — I/O port RB3 |
| פין 38 | RB4 — I/O port RB4 |
| פין 39 | RB5 — I/O port RB5 |
| פין 40 | RB6 — I/O port RB6 |
| פין 41 | RB7 — I/O port RB7 |
| פין 42 | VSS — Ground reference |
| פין 43 | VDD — Positive supply for I/O and core logic |
| פין 44 | RC1 — I/O port RC1 |
| פין 45 | RC2 — I/O port RC2 |
| פין 46 | RC3 — I/O port RC3 |
| פין 47 | RC4 — I/O port RC4 |
| פין 48 | VSS — Ground reference |
| פין 49 | RC5 — I/O port RC5 |
| פין 50 | RC6 — I/O port RC6 |
| פין 51 | RC7 — I/O port RC7 |
| פין 52 | RC8 — I/O port RC8 |
| פין 53 | RC9 — I/O port RC9 |
| פין 54 | VDD — Positive supply for I/O and core logic |
| פין 55 | VSS — Ground reference |
| פין 56 | RC10 — I/O port RC10 |
| פין 57 | RC11 — I/O port RC11 |
| פין 58 | RD0 — I/O port RD0 |
| פין 59 | RD1 — I/O port RD1 |
| פין 60 | RD8 — I/O port RD8 |
| פין 61 | RD9 — I/O port RD9 |
| פין 62 | RD10 — I/O port RD10 |
| פין 63 | RD11 — I/O port RD11 |
| פין 64 | VSS — Ground reference |
| פין 65 | VDD — Positive supply for I/O and core logic |
| פין 66 | RD12 — I/O port RD12 |
| פין 67 | RD13 — I/O port RD13 |
| פין 68 | RD14 — I/O port RD14 |
| פין 69 | RD15 — I/O port RD15 |
| פין 70 | RF6 — I/O port RF6 |
| פין 71 | RF7 — I/O port RF7 |
| פין 72 | RF8 — I/O port RF8 |
| פין 73 | RF12 — I/O port RF12 |
| פין 74 | VSS — Ground reference |
| פין 75 | RG0 — I/O port RG0 |
| פין 76 | RG1 — I/O port RG1 |
| פין 77 | RG2 — I/O port RG2 |
| פין 78 | RG3 — I/O port RG3 |
| פין 79 | RG6 — I/O port RG6 |
| פין 80 | RG7 — I/O port RG7 |
| פין 81 | RG8 — I/O port RG8 |
| פין 82 | RG9 — I/O port RG9 |
| פין 83 | AVDD2 — Analog positive supply 2 |
| פין 84 | AVSS2 — Analog ground 2 |
| פין 85 | RG12 — I/O port RG12 |
| פין 86 | RG13 — I/O port RG13 |
| פין 87 | RG14 — I/O port RG14 |
| פין 88 | RG15 — I/O port RG15 |
| פין 89 | MCLR — Master Clear (Reset) input, active-low |
| פין 90 | RG0 — I/O port RG0 (secondary) |
| פין 91 | ENV — I/O port ENV |
| פין 92 | PGEC1 — ICSP programming clock 1 |
| פין 93 | PGED1 — ICSP programming data 1 |
| פין 94 | PGEC2 — ICSP programming clock 2 |
| פין 95 | PGED2 — ICSP programming data 2 |
| פין 96 | VSS — Ground reference |
| פין 97 | VDD — Positive supply for I/O and core logic |
| פין 98 | RE0 — I/O port RE0 |
| פין 99 | RE1 — I/O port RE1 |
| פין 100 | RE2 — I/O port RE2 |
יישומים טיפוסיים
DSPIC33FJ256GP710A-H/PF מתאים עבור 6 יישוםs: Automotive HVAC and Body Controllers, Industrial BLDC/PMSM Motor Control, Switch-Mode Power Supply (SMPS) Digital Control, Sensor Signal Processing and Instrumentation, Audio and Speech Processing, CAN-Networked Automotive Sensor Nodes.
Automotive HVAC and Body Controllers
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 Grade 0 qualification and -40 C to +150 C operating range make it ideal for automotive HVAC and body controllers. Its 40 MIPS performance runs multiple CAN/LIN stacks, while 256 KB Flash supports full LIN/CAN/OSEK stacks plus application logic. The integrated CAN 2.0B controller, UART, and LINbus peripherals enable direct bus attachment without external transceivers. The dsPIC33F DSP engine executes PID climate-control loops and motor-control algorithms (BLDC blower, stepper damper) in a single cycle per MAC. The 100-pin TQFP exposes 85 I/O for driving MOSFET gates, reading thermistors, and managing multi-zone sensors. Compared to a discrete MCU plus DSP solution, this single-chip approach reduces PCB area by 40% and BOM cost while maintaining automotive-grade reliability.
מומלץ
Industrial BLDC/PMSM Motor Control
The DSPIC33FJ256GP710A-H/PF delivers deterministic DSP performance needed for field-oriented control (FOC) of BLDC and PMSM motors. Its modified Harvard architecture executes Clarke/Park transforms and PI current loops in single-cycle MAC instructions, achieving sub-10 us control loop times at 40 MIPS. The 9 timers include PWM, input capture for Hall/encoder feedback, and output compare for commutation. 256 KB Flash stores full state-machine firmware plus sensorless observer code. The -H grade supports industrial cabinet temperatures up to 150 C junction. Combined with external gate drivers and shunt resistors, the DSC implements 3-phase sine-wave commutation up to several kW. According to Microchip application notes, this part has been used in pump, fan, and servo drives.
מומלץ
Switch-Mode Power Supply (SMPS) Digital Control
The DSPIC33FJ256GP710A-H/PF is well suited to digitally-controlled power supplies where DSP-loop bandwidth must exceed analog-control limits. Its high-speed ADC with multiple channels supports voltage and current sensing at switching frequencies up to 1 MHz, while the dsPIC DSP engine executes digital compensators in microseconds. 256 KB Flash stores multiple control loops, soft-start sequences, and telemetry stacks, with 30 KB SRAM supporting large lookup tables. The CAN/UART peripherals enable PMBus or CAN-based digital monitoring. The AEC-Q100 grade also enables digital control in automotive SMPS modules (48 V mild-hybrid, LED drivers, on-board chargers). According to the Microchip datasheet, the CTMU supports slope compensation in peak-current-mode topologies without an analog comparator.
מומלץ
Sensor Signal Processing and Instrumentation
The DSPIC33FJ256GP710A-H/PF executes DSP algorithms for sensor signal processing in instrumentation and condition-monitoring equipment. Its 17 x 17-bit single-cycle multiplier and dual 40-bit accumulators compute FIR/IIR filters for predictive-maintenance FFTs, while the 10/12-bit ADC samples vibration, strain-gage, or thermocouple signals. 256 KB Flash stores reference waveforms plus DSP libraries, and 30 KB SRAM supports large ring buffers for vibration captures. The AEC-Q100 grade makes the device suitable for factory automation nodes. The UART/SPI peripherals connect to external ADCs, DACs, or wireless modules, while CAN connectivity enables factory-floor networking. Compared to a separate MCU + DSP architecture, this single-chip DSC solution lowers BOM and simplifies PCB layout.
מומלץ
Audio and Speech Processing
The DSPIC33FJ256GP710A-H/PF's DSP extensions enable real-time audio and speech processing applications including audio effects, noise cancellation, and voice-band codecs. Its dual 40-bit accumulators and barrel shifter implement biquad/FFT processing at sample rates up to 48 kHz with headroom for 16-bit PCM streams. 256 KB Flash stores audio algorithms, while 30 KB SRAM serves audio buffers. The I2S peripheral connects directly to audio DACs/ADCs, while UART supports command interfaces. The DSC achieves deterministic audio processing without DSP overhead that would consume MIPS on a generic microcontroller. According to Microchip application notes, this part is suitable for intercom, hearing-aid, and consumer audio products.
מומלץ
CAN-Networked Automotive Sensor Nodes
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 grade, integrated CAN 2.0B controller, and LINbus support make it ideal for distributed automotive sensor modules. It runs at 40 MIPS while CAN messages stream in/out, leaving headroom for application-level processing of battery, current, pressure, or temperature data. 256 KB Flash accommodates OSEK/AUTOSAR-style stacks plus sensor-fusion code, while 30 KB SRAM supports CAN message buffers and sensor-history logs. The -H grade supports under-hood thermal loads up to 150 C, eliminating expensive thermal management. The 100-pin TQFP exposes 85 I/O for connecting to multiple sensors and actuators. According to Microchip reference designs, this part reduces module BOM by integrating CAN controller and DSP engine in one chip.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור DSPIC33FJ256GP710A-H/PF — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | DSPIC33FJ256GP710A-I/PF | DSPIC33FJ256GP710A-H/PT | DSPIC33FJ256GP710A-I/PT | DSPIC33FJ256GP710-H/PF | DSPIC33FJ256GP710-I/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same |
| CPU Performance | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Program Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Data SRAM | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB |
| Operating Temperature | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) |
| I/O Pins | 85 | 85 | 85 | 85 | 85 | 85 |
| Silicon Revision | A (advanced analog) | A (advanced analog) | A (advanced analog) | A (advanced analog) | Pre-A (original) | Pre-A (original) |
| Approximate Unit Price | $11.85 (qty 1) | Lower (industrial grade) | Similar | Lower (industrial grade) | Similar | Lower (industrial grade) |
מבדילים עיקריים
- Highest temperature grade in TQFP-100 dsPIC33F portfolio (לעומתDSPIC33FJ256GP710A-I/PF)
- Larger body TQFP (14x14) variant for better thermal performance (לעומתDSPIC33FJ256GP710A-H/PT (12x12))
- A silicon revision with advanced analog features (לעומתDSPIC33FJ256GP710-H/PF (pre-A))
- 100-pin TQFP gives highest I/O count in dsPIC33F GP family (לעומתDSPIC33EV256GM103 (64-pin))
הערות תכנון
Power supply decoupling is critical for the DSPIC33FJ256GP710A-H/PF. Place a 10 uF tantalum or ceramic bulk capacitor and a 0.1 uF ceramic capacitor on each VDD/AVDD pair within 5 mm of the pin pair, with the 0.1 uF closest to the IC. Use separate analog and digital ground planes joined at a single point near the IC. The on-chip voltage regulator requires a 10 uF capacitor on the VCAP pin per the Microchip datasheet. Undervoltage/overvoltage conditions may corrupt Flash - add a supervisor or use the internal BOR.
The TQFP-100 (PF) package has a thermal resistance (theta_JA) of approximately 45 C/W on a 2-layer JEDEC test board, and lower on 4-layer PCB designs with thermal vias. For continuous operation at 150 C junction in automotive under-hood environments, use 2 oz copper pours and place thermal vias under the exposed thermal pad if available. The -H grade extends operating range to +150 C junction, but system ambient may require additional heatsinking in enclosed housings. Use the Microchip thermal management application notes to estimate junction temperature for your specific PCB stack-up.
Place the ICSP programming pins (PGEC1/PGED1 and PGEC2/PGED2) on accessible test points or a programming header. Microchip recommends 4.7 kohm pull-up on MCLR with a 100 nF cap to ground for in-circuit programming robustness. Route the crystal traces (OSC1/OSC2) short with guard ground to reduce EMI pickup, and place the load capacitors within 5 mm of the crystal. For high-speed ADC accuracy, keep analog traces away from switching signals and use the dedicated analog ground pin (AVSS1/AVSS2).
Common pitfalls include: (1) forgetting to configure all unused I/O pins as outputs and tie them low to minimize current draw; (2) using the PLL outside its specified input frequency range, causing unreliable startup; (3) leaving the JTAG/ICSP pins unconfigured in firmware, blocking boundary-scan; (4) ignoring the Flash endurance limit of 10,000 erase/write cycles in heavy-rewrite applications - external EEPROM may be needed for high-write workloads. Refer to Microchip errata DS-80593 for known silicon issues and workarounds.
מידע על תאימות
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified for automotive use. Lead-free TQFP-100 (PF) package. Halogen-free. Conflict-mineral compliant per Microchip policy.
