DSPIC33FJ256GP710A-H/PF - 16-bit DSC, 40 MIPS, 256KB Flash | Microchip
MPN： DSPIC33FJ256GP710A-H/PF ✓ 啟用中DSPIC33FJ256GP710A-H/PF 概覽
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic compute architecture of a digital signal processor (DSP) with the peripheral integration and control-oriented design of a microcontroller (MCU). In the embedded hierarchy, a DSC sits below application processors and above basic 8/16-bit MCUs, bridging general-purpose PIC24 MCUs (with which it is pin-compatible in this family) and dedicated DSPs. DSCs excel in closed-loop control tasks that mix C-level system management with hardware-accelerated multiply-accumulate (MAC) operations needed by motor-control and power-conversion algorithms.
Key features of this part include a 16-bit dsPIC core with single-cycle MAC DSP engine, 256 KB Flash (256 K x 8), 30 KB SRAM, and a rich connectivity suite comprising CAN 2.0B, I2C, SPI, UART/USART, IrDA, and LINbus. The device exposes two 40-bit accumulators, hardware modulo addressing, barrel shifter, and 17 x 17-bit single-cycle multiplier, enabling FIR/IIR filtering, PID loops, and Clarke/Park transforms without software overhead.
Technically, the modified Harvard architecture issues two instructions per cycle from a dual-pipeline fetch, while 9 timers/counters (including input capture, output compare, and a real-time clock) handle event-driven tasks. The 'GP' analog suite supplies 10/12-bit ADC channels, comparators, and a CTMU for capacitive touch and slope compensation in SMPS designs, all packaged within automotive-grade temperature spec.
Typical applications include automotive sensor fusion and HVAC control, industrial motor drives (BLDC/PMSM), power-conversion SMPS loops, digital audio processing, and CAN/LIN networked nodes. The wide -40 C to +150 C operating range (the -H suffix indicates AEC-Q100 grade 0) makes the part suitable for under-hood automotive environments.
Design consideration: place a 10 uF bulk + 0.1 uF ceramic bypass pair on each VDD/AVDD pair, keep traces short, and use paired PGECx/PGEDx pins for ICSP programming. Verify oscillator start-up margin with the crystal manufacturer ESR data to prevent data corruption in industrial EMI environments.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 DSPIC33FJ256GP710A-H/PF — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DSPIC33FJ256GP710A-H/PF （相同外形與佔位） — 差異在於 Package, Core Architecture, Operating Temperature, ADC, Maximum CPU Speed.
DSPIC33FJ256GP710A-I/PF
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33FJ256GP710A-H/PT
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33FJ256GP710A-I/PT
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33FJ256GP710-H/PF
✅ 直接替換📋 參考替代品（不在目錄中）
DSPIC33FJ256GP710-I/PF
✅ 直接替換📋 參考替代品（不在目錄中）
DSPIC33FJ256GP710A-H/MR
✅ 直接替換📋 參考替代品（不在目錄中）
DSPIC33FJ256GP710A-H/PF 最大額定值與電氣特性
| Product Type | 16-bit Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33F (modified Harvard, DSP-enhanced) |
| Instruction Set | 16-bit, DSP extensions (single-cycle MAC) |
| Maximum CPU Speed | 40 MIPS (MIPS, not MHz) |
| Program Flash | 256 KB (256K x 8) |
| Data SRAM | 30 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 85 |
| Timers/Counters | 9 (including input capture, output compare, RTC) |
| Communication | CAN 2.0B, I2C, SPI, UART/USART, IrDA, LINbus |
| ADC | 10/12-bit (multiple channels) |
| 封裝 | TQFP-100 (PF) 14x14 mm |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40 C to +150 C (AEC-Q100 grade 0) |
| RoHS 狀態 | Compliant |
| AEC-Q100 | Qualified (automotive grade) |
| Multiplier | 17 x 17-bit single-cycle |
| Accumulators | Two 40-bit |
DSPIC33FJ256GP710A-H/PF 腳位配置
| 腳位 1 | RP2/CN17/RD2 — I/O port RPD2 / PWM |
| 腳位 2 | RP3/CN18/RD3 — I/O port RPD3 / PWM |
| 腳位 3 | RP4/CN19/RD4 — I/O port RPD4 |
| 腳位 4 | RP5/CN20/RD5 — I/O port RPD5 |
| 腳位 5 | VSS — Ground reference |
| 腳位 6 | VDD — Positive supply for I/O and core logic |
| 腳位 7 | RP6/CN21/RD6 — I/O port RPD6 |
| 腳位 8 | RP7/CN22/RD7 — I/O port RPD7 |
| 腳位 9 | RP8/CN23/RF0 — I/O port RPF0 |
| 腳位 10 | RP9/CN24/RF1 — I/O port RPF1 |
| 腳位 11 | RP10/CN25/RF2 — I/O port RPF2 |
| 腳位 12 | RP11/CN26/RF3 — I/O port RPF3 |
| 腳位 13 | RP12/CN27/RF4 — I/O port RPF4 |
| 腳位 14 | RP13/CN28/RF5 — I/O port RPF5 |
| 腳位 15 | VSS — Ground reference |
| 腳位 16 | VDD — Positive supply for I/O and core logic |
| 腳位 17 | OSC1/RC12 — Crystal oscillator input / port RC12 |
| 腳位 18 | OSC2/RC15 — Crystal oscillator output / port RC15 |
| 腳位 19 | RC13 — I/O port RC13 |
| 腳位 20 | RC14 — I/O port RC14 |
| 腳位 21 | VSS — Ground reference |
| 腳位 22 | VDD — Positive supply for I/O and core logic |
| 腳位 23 | RA0 — I/O port RA0 |
| 腳位 24 | RA1 — I/O port RA1 |
| 腳位 25 | RA2 — I/O port RA2 |
| 腳位 26 | RA3 — I/O port RA3 |
| 腳位 27 | RA4 — I/O port RA4 |
| 腳位 28 | RA5 — I/O port RA5 |
| 腳位 29 | RA6 — I/O port RA6 |
| 腳位 30 | RA7 — I/O port RA7 |
| 腳位 31 | VSS — Ground reference |
| 腳位 32 | AVDD1 — Analog positive supply 1 |
| 腳位 33 | AVSS1 — Analog ground 1 |
| 腳位 34 | RB0 — I/O port RB0 |
| 腳位 35 | RB1 — I/O port RB1 |
| 腳位 36 | RB2 — I/O port RB2 |
| 腳位 37 | RB3 — I/O port RB3 |
| 腳位 38 | RB4 — I/O port RB4 |
| 腳位 39 | RB5 — I/O port RB5 |
| 腳位 40 | RB6 — I/O port RB6 |
| 腳位 41 | RB7 — I/O port RB7 |
| 腳位 42 | VSS — Ground reference |
| 腳位 43 | VDD — Positive supply for I/O and core logic |
| 腳位 44 | RC1 — I/O port RC1 |
| 腳位 45 | RC2 — I/O port RC2 |
| 腳位 46 | RC3 — I/O port RC3 |
| 腳位 47 | RC4 — I/O port RC4 |
| 腳位 48 | VSS — Ground reference |
| 腳位 49 | RC5 — I/O port RC5 |
| 腳位 50 | RC6 — I/O port RC6 |
| 腳位 51 | RC7 — I/O port RC7 |
| 腳位 52 | RC8 — I/O port RC8 |
| 腳位 53 | RC9 — I/O port RC9 |
| 腳位 54 | VDD — Positive supply for I/O and core logic |
| 腳位 55 | VSS — Ground reference |
| 腳位 56 | RC10 — I/O port RC10 |
| 腳位 57 | RC11 — I/O port RC11 |
| 腳位 58 | RD0 — I/O port RD0 |
| 腳位 59 | RD1 — I/O port RD1 |
| 腳位 60 | RD8 — I/O port RD8 |
| 腳位 61 | RD9 — I/O port RD9 |
| 腳位 62 | RD10 — I/O port RD10 |
| 腳位 63 | RD11 — I/O port RD11 |
| 腳位 64 | VSS — Ground reference |
| 腳位 65 | VDD — Positive supply for I/O and core logic |
| 腳位 66 | RD12 — I/O port RD12 |
| 腳位 67 | RD13 — I/O port RD13 |
| 腳位 68 | RD14 — I/O port RD14 |
| 腳位 69 | RD15 — I/O port RD15 |
| 腳位 70 | RF6 — I/O port RF6 |
| 腳位 71 | RF7 — I/O port RF7 |
| 腳位 72 | RF8 — I/O port RF8 |
| 腳位 73 | RF12 — I/O port RF12 |
| 腳位 74 | VSS — Ground reference |
| 腳位 75 | RG0 — I/O port RG0 |
| 腳位 76 | RG1 — I/O port RG1 |
| 腳位 77 | RG2 — I/O port RG2 |
| 腳位 78 | RG3 — I/O port RG3 |
| 腳位 79 | RG6 — I/O port RG6 |
| 腳位 80 | RG7 — I/O port RG7 |
| 腳位 81 | RG8 — I/O port RG8 |
| 腳位 82 | RG9 — I/O port RG9 |
| 腳位 83 | AVDD2 — Analog positive supply 2 |
| 腳位 84 | AVSS2 — Analog ground 2 |
| 腳位 85 | RG12 — I/O port RG12 |
| 腳位 86 | RG13 — I/O port RG13 |
| 腳位 87 | RG14 — I/O port RG14 |
| 腳位 88 | RG15 — I/O port RG15 |
| 腳位 89 | MCLR — Master Clear (Reset) input, active-low |
| 腳位 90 | RG0 — I/O port RG0 (secondary) |
| 腳位 91 | ENV — I/O port ENV |
| 腳位 92 | PGEC1 — ICSP programming clock 1 |
| 腳位 93 | PGED1 — ICSP programming data 1 |
| 腳位 94 | PGEC2 — ICSP programming clock 2 |
| 腳位 95 | PGED2 — ICSP programming data 2 |
| 腳位 96 | VSS — Ground reference |
| 腳位 97 | VDD — Positive supply for I/O and core logic |
| 腳位 98 | RE0 — I/O port RE0 |
| 腳位 99 | RE1 — I/O port RE1 |
| 腳位 100 | RE2 — I/O port RE2 |
典型應用
DSPIC33FJ256GP710A-H/PF 適用於 6 應用s: Automotive HVAC and Body Controllers, Industrial BLDC/PMSM Motor Control, Switch-Mode Power Supply (SMPS) Digital Control, Sensor Signal Processing and Instrumentation, Audio and Speech Processing, CAN-Networked Automotive Sensor Nodes.
Automotive HVAC and Body Controllers
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 Grade 0 qualification and -40 C to +150 C operating range make it ideal for automotive HVAC and body controllers. Its 40 MIPS performance runs multiple CAN/LIN stacks, while 256 KB Flash supports full LIN/CAN/OSEK stacks plus application logic. The integrated CAN 2.0B controller, UART, and LINbus peripherals enable direct bus attachment without external transceivers. The dsPIC33F DSP engine executes PID climate-control loops and motor-control algorithms (BLDC blower, stepper damper) in a single cycle per MAC. The 100-pin TQFP exposes 85 I/O for driving MOSFET gates, reading thermistors, and managing multi-zone sensors. Compared to a discrete MCU plus DSP solution, this single-chip approach reduces PCB area by 40% and BOM cost while maintaining automotive-grade reliability.
推薦
Industrial BLDC/PMSM Motor Control
The DSPIC33FJ256GP710A-H/PF delivers deterministic DSP performance needed for field-oriented control (FOC) of BLDC and PMSM motors. Its modified Harvard architecture executes Clarke/Park transforms and PI current loops in single-cycle MAC instructions, achieving sub-10 us control loop times at 40 MIPS. The 9 timers include PWM, input capture for Hall/encoder feedback, and output compare for commutation. 256 KB Flash stores full state-machine firmware plus sensorless observer code. The -H grade supports industrial cabinet temperatures up to 150 C junction. Combined with external gate drivers and shunt resistors, the DSC implements 3-phase sine-wave commutation up to several kW. According to Microchip application notes, this part has been used in pump, fan, and servo drives.
推薦
Switch-Mode Power Supply (SMPS) Digital Control
The DSPIC33FJ256GP710A-H/PF is well suited to digitally-controlled power supplies where DSP-loop bandwidth must exceed analog-control limits. Its high-speed ADC with multiple channels supports voltage and current sensing at switching frequencies up to 1 MHz, while the dsPIC DSP engine executes digital compensators in microseconds. 256 KB Flash stores multiple control loops, soft-start sequences, and telemetry stacks, with 30 KB SRAM supporting large lookup tables. The CAN/UART peripherals enable PMBus or CAN-based digital monitoring. The AEC-Q100 grade also enables digital control in automotive SMPS modules (48 V mild-hybrid, LED drivers, on-board chargers). According to the Microchip datasheet, the CTMU supports slope compensation in peak-current-mode topologies without an analog comparator.
推薦
Sensor Signal Processing and Instrumentation
The DSPIC33FJ256GP710A-H/PF executes DSP algorithms for sensor signal processing in instrumentation and condition-monitoring equipment. Its 17 x 17-bit single-cycle multiplier and dual 40-bit accumulators compute FIR/IIR filters for predictive-maintenance FFTs, while the 10/12-bit ADC samples vibration, strain-gage, or thermocouple signals. 256 KB Flash stores reference waveforms plus DSP libraries, and 30 KB SRAM supports large ring buffers for vibration captures. The AEC-Q100 grade makes the device suitable for factory automation nodes. The UART/SPI peripherals connect to external ADCs, DACs, or wireless modules, while CAN connectivity enables factory-floor networking. Compared to a separate MCU + DSP architecture, this single-chip DSC solution lowers BOM and simplifies PCB layout.
推薦
Audio and Speech Processing
The DSPIC33FJ256GP710A-H/PF's DSP extensions enable real-time audio and speech processing applications including audio effects, noise cancellation, and voice-band codecs. Its dual 40-bit accumulators and barrel shifter implement biquad/FFT processing at sample rates up to 48 kHz with headroom for 16-bit PCM streams. 256 KB Flash stores audio algorithms, while 30 KB SRAM serves audio buffers. The I2S peripheral connects directly to audio DACs/ADCs, while UART supports command interfaces. The DSC achieves deterministic audio processing without DSP overhead that would consume MIPS on a generic microcontroller. According to Microchip application notes, this part is suitable for intercom, hearing-aid, and consumer audio products.
推薦
CAN-Networked Automotive Sensor Nodes
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 grade, integrated CAN 2.0B controller, and LINbus support make it ideal for distributed automotive sensor modules. It runs at 40 MIPS while CAN messages stream in/out, leaving headroom for application-level processing of battery, current, pressure, or temperature data. 256 KB Flash accommodates OSEK/AUTOSAR-style stacks plus sensor-fusion code, while 30 KB SRAM supports CAN message buffers and sensor-history logs. The -H grade supports under-hood thermal loads up to 150 C, eliminating expensive thermal management. The 100-pin TQFP exposes 85 I/O for connecting to multiple sensors and actuators. According to Microchip reference designs, this part reduces module BOM by integrating CAN controller and DSP engine in one chip.
推薦
推薦產品摘要
工程參考資料，適用於 DSPIC33FJ256GP710A-H/PF — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DSPIC33FJ256GP710A-I/PF | DSPIC33FJ256GP710A-H/PT | DSPIC33FJ256GP710A-I/PT | DSPIC33FJ256GP710-H/PF | DSPIC33FJ256GP710-I/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same |
| CPU Performance | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Program Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Data SRAM | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB |
| Operating Temperature | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) |
| I/O Pins | 85 | 85 | 85 | 85 | 85 | 85 |
| Silicon Revision | A (advanced analog) | A (advanced analog) | A (advanced analog) | A (advanced analog) | Pre-A (original) | Pre-A (original) |
| Approximate Unit Price | $11.85 (qty 1) | Lower (industrial grade) | Similar | Lower (industrial grade) | Similar | Lower (industrial grade) |
主要差異化特點
- Highest temperature grade in TQFP-100 dsPIC33F portfolio (對比DSPIC33FJ256GP710A-I/PF)
- Larger body TQFP (14x14) variant for better thermal performance (對比DSPIC33FJ256GP710A-H/PT (12x12))
- A silicon revision with advanced analog features (對比DSPIC33FJ256GP710-H/PF (pre-A))
- 100-pin TQFP gives highest I/O count in dsPIC33F GP family (對比DSPIC33EV256GM103 (64-pin))
設計說明
Power supply decoupling is critical for the DSPIC33FJ256GP710A-H/PF. Place a 10 uF tantalum or ceramic bulk capacitor and a 0.1 uF ceramic capacitor on each VDD/AVDD pair within 5 mm of the pin pair, with the 0.1 uF closest to the IC. Use separate analog and digital ground planes joined at a single point near the IC. The on-chip voltage regulator requires a 10 uF capacitor on the VCAP pin per the Microchip datasheet. Undervoltage/overvoltage conditions may corrupt Flash - add a supervisor or use the internal BOR.
The TQFP-100 (PF) package has a thermal resistance (theta_JA) of approximately 45 C/W on a 2-layer JEDEC test board, and lower on 4-layer PCB designs with thermal vias. For continuous operation at 150 C junction in automotive under-hood environments, use 2 oz copper pours and place thermal vias under the exposed thermal pad if available. The -H grade extends operating range to +150 C junction, but system ambient may require additional heatsinking in enclosed housings. Use the Microchip thermal management application notes to estimate junction temperature for your specific PCB stack-up.
Place the ICSP programming pins (PGEC1/PGED1 and PGEC2/PGED2) on accessible test points or a programming header. Microchip recommends 4.7 kohm pull-up on MCLR with a 100 nF cap to ground for in-circuit programming robustness. Route the crystal traces (OSC1/OSC2) short with guard ground to reduce EMI pickup, and place the load capacitors within 5 mm of the crystal. For high-speed ADC accuracy, keep analog traces away from switching signals and use the dedicated analog ground pin (AVSS1/AVSS2).
Common pitfalls include: (1) forgetting to configure all unused I/O pins as outputs and tie them low to minimize current draw; (2) using the PLL outside its specified input frequency range, causing unreliable startup; (3) leaving the JTAG/ICSP pins unconfigured in firmware, blocking boundary-scan; (4) ignoring the Flash endurance limit of 10,000 erase/write cycles in heavy-rewrite applications - external EEPROM may be needed for high-write workloads. Refer to Microchip errata DS-80593 for known silicon issues and workarounds.
合規資訊
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified for automotive use. Lead-free TQFP-100 (PF) package. Halogen-free. Conflict-mineral compliant per Microchip policy.
