EP1SGX25DE672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
MPN: EP1SGX25DE672C7 ✗ סוף ייצורEP1SGX25DE672C7 סקירה
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that combines programmable logic blocks, programmable interconnects, and programmable I/O cells. The Stratix GX product line extends this architecture with dedicated high-speed transceiver channels, supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and Fibre Channel. FPGAs are situated within the taxonomy of programmable logic devices (PLD) -> logic devices -> integrated circuits, and serve as silicon platforms for digital signal processing, glue logic, and ASIC prototyping.
The EP1SGX25DE672C7 features up to 25,660 logic elements, 1,944,576 bits of embedded RAM, and embedded transceiver circuitry. Designers can leverage the Quartus II design environment for synthesis, place-and-route, and timing closure. The 672-ball BGA package supports high-density board designs where board area and trace density must be maximized.
Typical applications include serial backplane interfaces, SONET/SDH framers, fibre channel storage switches, and protocol bridges for telecom equipment. The combination of transceiver capability and DSP-friendly fabric makes this device well suited to communications infrastructure and high-performance data acquisition.
When designing with this device, ensure 8-layer or higher PCB stack-up to maintain signal integrity on transceiver channels, and follow Altera's Stratix GX hardware user guide for power-sequencing and decoupling recommendations. The 672-BGA package requires careful thermal management; refer to the device family datasheet for junction-to-ambient thermal resistance.
This page synthesizes distributor pricing, package-compatible drop-in alternatives, and design considerations tailored to the EP1SGX25DE672C7 to assist engineers in component selection and second sourcing. Information here complements the official Altera device handbook.
חלופות תחליף ישיר עבור EP1SGX25DE672C7 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP1SGX25DE672C7 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Operating Temperature, Process Technology, Speed Grade, Mounting Type.
EP1SGX25DF672C7
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25CF672C7
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25CF672C7N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25CF672I7
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25CF672C6
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25CF672C5
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25DE672C7 דירוגים מרביים ומאפיינים חשמליים
| Series | Stratix GX |
| Family Name | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| Number of Logic Array Blocks | 455 |
| Number of I/O | 372 |
| מתח אספקה פעיל | 1.5 V core (typical) |
| Speed Grade | C7 |
| טווח טמפרטורת פעולה | -40C to +85C |
| סוג הרכבה | Surface Mount |
| מארז | 672-BGA (FineLine BGA) |
| Embedded Transceivers | Multi-gigabit serial transceivers |
| Design Tool | Altera Quartus II |
| Sub-Family | Stratix GX |
תצורת פינים של EP1SGX25DE672C7
| פין A1 | VCCINT — Internal core voltage supply |
| פין A2 | GND — Ground reference |
| פין B1 | VCCIO_BANK_1 — I/O bank 1 voltage supply |
| פין B2 | IO[0] — User I/O pin |
| פין C1 | GXB_RX_P[0] — Transceiver channel 0 positive receive |
| פין C2 | GXB_RX_N[0] — Transceiver channel 0 negative receive |
| פין D1 | GXB_TX_P[0] — Transceiver channel 0 positive transmit |
| פין D2 | GXB_TX_N[0] — Transceiver channel 0 negative transmit |
| פין E1 | nCONFIG — Configuration control (active low) |
| פין E2 | nSTATUS — Configuration status (active low) |
| פין F1 | CONF_DONE — Configuration complete (active high) |
| פין F2 | MSEL0 — Configuration mode select |
| פין G1 | MSEL1 — Configuration mode select |
| פין G2 | CLK0 — Dedicated clock input 0 |
| פין H1 | CLK1 — Dedicated clock input 1 |
יישומים טיפוסיים
EP1SGX25DE672C7 מתאים עבור 6 יישוםs: Communications Backplane Interface, Fibre Channel Storage Switch, SONET/SDH Framer, Protocol Bridge / ASIC Prototyping, Broadband Access Equipment, Test and Measurement Instrumentation.
Communications Backplane Interface
The EP1SGX25DE672C7 is well suited for multi-gigabit serial backplane interfaces in telecom switching equipment. The Stratix GX family's embedded transceivers support protocols including Serial RapidIO, PCI Express, and Gigabit Ethernet at line rates up to 3.125 Gbps. The 25,660 logic elements provide sufficient fabric for protocol framing and link-layer state machines, while the 1,944,576 RAM bits accommodate packet buffers and lookup tables.
מומלץ
Fibre Channel Storage Switch
Storage Area Networking equipment requiring 1G/2G Fibre Channel ports can leverage the EP1SGX25DE672C7 as a protocol-bridging FPGA. The embedded transceivers map directly to FC physical-layer interfaces, while the programmable fabric implements the FC-2 layer framing and buffer-to-buffer credit management. Designers typically instantiate two transceivers per FC port and dedicate roughly 6,000 LEs to the FC-2 protocol engine.
מומלץ
SONET/SDH Framer
The EP1SGX25DE672C7 supports SONET OC-48/STM-16 framer applications at 2.488 Gbps line rates. The transceiver channels connect to optical modules via SFP interfaces, while the fabric implements section/line/path overhead processing, pointer justification, and scrambling per Telcordia GR-253. The 1,944,576 embedded RAM bits provide ample bandwidth for payload mapping and concatenation.
מומלץ
Protocol Bridge / ASIC Prototyping
The EP1SGX25DE672C7 serves as an ASIC prototyping platform for designs targeting 90 nm ASIC flows. With 25,660 LEs and abundant M-RAM blocks, the device maps near-100 percent of mid-complexity ASIC netlists. The 672-BGA package exposes sufficient user I/O (372 pins) to replicate production ASIC pin counts, while transceiver channels emulate high-speed SERDES for pre-silicon validation.
מומלץ
Broadband Access Equipment
Broadband DSLAM and cable-modem termination systems deploy the EP1SGX25DE672C7 to bridge between network processors and PHY devices. The transceiver channels connect to backplane SERDES at multi-gigabit rates, while the fabric performs traffic shaping, queue management, and ATM/Ethernet protocol adaptation. The 85C operating temperature and industrial qualification suit central-office deployment.
מומלץ
Test and Measurement Instrumentation
The EP1SGX25DE672C7 supports high-end logic analyzer and protocol-analyzer applications requiring rapid pattern generation and parallel acquisition. The transceiver channels capture multi-gigabit serial streams, while the fabric performs triggering, pattern matching, and protocol decode at wire speed. The 1,944,576 embedded RAM bits buffer deep acquisition traces for post-processing.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP1SGX25DE672C7 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP1SGX25DF672C7 | EP1SGX25CF672C7 | EP1SGX25CF672C7N | EP1SGX25CF672I7 | EP1SGX25CF672C6 | EP1SGX25CF672C5 |
|---|---|---|---|---|---|---|---|
| Package | 672-BGA | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | C7 | C7 | C7 | C7 | I7 (industrial) | C6 (slower) | C5 (slowest) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +100C (industrial) | -40C to +85C | -40C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Number of I/O | 372 | 372 | 372 | 372 | 372 | 372 | 372 |
מבדילים עיקריים
- Same-fabric drop-in alternative in identical 672-BGA package (לעומתEP1SGX25DF672C7)
- Industrial temperature variant available (לעומתEP1SGX25CF672I7)
- Multiple speed-grade variants support flexibility (לעומתEP1SGX25CF672C5, EP1SGX25CF672C6)
הערות תכנון
The 672-BGA package requires 8-layer or higher PCB stack-up to maintain signal integrity on the multi-gigabit transceiver channels. Use a controlled-impedance stack-up with 50 ohm single-ended and 100 ohm differential traces. Place transceiver channels first in the pin assignment, route on the top layer, and reference them to a continuous ground plane.
Estimated: At 1.5V core and full utilization, the EP1SGX25DE672C7 dissipates roughly 3-5W of dynamic power. With the 672-BGA thermal pad and 1 square inch of copper pour, junction-to-ambient thermal resistance is approximately 8-12 C/W, yielding a 24-60C temperature rise above ambient. Improve cooling by exposing the thermal pad to an internal ground plane and providing airflow.
Do not apply core voltage before I/O banks are powered. Sequence VCCINT, then VCCIO, then VCCA, following the Stratix GX power-supply sequencing specification in the device handbook. Reverse power sequencing can latch-up the I/O cells and damage the device permanently. Add power-good supervisory circuits to enforce proper sequencing.
מידע על תאימות
Compliance status not present in the Verified Web Data. Many Stratix GX 672-BGA variants were offered in both leaded and lead-free packages (the 'N' suffix typically denotes lead-free finish). Confirm RoHS/REACH compliance with the distributor before use in restricted markets.
