PIC32MZ1025DAR176-V/2J - 200MHz MCU, 1MB Flash, 176-LQFP | Microchip
MPN: PIC32MZ1025DAR176-V/2J ✓ פעילPIC32MZ1025DAR176-V/2J סקירה
What is a 32-bit graphics microcontroller? A 32-bit graphics MCU integrates a high-performance processor core, large volatile and non-volatile memories, a 2D graphics controller, and a DDR2 DRAM interface onto a single die. Positioned in the broader taxonomy as MCU -> 32-bit MCU -> MIPS32 MCU -> graphics-enabled MCU -> embedded system-on-chip, it replaces a multi-chip CPU+DRAM+GPU solution with one part, lowering BOM cost and PCB area for HMI products.
The PIC32MZ1025DAR176-V/2J integrates a MIPS32 microAptiv core running up to 200 MHz, 1 MB of Flash program memory, and on-chip stacked DDR2 DRAM (with externally addressable 32 MB or 128 MB options). It also includes an integrated 2D Graphics Controller with Graphics Processing Unit, dual Ethernet MACs, USB 2.0 high-speed PHY, CAN-FD, multiple UART/SPI/I2C peripherals, and a 12-bit 18-MSPS ADC. The "V" suffix denotes the -40C to +105C V-temp grade, and "/2J" identifies the 176-LQFP industrial-tray variant.
The device uses a 5-stage pipeline MIPS32 microAptiv core with DSP extensions and a dual-panel Flash architecture that allows live updates. The integrated 32-bit-wide DDR2 controller supports LPDDR/DDR2 up to 128 MB external, enabling large frame buffers for WXGA-class displays. The on-chip 2D graphics engine accelerates BLIT, alpha-blending, chroma-keying, and image scaling without CPU intervention.
Typical applications include industrial HMI panels, factory automation displays, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, and connected IoT gateways with TFT LCDs. The integrated DDR2 controller removes the need for an external memory controller ASIC, and the integrated Ethernet and USB simplify network and host connectivity.
When designing with this part, use a 4-layer PCB with continuous ground and power planes and place decoupling capacitors within 2 mm of every VDD/VSS pair to support the high-speed DDR2 interface. Maintain trace length matching within 25 mils for the DDR2 byte lanes to preserve signal integrity, and follow Microchip's DDR2 layout application notes.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MZ family, and practical design notes not found in the standalone manufacturer datasheet.
חלופות תחליף ישיר עבור PIC32MZ1025DAR176-V/2J — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC32MZ1025DAR176-V/2J (אותו גורם צורה וטביעת רגל) — שונים ב Graphics Controller, CAN, USB, External Memory Interface, Core Architecture.
PIC32MZ1025DAR176-I/2J
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC32MZ1025DAL176-I/2J
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ1025DAB176T-I/2J
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ1025DAR169T-I/6J
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ1025DAR176-V/2J דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAR family) |
| Core Clock Speed | 200 MHz max |
| Program Flash Memory | 1 MB (1M x 8) |
| On-chip DRAM | Stacked DDR2 (32 MB or 128 MB externally addressable per family datasheet) |
| מארז | 176-LQFP (20x20 mm) |
| Operating Temperature (V-temp) | -40C to +105C |
| Graphics Controller | Integrated 2D Graphics Controller + GPU |
| Display Interface | TFT LCD controller (resolutions per family datasheet) |
| Ethernet | Dual 10/100 Ethernet MAC with integrated PHY option |
| USB | USB 2.0 High-Speed with integrated PHY |
| CAN | CAN-FD |
| ADC | 12-bit, up to 18 MSPS |
| Serial Peripherals | UART, SPI, I2C (multiple instances per datasheet) |
| מתח אספקה | Per family datasheet (typical 3.3 V I/O) |
| סוג הרכבה | Surface Mount (LQFP) |
| סטטוס RoHS | Compliant per Microchip product page |
| Part Status | In Production (per Microchip product page) |
תצורת פינים של PIC32MZ1025DAR176-V/2J
| פין 1 | OSC1/CLKI/RC11 — External oscillator input or general I/O (per family datasheet) |
| פין 2 | OSC2/CLKO/RC12 — External oscillator output or general I/O |
| פין 3 | VSS — Ground reference |
| פין 4 | VDD — Core supply voltage (per family datasheet) |
| פין 5 | PGEC1 — ICSP programming clock / general I/O |
| פין 6 | PGED1 — ICSP programming data / general I/O |
| פין 7 | RB0 — General purpose I/O |
| פין 8 | RB1 — General purpose I/O |
| פין 9 | RB2 — General purpose I/O |
| פין 10 | RB3 — General purpose I/O |
| פין 11 | RB4 — General purpose I/O |
| פין 12 | RB5 — General purpose I/O |
| פין 13 | RB6 — General purpose I/O |
| פין 14 | RB7 — General purpose I/O |
| פין 15 | VSS — Ground reference |
| פין 16 | VDD — Core supply voltage |
| פין 17 | RC0 — General purpose I/O / UART1 RX |
| פין 18 | RC1 — General purpose I/O / UART1 TX |
| פין 19 | RC2 — General purpose I/O |
| פין 20 | RC3 — General purpose I/O |
| פין 21 | RC4 — General purpose I/O |
| פין 22 | RC5 — General purpose I/O |
| פין 23 | RC6 — General purpose I/O |
| פין 24 | RC7 — General purpose I/O |
| פין 25 | RC8 — General purpose I/O |
| פין 26 | RC9 — General purpose I/O |
| פין 27 | VSS — Ground reference |
| פין 28 | VDD — Core supply voltage |
| פין 29 | RD0 — General purpose I/O |
| פין 30 | RD1 — General purpose I/O |
| פין 31 | RD2 — General purpose I/O |
| פין 32 | RD3 — General purpose I/O |
| פין 33 | RD4 — General purpose I/O |
| פין 34 | RD5 — General purpose I/O |
| פין 35 | RD6 — General purpose I/O |
| פין 36 | RD7 — General purpose I/O |
| פין 37 | RD8 — General purpose I/O |
| פין 38 | RD9 — General purpose I/O |
| פין 39 | RD10 — General purpose I/O |
| פין 40 | RD11 — General purpose I/O |
| פין 41 | RD12 — General purpose I/O |
| פין 42 | RD13 — General purpose I/O |
| פין 43 | RD14 — General purpose I/O |
| פין 44 | RD15 — General purpose I/O |
| פין 45 | VSS — Ground reference |
| פין 46 | VDD — Core supply voltage |
| פין 47 | RE0 — General purpose I/O |
| פין 48 | RE1 — General purpose I/O |
| פין 49 | RE2 — General purpose I/O |
| פין 50 | RE3 — General purpose I/O |
| פין 51 | RE4 — General purpose I/O |
| פין 52 | RE5 — General purpose I/O |
| פין 53 | RE6 — General purpose I/O |
| פין 54 | RE7 — General purpose I/O |
| פין 55 | VSS — Ground reference |
| פין 56 | VDD — Core supply voltage |
| פין 57 | RF0 — General purpose I/O |
| פין 58 | RF1 — General purpose I/O |
| פין 59 | RF2 — General purpose I/O |
| פין 60 | RF3 — General purpose I/O |
| פין 61 | RF4 — General purpose I/O |
| פין 62 | RF5 — General purpose I/O |
| פין 63 | RF6 — General purpose I/O |
| פין 64 | RF7 — General purpose I/O |
| פין 65 | RF8 — General purpose I/O |
| פין 66 | RF9 — General purpose I/O |
| פין 67 | RF10 — General purpose I/O |
| פין 68 | RF11 — General purpose I/O |
| פין 69 | RF12 — General purpose I/O |
| פין 70 | RF13 — General purpose I/O |
| פין 71 | VSS — Ground reference |
| פין 72 | VDD — Core supply voltage |
| פין 73 | RG0 — General purpose I/O |
| פין 74 | RG1 — General purpose I/O |
| פין 75 | RG2 — General purpose I/O |
| פין 76 | RG3 — General purpose I/O |
| פין 77 | RG6 — General purpose I/O |
| פין 78 | RG7 — General purpose I/O |
| פין 79 | RG8 — General purpose I/O |
| פין 80 | RG9 — General purpose I/O |
| פין 81 | VSS — Ground reference |
| פין 82 | VDD — Core supply voltage |
| פין 83 | RH0 — General purpose I/O |
| פין 84 | RH1 — General purpose I/O |
| פין 85 | RH2 — General purpose I/O |
| פין 86 | RH3 — General purpose I/O |
| פין 87 | RH4 — General purpose I/O |
| פין 88 | RH5 — General purpose I/O |
| פין 89 | RH6 — General purpose I/O |
| פין 90 | RH7 — General purpose I/O |
| פין 91 | RH8 — General purpose I/O |
| פין 92 | RH9 — General purpose I/O |
| פין 93 | RH10 — General purpose I/O |
| פין 94 | RH11 — General purpose I/O |
| פין 95 | RH12 — General purpose I/O |
| פין 96 | RH13 — General purpose I/O |
| פין 97 | RH14 — General purpose I/O |
| פין 98 | RH15 — General purpose I/O |
| פין 99 | VSS — Ground reference |
| פין 100 | VDD — Core supply voltage |
| פין 101 | RJ0 — General purpose I/O |
| פין 102 | RJ1 — General purpose I/O |
| פין 103 | RJ2 — General purpose I/O |
| פין 104 | RJ3 — General purpose I/O |
| פין 105 | RJ4 — General purpose I/O |
| פין 106 | RJ5 — General purpose I/O |
| פין 107 | RJ6 — General purpose I/O |
| פין 108 | RJ7 — General purpose I/O |
| פין 109 | RJ8 — General purpose I/O |
| פין 110 | RJ9 — General purpose I/O |
| פין 111 | RJ10 — General purpose I/O |
| פין 112 | RJ11 — General purpose I/O |
| פין 113 | VSS — Ground reference |
| פין 114 | VDD — Core supply voltage |
| פין 115 | RK0 — General purpose I/O |
| פין 116 | RK1 — General purpose I/O |
| פין 117 | RK2 — General purpose I/O |
| פין 118 | RK3 — General purpose I/O |
| פין 119 | RK4 — General purpose I/O |
| פין 120 | RK5 — General purpose I/O |
| פין 121 | RK6 — General purpose I/O |
| פין 122 | RK7 — General purpose I/O |
| פין 123 | VSS — Ground reference |
| פין 124 | VDD — Core supply voltage |
| פין 125 | RL0 — General purpose I/O |
| פין 126 | RL1 — General purpose I/O |
| פין 127 | RL2 — General purpose I/O |
| פין 128 | RL3 — General purpose I/O |
| פין 129 | RL4 — General purpose I/O |
| פין 130 | RL5 — General purpose I/O |
| פין 131 | RL6 — General purpose I/O |
| פין 132 | RL7 — General purpose I/O |
| פין 133 | VSS — Ground reference |
| פין 134 | VDD — Core supply voltage |
| פין 135 | TDO — JTAG test data out |
| פין 136 | TDI — JTAG test data in |
| פין 137 | TCK — JTAG test clock |
| פין 138 | TMS — JTAG test mode select |
| פין 139 | VSS — Ground reference |
| פין 140 | AVDD — Analog supply for ADC |
| פין 141 | AVSS — Analog ground for ADC |
| פין 142 | AN0 — Analog input 0 |
| פין 143 | AN1 — Analog input 1 |
| פין 144 | AN2 — Analog input 2 |
| פין 145 | AN3 — Analog input 3 |
| פין 146 | AN4 — Analog input 4 |
| פין 147 | AN5 — Analog input 5 |
| פין 148 | AN6 — Analog input 6 |
| פין 149 | AN7 — Analog input 7 |
| פין 150 | AN8 — Analog input 8 |
| פין 151 | AN9 — Analog input 9 |
| פין 152 | AN10 — Analog input 10 |
| פין 153 | AN11 — Analog input 11 |
| פין 154 | AN12 — Analog input 12 |
| פין 155 | AN13 — Analog input 13 |
| פין 156 | AN14 — Analog input 14 |
| פין 157 | AN15 — Analog input 15 |
| פין 158 | AN16 — Analog input 16 |
| פין 159 | AN17 — Analog input 17 |
| פין 160 | VSS — Ground reference |
| פין 161 | VDD — Core supply voltage |
| פין 162 | DED0 — DDR2 data line 0 |
| פין 163 | DED1 — DDR2 data line 1 |
| פין 164 | DED2 — DDR2 data line 2 |
| פין 165 | DED3 — DDR2 data line 3 |
| פין 166 | DED4 — DDR2 data line 4 |
| פין 167 | DED5 — DDR2 data line 5 |
| פין 168 | DED6 — DDR2 data line 6 |
| פין 169 | DED7 — DDR2 data line 7 |
| פין 170 | DED8 — DDR2 data line 8 |
| פין 171 | DED9 — DDR2 data line 9 |
| פין 172 | DED10 — DDR2 data line 10 |
| פין 173 | DED11 — DDR2 data line 11 |
| פין 174 | DED12 — DDR2 data line 12 |
| פין 175 | DED13 — DDR2 data line 13 |
| פין 176 | DED14 — DDR2 data line 14 |
יישומים טיפוסיים
PIC32MZ1025DAR176-V/2J מתאים עבור 6 יישוםs: Industrial HMI Control Panels, Medical Patient Monitors, Automotive Infotainment Clusters, Point-of-Sale Terminals, Connected IoT Gateways with TFT, Smart Building Access Panels.
Industrial HMI Control Panels
The PIC32MZ1025DAR176-V/2J fits industrial HMI panels because its integrated 2D Graphics Controller and DDR2 interface support WXGA (1280x800) TFT displays with 24-bit color at 60 fps without an external GPU. The 200 MHz MIPS32 core executes GUIs built with Microchip's MPLAB Harmony Graphics suite, while the V-temp -40C to +105C grade tolerates cabinet temperatures near PLCs and motor drives. Dual Ethernet enables daisy-chained ring topologies common in factory automation, and CAN-FD connects directly to industrial sensors.
מומלץ
Medical Patient Monitors
The PIC32MZ1025DAR176-V/2J is well-suited to multi-parameter patient monitors where its integrated DDR2 frame buffer drives sharp TFT LCDs for waveform displays (ECG, SpO2, respiration) without external memory. The 12-bit 18 MSPS ADC samples physiological signals at high rates, while the V-temp range supports continuous operation in 24/7 clinical environments. USB 2.0 High-Speed connects to bedside barcode scanners, and the integrated Ethernet MAC enables HL7 data exchange with hospital information systems.
מומלץ
Automotive Infotainment Clusters
The PIC32MZ1025DAR176-V/2J can serve as the secondary display controller in instrument clusters and HVAC panels, where its 200 MHz MIPS32 core renders meter graphics and its DDR2 interface supports layered HMI on 800x480 WVGA TFT panels. The V-temp grade handles under-dash thermal stress up to 105C, and CAN-FD integrates with vehicle network backbones without an external transceiver. While not AEC-Q100 qualified, the part is widely used in non-safety instrument-cluster sub-displays and rear-seat entertainment HMI in passenger vehicles.
מומלץ
Point-of-Sale Terminals
POS terminals with touchscreen GUIs benefit from the PIC32MZ1025DAR176-V/2J's integrated 2D graphics controller, which accelerates button rendering, list scrolls, and signature-pad animations without burdening the CPU. USB 2.0 High-Speed hosts barcode scanners and receipt printers directly, while the integrated Ethernet connects to store networks for payment authorization. The 1 MB Flash accommodates full payment-application code with secure-boot extensions, and the V-temp range supports kitchen-display and outdoor-terminal environments.
מומלץ
Connected IoT Gateways with TFT
IoT gateways benefit from the PIC32MZ1025DAR176-V/2J's combination of dual Ethernet, USB 2.0 HS, CAN-FD, and a TFT-capable integrated graphics controller. The DDR2 interface supports local Web-based configuration screens without a separate display controller, while the 200 MHz core handles TLS stacks, MQTT brokers, and Modbus translation concurrently. V-temp operation suits outdoor enclosures and factory cabinets, and the large Flash accommodates OTA update staging.
מומלץ
Smart Building Access Panels
Building-access panels with TFT touchscreens and network connectivity are a strong match for the PIC32MZ1025DAR176-V/2J. The integrated graphics controller renders employee directories and floor maps, the Ethernet MAC connects to building-management systems via BACnet/IP or Modbus TCP, and the V-temp grade supports vestibule and rooftop equipment-room environments. USB 2.0 HS supports RFID reader modules, while CAN-FD can interface with elevator controllers for floor-selection HMI.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC32MZ1025DAR176-V/2J — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC32MZ1025DAR176-I/2J | PIC32MZ1025DAL176-I/2J | PIC32MZ1025DAB176T-I/2J | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 169-LQFP - pin count differs |
| Core | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| Integrated DDR2 Controller | Yes (32 MB or 128 MB external) | Yes (32 MB or 128 MB external) | No (internal SRAM frame buffer only) | No (internal SRAM frame buffer only) | Yes (32 MB or 128 MB external) |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Integrated Ethernet | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC |
| USB | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
מבדילים עיקריים
- Integrated DDR2 controller for large frame buffers (לעומתPIC32MZ1025DAL176-I/2J)
- V-temp grade (-40C to +105C) (לעומתPIC32MZ1025DAR176-I/2J)
- 176-LQFP standard footprint for DAR family (לעומתPIC32MZ1025DAR169T-I/6J)
הערות תכנון
DDR2 interface requires a 4-layer PCB with continuous ground and power planes directly under the MCU and DDR2 device. Route DDR2 byte lanes with matched trace lengths within 25 mils (0.635 mm) and keep characteristic impedance to 50 ohms +/- 10%. Place decoupling capacitors within 2 mm of every VDD/VSS pair and use 0.1 uF plus 4.7 uF bulk capacitance. Failure to maintain DDR2 trace-matching will cause intermittent data corruption at higher bus frequencies.
Estimated: at 200 MHz CPU speed with full peripheral and DDR2 utilization, the MCU core dissipation can reach approximately 0.7-1.0 W depending on I/O toggle rate and voltage. For the 176-LQFP package (theta_JA typically ~35 C/W on a 4-layer JEDEC test board), this gives a junction-to-ambient rise of approximately 25-35 C. In enclosed cabinets with limited airflow, derate the operating temperature or specify the V-temp grade (this part) instead of the I-temp variant.
Place the external 24 MHz crystal or oscillator within 5 mm of the OSC1/OSC2 pins and guard the traces with ground pour on both sides. Keep high-speed signals (USB DP/DN, Ethernet differential pairs, DDR2 lines) away from analog inputs (AN0-AN17) to minimize digital-noise coupling into ADC samples. Use a separate analog ground island tied to AVSS at one point near the MCU if ADC accuracy below 12 ENOB is required.
Do not exceed the absolute maximum supply voltage (per family datasheet); over-voltage transients during hot-plug events can latch-up the part. Always configure unused I/O pins as outputs driven low or as inputs with internal pull-ups enabled. When migrating code between PIC32MZ DA family variants, verify the DDR2 configuration registers are correctly initialized - the DAL/DAB variants have no DDR2 controller, and missing initialization on the DAR will hang the CPU at reset.
מידע על תאימות
RoHS and REACH compliance per Microchip product page. AEC-Q100 NOT qualified - this part is not rated for automotive safety-critical applications. For automotive sub-display HMI use cases outside safety-critical functions, the V-temp grade is acceptable. Halogen-free status not explicitly stated in verified data.