EP3SE260H780I4 vs EP3SE260H780I4N तुलना
विस्तृत दोनों ओर की तुलना EP3SE260H780I4 द्वारा Intel और EP3SE260H780I4N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3SE260H780I4 | EP3SE260H780I4N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | अंतिम बार खरीदें |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | 450 MHz |
| पैकेज | 780-ball FC-HFBGA (HBGA) | 780-pin FC-HFBGA (FCBGA) |
| ऑपरेटिंग तापमान | -40C to +100C (industrial, 'I' grade) | -40C to +100C (Industrial) |
| Speed Grade | 4 | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | — |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/Os | — | 488 |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |