G9S12GN32F1VLCR vs MC9S08LH36CLK तुलना
विस्तृत दोनों ओर की तुलना G9S12GN32F1VLCR द्वारा NXP Semiconductors और MC9S08LH36CLK द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP
G9S12GN32F1VLCR ✓ सक्रिय
विशेषता तुलना
| पैरामीटर | G9S12GN32F1VLCR | MC9S08LH36CLK |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Core | S12 (HCS12, 16-bit CISC) | — |
| Program Flash | 32 KB | — |
| SRAM | 2 KB | — |
| Bus Frequency (max) | 25 MHz | — |
| CAN Controller | 1 x CAN 2.0A/B | — |
| LIN / SAE J2602 | Yes (via SCI + external transceiver) | — |
| ADC | 10-bit, 8 channels [DATA_NEEDED: channel count confirmation] | — |
| PWM Channels | Multi-channel 16-bit [DATA_NEEDED: exact channel count] | — |
| Enhanced Capture Timer (ECT) | Yes | — |
| पैकेज | LQFP-32 | 80-LQFP (14 x 14 mm) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| ऑपरेटिंग तापमान | -40 C to +105 C (VLC suffix, automotive grade) [DATA_NEEDED: confirmation of grade letter] | — |
| नमी संवेदनशीलता स्तर (MSL) | 3 | — |
| Peak Reflow Temperature | 260 °C | — |
| Maximum Time at Peak Reflow | 40 s | — |
| Terminal Finish | Tin (Sn), matte | — |
| JEDEC J-STD-609 Code | e3 | — |
| Lead-Free | Yes (e3 Sn finish) | — |
| RoHS स्थिति | Compliant | RoHS Compliant |
| Security | Flash security lockout supported [DATA_NEEDED: full feature list] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency (per distributor listing) | — | 16 MHz |
| Flash Memory | — | 36 KB (36K x 8) |
| Supply Voltage Range | — | 2.1 V to 3.6 V |
| Number of I/O | — | 37 |
| Program Memory Type | — | FLASH |
| Operating Voltage at Reduced Speed | — | 2.1 V (up to 20 MHz, per family datasheet) |
| Lifecycle Stage | — | ACTIVE (per parametric source) |
| Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| Peripherals | — | [DATA_NEEDED: peripheral set detail] |
| Package Body Dimensions | — | 14 mm x 14 mm |