G9S12GN32F1VLCR vs MC9S08LH36CLK Perbandingan
Perbandingan bersamaan detil G9S12GN32F1VLCR dari NXP Semiconductors dan MC9S08LH36CLK dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP
G9S12GN32F1VLCR ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | G9S12GN32F1VLCR | MC9S08LH36CLK |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core | S12 (HCS12, 16-bit CISC) | — |
| Program Flash | 32 KB | — |
| SRAM | 2 KB | — |
| Bus Frequency (max) | 25 MHz | — |
| CAN Controller | 1 x CAN 2.0A/B | — |
| LIN / SAE J2602 | Yes (via SCI + external transceiver) | — |
| ADC | 10-bit, 8 channels [DATA_NEEDED: channel count confirmation] | — |
| PWM Channels | Multi-channel 16-bit [DATA_NEEDED: exact channel count] | — |
| Enhanced Capture Timer (ECT) | Yes | — |
| Paket | LQFP-32 | 80-LQFP (14 x 14 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40 C to +105 C (VLC suffix, automotive grade) [DATA_NEEDED: confirmation of grade letter] | — |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 | — |
| Peak Reflow Temperature | 260 °C | — |
| Maximum Time at Peak Reflow | 40 s | — |
| Terminal Finish | Tin (Sn), matte | — |
| JEDEC J-STD-609 Code | e3 | — |
| Lead-Free | Yes (e3 Sn finish) | — |
| Status RoHS | Compliant | RoHS Compliant |
| Security | Flash security lockout supported [DATA_NEEDED: full feature list] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency (per distributor listing) | — | 16 MHz |
| Flash Memory | — | 36 KB (36K x 8) |
| Supply Voltage Range | — | 2.1 V to 3.6 V |
| Number of I/O | — | 37 |
| Program Memory Type | — | FLASH |
| Operating Voltage at Reduced Speed | — | 2.1 V (up to 20 MHz, per family datasheet) |
| Lifecycle Stage | — | ACTIVE (per parametric source) |
| Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| Peripherals | — | [DATA_NEEDED: peripheral set detail] |
| Package Body Dimensions | — | 14 mm x 14 mm |