G9S12GN32F1VLCR vs MC9S08LH36CLK 比較

詳細並排比較 G9S12GN32F1VLCR 由 NXP Semiconductors 與 MC9S08LH36CLK 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
G9S12GN32F1VLCR G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP

G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP

G9S12GN32F1VLCR ✓ 啟用中
NXP Semiconductors
MC9S08LH36CLK MC9S08LH36CLK - 8-bit S08 MCU 40MHz 36KB Flash | NXP

MC9S08LH36CLK - 8-bit S08 MCU 40MHz 36KB Flash | NXP

MC9S08LH36CLK ✓ 啟用中

規格比較

參數 G9S12GN32F1VLCR MC9S08LH36CLK
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core S12 (HCS12, 16-bit CISC) —
Program Flash 32 KB —
SRAM 2 KB —
Bus Frequency (max) 25 MHz —
CAN Controller 1 x CAN 2.0A/B —
LIN / SAE J2602 Yes (via SCI + external transceiver) —
ADC 10-bit, 8 channels [DATA_NEEDED: channel count confirmation] —
PWM Channels Multi-channel 16-bit [DATA_NEEDED: exact channel count] —
Enhanced Capture Timer (ECT) Yes —
封裝 LQFP-32 80-LQFP (14 x 14 mm)
安裝類型 Surface Mount Surface Mount
工作溫度 -40 C to +105 C (VLC suffix, automotive grade) [DATA_NEEDED: confirmation of grade letter] —
濕度敏感等級 (MSL) 3 —
Peak Reflow Temperature 260 °C —
Maximum Time at Peak Reflow 40 s —
Terminal Finish Tin (Sn), matte —
JEDEC J-STD-609 Code e3 —
Lead-Free Yes (e3 Sn finish) —
RoHS 狀態 Compliant RoHS Compliant
Security Flash security lockout supported [DATA_NEEDED: full feature list] —
Debug Interface BDM (Background Debug Mode) —
Core Processor — S08
Core Size — 8-Bit
CPU Frequency — 40 MHz
Bus Frequency (per distributor listing) — 16 MHz
Flash Memory — 36 KB (36K x 8)
Supply Voltage Range — 2.1 V to 3.6 V
Number of I/O — 37
Program Memory Type — FLASH
Operating Voltage at Reduced Speed — 2.1 V (up to 20 MHz, per family datasheet)
Lifecycle Stage — ACTIVE (per parametric source)
Temperature Range — [DATA_NEEDED: operating temperature range]
RAM Size — [DATA_NEEDED: RAM size]
Peripherals — [DATA_NEEDED: peripheral set detail]
Package Body Dimensions — 14 mm x 14 mm

資料表與資源

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