G9S12GN32F1VLCR vs MC9S08LH36CLK Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci G9S12GN32F1VLCR disebabkan oleh NXP Semiconductors dan MC9S08LH36CLK disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
G9S12GN32F1VLCR G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP

G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP

G9S12GN32F1VLCR ✓ Aktif
NXP Semiconductors
MC9S08LH36CLK MC9S08LH36CLK - 8-bit S08 MCU 40MHz 36KB Flash | NXP

MC9S08LH36CLK - 8-bit S08 MCU 40MHz 36KB Flash | NXP

MC9S08LH36CLK ✓ Aktif

Pengandingan Spesifikasi

Parametr G9S12GN32F1VLCR MC9S08LH36CLK
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Aktif
Core S12 (HCS12, 16-bit CISC) —
Program Flash 32 KB —
SRAM 2 KB —
Bus Frequency (max) 25 MHz —
CAN Controller 1 x CAN 2.0A/B —
LIN / SAE J2602 Yes (via SCI + external transceiver) —
ADC 10-bit, 8 channels [DATA_NEEDED: channel count confirmation] —
PWM Channels Multi-channel 16-bit [DATA_NEEDED: exact channel count] —
Enhanced Capture Timer (ECT) Yes —
Kemasan LQFP-32 80-LQFP (14 x 14 mm)
Jenis Pemasangan Surface Mount Surface Mount
Suhu Operasi -40 C to +105 C (VLC suffix, automotive grade) [DATA_NEEDED: confirmation of grade letter] —
Tingkat sensitiviti Air Nama (MSL) 3 —
Peak Reflow Temperature 260 °C —
Maximum Time at Peak Reflow 40 s —
Terminal Finish Tin (Sn), matte —
JEDEC J-STD-609 Code e3 —
Lead-Free Yes (e3 Sn finish) —
Status RoHS Compliant RoHS Compliant
Security Flash security lockout supported [DATA_NEEDED: full feature list] —
Debug Interface BDM (Background Debug Mode) —
Core Processor — S08
Core Size — 8-Bit
CPU Frequency — 40 MHz
Bus Frequency (per distributor listing) — 16 MHz
Flash Memory — 36 KB (36K x 8)
Supply Voltage Range — 2.1 V to 3.6 V
Number of I/O — 37
Program Memory Type — FLASH
Operating Voltage at Reduced Speed — 2.1 V (up to 20 MHz, per family datasheet)
Lifecycle Stage — ACTIVE (per parametric source)
Temperature Range — [DATA_NEEDED: operating temperature range]
RAM Size — [DATA_NEEDED: RAM size]
Peripherals — [DATA_NEEDED: peripheral set detail]
Package Body Dimensions — 14 mm x 14 mm

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