MC9S12DG256CMPV vs MC9S12DG256CCPV तुलना
विस्तृत दोनों ओर की तुलना MC9S12DG256CMPV द्वारा NXP Semiconductors और MC9S12DG256CCPV द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP
MC9S12DG256CMPV ✓ सक्रियNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV Nrndविशेषता तुलना
| पैरामीटर | MC9S12DG256CMPV | MC9S12DG256CCPV |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Core | HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) | HCS12 (16-bit CISC) |
| Maximum CPU Clock | 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) | — |
| Program Memory (Flash) | 256 KB (256K x 8) | 256 KB (256K x 8) |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Operating Voltage | 2.5 V / 5 V (single supply with on-chip regulator) | — |
| I/O Voltage | 5 V tolerant | — |
| ADC | 10-bit, 8 channels | 8-channel, 10-bit |
| CAN Modules (MSCAN) | 1 x MSCAN 2.0A/B-compatible | — |
| SCI / SPI | 2 x SCI, 1 x SPI | — |
| Timers | Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI | Enhanced Capture Timer (ECT) + watchdog |
| BDLC (J1850) | 1 module (VPW) | — |
| पैकेज | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | — |
| पिन काउंट | 112 | — |
| ऑपरेटिंग तापमान | -40 C to +85 C (automotive AEC-Q100) | — |
| AEC-Q100 Qualification | Qualified (automotive grade) | — |
| माउंटिंग प्रकार | Surface Mount (gull-wing) | Surface Mount |
| RoHS स्थिति | [DATA_NEEDED: RoHS status - not present in verified snippet] | Compliant |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| ऑपरेटिंग तापमान रेंज | — | -40 °C to +85 °C (industrial) |
| पैकेज / केस | — | 112-LQFP (20 x 20 mm) |
| PWM Channels | — | 8 channels |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| MSL स्तर | — | 3 (168 hours, JEDEC J-STD-020) |