MC9S12DG256CMPV vs MC9S12DG256CCPV Perbandingan
Perbandingan bersamaan detil MC9S12DG256CMPV dari NXP Semiconductors dan MC9S12DG256CCPV dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP
MC9S12DG256CMPV ✓ AktifNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S12DG256CMPV | MC9S12DG256CCPV |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core | HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) | HCS12 (16-bit CISC) |
| Maximum CPU Clock | 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) | — |
| Program Memory (Flash) | 256 KB (256K x 8) | 256 KB (256K x 8) |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Operating Voltage | 2.5 V / 5 V (single supply with on-chip regulator) | — |
| I/O Voltage | 5 V tolerant | — |
| ADC | 10-bit, 8 channels | 8-channel, 10-bit |
| CAN Modules (MSCAN) | 1 x MSCAN 2.0A/B-compatible | — |
| SCI / SPI | 2 x SCI, 1 x SPI | — |
| Timers | Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI | Enhanced Capture Timer (ECT) + watchdog |
| BDLC (J1850) | 1 module (VPW) | — |
| Paket | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | — |
| Jumlah Pin | 112 | — |
| Suhu Kerja | -40 C to +85 C (automotive AEC-Q100) | — |
| AEC-Q100 Qualification | Qualified (automotive grade) | — |
| Tipe Mounting | Surface Mount (gull-wing) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status - not present in verified snippet] | Compliant |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Rentang Suhu Kerja | — | -40 °C to +85 °C (industrial) |
| Paket / Case | — | 112-LQFP (20 x 20 mm) |
| PWM Channels | — | 8 channels |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| Level MSL | — | 3 (168 hours, JEDEC J-STD-020) |