MC9S12DG256CMPV vs MC9S12DG256CCPV 比較

詳細並排比較 MC9S12DG256CMPV 由 NXP Semiconductors 與 MC9S12DG256CCPV 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12DG256CMPV MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV ✓ 啟用中
NXP Semiconductors
MC9S12DG256CCPV MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV Nrnd

規格比較

參數 MC9S12DG256CMPV MC9S12DG256CCPV
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) HCS12 (16-bit CISC)
Maximum CPU Clock 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) —
Program Memory (Flash) 256 KB (256K x 8) 256 KB (256K x 8)
RAM 12 KB —
EEPROM 4 KB —
Operating Voltage 2.5 V / 5 V (single supply with on-chip regulator) —
I/O Voltage 5 V tolerant —
ADC 10-bit, 8 channels 8-channel, 10-bit
CAN Modules (MSCAN) 1 x MSCAN 2.0A/B-compatible —
SCI / SPI 2 x SCI, 1 x SPI —
Timers Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI Enhanced Capture Timer (ECT) + watchdog
BDLC (J1850) 1 module (VPW) —
封裝 112-LQFP (20 x 20 mm, 0.65 mm pitch) —
腳位數 112 —
工作溫度 -40 C to +85 C (automotive AEC-Q100) —
AEC-Q100 Qualification Qualified (automotive grade) —
安裝類型 Surface Mount (gull-wing) Surface Mount
RoHS 狀態 [DATA_NEEDED: RoHS status - not present in verified snippet] Compliant
Maximum CPU/Bus Frequency — 25 MHz
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Lines — 91
Supply Voltage Range — 2.97 V to 5.5 V (single 5 V supply)
工作溫度範圍 — -40 °C to +85 °C (industrial)
封裝 / 外殼 — 112-LQFP (20 x 20 mm)
PWM Channels — 8 channels
Communication Interfaces — 2 x SCI, 2 x SPI, I2C, CAN 2.0
On-chip Debug — Background Debug Mode (BDM)
MSL 等級 — 3 (168 hours, JEDEC J-STD-020)

資料表與資源

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