MC9S12DG256CMPV vs MC9S12DG256CCPV Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DG256CMPV disebabkan oleh NXP Semiconductors dan MC9S12DG256CCPV disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12DG256CMPV MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV ✓ Aktif
NXP Semiconductors
MC9S12DG256CCPV MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV Nrnd

Pengandingan Spesifikasi

Parametr MC9S12DG256CMPV MC9S12DG256CCPV
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif NRND
Core HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) HCS12 (16-bit CISC)
Maximum CPU Clock 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) —
Program Memory (Flash) 256 KB (256K x 8) 256 KB (256K x 8)
RAM 12 KB —
EEPROM 4 KB —
Operating Voltage 2.5 V / 5 V (single supply with on-chip regulator) —
I/O Voltage 5 V tolerant —
ADC 10-bit, 8 channels 8-channel, 10-bit
CAN Modules (MSCAN) 1 x MSCAN 2.0A/B-compatible —
SCI / SPI 2 x SCI, 1 x SPI —
Timers Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI Enhanced Capture Timer (ECT) + watchdog
BDLC (J1850) 1 module (VPW) —
Kemasan 112-LQFP (20 x 20 mm, 0.65 mm pitch) —
Kiraan Pin 112 —
Suhu Operasi -40 C to +85 C (automotive AEC-Q100) —
AEC-Q100 Qualification Qualified (automotive grade) —
Jenis Pemasangan Surface Mount (gull-wing) Surface Mount
Status RoHS [DATA_NEEDED: RoHS status - not present in verified snippet] Compliant
Maximum CPU/Bus Frequency — 25 MHz
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Lines — 91
Supply Voltage Range — 2.97 V to 5.5 V (single 5 V supply)
Gambaran Suhu Operasi — -40 °C to +85 °C (industrial)
Kemasan / Case — 112-LQFP (20 x 20 mm)
PWM Channels — 8 channels
Communication Interfaces — 2 x SCI, 2 x SPI, I2C, CAN 2.0
On-chip Debug — Background Debug Mode (BDM)
Aras MSL — 3 (168 hours, JEDEC J-STD-020)

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