MPC860DPZQ66D4 vs MPC862PVR66B तुलना
विस्तृत दोनों ओर की तुलना MPC860DPZQ66D4 द्वारा NXP Semiconductors और MPC862PVR66B द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | MPC860DPZQ66D4 | MPC862PVR66B |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | NRND |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | — |
| Core | 1 Core, 32-Bit PowerPC | PowerPC 32-bit RISC, 1 Core |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| पैकेज / केस | 357-Ball PBGA, 25 x 25 mm | — |
| Packaging | Tray | — |
| Lead-Free Status | Contains Lead | — |
| RoHS स्थिति | Non-RoHS (legacy BGA, contains lead) | Compliant (lead-free) |
| ऑपरेटिंग तापमान | 0C to +70C (commercial grade) | [DATA_NEEDED: industrial temp grade] |
| Part Status | Not For New Designs | — |
| Family | — | PowerQUICC MPC8xx |
| Core Frequency | — | 66 MHz |
| Process Technology | — | 0.32 micrometer CMOS |
| पैकेज | — | 357-PBGA (25x25 mm) |
| माउंटिंग प्रकार | — | Surface Mount (BGA) |
| Communication Module | — | CPM (Communications Processor Module), integrated |
| Ethernet MAC | — | 2x 10/100 Mbps (Fast Ethernet) |
| HDLC Channels | — | Multi-channel HDLC, SCC/SMC |
| सप्लाई वोल्टेज | — | [DATA_NEEDED: core/IO voltage] |
| Lead-Free Termination | — | Yes (Pb-free BGA balls, "B" suffix) |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |
| Tray Packaging | — | Tray (per distributor listing) |