MPC860DPZQ66D4 vs MPC862PVR66B Perbandingan

Perbandingan bersamaan detil MPC860DPZQ66D4 dari NXP Semiconductors dan MPC862PVR66B dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC860DPZQ66D4 MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC860DPZQ66D4 ⚠ Waktu Beli Terakhir
NXP Semiconductors
MPC862PVR66B MPC862PVR66B - PowerQUICC MPC862 MPU 66MHz 357-PBGA | NXP

MPC862PVR66B - PowerQUICC MPC862 MPU 66MHz 357-PBGA | NXP

MPC862PVR66B Nrnd

Perbandingan Spesifikasi

Parameter Umum MPC860DPZQ66D4 MPC862PVR66B
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Processor Type MPC8xx PowerQUICC 32-Bit RISC MPU —
Core 1 Core, 32-Bit PowerPC PowerPC 32-bit RISC, 1 Core
Operating Frequency 66 MHz —
Core / I/O Voltage 3.3 V —
L1 Instruction Cache 4 Kbyte —
L1 Data Cache 4 Kbyte —
On-chip RAM (per data sheet) [DATA_NEEDED: internal SRAM size] —
Co-Processor / DSP Communications Processor Module (CPM) —
Ethernet 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) —
DRAM Controller Yes, up to 256 Mbyte addressable —
Address Bus Width 32-Bit —
Paket / Case 357-Ball PBGA, 25 x 25 mm —
Packaging Tray —
Lead-Free Status Contains Lead —
Status RoHS Non-RoHS (legacy BGA, contains lead) Compliant (lead-free)
Suhu Kerja 0C to +70C (commercial grade) [DATA_NEEDED: industrial temp grade]
Part Status Not For New Designs —
Family — PowerQUICC MPC8xx
Core Frequency — 66 MHz
Process Technology — 0.32 micrometer CMOS
Paket — 357-PBGA (25x25 mm)
Tipe Mounting — Surface Mount (BGA)
Communication Module — CPM (Communications Processor Module), integrated
Ethernet MAC — 2x 10/100 Mbps (Fast Ethernet)
HDLC Channels — Multi-channel HDLC, SCC/SMC
Tegangan Pemuat — [DATA_NEEDED: core/IO voltage]
Lead-Free Termination — Yes (Pb-free BGA balls, "B" suffix)
Level MSL — [DATA_NEEDED: MSL rating]
Tray Packaging — Tray (per distributor listing)

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon