MRF5S21100HSR5 vs MRF5S21100HSR3 तुलना
विस्तृत दोनों ओर की तुलना MRF5S21100HSR5 द्वारा NXP Semiconductors और MRF5S21100HSR3 द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MRF5S21100HSR5 - 23W RF Power MOSFET 2.17GHz NI-780S | NXP
MRF5S21100HSR5 ✓ सक्रियNXP Semiconductors
MRF5S21100HSR3 - 23W RF Power MOSFET, 2110-2170 MHz | NXP
MRF5S21100HSR3 Obsoleteविशेषता तुलना
| पैरामीटर | MRF5S21100HSR5 | MRF5S21100HSR3 |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | MOSFETs | MOSFETs |
| लाइफसाइकिल स्थिति | सक्रिय | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Part Status | Active | Obsolete |
| ट्रांज़िस्टर प्रकार | N-Channel RF Power MOSFET | LDMOS, N-Channel Enhancement-Mode Lateral MOSFET |
| Technology | LDMOS (Laterally Diffused MOS) | — |
| Operating Frequency | 2.16 GHz to 2.17 GHz | — |
| Drain-to-Source Voltage (Vdss) Max | 65 V | — |
| Test Supply Voltage | 28 V | — |
| Output Power (Pout) | 23 W (CW) | — |
| Power Gain | 13.5 dB (typical) | 13.5 dB |
| Drain Current (Id) | 1.05 A | — |
| पैकेज / केस | NI-780S (ceramic flange-mount) | NI-780S (lower thermal resistance, ceramic flanged) |
| माउंटिंग प्रकार | Chassis / Flange Mount (through-hole RF) | Chassis / flange mount (through-hole, surface ceramic) |
| ऑपरेटिंग तापमान रेंज | -40C to +150C (junction) | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status from NXP product page] | Compliant (low gold plating, 40 microinches nominal) |
| Lead-Free | [DATA_NEEDED: lead-free finish] | — |
| Frequency | — | 2.16 GHz to 2.17 GHz (2110-2170 MHz) |
| Test Voltage | — | 28 V |
| Test Current | — | 1.05 A |
| Power Output (Avg, 2x W-CDMA) | — | 23 W |
| Voltage - Rated (Max V DSS) | — | 65 V |
| Maximum VDD Operation | — | 32 V (qualified) |
| Supplier Device Package | — | NI-780S |
| Configuration | — | Single, Class AB |
| ESD Protection | — | Integrated |
| Matching | — | Internally matched (input and output) |
| Lead Finish | — | Gold, 40 microinches nominal |
| Packaging | — | Tape and Reel |
| Designed Application | — | W-CDMA, TDMA, CDMA, multicarrier base station PA |