MRF5S21100HSR5 vs MRF5S21100HSR3 Perbandingan
Perbandingan bersamaan detil MRF5S21100HSR5 dari NXP Semiconductors dan MRF5S21100HSR3 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MRF5S21100HSR5 - 23W RF Power MOSFET 2.17GHz NI-780S | NXP
MRF5S21100HSR5 ✓ AktifNXP Semiconductors
MRF5S21100HSR3 - 23W RF Power MOSFET, 2110-2170 MHz | NXP
MRF5S21100HSR3 ObsoletePerbandingan Spesifikasi
| Parameter Umum | MRF5S21100HSR5 | MRF5S21100HSR3 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | MOSFETs | MOSFETs |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Part Status | Active | Obsolete |
| Tipe Transistor | N-Channel RF Power MOSFET | LDMOS, N-Channel Enhancement-Mode Lateral MOSFET |
| Technology | LDMOS (Laterally Diffused MOS) | — |
| Operating Frequency | 2.16 GHz to 2.17 GHz | — |
| Drain-to-Source Voltage (Vdss) Max | 65 V | — |
| Test Supply Voltage | 28 V | — |
| Output Power (Pout) | 23 W (CW) | — |
| Power Gain | 13.5 dB (typical) | 13.5 dB |
| Drain Current (Id) | 1.05 A | — |
| Paket / Case | NI-780S (ceramic flange-mount) | NI-780S (lower thermal resistance, ceramic flanged) |
| Tipe Mounting | Chassis / Flange Mount (through-hole RF) | Chassis / flange mount (through-hole, surface ceramic) |
| Rentang Suhu Kerja | -40C to +150C (junction) | — |
| Status RoHS | [DATA_NEEDED: RoHS status from NXP product page] | Compliant (low gold plating, 40 microinches nominal) |
| Lead-Free | [DATA_NEEDED: lead-free finish] | — |
| Frequency | — | 2.16 GHz to 2.17 GHz (2110-2170 MHz) |
| Test Voltage | — | 28 V |
| Test Current | — | 1.05 A |
| Power Output (Avg, 2x W-CDMA) | — | 23 W |
| Voltage - Rated (Max V DSS) | — | 65 V |
| Maximum VDD Operation | — | 32 V (qualified) |
| Supplier Device Package | — | NI-780S |
| Configuration | — | Single, Class AB |
| ESD Protection | — | Integrated |
| Matching | — | Internally matched (input and output) |
| Lead Finish | — | Gold, 40 microinches nominal |
| Packaging | — | Tape and Reel |
| Designed Application | — | W-CDMA, TDMA, CDMA, multicarrier base station PA |