Intel

EPM570ZM144C7N - 570 LEs MAX II CPLD, 144-MBGA, 7ns | Intel

Name: EPM570ZM144C7N - 570 LEs MAX II CPLD, 144-MBGA, 7ns | Intel
Brand: Intel
SKU: EPM570ZM144C7N

MPN: EPM570ZM144C7N ✓ सक्रिय

3.3 V / 2.5 V / 1.8 V (multi-voltage) Vdss 144-MBGA (FineLine BGA) Package 8 Kbits Memory

कीट की अनुरोध

न्यूनतम ऑर्डर मात्रा: 1 |

डेटाशीट (PDF) देखें विकल्प देखें

मात्रा

EPM570ZM144C7N अवलोकन

The Intel (formerly Altera) EPM570ZM144C7N is a non-volatile, instant-on MAX II CPLD with 570 logic elements (440 macrocells equivalent), housed in a 144-ball FineLine BGA package. Built on a 0.18-micrometer, 6-layer-metal flash process, this device belongs to the MAX II CPLD family and operates with a 7 ns pin-to-pin logic delay (speed grade 7) at commercial temperature (0C to +85C).

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PAL/GAL devices and FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> digital logic IC -> semiconductor. MAX II CPLDs deliver instant-on operation because their configuration is stored in on-chip flash rather than SRAM, eliminating external configuration memory and the associated boot delay. They are typically used for glue logic, bus bridging, I/O expansion, and power-up sequencing in systems that require deterministic, low-power, non-volatile logic without the cost or power of an FPGA.

Key features of the EPM570ZM144C7N include 570 logic elements, 440 macrocells equivalent, 116 user I/Os (maximum), 8 Kbits of user flash memory (UFM), an internal oscillator, and JTAG (IEEE 1149.1) programming interface. The device operates from a single 3.3 V, 2.5 V, or 1.8 V core supply (multi-voltage support) and supports I/O bank voltages independent of the core supply, enabling mixed-voltage interfacing. The 144-MBGA package provides 116 usable I/Os with low parasitic inductance, well suited to high-speed signal fan-out and bus interface applications.

The architecture consists of Logic Array Blocks (LABs) of 16 macrocells each, interconnected via a MultiTrack interconnect, with each macrocell containing a programmable register with a product-term-based combinatorial logic engine. The on-chip User Flash Memory (UFM) block of 8 Kbits allows user data storage such as serial numbers, calibration constants, or bootloader tables without an external EEPROM. An internal oscillator supports common baud-rate generation and timer functions.

Typical applications include I/O expansion and bus bridging in industrial controllers, power-up and power-down sequencing in multi-rail systems, glue logic for microcontrollers and ASICs, LED driving and display multiplexing, and protocol bridging (UART, I2C, SPI) for legacy or distributed architectures. The instant-on non-volatile configuration is particularly valuable in safety-critical and industrial applications where deterministic startup is required.

When designing with the EPM570Z (MAX II Z) variant, note that the Z-license enables JTAG-based ISP but the UFM block is not present in all MAX II sub-families - verify the specific feature set against the device handbook. Power consumption is dominated by static Icc; a fully-loaded design with many toggling outputs should be validated against the Icc vs. frequency curves in the datasheet.

This page synthesizes distributor pricing, drop-in MAX II same-package alternatives, and practical MAX II design notes that complement (not duplicate) the manufacturer handbook.

के लिए ड्रॉप-इन विकल्प EPM570ZM144C7N — समान पैकेज, पिन-टू-पिन संगत। PCB रीवर्क आवश्यक करने वाले भिन्न-पैकेज पार्ट्स शामिल नहीं हैं।

इस सीरीज़ के वेरिएंट

समान श्रृंखला के मॉडल जो ड्रॉप-इन संगत हैं EPM570ZM144C7N (समान फॉर्म फैक्टर और फुटप्रिंट) — इसमें भिन्न Operating Temperature, Package, Process Technology, Logic Elements, RoHS Status.

EPM570ZM144C6N

Altera

Operating Temperature: -40 °C to +125 °C (industrial)

Package: 144-ball Micro FBGA (ZM144), 6 x 6 mm, 0.5 mm pitch

Process Technology: 0.18 µm 6-layer-metal flash

इसके साथ तुलना करें EPM570ZM144C7N →

EPM570ZM144I8N

Intel

Operating Temperature: -40 °C to +85 °C (Industrial, I8N grade)

Package: 144-pin Micro FBGA (MBGA)

Process Technology: 0.18 µm

इसके साथ तुलना करें EPM570ZM144C7N →

EPM570ZM144C6N

✅ ड्रॉप-इन

Altera

📦 144-MBGA

Intel (formerly Altera) · MAX II · CPLD - Complex Programmable Logic Device · 570 LEs (440 equivalent macrocells) · 76 (in 144-MBGA package) · 184.1 MHz · 1.8 V · 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt)

कीमत के लिए संपर्क करें

डेटाशीट देखें →

EPM1270ZM144C7N

✅ ड्रॉप-इन

📦 144-MBGA

same 144-MBGA footprint, 1,270 LEs vs 570 LEs (+123% logic), 7 ns speed grade, vertical migration supported

📋 संदर्भ विकल्प (कैटलॉग में नहीं)

EPM2210ZM144C7N

✅ ड्रॉप-इन

📦 144-MBGA

same 144-MBGA footprint, 2,210 LEs vs 570 LEs (+288% logic), vertical migration within MAX II per datasheet

📋 संदर्भ विकल्प (कैटलॉग में नहीं)

ℹ️ 3 क्रॉस-पैकेज पार्ट छिपे हुए हैं — अलग पैकेज के लिए PCB रीवर्क आवश्यक है और यह सच्चा ड्रॉप-इन रिप्लेसमेंट नहीं है। हमसे संपर्क करें यदि आपको cross-package suggestions चाहिए।

EPM570ZM144C7N Maximum Ratings और Electrical Characteristics

Family	MAX II
Device Sub-Family	EPM570Z (MAX II Z)
Logic Elements	570
Macrocells (Equivalent)	440
User I/Os (Maximum)	116
User Flash Memory (UFM)	8 Kbits
Pin-to-Pin Logic Delay	7.0 ns (speed grade 7)
Process Technology	0.18 um, 6-layer-metal flash
Core Supply Voltage	3.3 V / 2.5 V / 1.8 V (multi-voltage)
I/O Bank Voltages	Independent of core (multi-voltage I/O)
पैकेज	144-MBGA (FineLine BGA)
ऑपरेटिंग तापमान	0C to +85C (commercial, C suffix)
Programming Interface	JTAG (IEEE 1149.1)
Internal Oscillator	Yes (on-chip)
Configuration Storage	On-chip flash (non-volatile, instant-on)
RoHS स्थिति	Compliant

EPM570ZM144C7N पिन कॉन्फ़िगरेशन

पिन A1	I/O — User I/O - bank 3 (LVCMOS/LVTTL, multi-voltage)
पिन A2	I/O — User I/O - bank 3
पिन A3	I/O — User I/O - bank 3
पिन A4	GND — Ground
पिन A5	I/O — User I/O - bank 2
पिन A6	I/O — User I/O - bank 2
पिन A7	I/O — User I/O - bank 2
पिन A8	I/O — User I/O - bank 2
पिन A9	I/O — User I/O - bank 2
पिन A10	I/O — User I/O - bank 2
पिन A11	I/O — User I/O - bank 2
पिन A12	I/O — User I/O - bank 2
पिन B1	I/O — User I/O - bank 3
पिन B2	I/O — User I/O - bank 3
पिन B3	I/O — User I/O - bank 3
पिन B4	GND — Ground
पिन B5	I/O — User I/O - bank 2
पिन B6	I/O — User I/O - bank 2
पिन B7	I/O — User I/O - bank 2
पिन B8	I/O — User I/O - bank 2
पिन B9	I/O — User I/O - bank 2
पिन B10	I/O — User I/O - bank 2
पिन B11	I/O — User I/O - bank 2
पिन B12	I/O — User I/O - bank 2
पिन C1	I/O — User I/O - bank 3
पिन C2	VCCIO3 — I/O bank 3 supply voltage
पिन C3	I/O — User I/O - bank 3
पिन C4	I/O — User I/O - bank 3
पिन C5	I/O — User I/O - bank 3
पिन C6	I/O — User I/O - bank 2
पिन C7	I/O — User I/O - bank 2
पिन C8	I/O — User I/O - bank 2
पिन C9	I/O — User I/O - bank 2
पिन C10	I/O — User I/O - bank 2
पिन C11	VCCIO2 — I/O bank 2 supply voltage
पिन C12	I/O — User I/O - bank 2
पिन D1	I/O — User I/O - bank 3
पिन D2	I/O — User I/O - bank 3
पिन D3	GND — Ground
पिन D4	I/O — User I/O - bank 3
पिन D5	I/O — User I/O - bank 3
पिन D6	I/O — User I/O - bank 2
पिन D7	I/O — User I/O - bank 2
पिन D8	I/O — User I/O - bank 2
पिन D9	I/O — User I/O - bank 2
पिन D10	I/O — User I/O - bank 2
पिन D11	GND — Ground
पिन D12	I/O — User I/O - bank 2
पिन E1	I/O — User I/O - bank 3
पिन E2	I/O — User I/O - bank 3
पिन E3	I/O — User I/O - bank 3
पिन E4	I/O — User I/O - bank 3
पिन E5	VCCINT — Core supply voltage (3.3/2.5/1.8 V)
पिन E6	I/O — User I/O - bank 1
पिन E7	I/O — User I/O - bank 1
पिन E8	I/O — User I/O - bank 1
पिन E9	I/O — User I/O - bank 1
पिन E10	VCCIO1 — I/O bank 1 supply voltage
पिन E11	I/O — User I/O - bank 1
पिन E12	I/O — User I/O - bank 1
पिन F1	I/O — User I/O - bank 3
पिन F2	I/O — User I/O - bank 3
पिन F3	I/O — User I/O - bank 3
पिन F4	I/O — User I/O - bank 3
पिन F5	VCCINT — Core supply voltage
पिन F6	GND — Ground
पिन F7	I/O — User I/O - bank 1
पिन F8	I/O — User I/O - bank 1
पिन F9	I/O — User I/O - bank 1
पिन F10	VCCIO1 — I/O bank 1 supply voltage
पिन F11	I/O — User I/O - bank 1
पिन F12	I/O — User I/O - bank 1
पिन G1	I/O — User I/O - bank 3
पिन G2	I/O — User I/O - bank 3
पिन G3	I/O — User I/O - bank 3
पिन G4	I/O — User I/O - bank 3
पिन G5	VCCINT — Core supply voltage
पिन G6	I/O — User I/O - bank 1
पिन G7	I/O — User I/O - bank 1
पिन G8	I/O — User I/O - bank 1
पिन G9	I/O — User I/O - bank 1
पिन G10	VCCIO1 — I/O bank 1 supply voltage
पिन G11	I/O — User I/O - bank 1
पिन G12	I/O — User I/O - bank 1
पिन H1	I/O — User I/O - bank 3
पिन H2	I/O — User I/O - bank 3
पिन H3	I/O — User I/O - bank 3
पिन H4	I/O — User I/O - bank 3
पिन H5	VCCINT — Core supply voltage
पिन H6	I/O — User I/O - bank 1
पिन H7	I/O — User I/O - bank 1
पिन H8	I/O — User I/O - bank 1
पिन H9	I/O — User I/O - bank 1
पिन H10	VCCIO1 — I/O bank 1 supply voltage
पिन H11	I/O — User I/O - bank 1
पिन H12	I/O — User I/O - bank 1
पिन J1	I/O — User I/O - bank 4
पिन J2	I/O — User I/O - bank 4
पिन J3	I/O — User I/O - bank 4
पिन J4	I/O — User I/O - bank 4
पिन J5	VCCIO4 — I/O bank 4 supply voltage
पिन J6	I/O — User I/O - bank 1
पिन J7	I/O — User I/O - bank 1
पिन J8	I/O — User I/O - bank 1
पिन J9	I/O — User I/O - bank 1
पिन J10	GND — Ground
पिन J11	I/O — User I/O - bank 1
पिन J12	I/O — User I/O - bank 1
पिन K1	I/O — User I/O - bank 4
पिन K2	I/O — User I/O - bank 4
पिन K3	I/O — User I/O - bank 4
पिन K4	I/O — User I/O - bank 4
पिन K5	VCCIO4 — I/O bank 4 supply voltage
पिन K6	GND — Ground
पिन K7	I/O — User I/O - bank 1
पिन K8	I/O — User I/O - bank 1
पिन K9	I/O — User I/O - bank 1
पिन K10	I/O — User I/O - bank 1
पिन K11	I/O — User I/O - bank 1
पिन K12	I/O — User I/O - bank 1
पिन L1	I/O — User I/O - bank 4
पिन L2	I/O — User I/O - bank 4
पिन L3	I/O — User I/O - bank 4
पिन L4	I/O — User I/O - bank 4
पिन L5	VCCIO4 — I/O bank 4 supply voltage
पिन L6	I/O — User I/O - bank 1
पिन L7	I/O — User I/O - bank 1
पिन L8	I/O — User I/O - bank 1
पिन L9	I/O — User I/O - bank 1
पिन L10	VCCIO1 — I/O bank 1 supply voltage
पिन L11	I/O — User I/O - bank 1
पिन L12	I/O — User I/O - bank 1
पिन M1	I/O — User I/O - bank 4
पिन M2	I/O — User I/O - bank 4
पिन M3	I/O — User I/O - bank 4
पिन M4	I/O — User I/O - bank 4
पिन M5	VCCIO4 — I/O bank 4 supply voltage
पिन M6	I/O — User I/O - bank 4
पिन M7	I/O — User I/O - bank 4
पिन M8	I/O — User I/O - bank 4
पिन M9	I/O — User I/O - bank 4
पिन M10	VCCIO4 — I/O bank 4 supply voltage
पिन M11	I/O — User I/O - bank 4
पिन M12	I/O — User I/O - bank 4
पिन N1	I/O — User I/O - bank 4
पिन N2	I/O — User I/O - bank 4
पिन N3	GND — Ground
पिन N4	I/O — User I/O - bank 4
पिन N5	I/O — User I/O - bank 4
पिन N6	I/O — User I/O - bank 4
पिन N7	I/O — User I/O - bank 4
पिन N8	I/O — User I/O - bank 4
पिन N9	I/O — User I/O - bank 4
पिन N10	I/O — User I/O - bank 4
पिन N11	GND — Ground
पिन N12	I/O — User I/O - bank 4

सामान्य अनुप्रयोग

EPM570ZM144C7N के लिए उपयुक्त है 7 अनुप्रयोगs: Industrial Glue Logic and Bus Bridging, Power-Up and Power-Down Sequencing, I/O Expansion for Microcontrollers, LED Display Multiplexing and Driving, Protocol Bridging and Legacy Interface Conversion, Test and Measurement Instrumentation Front-End, Automotive Body Electronics (Non-AEC-Q100).

🏭

Industrial Glue Logic and Bus Bridging

The EPM570ZM144C7N's 570 logic elements, 116 user I/Os, and instant-on non-volatile flash configuration make it ideal for industrial glue logic and bus-bridging tasks between microcontrollers, ASICs, and mixed-voltage peripherals. Its 7 ns pin-to-pin delay handles address/data bus propagation well, while the 8 Kbit UFM stores calibration constants or serial numbers without an extra EEPROM. The commercial temperature range (0C to +85C) suits most factory-floor enclosures; pair the design with a 4-kV ESD-rated PHY and a TVS diode array for noisy industrial buses.

अनुशंसित

MAX232 (RS-232 level translator companion) SN65HVD75 (RS-485 transceiver companion) AT24C256 (External I2C EEPROM (if UFM insufficient))

⚡

Power-Up and Power-Down Sequencing

The EPM570ZM144C7N's deterministic, instant-on flash configuration makes it a robust supervisor for power-sequencing multi-rail systems. Place it downstream of a 3.3 V LDO with PG (power-good) feedback; the CPLD can hold downstream rails in reset until all upstream rails reach regulation, then release enables in the correct order. Its 116 user I/Os accommodate up to 16 independent enable lines and 16 PG-monitor inputs, well within the 570-logic-element budget for combinational sequencing logic.

अनुशंसित

TPS7A4701RGWR · Texas Instruments TPS7A4701RGWR · Texas Instruments TPS3823 (Voltage supervisor companion)

🧩

I/O Expansion for Microcontrollers

When a microcontroller's GPIO budget is exhausted, the EPM570ZM144C7N can serve as an I/O expander with deterministic response (no software stack involved). The CPLD reads a parallel command word from the MCU and drives up to 116 outputs, or latches input states for the MCU to read. Its 7 ns tPD is far faster than any I2C/SPI GPIO expander, making it well suited for high-speed parallel interfaces to legacy peripherals, LCDs, or FPGA mezzanine cards.

अनुशंसित

STM32F407VG (Host MCU with parallel FSMC bus) PCF8575 (I2C I/O expander reference (slower alternative))

💡

LED Display Multiplexing and Driving

The EPM570ZM144C7N's 116 user I/Os and 7 ns logic delay suit large LED matrix multiplexing with minimal flicker. A single EPM570Z can drive a 16-row by 8-column RGB matrix (48 output lines) while the remaining I/Os handle row decoding and brightness PWM. The on-chip User Flash Memory stores gamma-correction tables, and the internal oscillator provides a refresh-rate reference. Add a current-driver IC such as the TLC5941 or STP16DP05 for high-current LED rows.

अनुशंसित

TLC5941 (16-channel LED PWM driver) STP16DP05 (16-channel constant-current LED sink)

🌐

Protocol Bridging and Legacy Interface Conversion

The EPM570ZM144C7N can bridge between legacy and modern protocols - for example, parallel-bus to SPI/UART/I2C, or custom industrial protocols to standard interfaces. The 570 logic elements provide ample capacity for serial-to-parallel converters, CRC engines, and protocol state machines. The instant-on non-volatile configuration means the bridge works immediately at power-up without firmware boot, valuable in deterministic industrial networks where a slow-boot MCU bridge would be unacceptable.

अनुशंसित

MAX3107 (SPI-to-UART companion bridge) PCA9600 (I2C bus buffer for long-distance runs)

🔧

Test and Measurement Instrumentation Front-End

The EPM570ZM144C7N's 7 ns logic delay and 116 I/Os make it a flexible front-end for test and measurement: digital pattern generation, signal routing matrices, and trigger logic. The UFM stores test-pattern definitions, while the JTAG interface enables in-system reprogramming for different test campaigns. Pair the CPLD with precision ADCs/DACs and a low-noise LDO such as the TPS7A4701 for instrumentation power rails. The deterministic timing helps meet measurement-window synchronization requirements.

अनुशंसित

TPS7A4701RGWR · Texas Instruments TPS7A4701RGWR · Texas Instruments AD7606 · Analog Devices

🚗

Automotive Body Electronics (Non-AEC-Q100)

For non-safety automotive body electronics such as body control modules, lighting controllers, and HVAC panels, the EPM570ZM144C7N provides 116 user I/Os for switch scanning, relay driving, and LIN/CAN bus expansion. Note that the EPM570ZM144C7N is commercial-temperature (0C to +85C), so for under-hood or cabin-temperature-critical applications choose the industrial-temperature EPM570ZM144I7N (-40C to +85C). The MAX II family does not offer an AEC-Q100-qualified variant.

अनुशंसित

TJA1050 · NXP Semiconductors MC33660 (LIN transceiver companion)

अनुशंसित उत्पादों का सारांश

MAX232 RS-232 level translator companion उपयोग में: Industrial Glue Logic and Bus Bridging SN65HVD75 RS-485 transceiver companion उपयोग में: Industrial Glue Logic and Bus Bridging AT24C256 External I2C EEPROM (if UFM insufficient) उपयोग में: Industrial Glue Logic and Bus Bridging TPS7A4701RGWR Texas Instruments उपयोग में: Power-Up and Power-Down Sequencing, Power-Up and Power-Down Sequencing, Test and Measurement Instrumentation Front-End, Test and Measurement Instrumentation Front-End TPS3823 Voltage supervisor companion उपयोग में: Power-Up and Power-Down Sequencing STM32F407VG Host MCU with parallel FSMC bus उपयोग में: I/O Expansion for Microcontrollers PCF8575 I2C I/O expander reference (slower alternative) उपयोग में: I/O Expansion for Microcontrollers TLC5941 16-channel LED PWM driver उपयोग में: LED Display Multiplexing and Driving STP16DP05 16-channel constant-current LED sink उपयोग में: LED Display Multiplexing and Driving MAX3107 SPI-to-UART companion bridge उपयोग में: Protocol Bridging and Legacy Interface Conversion PCA9600 I2C bus buffer for long-distance runs उपयोग में: Protocol Bridging and Legacy Interface Conversion AD7606 Analog Devices उपयोग में: Test and Measurement Instrumentation Front-End TJA1050 NXP Semiconductors उपयोग में: Automotive Body Electronics (Non-AEC-Q100) MC33660 LIN transceiver companion उपयोग में: Automotive Body Electronics (Non-AEC-Q100)

What is the EPM570ZM144C7N and what family does it belong to?

The EPM570ZM144C7N is a 570-logic-element MAX II Z CPLD (Complex Programmable Logic Device) from Intel (formerly Altera), housed in a 144-ball FineLine BGA package with a 7 ns pin-to-pin logic delay. According to the Intel MAX II Device Handbook, it is built on a 0.18 micrometer flash process and offers non-volatile, instant-on configuration without an external boot memory. This makes it a fit for glue logic, I/O expansion, and power-sequencing applications.

How many user I/Os does the EPM570ZM144C7N have?

The EPM570ZM144C7N provides 116 user I/Os maximum in the 144-MBGA package. This is the highest I/O count variant of the EPM570 device, exceeding the 100-pin and 256-pin fine-line BGA variants of the same family. The MBGA package minimizes parasitic inductance and supports high-speed signal fan-out to multiple peripherals.

What is the difference between MAX II EPM570Z and the standard EPM570?

The EPM570Z variant enables IEEE 1149.1 JTAG-based in-system programmability (ISP) with the on-chip User Flash Memory (UFM) and JTAG circuitry fully accessible. The standard EPM570 has the same 570 logic elements and 440 macrocells but a different licensing of the JTAG/UFM subsystem. Both share the same 144-MBGA pinout and the same 7 ns speed grade option, making them drop-in compatible on the same PCB footprint.

Where can I download the EPM570ZM144C7N datasheet PDF?

The official EPM570ZM144C7N datasheet and the full MAX II Device Handbook are available from the Intel FPGA documentation portal at intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/max2/max2_mii5v1.pdf. Distributors such as DigiKey (544-2452-ND) and Mouser also host the datasheet on their product pages.

What is the lead time for EPM570ZM144C7N?

As of 2026-09-12, distributor Heisener lists the EPM570ZM144C7N with in stock and a lead time "To Be Confirmed" with estimated delivery between Jul 3 and Jul 8 when expedited shipping is selected. For higher-volume orders, request a formal quote from authorized distributors such as DigiKey, Mouser, or Heisener for the latest lead time.

Is the EPM570ZM144C7N in stock at major distributors?

Yes, as of 2026-09-12 the EPM570ZM144C7N is listed as in stock at Heisener (approximately 2,320 pieces at USD 25.55 each). DigiKey and Mouser also list the part in their catalogs; confirm real-time stock on each distributor page before placing an order, as CPLD inventory can fluctuate rapidly.

How much does the EPM570ZM144C7N cost at qty 1?

The EPM570ZM144C7N unit price at qty 1 is approximately USD 25.55 as of 2026-09-12, per the Heisener listing. Volume pricing drops to roughly USD 19.50 at qty 100 and approximately USD 15.40 at qty 1000. Always request a current quote from authorized distributors because CPLD pricing can vary significantly with allocation and lead time.

What is the best drop-in replacement for EPM570ZM144C7N?

The best drop-in replacement is the EPM570ZM144C6N (6 ns speed grade) - same 144-MBGA package, same 570 logic elements, same 116 user I/Os, same MAX II Z feature set, only the speed grade changes. Other same-package drop-in options are the EPM570T144C5N (lower-cost MAX II variant in the same 144-pin TQFP) and the EPM570GT144C5N. Always recompile your Quartus design and revalidate timing when swapping speed grades.

EPM570ZM144C7N vs EPM570ZM100C7N - which should I choose?

Choose the EPM570ZM144C7N if you need the full 116 user I/Os available in the 144-MBGA package. Choose the EPM570ZM100C7N if your design fits within 76 user I/Os and you prefer a smaller, easier-to-route 100-MBGA footprint. Both share the same 570 logic elements, 440 macrocells, 7 ns speed grade, and MAX II Z feature set, so logic capacity is identical - only the I/O count and package differ.

Can the EPM570ZM144C7N replace the EPM570T144C5N?

No, these are not drop-in compatible: the EPM570ZM144C7N is in the 144-ball FineLine BGA (MBGA) package, whereas the EPM570T144C5N is in the 144-pin TQFP package. The land patterns are completely different and the two parts cannot be soldered onto the same PCB footprint. If you need a drop-in replacement in the same MBGA package, choose the EPM570ZM144C6N instead.

Is the EPM570ZM144C7N suitable for industrial automation applications?

Yes, the EPM570ZM144C7N is well suited to industrial automation as a glue-logic and bus-bridging CPLD. Its instant-on, non-volatile flash configuration is deterministic at power-up, the 116 user I/Os handle multiple peripheral buses, and the 8 Kbit User Flash Memory can store calibration constants or serial numbers. For harsh industrial environments with extended temperature requirements, consider the EPM570Z (industrial) variants (I7N/I8N speed grades) rather than the C7N commercial-temperature grade.

What is the operating temperature range of the EPM570ZM144C7N?

The EPM570ZM144C7N has a commercial operating temperature range of 0C to +85C, indicated by the "C" in the speed-grade/temperature suffix. For industrial applications requiring -40C to +85C, choose the I-grade EPM570Z parts (e.g., EPM570ZM144I7N). For automotive-grade applications requiring -40C to +125C, the MAX II family does not offer an AEC-Q100 variant - migrate to a MAX 10 or Cyclone device for that range.

What core voltage does the EPM570ZM144C7N require?

The EPM570ZM144C7N supports multi-voltage core operation at 3.3 V, 2.5 V, or 1.8 V, configurable by the VCCINT pin rail. The I/O banks are independently powered and can interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V-tolerant signals depending on the bank supply. This flexibility lets a single design interface with mixed-voltage microcontrollers, memories, and ASICs without external level shifters.

Does the EPM570ZM144C7N have User Flash Memory?

Yes, the EPM570ZM144C7N includes 8 Kbits of User Flash Memory (UFM) that can be read and written through the JTAG interface. The UFM is commonly used to store serial numbers, calibration constants, firmware revision IDs, or small bootloader tables - replacing a separate external EEPROM and saving board space. The UFM block has a specified endurance and retention rating - check the datasheet for the exact figure before using it as a write-heavy data logger.

What are the key specifications of EPM570ZM144C7N that engineers should know?

Key specifications of the EPM570ZM144C7N are: 570 logic elements, 440 macrocells equivalent, 116 user I/Os, 8 Kbit User Flash Memory, 7.0 ns pin-to-pin logic delay, 0.18 um flash process, multi-voltage core (3.3/2.5/1.8 V), independent I/O bank voltages, JTAG (IEEE 1149.1) programming, internal oscillator, commercial temperature range 0C to +85C, and 144-ball FineLine BGA package. The device is non-volatile with instant-on configuration, no external boot memory required.

के लिए इंजीनियरिंग संदर्भ डेटा EPM570ZM144C7N — तुलना, डिज़ाइन मार्गदर्शन और अनुपालन जानकारी।

चयन गाइड

Choose the EPM570ZM144C7N when your design needs a non-volatile, instant-on CPLD with 570 logic elements and the maximum I/O count (116 user I/Os) of the EPM570 family. The 144-MBGA package suits high-density boards where TQFP routing is impractical. If your timing margins are tight, upgrade to the EPM570ZM144C6N (6 ns speed grade) - same footprint, ~14% faster. If you anticipate logic growth above 570 LEs, design the PCB once and migrate to the EPM1270ZM144C7N or EPM2210ZM144C7N (vertical migration per the MAX II datasheet). For -40C to +85C industrial environments, use the I-grade variant (EPM570ZM144I7N); the MAX II family does not offer AEC-Q100 automotive qualification. For lower I/O counts, consider the 100-MBGA EPM570ZM100C7N (76 I/Os) only if board space forces the smaller footprint.

विकल्पों के साथ तुलना

पैरामीटर	यह उत्पाद	EPM570ZM144C6N	EPM1270ZM144C7N	EPM2210ZM144C7N
Brand	Intel	Intel	Intel	Intel
Package	144-MBGA	144-MBGA (same)	144-MBGA (same)	144-MBGA (same)
Logic Elements	570	570 (same)	1,270 (+123%)	2,210 (+288%)
Pin-to-Pin Delay (tPD)	7.0 ns	6.0 ns (faster)	7.0 ns (same)	7.0 ns (same)
User I/Os	116	116 (same)	116 (same)	116 (same)
User Flash Memory (UFM)	8 Kbit	8 Kbit	8 Kbit	8 Kbit
Process Technology	0.18 um flash	0.18 um flash (same)	0.18 um flash (same)	0.18 um flash (same)
Vertical Migration Support	Yes (MAX II family)	Yes	Yes (same package, higher density)	Yes (same package, highest density)

मुख्य विशेषताएँ

Vertical migration within 144-MBGA footprint across MAX II family (बनामEPM1270ZM144C7N / EPM2210ZM144C7N)
Faster 6 ns speed grade available in identical 144-MBGA package (बनामEPM570ZM144C6N)
8 Kbit on-chip User Flash Memory eliminates external EEPROM (बनामDiscrete I2C EEPROM (e.g., 24LC256))

डिज़ाइन नोट्स

The EPM570ZM144C7N requires three separate supply rails: VCCINT (3.3 V / 2.5 V / 1.8 V selectable core), VCCIO1-VCCIO4 (four independent I/O bank voltages, each may be 1.5 V / 1.8 V / 2.5 V / 3.3 V). Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 100 mils of the BGA ball, plus a bulk 10 uF tantalum or ceramic on each rail. The MAX II family has very low static Icc (typically under 30 mA), so a small LDO such as an LT1963 or TPS7A45 is sufficient for the core rail.

Design the 144-MBGA land pattern on a 0.8 mm ball pitch using NSMD (non-soldermask-defined) pads per IPC-7351 for best BGA joint reliability. Use 4 mil trace/space routing on inner layers with microvia fan-out; route signals on the top layer directly out of the BGA when possible. Provide at least 4 via-in-pad or dog-bone fan-out vias per signal. Maintain a continuous ground plane on layer 2 beneath the BGA to control return paths for high-speed signals.

Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus assignment, otherwise they can float mid-rail and draw shoot-through current. Also: the JTAG TCK pin requires a defined logic level at power-up; do not leave it unconnected. The UFM block has a limited write-endurance spec - avoid using it as a frequently-rewritten data store; reserve it for configuration constants.

Estimated: the 144-MBGA package has a typical theta_JA of approximately 30-40 C/W on a 4-layer JEDEC test board. With typical Icc of 25 mA at 3.3 V core, dissipation is only ~80 mW - well below the thermal limit. Even at maximum Icc of 300 mA (fully loaded with high-frequency toggling), dissipation is approximately 1 W, giving a junction-temperature rise of 30-40 C above ambient, which is acceptable. Forced-air cooling is rarely required for MAX II CPLDs.

अनुपालन जानकारी

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

लीड फ्री

Yes

हैलोजन फ्री

Yes

कॉन्फ्लिक्ट मिनरल्स

Compliant

RoHS compliant per Altera/Intel MAX II product family compliance documentation. Lead-free (Pb-free) BGA balls. Not AEC-Q100 qualified - the MAX II family does not include AEC-Q100 variants. For automotive applications, migrate to MAX 10 (10M02/10M08) or Cyclone IV/V FPGA families.

डेटा सत्यापन तिथि: 2026-09-12 — डेटा XAIPART की कंपोनेंट इंजीनियरिंग टीम द्वारा सत्यापित और क्यूरेट किया गया

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