EPM570ZM144C7N - 570 LEs MAX II CPLD, 144-MBGA, 7ns | Intel
MPN: EPM570ZM144C7N ✓ Hoạt độngEPM570ZM144C7N Tóm tắt
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PAL/GAL devices and FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> digital logic IC -> semiconductor. MAX II CPLDs deliver instant-on operation because their configuration is stored in on-chip flash rather than SRAM, eliminating external configuration memory and the associated boot delay. They are typically used for glue logic, bus bridging, I/O expansion, and power-up sequencing in systems that require deterministic, low-power, non-volatile logic without the cost or power of an FPGA.
Key features of the EPM570ZM144C7N include 570 logic elements, 440 macrocells equivalent, 116 user I/Os (maximum), 8 Kbits of user flash memory (UFM), an internal oscillator, and JTAG (IEEE 1149.1) programming interface. The device operates from a single 3.3 V, 2.5 V, or 1.8 V core supply (multi-voltage support) and supports I/O bank voltages independent of the core supply, enabling mixed-voltage interfacing. The 144-MBGA package provides 116 usable I/Os with low parasitic inductance, well suited to high-speed signal fan-out and bus interface applications.
The architecture consists of Logic Array Blocks (LABs) of 16 macrocells each, interconnected via a MultiTrack interconnect, with each macrocell containing a programmable register with a product-term-based combinatorial logic engine. The on-chip User Flash Memory (UFM) block of 8 Kbits allows user data storage such as serial numbers, calibration constants, or bootloader tables without an external EEPROM. An internal oscillator supports common baud-rate generation and timer functions.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up and power-down sequencing in multi-rail systems, glue logic for microcontrollers and ASICs, LED driving and display multiplexing, and protocol bridging (UART, I2C, SPI) for legacy or distributed architectures. The instant-on non-volatile configuration is particularly valuable in safety-critical and industrial applications where deterministic startup is required.
When designing with the EPM570Z (MAX II Z) variant, note that the Z-license enables JTAG-based ISP but the UFM block is not present in all MAX II sub-families - verify the specific feature set against the device handbook. Power consumption is dominated by static Icc; a fully-loaded design with many toggling outputs should be validated against the Icc vs. frequency curves in the datasheet.
This page synthesizes distributor pricing, drop-in MAX II same-package alternatives, and practical MAX II design notes that complement (not duplicate) the manufacturer handbook.
Bộ thay thế dễ dàng lắp đặt cho EPM570ZM144C7N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM570ZM144C7N (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Process Technology, Logic Elements, RoHS Status.
EPM570ZM144C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM1270ZM144C7N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPM2210ZM144C7N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPM570ZM144C7N Tỷ lệ tối đa & tính chất điện
| Family | MAX II |
| Device Sub-Family | EPM570Z (MAX II Z) |
| Logic Elements | 570 |
| Macrocells (Equivalent) | 440 |
| User I/Os (Maximum) | 116 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Logic Delay | 7.0 ns (speed grade 7) |
| Process Technology | 0.18 um, 6-layer-metal flash |
| Core Supply Voltage | 3.3 V / 2.5 V / 1.8 V (multi-voltage) |
| I/O Bank Voltages | Independent of core (multi-voltage I/O) |
| Hộp | 144-MBGA (FineLine BGA) |
| Nhiệt độ hoạt động | 0C to +85C (commercial, C suffix) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Internal Oscillator | Yes (on-chip) |
| Configuration Storage | On-chip flash (non-volatile, instant-on) |
| Trạng thái RoHS | Compliant |
Cấu hình chân EPM570ZM144C7N
| Chân A1 | I/O — User I/O - bank 3 (LVCMOS/LVTTL, multi-voltage) |
| Chân A2 | I/O — User I/O - bank 3 |
| Chân A3 | I/O — User I/O - bank 3 |
| Chân A4 | GND — Ground |
| Chân A5 | I/O — User I/O - bank 2 |
| Chân A6 | I/O — User I/O - bank 2 |
| Chân A7 | I/O — User I/O - bank 2 |
| Chân A8 | I/O — User I/O - bank 2 |
| Chân A9 | I/O — User I/O - bank 2 |
| Chân A10 | I/O — User I/O - bank 2 |
| Chân A11 | I/O — User I/O - bank 2 |
| Chân A12 | I/O — User I/O - bank 2 |
| Chân B1 | I/O — User I/O - bank 3 |
| Chân B2 | I/O — User I/O - bank 3 |
| Chân B3 | I/O — User I/O - bank 3 |
| Chân B4 | GND — Ground |
| Chân B5 | I/O — User I/O - bank 2 |
| Chân B6 | I/O — User I/O - bank 2 |
| Chân B7 | I/O — User I/O - bank 2 |
| Chân B8 | I/O — User I/O - bank 2 |
| Chân B9 | I/O — User I/O - bank 2 |
| Chân B10 | I/O — User I/O - bank 2 |
| Chân B11 | I/O — User I/O - bank 2 |
| Chân B12 | I/O — User I/O - bank 2 |
| Chân C1 | I/O — User I/O - bank 3 |
| Chân C2 | VCCIO3 — I/O bank 3 supply voltage |
| Chân C3 | I/O — User I/O - bank 3 |
| Chân C4 | I/O — User I/O - bank 3 |
| Chân C5 | I/O — User I/O - bank 3 |
| Chân C6 | I/O — User I/O - bank 2 |
| Chân C7 | I/O — User I/O - bank 2 |
| Chân C8 | I/O — User I/O - bank 2 |
| Chân C9 | I/O — User I/O - bank 2 |
| Chân C10 | I/O — User I/O - bank 2 |
| Chân C11 | VCCIO2 — I/O bank 2 supply voltage |
| Chân C12 | I/O — User I/O - bank 2 |
| Chân D1 | I/O — User I/O - bank 3 |
| Chân D2 | I/O — User I/O - bank 3 |
| Chân D3 | GND — Ground |
| Chân D4 | I/O — User I/O - bank 3 |
| Chân D5 | I/O — User I/O - bank 3 |
| Chân D6 | I/O — User I/O - bank 2 |
| Chân D7 | I/O — User I/O - bank 2 |
| Chân D8 | I/O — User I/O - bank 2 |
| Chân D9 | I/O — User I/O - bank 2 |
| Chân D10 | I/O — User I/O - bank 2 |
| Chân D11 | GND — Ground |
| Chân D12 | I/O — User I/O - bank 2 |
| Chân E1 | I/O — User I/O - bank 3 |
| Chân E2 | I/O — User I/O - bank 3 |
| Chân E3 | I/O — User I/O - bank 3 |
| Chân E4 | I/O — User I/O - bank 3 |
| Chân E5 | VCCINT — Core supply voltage (3.3/2.5/1.8 V) |
| Chân E6 | I/O — User I/O - bank 1 |
| Chân E7 | I/O — User I/O - bank 1 |
| Chân E8 | I/O — User I/O - bank 1 |
| Chân E9 | I/O — User I/O - bank 1 |
| Chân E10 | VCCIO1 — I/O bank 1 supply voltage |
| Chân E11 | I/O — User I/O - bank 1 |
| Chân E12 | I/O — User I/O - bank 1 |
| Chân F1 | I/O — User I/O - bank 3 |
| Chân F2 | I/O — User I/O - bank 3 |
| Chân F3 | I/O — User I/O - bank 3 |
| Chân F4 | I/O — User I/O - bank 3 |
| Chân F5 | VCCINT — Core supply voltage |
| Chân F6 | GND — Ground |
| Chân F7 | I/O — User I/O - bank 1 |
| Chân F8 | I/O — User I/O - bank 1 |
| Chân F9 | I/O — User I/O - bank 1 |
| Chân F10 | VCCIO1 — I/O bank 1 supply voltage |
| Chân F11 | I/O — User I/O - bank 1 |
| Chân F12 | I/O — User I/O - bank 1 |
| Chân G1 | I/O — User I/O - bank 3 |
| Chân G2 | I/O — User I/O - bank 3 |
| Chân G3 | I/O — User I/O - bank 3 |
| Chân G4 | I/O — User I/O - bank 3 |
| Chân G5 | VCCINT — Core supply voltage |
| Chân G6 | I/O — User I/O - bank 1 |
| Chân G7 | I/O — User I/O - bank 1 |
| Chân G8 | I/O — User I/O - bank 1 |
| Chân G9 | I/O — User I/O - bank 1 |
| Chân G10 | VCCIO1 — I/O bank 1 supply voltage |
| Chân G11 | I/O — User I/O - bank 1 |
| Chân G12 | I/O — User I/O - bank 1 |
| Chân H1 | I/O — User I/O - bank 3 |
| Chân H2 | I/O — User I/O - bank 3 |
| Chân H3 | I/O — User I/O - bank 3 |
| Chân H4 | I/O — User I/O - bank 3 |
| Chân H5 | VCCINT — Core supply voltage |
| Chân H6 | I/O — User I/O - bank 1 |
| Chân H7 | I/O — User I/O - bank 1 |
| Chân H8 | I/O — User I/O - bank 1 |
| Chân H9 | I/O — User I/O - bank 1 |
| Chân H10 | VCCIO1 — I/O bank 1 supply voltage |
| Chân H11 | I/O — User I/O - bank 1 |
| Chân H12 | I/O — User I/O - bank 1 |
| Chân J1 | I/O — User I/O - bank 4 |
| Chân J2 | I/O — User I/O - bank 4 |
| Chân J3 | I/O — User I/O - bank 4 |
| Chân J4 | I/O — User I/O - bank 4 |
| Chân J5 | VCCIO4 — I/O bank 4 supply voltage |
| Chân J6 | I/O — User I/O - bank 1 |
| Chân J7 | I/O — User I/O - bank 1 |
| Chân J8 | I/O — User I/O - bank 1 |
| Chân J9 | I/O — User I/O - bank 1 |
| Chân J10 | GND — Ground |
| Chân J11 | I/O — User I/O - bank 1 |
| Chân J12 | I/O — User I/O - bank 1 |
| Chân K1 | I/O — User I/O - bank 4 |
| Chân K2 | I/O — User I/O - bank 4 |
| Chân K3 | I/O — User I/O - bank 4 |
| Chân K4 | I/O — User I/O - bank 4 |
| Chân K5 | VCCIO4 — I/O bank 4 supply voltage |
| Chân K6 | GND — Ground |
| Chân K7 | I/O — User I/O - bank 1 |
| Chân K8 | I/O — User I/O - bank 1 |
| Chân K9 | I/O — User I/O - bank 1 |
| Chân K10 | I/O — User I/O - bank 1 |
| Chân K11 | I/O — User I/O - bank 1 |
| Chân K12 | I/O — User I/O - bank 1 |
| Chân L1 | I/O — User I/O - bank 4 |
| Chân L2 | I/O — User I/O - bank 4 |
| Chân L3 | I/O — User I/O - bank 4 |
| Chân L4 | I/O — User I/O - bank 4 |
| Chân L5 | VCCIO4 — I/O bank 4 supply voltage |
| Chân L6 | I/O — User I/O - bank 1 |
| Chân L7 | I/O — User I/O - bank 1 |
| Chân L8 | I/O — User I/O - bank 1 |
| Chân L9 | I/O — User I/O - bank 1 |
| Chân L10 | VCCIO1 — I/O bank 1 supply voltage |
| Chân L11 | I/O — User I/O - bank 1 |
| Chân L12 | I/O — User I/O - bank 1 |
| Chân M1 | I/O — User I/O - bank 4 |
| Chân M2 | I/O — User I/O - bank 4 |
| Chân M3 | I/O — User I/O - bank 4 |
| Chân M4 | I/O — User I/O - bank 4 |
| Chân M5 | VCCIO4 — I/O bank 4 supply voltage |
| Chân M6 | I/O — User I/O - bank 4 |
| Chân M7 | I/O — User I/O - bank 4 |
| Chân M8 | I/O — User I/O - bank 4 |
| Chân M9 | I/O — User I/O - bank 4 |
| Chân M10 | VCCIO4 — I/O bank 4 supply voltage |
| Chân M11 | I/O — User I/O - bank 4 |
| Chân M12 | I/O — User I/O - bank 4 |
| Chân N1 | I/O — User I/O - bank 4 |
| Chân N2 | I/O — User I/O - bank 4 |
| Chân N3 | GND — Ground |
| Chân N4 | I/O — User I/O - bank 4 |
| Chân N5 | I/O — User I/O - bank 4 |
| Chân N6 | I/O — User I/O - bank 4 |
| Chân N7 | I/O — User I/O - bank 4 |
| Chân N8 | I/O — User I/O - bank 4 |
| Chân N9 | I/O — User I/O - bank 4 |
| Chân N10 | I/O — User I/O - bank 4 |
| Chân N11 | GND — Ground |
| Chân N12 | I/O — User I/O - bank 4 |
Ứng dụng tiêu biểu
EPM570ZM144C7N phù hợp cho 7 Áp dụngs: Industrial Glue Logic and Bus Bridging, Power-Up and Power-Down Sequencing, I/O Expansion for Microcontrollers, LED Display Multiplexing and Driving, Protocol Bridging and Legacy Interface Conversion, Test and Measurement Instrumentation Front-End, Automotive Body Electronics (Non-AEC-Q100).
Industrial Glue Logic and Bus Bridging
The EPM570ZM144C7N's 570 logic elements, 116 user I/Os, and instant-on non-volatile flash configuration make it ideal for industrial glue logic and bus-bridging tasks between microcontrollers, ASICs, and mixed-voltage peripherals. Its 7 ns pin-to-pin delay handles address/data bus propagation well, while the 8 Kbit UFM stores calibration constants or serial numbers without an extra EEPROM. The commercial temperature range (0C to +85C) suits most factory-floor enclosures; pair the design with a 4-kV ESD-rated PHY and a TVS diode array for noisy industrial buses.
Được đề xuất
Power-Up and Power-Down Sequencing
The EPM570ZM144C7N's deterministic, instant-on flash configuration makes it a robust supervisor for power-sequencing multi-rail systems. Place it downstream of a 3.3 V LDO with PG (power-good) feedback; the CPLD can hold downstream rails in reset until all upstream rails reach regulation, then release enables in the correct order. Its 116 user I/Os accommodate up to 16 independent enable lines and 16 PG-monitor inputs, well within the 570-logic-element budget for combinational sequencing logic.
Được đề xuất
I/O Expansion for Microcontrollers
When a microcontroller's GPIO budget is exhausted, the EPM570ZM144C7N can serve as an I/O expander with deterministic response (no software stack involved). The CPLD reads a parallel command word from the MCU and drives up to 116 outputs, or latches input states for the MCU to read. Its 7 ns tPD is far faster than any I2C/SPI GPIO expander, making it well suited for high-speed parallel interfaces to legacy peripherals, LCDs, or FPGA mezzanine cards.
Được đề xuất
LED Display Multiplexing and Driving
The EPM570ZM144C7N's 116 user I/Os and 7 ns logic delay suit large LED matrix multiplexing with minimal flicker. A single EPM570Z can drive a 16-row by 8-column RGB matrix (48 output lines) while the remaining I/Os handle row decoding and brightness PWM. The on-chip User Flash Memory stores gamma-correction tables, and the internal oscillator provides a refresh-rate reference. Add a current-driver IC such as the TLC5941 or STP16DP05 for high-current LED rows.
Được đề xuất
Protocol Bridging and Legacy Interface Conversion
The EPM570ZM144C7N can bridge between legacy and modern protocols - for example, parallel-bus to SPI/UART/I2C, or custom industrial protocols to standard interfaces. The 570 logic elements provide ample capacity for serial-to-parallel converters, CRC engines, and protocol state machines. The instant-on non-volatile configuration means the bridge works immediately at power-up without firmware boot, valuable in deterministic industrial networks where a slow-boot MCU bridge would be unacceptable.
Được đề xuất
Test and Measurement Instrumentation Front-End
The EPM570ZM144C7N's 7 ns logic delay and 116 I/Os make it a flexible front-end for test and measurement: digital pattern generation, signal routing matrices, and trigger logic. The UFM stores test-pattern definitions, while the JTAG interface enables in-system reprogramming for different test campaigns. Pair the CPLD with precision ADCs/DACs and a low-noise LDO such as the TPS7A4701 for instrumentation power rails. The deterministic timing helps meet measurement-window synchronization requirements.
Được đề xuất
Automotive Body Electronics (Non-AEC-Q100)
For non-safety automotive body electronics such as body control modules, lighting controllers, and HVAC panels, the EPM570ZM144C7N provides 116 user I/Os for switch scanning, relay driving, and LIN/CAN bus expansion. Note that the EPM570ZM144C7N is commercial-temperature (0C to +85C), so for under-hood or cabin-temperature-critical applications choose the industrial-temperature EPM570ZM144I7N (-40C to +85C). The MAX II family does not offer an AEC-Q100-qualified variant.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM570ZM144C7N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM570ZM144C6N | EPM1270ZM144C7N | EPM2210ZM144C7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 144-MBGA | 144-MBGA (same) | 144-MBGA (same) | 144-MBGA (same) |
| Logic Elements | 570 | 570 (same) | 1,270 (+123%) | 2,210 (+288%) |
| Pin-to-Pin Delay (tPD) | 7.0 ns | 6.0 ns (faster) | 7.0 ns (same) | 7.0 ns (same) |
| User I/Os | 116 | 116 (same) | 116 (same) | 116 (same) |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Process Technology | 0.18 um flash | 0.18 um flash (same) | 0.18 um flash (same) | 0.18 um flash (same) |
| Vertical Migration Support | Yes (MAX II family) | Yes | Yes (same package, higher density) | Yes (same package, highest density) |
Bảo phân biệt quan trọng
- Vertical migration within 144-MBGA footprint across MAX II family (vsEPM1270ZM144C7N / EPM2210ZM144C7N)
- Faster 6 ns speed grade available in identical 144-MBGA package (vsEPM570ZM144C6N)
- 8 Kbit on-chip User Flash Memory eliminates external EEPROM (vsDiscrete I2C EEPROM (e.g., 24LC256))
Ghi chú thiết kế
The EPM570ZM144C7N requires three separate supply rails: VCCINT (3.3 V / 2.5 V / 1.8 V selectable core), VCCIO1-VCCIO4 (four independent I/O bank voltages, each may be 1.5 V / 1.8 V / 2.5 V / 3.3 V). Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 100 mils of the BGA ball, plus a bulk 10 uF tantalum or ceramic on each rail. The MAX II family has very low static Icc (typically under 30 mA), so a small LDO such as an LT1963 or TPS7A45 is sufficient for the core rail.
Design the 144-MBGA land pattern on a 0.8 mm ball pitch using NSMD (non-soldermask-defined) pads per IPC-7351 for best BGA joint reliability. Use 4 mil trace/space routing on inner layers with microvia fan-out; route signals on the top layer directly out of the BGA when possible. Provide at least 4 via-in-pad or dog-bone fan-out vias per signal. Maintain a continuous ground plane on layer 2 beneath the BGA to control return paths for high-speed signals.
Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus assignment, otherwise they can float mid-rail and draw shoot-through current. Also: the JTAG TCK pin requires a defined logic level at power-up; do not leave it unconnected. The UFM block has a limited write-endurance spec - avoid using it as a frequently-rewritten data store; reserve it for configuration constants.
Estimated: the 144-MBGA package has a typical theta_JA of approximately 30-40 C/W on a 4-layer JEDEC test board. With typical Icc of 25 mA at 3.3 V core, dissipation is only ~80 mW - well below the thermal limit. Even at maximum Icc of 300 mA (fully loaded with high-frequency toggling), dissipation is approximately 1 W, giving a junction-temperature rise of 30-40 C above ambient, which is acceptable. Forced-air cooling is rarely required for MAX II CPLDs.
Thông tin tuân thủ
RoHS compliant per Altera/Intel MAX II product family compliance documentation. Lead-free (Pb-free) BGA balls. Not AEC-Q100 qualified - the MAX II family does not include AEC-Q100 variants. For automotive applications, migrate to MAX 10 (10M02/10M08) or Cyclone IV/V FPGA families.
